High-power ultrasonic transducer
By introducing a double-layer shock absorption and vibration isolation structure and temperature control device into the high-power ultrasonic transducer, the problems of easy damage and high-pressure breakdown at high temperatures are solved, efficient protection and temperature control effects are achieved, and working efficiency is improved.
Patent Information
- Application Number
- CN202422010071.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-19
AI Technical Summary
Existing high-power ultrasonic transducers are prone to damage at high temperatures and lack effective temperature control and protection structures, resulting in low working efficiency and risk of high-pressure breakdown and burning.
A structure including the front pressure gland, the rear pressure gland, the fixing disc, the piezoelectric assembly, the prestressed fastener and the shield is designed, and a double-layer shock absorption and vibration isolation structure is formed to provide a shielding, protection and temperature control environment.
It improves the working efficiency of the transducer, reduces vibration losses, prevents high-pressure breakdown, ensures that the temperature is within a safe range, avoids damage, and is simple and easy to disassemble, and is cheap.
Smart Images
Figure CN223128546U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of high-power ultrasonic applications, and particularly to a high-power ultrasonic transducer. Background Art
[0002] In the field of high-power ultrasonic applications, an ultrasonic transducer is an important component of an ultrasonic system. The ultrasonic transducer is used to convert the input electrical energy into ultrasonic mechanical vibrations and is the vibration excitation source of the ultrasonic system.
[0003] Piezoelectric ceramics are commonly used as electro-acoustic conversion devices in ultrasonic transducers. An ultrasonic transducer using piezoelectric ceramics as an electro-acoustic conversion device is also called a piezoelectric ceramic ultrasonic transducer. When a piezoelectric ceramic ultrasonic transducer works, the temperature must be lower than the Curie temperature of the piezoelectric ceramics. Currently, the Curie temperatures of piezoelectric ceramics are very low, so the working temperatures of current piezoelectric ceramic ultrasonic transducers are relatively low, generally below 60 degrees Celsius. In addition, a piezoelectric ceramic ultrasonic transducer has a certain electro-acoustic conversion efficiency. When working, part of the electrical energy is converted into ultrasonic mechanical vibrations, and part of it is lost and finally converted into heat energy, which will cause the temperature of the transducer to rise during operation.
[0004] Therefore, for a high-power ultrasonic transducer, on the one hand, it is required to have high working efficiency, and on the other hand, it is necessary to have a necessary temperature control structure. Otherwise, it will not be able to maintain the normal working temperature and will eventually be damaged due to excessive temperature. At the same time, for a high-power ultrasonic transducer with a piezoelectric ceramic structure, the working drive voltage is very high, and good external shielding and protection must be provided during operation. Otherwise, in the lightest case, it may cause the transducer to be burned out by high-voltage breakdown, and in the most serious case, it may cause a high-voltage electric shock safety accident. Summary of the Utility Model
[0005] The purpose of this application is to provide a high-power ultrasonic transducer to solve the problems existing in the background art.
[0006] The embodiments of this application can be realized through the following technical solutions:
[0007] A high-power ultrasonic transducer includes a front gland, a rear gland, a fixing disk, a piezoelectric component, a prestress fastener, and a shield. One end of the prestress fastener is connected to the rear cover, passes through the rear gland, the piezoelectric component, and the fixing disk, and is connected to the front gland. The fixing disk and the piezoelectric component are fastened between the front gland and the rear gland, and the shield is fixed on the fixing disk to wrap the front gland, the rear gland, the piezoelectric component, the fixing disk, and the prestress fastener.
[0008] Further, a shock isolation pad is provided on the inner circumference of the shield. The shock isolation pad is sleeved between the fixed disk and the shield. The fixed disk is a sheet-like structure, and a connection port is provided on the outer circumference of the fixed disk. The fixed disk is connected to the shock isolation pad and the shield through the connection port.
