Adsorption device for SMT (Surface Mount Technology)

Abstract

The utility model discloses an adsorption device for SMT (surface mount technology), which belongs to the technical field of SMT and comprises a mounting seat, two hinge rods are movably hinged to the bottom end of the mounting seat, rotating nuts are rotatably connected to two ends of each hinge rod, and telescopic screws are in threaded connection in the four rotating nuts. Four telescopic screw rods are arranged on the mounting base, the four telescopic screw rods are slidably inserted into the two hinge rods respectively, the ends, away from each other, of the four telescopic screw rods are fixedly connected with suction cups, and an adjusting mechanism is arranged between the mounting base and the two hinge rods and used for adjusting the angle between the two hinge rods so as to achieve adjustment of the positions of the four suction cups; according to the utility model, the length and the angle are adjusted, so that the four suckers can correspondingly adsorb the four corners of the PCB, components on the PCB cannot be damaged, the suction force is uniformly distributed, and the device can adapt to the PCBs with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT chip mounting, and more specifically, to an adsorption device for SMT chip mounting. Background Technique

[0002] SMT is surface mounting technology (surface mount technology), which is currently the most popular technology and process in the electronic assembly industry. SMT chip mounting refers to the abbreviation of a series of process flows processed on the basis of a PCB, and the PCB is a printed circuit board.

[0003] At present, there are many processes in the processing of PCB boards in the SMT chip mounting process. An adsorption device is often used to grab the PCB board between each process to transfer the PCB board between different processes. However, most of the existing adsorption devices usually have a fixed size, and the way of increasing or decreasing the suction cups is used to adjust the suction position. When the size of the PCB board is larger than the size of the adsorption device, it is difficult for the fixed-size adsorption device to evenly distribute the suction force on the PCB board, which easily causes the PCB board to fall. Moreover, the suction cups are prone to adsorb the components on the PCB board, resulting in damage to the components. Content of the Utility Model

[0004] 1. Technical Problems to be Solved

[0005] Aiming at the problems existing in the prior art, the purpose of the utility model is to provide an adsorption device for SMT chip mounting, aiming to solve the problems that when the size of the PCB board in the prior art is larger than the size of the adsorption device, it is difficult for the fixed-size adsorption device to evenly distribute the suction force on the PCB board, which easily causes the PCB board to fall, and moreover, the suction cups are prone to adsorb the components on the PCB board, resulting in damage to the components.

[0006] 2. Technical Solutions

[0007] To solve the above problems, the utility model adopts the following technical solutions:

[0008] An adsorption device for SMT chip mounting includes a mounting base. Two hinge rods are movably hinged to the bottom end of the mounting base. Rotating nuts are rotatably connected to both ends of the two hinge rods. Telescopic screws are threadedly connected to the four rotating nuts, and the four telescopic screws are respectively slidably inserted into the two hinge rods. Suction cups are fixedly connected to the ends of the four telescopic screws away from each other. An adjustment mechanism is arranged between the mounting base and the two hinge rods, and the adjustment mechanism is used to adjust the angle between the two hinge rods to realize the adjustment of the positions of the four suction cups.

[0009] As a preferred embodiment of the present utility model, the adjusting mechanism includes a bidirectional screw, two travel nuts and two connecting rods. The bidirectional screw is rotatably connected within the mounting base. Both of the two travel nuts are threadedly connected to the bidirectional screw. The two connecting rods are respectively movably hinged to the bottom ends of the two travel nuts through hinge shafts, and the two connecting rods are movably hinged to the two hinge rods through hinge shafts.

[0010] As a preferred embodiment of the present utility model, two fixing rods are fixedly connected within the mounting base, and both of the two travel nuts are slidably connected between the two fixing rods.

[0011] As a preferred embodiment of the present utility model, two stabilizing rods are fixedly connected within each of the two hinge rods, and the four telescopic screws are respectively slidably connected to the outer surfaces of the four stabilizing rods.

[0012] As a preferred embodiment of the present utility model, two mounting blocks are fixedly connected to the mounting base, and mounting holes are formed in both of the two mounting blocks.

[0013] 3. Beneficial effects

[0014] Compared with the prior art, the advantages of the present utility model are as follows:

[0015] (1) In this solution, the four rotating nuts cooperate with the four telescopic screws to adjust the distance between the four suction cups. The adjusting mechanism adjusts the angles of the four suction cups. The adjustment of the length and angle enables the four suction cups to adsorb at the four corners of the PCB board, without damaging the components on the PCB board. The suction force is evenly distributed, and it can adapt to PCB boards of different sizes. Description of the drawings

[0016] Figure 1 is the front view of the present utility model;

[0017] Figure 2 is the three-dimensional view of the present utility model;

[0018] Figure 3 is the exploded view of the present utility model;

[0019] Figure 4 is the cross-sectional view of the present utility model.

[0020] Explanation of the reference numerals in the drawings:

[0021] 1. Mounting base; 2. Hinge rod; 3. Rotating nut; 4. Telescopic screw; 5. Suction cup; 61. Bidirectional screw; 62. Travel nut; 63. Connecting rod; 7. Fixing rod; 8. Stabilizing rod; 9. Mounting block; 10. Mounting hole. Specific implementation manners

[0022] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0023] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0024] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "provided with", "sheathed / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] Embodiment:

[0026] Please refer to Figures 1-4 , a suction device for SMT patching, including a mounting base 1. Two hinge rods 2 are movably hinged at the bottom end of the mounting base 1. Rotating nuts 3 are rotatably connected to both ends of the two hinge rods 2. Telescopic screws 4 are threadedly connected inside the four rotating nuts 3, and the four telescopic screws 4 are respectively slidably inserted into the two hinge rods 2. Suction cups 5 are fixedly connected to the ends of the four telescopic screws 4 away from each other. An adjusting mechanism is provided between the mounting base 1 and the two hinge rods 2. The adjusting mechanism is used to adjust the angle between the two hinge rods 2 to realize the adjustment of the positions of the four suction cups 5.

