Micro-feeding mechanism of wafer thinning machine

Abstract

The utility model belongs to the technical field of wafer thinning processing, and discloses a micro-feeding mechanism of a wafer thinning machine, which comprises an upright post, a primary feeding assembly and a secondary feeding assembly, a vertical guide rail is arranged on the upright post, and a first moving plate and a second moving plate are arranged on the vertical guide rail in a sliding manner; an inclined surface block is arranged between the first moving plate and the second moving plate, the first side surface of the inclined surface block is in contact and sliding fit with the first moving plate, the second side surface of the inclined surface block is in contact and sliding fit with the second moving plate, the first side surface is not parallel to the second side surface, and the second moving plate is used for mounting a grinding main shaft; the first-stage feeding assembly is used for driving the first moving plate to move along the vertical guide rail; the second-stage feeding assembly is used for driving the slope block to move along the first moving plate, and then the second moving plate is driven to move along the vertical guide rail and get close to or away from the first moving plate. The mechanism has the first-stage basic feeding function and the second-stage micro-feeding function, and the Z-axis feeding precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thinning processing, in particular to a micro-feed mechanism of a wafer thinning machine. Background Art

[0002] Wafer thinning processing is very precise processing. During the processing, the magnitude of the feed amount in the Z-axis will significantly affect the processing effect. An excessive feed amount may cause fragmentation, while a finer feed amount will improve the surface finish and reduce the residual stress of the processing.

[0003] The existing wafer thinning machines mainly adopt a direct drive scheme of a lead screw guide rail for the feed in the Z-axis. As Figure 1 shown, it includes a casting column 1', a Z-axis guide rail 2' and a driving motor 3' are arranged on the casting column 1', a Z-axis moving plate 4' is slidably arranged on the Z-axis guide rail 2', the driving motor 3' is connected to a ball screw 5', a transmission nut 6' matched with the ball screw 5' is arranged on the Z-axis moving plate 4', a grinding spindle 7' is installed on the Z-axis moving plate 4', the driving motor 3' drives the ball screw 5' to rotate, and then drives the transmission nut 6' and the Z-axis moving plate 4' to move linearly along the Z-axis guide rail 2', so as to realize the feed movement of the grinding spindle 7' in the Z-axis direction.

[0004] The above feed structure has the advantage of stable structure. However, to meet the accuracy requirements of the micro-feed amount, only the matching accuracy between the Z-axis guide rail 2' and the Z-axis moving plate 4', and between the ball screw 5' and the transmission nut 6' can be further improved, and the control accuracy of the driving motor 3' can be further improved, resulting in a high equipment input cost, but the improved feed amount accuracy is limited and cannot meet the needs of wafer thinning processing. Content of the Utility Model

[0005] Based on the above problems, the purpose of the utility model is to provide a micro-feed mechanism of a wafer thinning machine, which improves the feed ability of the wafer thinning machine on the existing basis, realizes a more micro feed, and improves the wafer thinning processing effect.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A micro-feed mechanism of a wafer thinning machine, which includes:

[0008] A column, on which a vertical guide rail is arranged, a first moving plate and a second moving plate are slidably arranged on the vertical guide rail, an inclined plane block is arranged between the first moving plate and the second moving plate, a first side surface of the inclined plane block is in contact with and slidably matched with the first moving plate, a second side surface of the inclined plane block is in contact with and slidably matched with the second moving plate, the first side surface and the second side surface are not parallel, and the second moving plate is used for installing a grinding spindle;

[0009] The first-level feeding component is used to drive the first moving plate to move along the vertical guide rail;

[0010] The second-level feeding component is used to drive the inclined block to move along the first moving plate, and then drive the second moving plate to move along the vertical guide rail while approaching or departing from the first moving plate.