[0009] Further, the shield is a circular or square or polygonal sleeve structure. Fixing holes are provided around the barrel wall of the shield near the fixed disk. The fixing holes are aligned with the connection ports on the fixed disk, and the shield is tightly connected to the outer circumference of the fixed disk by passing fasteners through the fixing holes and connecting them to the connection ports.
[0010] Further, vibration isolation grooves are provided around the barrel wall of the shield near the fixed disk. The vibration isolation grooves are provided on both sides or the circumference of the fixing holes.
[0011] Further, the cross-sectional shape of the shock isolation pad is the same as that of the shield, and the shock isolation pad is made of shock isolation material.
[0012] Further, a temperature control device is also included. The temperature control device includes a heat dissipation port, a temperature sensing groove provided on the outer circumference or edge of the fixed disk, a heat dissipation part installed on the shield, and a temperature sensing part installed in the temperature sensing groove. The heat dissipation port penetrates the fixed disk along the axial direction of the fixed disk.
[0013] Further, the fixed disk is arranged in the vibration node area. The end faces of the fixed disk are respectively provided with a first vibration coupling surface and a second vibration coupling surface; the first vibration coupling surface abuts against the front gland or is integrated with the front gland, and the second vibration coupling surface abuts against the piezoelectric component; when there are two groups of piezoelectric components, the first vibration coupling surface abuts against one end of the first piezoelectric component, and the end of the first piezoelectric component facing away from the first vibration coupling surface abuts against the front gland; the second vibration coupling surface abuts against one end of the second piezoelectric component, and the end of the second piezoelectric component facing away from the second vibration coupling surface abuts against the rear gland.
[0014] Further, the first vibration coupling surface and the second vibration coupling surface are planar structures and are parallel to each other.
[0015] Further, a through hole is coaxially provided at the axis of the fixed disk. The through hole is provided between the first vibration coupling surface and the second vibration coupling surface and vertically penetrates the first vibration coupling surface and the second vibration coupling surface.
[0016] Further, the piezoelectric component is formed by integrating a piezoelectric ceramic sheet and an electrode sheet, and the piezoelectric ceramic sheets and the electrode sheets are arranged alternately; when the number of piezoelectric components is one group, the piezoelectric component is located between the fixed disk and the rear gland; when the number of piezoelectric components is two groups, one group of the piezoelectric components is located between the fixed disk and the front gland, and the other group is located between the fixed disk and the rear gland.
[0017] The high-power ultrasonic transducer provided by the embodiment of the present application has at least the following beneficial effects:
[0018] 1. The present application is provided with a double-layer shock absorption and vibration isolation structure, which can reduce vibration loss and improve the working efficiency of the transducer: First, a shock isolation pad is provided, and the shock isolation pad is sleeved between the fixed disk and the shield. When the shield is fixed on the fixed disk through the shock isolation pad, the shock isolation pad performs the first-level shock absorption and vibration isolation; Second, the shield is provided with vibration isolation grooves, which perform the second-level shock absorption and vibration isolation.
[0019] 2. The fixed disk of the present application is arranged in the vibration node area and is in a micro-vibration or non-vibration state during operation, which is suitable for being fixedly clamped. And the fixed disk is provided with connection ports, and the protective cover can be directly fixed on the fixed disk through conventional standard fasteners. The structure is simple, the disassembly is convenient, the cost is low, and it is easy to promote.
[0020] 3. The present application is provided with a fixed disk, and the fixed disk is directly connected to the piezoelectric component. The fixed disk is provided with a heat dissipation port and a temperature sensing groove, and a temperature control device is arranged in the temperature sensing groove, which can control the piezoelectric component to work within a safe temperature range.
[0021] 4. The present application is provided with a protective cover. On the one hand, the protective cover can provide shielding and protection for the transducer, and on the other hand, it can provide a ventilation and heat dissipation and temperature control environment for the transducer, and it is convenient to install electrical connection devices and heat dissipation fans. Description of the Drawings
[0022] Figure 1 It is a three-dimensional structure diagram of the high-power ultrasonic transducer according to Embodiment 1 of the present application.