[0027] In this embodiment, when sucking and grasping PCB boards of different sizes, the two hinge rods 2 are controlled to rotate through the adjusting mechanism, changing the angles of the four suction cups 5 to make the four suction cups 5 adapt to PCB boards of different sizes. By rotating the four rotating nuts 3, the four telescopic screws 4 are telescoped inside the two hinge rods 2, thereby adjusting the positions of the four suction cups 5 so that the four suction cups 5 adsorb at the four corners of the PCB board.

[0028] Specifically, the adjusting mechanism includes a bidirectional screw 61, two travel nuts 62, and two connecting rods 63. The bidirectional screw 61 is rotatably connected within the mounting base 1. The two travel nuts 62 are both threadedly connected to the bidirectional screw 61. The two connecting rods 63 are respectively movably hinged to the bottoms of the two travel nuts 62 through hinge shafts, and the two connecting rods 63 are movably hinged to the two hinge rods 2 through hinge shafts.

[0029] In this embodiment, two opposite-direction threads are provided on the surface of the bidirectional screw 61. The two travel nuts 62 are respectively located on the two opposite threads. By rotating the bidirectional screw 61, the two travel nuts 62 move in opposite directions. When the two travel nuts 62 move, the angles between the two hinge rods 2 are adjusted through the two connecting rods 63, so as to adjust the angles between the four suction cups 5 to adapt to PCB boards of different sizes.

[0030] Specifically, two fixing rods 7 are fixedly connected within the mounting base 1, and the two travel nuts 62 are both slidably connected between the two fixing rods 7.

[0031] In this embodiment, the two fixing rods 7 assist the two travel nuts 62 in sliding, so that the two travel nuts 62 remain stable when moving.

[0032] Specifically, two stabilizing rods 8 are fixedly connected within each of the two hinge rods 2, and the four telescopic screws 4 are respectively slidably connected to the outer surfaces of the four stabilizing rods 8.

[0033] In this embodiment, the four stabilizing rods 8 assist the four telescopic screws 4 in sliding, so that the four telescopic screws 4 can perform stable telescoping.

[0034] Specifically, two mounting blocks 9 are fixedly connected to the mounting base 1, and mounting holes 10 are formed in both of the two mounting blocks 9.

[0035] In this embodiment, the mounting base 1 is installed and used through the mounting holes 10 in the two mounting blocks 9, and the mounting holes 10 are fitted with bolts for installation.

[0036] Working principle: When adsorbing and grasping PCB boards of different sizes, by rotating the bidirectional screw 61, the two travel nuts 62 move in opposite directions. When the two travel nuts 62 move, the angles between the two hinge rods 2 are adjusted through the two connecting rods 63, so as to change the angles between the four suction cups 5 to adapt to PCB boards of different sizes. Then, by rotating the four rotating nuts 3, the four telescopic screws 4 are telescoped within the two hinge rods 2, thereby adjusting the positions of the four suction cups 5 so that the four suction cups 5 adsorb at the four corners of the PCB board.

[0037] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its improved concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present utility model.

Claims

1. An adsorption device for SMT chip mounting, comprising a mounting base (1), characterized in that: The bottom end of the mounting base (1) is movably hinged with two hinge rods (2). Both ends of the two hinge rods (2) are rotatably connected with rotating nuts (3). Four telescopic screws (4) are threadedly connected in the four rotating nuts (3), and the four telescopic screws (4) are respectively slidably inserted into the two hinge rods (2). The remote ends of the four telescopic screws (4) are fixedly connected with suction cups (5). An adjusting mechanism is arranged between the mounting base (1) and the two hinge rods (2). The adjusting mechanism is used to adjust the angle between the two hinge rods (2) so as to realize the adjustment of the positions of the four suction cups (5).

2. The adsorption device for SMT chip mounter according to claim 1, characterized in that: The adjusting mechanism includes a bidirectional screw (61), two travel nuts (62) and two connecting rods (63). The bidirectional screw (61) is rotatably connected in the mounting base (1). The two travel nuts (62) are both threadedly connected to the bidirectional screw (61). The two connecting rods (63) are respectively movably hinged to the bottom ends of the two travel nuts (62) through hinge shafts, and the two connecting rods (63) are movably hinged to the two hinge rods (2) through hinge shafts.

3. The adsorption device for SMT chip mounting according to claim 2, wherein: Two fixing rods (7) are fixedly connected in the mounting base (1), and the two travel nuts (62) are both slidably connected between the two fixing rods (7).

4. An adsorption device for SMT chip mounting according to claim 3, characterized in that: Two stabilizing rods (8) are fixedly connected in each of the two hinge rods (2), and the four telescopic screws (4) are respectively slidably connected to the outer surfaces of the four stabilizing rods (8).

5. An adsorption device for SMT chip mounter according to claim 4, characterized in that: Two mounting blocks (9) are fixedly connected to the mounting base (1), and mounting holes (10) are formed in the two mounting blocks (9).

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