Heat conduction structure of MOS tube of power board of electronic speed regulator

Abstract

The utility model discloses a heat conduction structure of an MOS tube of a power board of an electronic speed regulator, which comprises a shell assembly, a circuit board, an MOS tube pad pin, an MOS tube and a heat conduction piece, the circuit board, the MOS tube pad pin, the MOS tube and the heat conduction piece are all arranged in the shell assembly, the MOS tube pad pin, the MOS tube and the heat conduction piece are all arranged on the circuit board, and the MOS tube pad pin, the MOS tube and the heat conduction piece are arranged in the shell assembly. The top of the circuit board is provided with a plurality of MOS tube bonding pad pins and a plurality of MOS tubes, the MOS tube bonding pad pins and the MOS tubes are arranged adjacently, and heat conduction pieces are arranged above the MOS tubes. According to the utility model, the heat exporting capability of the MOS tube is greatly increased, so that the heat of the MOS tube is rapidly conducted to the heat dissipation shell assembly through a method of opening a window and exposing a copper sheet on the lower surface of the circuit board, and then the heat is volatilized through the heat dissipation shell assembly, thereby achieving the purpose of more effectively and rapidly reducing the working temperature of the MOS tube. The reliability, the stability and the service life of the electronic speed regulator are improved; therefore, the structure is simple and compact, assembling is easy, and practicability is high.

Description

Technical Field

[0001] The utility model belongs to an electronic speed regulator, in particular to a heat conduction structure of a MOS tube of a power board of the electronic speed regulator. Background Art

[0002] The reliability and stability of the electronic speed controller plays a vital role in the performance of drone products. At present, the common electronic speed controller MOS tubes on the market use copper sheets as heat conduction media, and quickly conduct the heat of the MOS tube to the aluminum heat sink through the heat conduction parts, and then evaporate the heat through the aluminum heat sink to achieve the purpose of reducing the working temperature of the MOS tube, thereby improving the reliability, stability and service life of the electronic speed controller. The heat of the speed controller MOS tube of this design can only be conducted through the heat conduction parts on the surface of the PCB board, and the actual heat conduction effect is very limited. Utility Model Content

[0003] The purpose of the utility model is to provide a heat conduction structure of a MOS tube of an electronic speed regulator power board, aiming to solve the problems existing in the background technology. To achieve the above purpose, the technical solution adopted by the utility model is:

[0004] A heat conduction structure of a MOS tube of a power board of an electronic speed regulator comprises a shell assembly, a circuit board, a MOS tube solder pad pin, a MOS tube and a heat conduction member, wherein the circuit board, the MOS tube solder pad pin, the MOS tube and the heat conduction member are all mounted inside the shell assembly, the MOS tube solder pad pin, the MOS tube and the heat conduction member are all mounted on the circuit board, a plurality of MOS tube solder pad pins and a plurality of MOS tubes are mounted on the top of the circuit board, the MOS tube solder pad pin and the MOS tube are placed adjacent to each other, and a heat conduction member is mounted above the MOS tube.

[0005] Preferably, a window copper sheet is also provided at the bottom of the circuit board, and the window copper sheet is connected to the solder pad pin of the MOS tube.

[0006] Preferably, the housing assembly comprises a heat dissipation upper housing and a heat dissipation lower housing, and the heat dissipation upper housing and the heat dissipation lower housing are detachably connected by screws.

[0007] Preferably, the heat dissipation upper shell and the heat dissipation lower shell are both made of aluminum.

[0008] Preferably, a plurality of heat dissipation fins are provided on the surfaces of the heat dissipation upper shell and the heat dissipation lower shell.

[0009] Preferably, a thermally conductive silicone sheet is provided between the heat conducting member and the heat dissipation upper shell and between the circuit board and the heat dissipation lower shell.

[0010] Preferably, the thermally conductive silicone sheet is solid or liquid.

[0011] Preferably, a plurality of heat dissipation holes are provided on the surface of the heat conducting member.

[0012] Preferably, the heat conducting member is a copper heat conducting sheet.

[0013] Preferably, both sides of the heat conducting member are bent, and both sides of the heat conducting member are attached to the MOS transistor pad pins.

[0014] The beneficial effects of the present utility model: Through the structural design of opening a window on the lower surface of the speed governor circuit board to expose the copper foil, the heat of the MOS transistor on the upper surface of the circuit board can be quickly conducted to the position where the copper foil is exposed through the window on the lower surface of the circuit board. The MOS transistor pad pins are connected to the position where the copper foil is exposed through the window on the circuit board. Then, the heat at the position of the copper foil exposed through the window on the lower surface of the circuit board is conducted to the heat dissipation housing assembly through a heat conducting medium, and then volatilized through the heat dissipation housing assembly, greatly increasing the heat dissipation capacity of the MOS transistor. The heat of the MOS transistor is quickly conducted to the heat dissipation housing assembly through the method of opening a window on the lower surface of the circuit board to expose the copper foil, and then the heat is volatilized through the heat dissipation housing assembly, so as to achieve the purpose of more effectively and quickly reducing the working temperature of the MOS transistor, improving the reliability, stability and service life of the electronic speed governor; Therefore, the structure is simple and compact, the assembly is simple, and the practicability is very strong. Description of the Drawings

[0015] Figure 1 It is an overall schematic diagram provided by an embodiment of the present utility model;

[0016] Figure 2 It is an overall exploded structural schematic diagram provided by an embodiment of the present utility model;

[0017] Figure 3 It is a partial structural schematic diagram provided by an embodiment of the present utility model;

[0018] Figure 4 It is a partial structural schematic diagram provided by an embodiment of the present utility model.