[0023] Figure 2 It is a three-dimensional exploded view of the structure of the high-power ultrasonic transducer according to Embodiment 1 of the present application.
[0024] Figure 3 It is a structure diagram of the fixed disk according to Embodiment 1 of the present application.
[0025] Figure 4 It is a sectional view of the structure of the high-power ultrasonic transducer according to Embodiment 1 of the present application.
[0026] Figure 5 It is a three-dimensional structure diagram of the high-power ultrasonic transducer according to Embodiment 2 of the present application.
[0027] Figure 6This is the three-dimensional exploded view of the high-power ultrasonic transducer structure in the second embodiment of the present application.
[0028] Figure 7 This is the sectional view of the high-power ultrasonic transducer structure in the second embodiment of the present application.
[0029] Figure 8 This is the three-dimensional view of the high-power ultrasonic transducer structure in the third embodiment of the present application.
[0030] Figure 9 This is the three-dimensional exploded view of the high-power ultrasonic transducer structure in the third embodiment of the present application.
[0031] Figure 10 This is the structure diagram of the fixing plate in the third embodiment of the present application.
[0032] Figure 11 This is the sectional view of the high-power ultrasonic transducer structure in the third embodiment of the present application.
[0033] Reference numerals: 1 - front gland, 1a - vibration input end face, 2 - fixing plate, 2a - through hole, 2b - connection structure, 2c - heat dissipation port, 2d - temperature sensing groove, 2e - first vibration coupling surface, 2f - second vibration coupling surface, 3 - electrode plate, 4 - piezoelectric ceramic plate, 5 - rear gland, 6 - bolt, 7 - nut, 8 - vibration isolation pad, 9 - shield, 9a - fixing hole, 9b - vibration isolation groove, 9c - heat dissipation hole, 10 - fastener, 11 - rear end cover, 12 - front end cover, 13 - screw. Detailed embodiments
[0034] Hereinafter, the present application will be further described based on preferred embodiments with reference to the drawings.
[0035] The terms used in this specification are for the purpose of describing the embodiments of the present application, but are not intended to limit the present application. Unless otherwise clearly defined and limited, if the terms "set", "connected", "connected" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be specifically understood.
[0036] In addition, in the description of the embodiments of the present application, for the convenience of understanding, various components in the drawings are enlarged or reduced, but this approach is not intended to limit the protection scope of the present application.
[0037] Embodiment 1
[0038] The first embodiment of the present application provides a high-power ultrasonic transducer. Please refer to Figures 1 to 4; A high-power ultrasonic transducer includes a front gland 1, a rear gland 5, a fixing plate 2, a piezoelectric component, and a prestress fastener. One end of the prestress fastener is connected to the rear gland 5, passes through the rear gland 5, the piezoelectric component, and the fixing plate 2, and is connected to the front gland 1; the fixing plate 2 and the piezoelectric component are fastened between the front gland 1 and the rear gland 5. The fixing plate 2 is in close contact with the front gland 1, and the piezoelectric component is in close contact with the rear gland 5, connecting the rear gland 5, the piezoelectric component, the fixing plate 2, and the front gland 1 in series.
[0039] Specifically, a shield 9 is provided outside the high-power ultrasonic transducer. The shield 9 is of a circular sleeve structure, which wraps the fixing plate 2, the piezoelectric component, and the prestress fastener. A rear end cover 11 is provided at one end of the shield 9 away from the front gland 1, so that the transducer can play a good shielding and protection role during operation, preventing the transducer from being burned out by high-voltage breakdown or causing safety accidents.
[0040] Specifically, fixing holes 9a are provided around the barrel wall of the shield 9 near the fixing plate 2. A connection port 2b is provided on the circumferential outer side of the fixing plate 2. The fixing holes 9a are aligned with the connection port 2b on the fixing plate 2. The shield 9 is fastened to the outer periphery of the fixing plate 2 by a fastener 10 passing through the fixing holes 9a and connecting to the connection port 2b; the fastener 10 is a fastening screw or a fastening pin, but is not limited thereto, and is used to fasten the shield 9.
