Barrier radar PCB with laminated structure

Abstract

The utility model discloses a barrier gate radar PCB board with a laminated structure, comprising a first PCB board, a second PCB board and a welding assembly, the first PCB board and the second PCB board are connected through the welding assembly; the first PCB comprises a layer of RO4830 high-speed board and three layers of FR4 common boards; and the same signal lines of all layers of plates are connected through plated-through holes. The second PCB comprises two layers of FR4 common plates, and the same signal lines of all the layers of plates are connected through plated-through holes. The welding assembly comprises a metalized stamp hole and a metal bonding pad, the metalized stamp hole is arranged on the first PCB, and the metal bonding pad is arranged on the second PCB. The first PCB is provided with a main control unit, a storage unit, a clock unit and an antenna. According to the utility model, the usable area of special high-frequency plates can be effectively reduced, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of PCB board structures, and specifically to a barrier gate radar PCB board with a stacked structure. Background Art

[0002] 76GHz - 81GHz millimeter-wave radars are currently widely used in fields such as vehicles, drones, security, and industrial control. Due to the relatively high operating frequency band of millimeter-wave radars, extremely stringent requirements are imposed on the loss factor and dielectric constant stability of PCB materials. High-frequency plates can provide better frequency stability and lower losses, ensuring the accurate transmission and reception of radar signals. Due to the particularity of high-frequency plates, the cost is relatively high. Currently, in the design, basically the first layer of a whole PCB is a high-frequency plate. However, only the antenna part of the millimeter-wave radar has requirements for high-frequency plates. Therefore, such a design is somewhat wasteful in terms of cost. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a barrier gate radar PCB board with a stacked structure to solve the problem of the relatively high cost of the existing PCB board structure.

[0004] To achieve the above purpose, the utility model provides the following technical solution: A barrier gate radar PCB board with a stacked structure, comprising: a first PCB board, a second PCB board, and a welding component. The first PCB board and the second PCB board are connected by the welding component; the first PCB board includes 1 layer of RO4830 high-speed board and 3 layers of FR4 ordinary boards; the same signal lines of each layer of boards are connected through metallized holes.

[0005] Preferably, the second PCB board includes 2 layers of FR4 ordinary boards, and the same signal lines of each layer of boards are connected through metallized holes.

[0006] Preferably, the welding component includes metallized postage holes and metal pads. The metallized postage holes are arranged on the first PCB board, and the metal pads are arranged on the second PCB board.

[0007] Preferably, a main control unit, a storage unit, a clock unit, and an antenna are arranged on the first PCB board.

[0008] Preferably, the bypass capacitor distribution area of the main control unit on the first PCB board is S1, and a slot is arranged at the position corresponding to S1 on the second PCB board. The slot area is S2, and S2 > S1.

[0009] Preferably, a first heat dissipation window S3 is opened on the first PCB board, and a second heat dissipation window S4 is opened on the second PCB board. The first heat dissipation window S3 and the second heat dissipation window S4 are in corresponding positions.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] Through the stacked design, the core part of the millimeter-wave radar of the present utility model is designed as a small board, which can effectively reduce the usage area of expensive high-frequency boards, reduce production costs. Under the same solution, the core small board can be reused, greatly saving the development cycle and improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0013] Figure 2 is a schematic diagram of the structure of the first PCB board of the present utility model;

[0014] Figure 3 is a schematic diagram of the structure of the second PCB board of the present utility model;

[0015] Figure 4 is a schematic diagram of the structure of the welding assembly of the present utility model.

[0016] Reference numerals: 1, the first PCB board; 2, the second PCB board; 3, the welding assembly; 31, metallized postage holes; 32, metal pads. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In order to make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] In the description of the present utility model, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0019] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] As Figure 1 shown, the barrier gate radar PCB board of the laminated structure in this embodiment includes: a first PCB board 1, a second PCB board 2, and a welding component 3. The first PCB board 1 and the second PCB board 2 are connected by the welding component 3. The first PCB board 1 is the core board of the system, and a main control unit, a storage unit, a clock unit, and an antenna are provided on the first PCB board 1. The second PCB board 2 is the power supply and communication interface board of the system.

[0022] As Figure 2 shown, the first PCB board 1 includes 1 layer of RO4830 high-speed board material L1 and 3 layers of FR4 ordinary board materials (L2, L3, and L4); the same signal lines of each layer of board materials (L1, L2, L3, and L4) are connected through metallized holes.

[0023] As Figure 3 shown, the second PCB board 2 includes 2 layers of FR4 ordinary board materials (L1' and L2'), and the same signal lines of each layer of board materials (L1' and L2') are connected through metallized holes.

[0024] As Figure 4 shown, the welding component 3 includes a metallized postage hole 31 and a metal pad 32. The metallized postage hole 31 is provided on the first PCB board 1, and the metal pad 32 is provided on the second PCB board 2. The positions of the metallized postage hole 31 and the metal pad 32 correspond one by one. The aperture of the metallized postage hole 31 is d1, and d1 is 1.3 mm, which is convenient for solder climbing during reflow soldering.

[0025] The bypass capacitor distribution area of the main control unit of the first PCB board 1 is S1, which conforms to the EMC principle. A slot is provided on the second PCB board at the position corresponding to S1, and the slot area is S2, and S2 > S1. Ensure that the bypass capacitor is not interfered during welding.

[0026] A first heat dissipation window S3 is opened on the first PCB board 1, and a second heat dissipation window S4 is opened on the second PCB board 2. The positions of the first heat dissipation window S3 and the second heat dissipation window S4 correspond to each other and can be combined together during soldering with solder paste. The heat energy of the first PCB board 1 can be conducted to the second PCB board 2 to balance the temperature of the PCB board and maintain stable performance.

[0027] The above are only embodiments of the present utility model, and common knowledge such as specific structures and characteristics known in the solutions is not described in detail herein. For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A barrier radar PCB board with a laminated structure, characterized in that Comprising: A first PCB board (1), a second PCB board (2), and a welding component (3), wherein the first PCB board (1) and the second PCB board (2) are connected by the welding component (3); the first PCB board (1) comprises 1 layer of RO4830 high-speed board material and 3 layers of FR4 general board material; the same signal lines of each layer of board material are connected by metallized holes.

2. The barrier gate radar PCB board of the laminated structure according to claim 1, characterized in that: The second PCB board (2) comprises 2 layers of FR4 general board material, and the same signal lines of each layer of board material are connected by metallized holes.

3. The barrier radar PCB of the laminated structure according to claim 2, characterized in that: The welding component (3) comprises metallized postage holes (31) and metal pads (32), the metallized postage holes (31) are arranged on the first PCB board (1), and the metal pads (32) are arranged on the second PCB board (2).

4. The barrier gate radar PCB board of the laminated structure according to claim 3, characterized in that: A main control unit, a storage unit, a clock unit, and an antenna are arranged on the first PCB board (1).

5. The barrier gate radar PCB board of the laminated structure according to claim 3, characterized in that: The bypass capacitor distribution area of the main control unit on the first PCB board (1) is S1, a slot is arranged on the second PCB board at the corresponding position of S1, and the slot area is S2, and S2 > S1.

6. The barrier gate radar PCB board of the laminated structure according to claim 5, characterized in that: A first heat dissipation window S3 is opened on the first PCB board (1), a second heat dissipation window S4 is opened on the second PCB board (2), and the first heat dissipation window S3 and the second heat dissipation window S4 are in corresponding positions.

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