[0019] Among them, each reference numeral in the figure:

[0020] 1. Housing assembly; 11. Upper heat dissipation shell; 12. Lower heat dissipation shell; 2. Circuit board; 3. MOS transistor pad pins; 4. MOS transistor; 5. Heat conducting member; 6. Windowed copper foil; 7. Heat conducting silicone sheet; 8. Heat dissipation fins; 9. Heat dissipation holes. Detailed Embodiments

[0021] In order to facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present utility model can be understood more thoroughly and comprehensively.

[0022] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation. The terms "upper end", "lower end", "left side", "right side", "front end", "rear end" and similar expressions used herein refer to the positional relationship in the accompanying drawings.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used herein in the specification of this utility model are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0024] The technical solutions of this patent will be further described in detail below in conjunction with specific embodiments.

[0025] As Figures 1 to 4 shown, an embodiment of the present utility model provides a heat conduction structure for the MOS tube of an electronic speed governor power board, which includes a housing assembly 1, a circuit board 2, MOS tube pad pins 3, a MOS tube 4 and a heat conduction member 5. The circuit board 2, the MOS tube pad pins 3, the MOS tube 4 and the heat conduction member 5 are all installed inside the housing assembly 1. The MOS tube pad pins 3, the MOS tube 4 and the heat conduction member 5 are all installed on the circuit board 2. A plurality of MOS tube pad pins 3 and a plurality of MOS tubes 4 are installed on the top of the circuit board 2. The MOS tube pad pins 3 and the MOS tubes 4 are arranged adjacent to each other. A heat conduction member 5 is installed above the MOS tube 4.

[0026] In the embodiment, a windowed copper sheet 6 is further provided at the bottom of the circuit board 2, and the windowed copper sheet 6 is communicated with the MOS tube pad pins 3.

[0027] In the embodiment, the housing assembly 1 includes a heat dissipation upper shell 11 and a heat dissipation lower shell 12, and the heat dissipation upper shell 11 and the heat dissipation lower shell 12 are detachably connected by screws.

[0028] In the embodiment, both the heat dissipation upper shell 11 and the heat dissipation lower shell 12 are made of aluminum.

[0029] In the embodiment, a plurality of heat dissipation fins 8 are provided on the surfaces of both the heat dissipation upper shell 11 and the heat dissipation lower shell 12.

[0030] In the embodiment, a thermal conductive silica gel sheet 7 is provided between the thermal conductive member 5 and the upper heat dissipation case 11, and between the circuit board 2 and the lower heat dissipation case 12.

[0031] In the embodiment, the thermal conductive silica gel sheet 7 is solid or liquid.

[0032] In the embodiment, a plurality of heat dissipation holes 9 are formed on the surface of the thermal conductive member 5.

[0033] In the embodiment, the thermal conductive member 5 is a thermal conductive copper sheet.

[0034] In the embodiment, both sides of the thermal conductive member 5 are bent, and both sides of the thermal conductive member 5 are attached to the MOS transistor pad pins 3.

[0035] The above embodiments are only used to illustrate the present invention, rather than limiting the present invention. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention. The patent protection scope of the present invention shall be defined by the claims.

Claims

1. A heat conduction structure for a MOS transistor on a power board of an electronic speed governor, characterized in that: It includes a housing assembly, a circuit board, MOS transistor pad pins, a MOS transistor, and a heat conducting member. The circuit board, the MOS transistor pad pins, the MOS transistor, and the heat conducting member are all installed inside the housing assembly. The MOS transistor pad pins, the MOS transistor, and the heat conducting member are all installed on the circuit board. A plurality of the MOS transistor pad pins and a plurality of the MOS transistors are installed on the top of the circuit board. The MOS transistor pad pins and the MOS transistors are arranged adjacent to each other. The heat conducting member is installed above the MOS transistor.

2. The heat conduction structure of the MOS transistor on the power board of the electronic speed governor according to claim 1, wherein: A windowed copper sheet is further provided at the bottom of the circuit board. The windowed copper sheet is communicated with the MOS transistor pad pins.

3. The heat conduction structure of the MOS tube of the electronic speed governor power board according to claim 2, characterized in that: The housing assembly includes a heat dissipation upper shell and a heat dissipation lower shell. The heat dissipation upper shell and the heat dissipation lower shell are detachably connected by screws.

4. The heat conduction structure of the MOS transistor on the power board of an electronic speed governor according to claim 3, characterized in that: Both the heat dissipation upper shell and the heat dissipation lower shell are made of aluminum.

5. The heat conduction structure of the MOS tube of the electronic speed governor power board according to claim 4, characterized in that: A plurality of heat dissipation fins are provided on the surfaces of both the heat dissipation upper shell and the heat dissipation lower shell.

6. The heat conduction structure of the MOS tube of the electronic speed governor power board according to claim 3, characterized in that: Thermal conductive silicone sheets are provided between the heat conducting member and the heat dissipation upper shell and between the circuit board and the heat dissipation lower shell.

7. The heat conduction structure of the MOS tube of the electronic speed governor power board according to claim 6, characterized in that: The thermal conductive silicone sheet is solid or liquid.

8. The heat conduction structure of the MOS tube of the electronic speed governor power board according to claim 1, characterized in that: A plurality of heat dissipation holes are formed on the surface of the heat conducting member.

9. The heat conduction structure of the MOS transistor on the power board of the electronic speed governor according to claim 8, characterized in that: The heat conducting member is a heat conducting copper sheet.

10. The heat conduction structure of the MOS transistor on the power board of the electronic speed governor according to claim 7, characterized in that: Both sides of the heat conducting member are bent, and both sides of the heat conducting member are attached to the MOS transistor pad pins.

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