[0041] Specifically, the shield 9 is provided with heat dissipation holes 9c, which can provide a temperature-controlled environment for heat dissipation of the transducer, prevent the transducer from being damaged due to excessive temperature during operation, and at the same time, a structural fan can be installed to achieve a larger heat dissipation space.
[0042] Specifically, a vibration isolation pad 8 is further provided between the fixing plate 2 and the shield 9. The vibration isolation pad 8 is sleeved between the fixing plate 2 and the shield 9. When the shield 9 is fixed on the fixing plate 2 through the vibration isolation pad 8, the vibration isolation pad 8 performs the first-level shock absorption and vibration isolation; at the same time, vibration isolation grooves 9b are provided around the barrel wall of the shield 9 near the fixing plate 2. The vibration isolation grooves 9b are provided on both sides or the circumferential side of the fixing holes 9a, and can also play a role in shock absorption when using fasteners for connection; the vibration isolation pad 8 is of an annular gasket structure, and the vibration isolation pad 8 is made of vibration isolation material; the double-layer shock absorption and vibration isolation structure can reduce vibration loss and improve the working efficiency of the transducer.
[0043] Specifically, the fixed disk 2 has a sheet-like structure. The transducer further includes a temperature control device, which includes a heat dissipation port 2c, a temperature sensing groove 2d provided on the circumferential outer side or edge of the fixed disk 2, a heat dissipation part installed on the shield 9, and a temperature sensing part installed in the temperature sensing groove 2d. The heat dissipation port 2c penetrates the fixed disk 2 along the axial direction of the fixed disk 2. The heat dissipation port 2c is an open slot, and there are multiple heat dissipation ports 2c, which are used for ventilation and heat dissipation to keep the operating temperature of the transducer within the safe limit. The temperature sensing groove 2d is a square slot, which is also provided on the outer periphery of the fixed disk 2.
[0044] In some specific embodiments of the present application, the temperature sensing part is a temperature control switch or a temperature control sensor, which can detect whether the temperature of the transducer is abnormal and prevent and control it in time.
[0045] In some specific embodiments of the present application, the heat dissipation part is a heat dissipation fan.
[0046] Specifically, a connection port 2b is provided on the outer peripheral side of the fixed disk. The fixed disk 2 is connected to the shield 9 and the shock isolation pad 8 through the connection port 2b.
[0047] Specifically, the fixed disk 2 is arranged in the vibration node area. The end faces of the fixed disk 2 are respectively provided with a first vibration coupling surface 2e and a second vibration coupling surface 2f. The first vibration coupling surface 2e abuts against the front gland 1 or is integrated with the front gland 1, and the second vibration coupling surface 2f abuts against the piezoelectric component.
[0048] Specifically, the first vibration coupling surface 2e and the second vibration coupling surface 2f are of a planar structure and are parallel to each other.
[0049] Specifically, a through hole 2a is coaxially provided at the axis of the fixed disk 2. The through hole 2a is provided between the first vibration coupling surface 2e and the second vibration coupling surface 2f and vertically penetrates the first vibration coupling surface 2e and the second vibration coupling surface 2f, which is convenient for the close fitting of the rear gland 5, the piezoelectric component, the fixed disk 2 and the front gland 1.
[0050] Specifically, one end of the front gland 1 facing the fixed disk 2 is a vibration input end face 1a, and the end facing away from the fixed disk 2 is a vibration output end face. The first vibration coupling surface 2e is connected to the vibration input end face 1a, and the second vibration coupling surface 2f is connected to one end of the piezoelectric component.
[0051] Specifically, the prestressed fastener includes at least one of a screw 13, a bolt 6, a combination of a nut 7 and a bolt 6.
[0052] Specifically, the prestressed fastener used in this embodiment is a combination of a nut 7 and a bolt 6.
[0053] Specifically, the piezoelectric component is formed by integrating a piezoelectric ceramic sheet 4 and electrode sheets 3, with the piezoelectric ceramic sheet 4 and the electrode sheets 3 arranged alternately. When the number of piezoelectric components is one group, the piezoelectric component is located between the fixed disk 2 and the rear gland 5; when acted upon by an electrical signal, the piezoelectric component generates mechanical vibration, and using this piezoelectric effect, the electrical signal is converted into mechanical vibration.
[0054] Embodiment 2
[0055] Embodiment 2 of the present application provides a high-power ultrasonic transducer. Please refer to Figures 5 to 7 ;
[0056] The structure of this embodiment is similar to that of Embodiment 1, the difference being:
[0057] The piezoelectric component is formed by stacking 2 piezoelectric ceramic sheets 4 and 3 electrode sheets 3 layer by layer alternately. The number of piezoelectric components is two groups. One end of the first vibration coupling surface 2e abuts against one end of the first group of piezoelectric components, and the end of the first group of piezoelectric components facing away from the first vibration coupling surface 2e abuts against the vibration input end surface 1a; one end of the second vibration coupling surface 2f abuts against one end of the second group of piezoelectric components, and the end of the second group of piezoelectric components facing away from the second vibration coupling surface 2f abuts against the rear gland 5.
[0058] In the specific Embodiment 2 of the present application, there are two groups of piezoelectric components, which can obtain a larger output power; since one more group of piezoelectric components is used, the transducer cannot be completely wrapped by the shield 9, so a front end cover 12 is provided at the end of the shield 9 close to the front gland 1, and the front end cover 12 can assist the shield 9 to completely wrap the transducer inside the shield 9.
[0059] Embodiment 3
[0060] Embodiment 3 of the present application provides a high-power ultrasonic transducer. Please refer to Figures 8 to 11 ;
[0061] The structure of this embodiment is similar to that of Embodiment 1, the difference being:
[0062] The fixed disk 2 is an axisymmetric square disk cover structure. A through hole 2a is coaxially provided at the axis of the fixed disk, and a first vibration coupling surface 2e and a second vibration coupling surface 2f are respectively provided on the end surface. The first vibration coupling surface 2e and the second vibration coupling surface 2f are plane structures and are parallel to each other. The through hole 2a is provided between the first vibration coupling surface 2e and the second vibration coupling surface 2f and vertically penetrates the first vibration coupling surface 2e and the second vibration coupling surface 2f.
[0063] The said protective cover 9 corresponds to the outer shape of the said fixed disk 2 and is of a square sleeve structure. The barrel wall of the protective cover 9 is provided with a fixing structure and a shock-absorbing structure. The fixing structure is in cooperation with the connection structure, and the shock-absorbing structure is arranged in the peripheral area of the fixing mechanism.
[0064] The said vibration isolation pad 8 is a square annular gasket, and the material is rubber, polyurethane and other materials with vibration isolation functions, which is used for shock absorption and vibration isolation.
[0065] The said prestressed fastener is the screw 13.
[0066] This embodiment is to illustrate the diversity of the structure of the solution of the present application. In this embodiment, both the fixed disk 2 and the protective cover 9 are of square structures. The square structure is suitable for installing a square heat dissipation part inside, and at the same time, a larger heat dissipation space can be realized.
[0067] The above has made a detailed introduction to the specific implementation manners of the present application. For those skilled in the art of this technology, without departing from the principle of the present application, several improvements and modifications can still be made to the present application, and these improvements and modifications also belong to the protection scope of the claims of the present application.
Claims
1. A high-power ultrasonic transducer, characterized in that: It includes a front gland (1), a rear gland (5), a fixing disk (2), a piezoelectric component, a prestress fastener, and a shield (9). One end of the prestress fastener is connected to the rear gland (5), passes through the rear gland (5), the piezoelectric component, and the fixing disk (2), and is connected to the front gland (1); the fixing disk (2) and the piezoelectric component are fastened between the front gland (1) and the rear gland (5), and the shield (9) is fixed on the fixing disk (2) to wrap the front gland (1), the rear gland (5), the piezoelectric component, and the prestress fastener inside; An anti-vibration pad (8) is arranged on the inner side in the circumferential direction of the shield (9), and the anti-vibration pad (8) is sleeved between the fixing disk (2) and the shield (9). The fixing disk (2) is a sheet-like structure, and a connection port (2b) is arranged on the outer side in the circumferential direction of the fixing disk (2). The fixing disk (2) is connected to the anti-vibration pad (8) and the shield (9) through the connection port (2b).
2. The high-power ultrasonic transducer according to claim 1, characterized in that: The shield (9) is a circular or square or polygonal sleeve structure. A fixing hole (9a) is arranged around the barrel wall near the position of the fixing disk (2). The fixing hole (9a) is aligned with the connection port (2b) on the fixing disk (2), and a fastener (10) is used to pass through the fixing hole (9a) to fasten and connect the shield (9) to the outer side in the circumferential direction of the fixing disk (2).
3. The high-power ultrasonic transducer according to claim 2, characterized in that: An anti-vibration groove (9b) is arranged around the barrel wall near the position of the fixing disk (2). The anti-vibration groove (9b) is arranged on both sides or the circumferential side of the fixing hole (9a).
4. The high-power ultrasonic transducer according to claim 1, characterized in that: The cross-sectional shape of the anti-vibration pad (8) is consistent with that of the shield (9), and the anti-vibration pad (8) is made of anti-vibration material.
5. The high-power ultrasonic transducer according to claim 1, characterized in that: It further includes a temperature control device, and the temperature control device includes a temperature sensing groove (2d), a heat dissipation port (2c) arranged on the outer side or the edge in the circumferential direction of the fixing disk (2), a heat dissipation part installed on the shield (9), and a temperature sensing part installed in the temperature sensing groove (2d); The heat dissipation port (2c) penetrates the fixing disk (2) along the axial direction of the fixing disk (2).
6. The high-power ultrasonic transducer according to claim 1, characterized in that: The fixing disk (2) is arranged in the vibration node area, and a first vibration coupling surface (2e) and a second vibration coupling surface (2f) are respectively arranged on the end surface of the fixing disk (2); The first vibration coupling surface (2e) abuts against the front gland (1) or is integrally combined with the front gland (1), and the second vibration coupling surface (2f) abuts against the piezoelectric component; when there are two sets of piezoelectric components, the first vibration coupling surface (2e) abuts against one end of the first set of piezoelectric components, and the end of the first set of piezoelectric components facing away from the first vibration coupling surface (2e) abuts against the front gland (1); the second vibration coupling surface (2f) abuts against one end of the second set of piezoelectric components, and the end of the second set of piezoelectric components facing away from the second vibration coupling surface (2f) abuts against the rear gland (5).
7. The high-power ultrasonic transducer according to claim 6, wherein: The first vibration coupling surface (2e) and the second vibration coupling surface (2f) are planar structures and are parallel to each other.
8. The high-power ultrasonic transducer according to claim 6, wherein: A through hole (2a) is coaxially provided at the axis of the fixed disk (2), and the through hole (2a) is provided between the first vibration coupling surface (2e) and the second vibration coupling surface (2f) and vertically penetrates the first vibration coupling surface (2e) and the second vibration coupling surface (2f).
9. The high-power ultrasonic transducer according to claim 6, wherein: The piezoelectric component includes a piezoelectric ceramic sheet (4) and an electrode sheet (3), and the piezoelectric ceramic sheets (4) and the electrode sheets (3) are arranged alternately; when the number of piezoelectric components is one set, the piezoelectric component is located between the fixed disk (2) and the rear gland (5); when the number of piezoelectric components is two sets, one set of the piezoelectric components is located between the fixed disk (2) and the front gland (1), and the other set is located between the fixed disk (2) and the rear gland (5).