[0011] As an alternative solution, the second moving plate is located below the first moving plate. The first side surface is the upper surface of the inclined block, and the second side surface is the lower surface of the inclined block. The first side surface is horizontal, and the second side surface is inclined relative to the horizontal plane, and the inclination angle is less than 45°.

[0012] As an alternative solution, the second-level feeding component includes a first motor, a first lead screw, and a first nut. The first lead screw is arranged along the first side surface. The first motor is installed on the first moving plate and located at one end of the first lead screw. The first motor is used to drive the first lead screw to rotate. The first nut is installed on the inclined block and is in threaded cooperation with the first lead screw.

[0013] As an alternative solution, the inclined block is respectively connected with the first moving plate and the second moving plate through a guide rail pair. The guide rail pair is used to guide and limit the relative movement between the inclined block and the first moving plate or the second moving plate.

[0014] As an alternative solution, the first-level feeding component includes a second motor, a second lead screw, and a second nut. The second lead screw is arranged along the vertical guide rail. The second motor is installed on the column and located at one end of the second lead screw. The second motor is used to drive the second lead screw to rotate. The second nut is installed on the first moving plate and is in threaded cooperation with the second lead screw.

[0015] The beneficial effects of the present utility model: Without substantially changing the structure and function of the existing wafer thinning machine, the micro-feeding mechanism of the wafer thinning machine has a first-level basic feeding function and a second-level micro-feeding function, improves the Z-axis feeding accuracy, makes the fragmentation rate of the processed wafer lower, the surface finish higher, and the processing residual stress smaller. Under certain conditions, the subsequent polishing process can be omitted, saving costs for customers, and improving the yield and quality. Description of the Drawings

[0016] Figure 1 is a schematic structural diagram of the feeding mechanism of the existing wafer thinning machine;

[0017] Figure 2 is a schematic structural diagram of the micro-feeding mechanism of the wafer thinning machine provided by the embodiment of the present utility model;

[0018] Figure 3 is a front view of the micro-feeding mechanism of the wafer thinning machine provided by the embodiment of the present utility model.

[0019] In the drawings:

[0020] 1', casting column; 2', Z-axis guide rail; 3', drive motor; 4', Z-axis moving plate; 5', ball screw; 6', transmission nut; 7', grinding spindle;

[0021] 1, column; 2, vertical guide rail; 3, first moving plate; 4, second moving plate; 5, inclined block; 6, first motor; 7, first screw rod; 8, first nut; 9, guide rail pair; 10, second motor; 11, second screw rod; 12, second nut; 13, connecting block. Specific embodiments

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the convenience of description, only the parts related to the present invention rather than all the structures are shown in the drawings.

[0023] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0025] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left", and "right" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0026] Please refer toFigure 2 and Figure 3 As shown in Figure 3 , this preferred embodiment provides a micro-feed mechanism for a wafer thinning machine, which includes a column 1, a first-level feed assembly, and a second-level feed assembly, where:

[0027] A vertical guide rail 2 is provided on the column 1. A first moving plate 3 and a second moving plate 4 are slidably arranged on the vertical guide rail 2. An inclined plane block 5 is arranged between the first moving plate 3 and the second moving plate 4. The first side surface of the inclined plane block 5 is in contact with and slidably matched with the first moving plate 3, and the second side surface of the inclined plane block 5 is in contact with and slidably matched with the second moving plate 4. The first side surface and the second side surface are not parallel. The second moving plate 4 is used to install a grinding spindle;

[0028] The first-level feed assembly is used to drive the first moving plate 3 to move along the vertical guide rail 2;

[0029] The second-level feed assembly is used to drive the inclined plane block 5 to move along the first moving plate 3, so as to drive the second moving plate 4 to move along the vertical guide rail 2 while approaching or departing from the first moving plate 3.

[0030] Thus, this micro-feed mechanism for a wafer thinning machine has a first-level basic feed function and a second-level micro-feed function, improves the Z-axis feed accuracy, makes the fragmentation rate of processed wafers lower, the surface finish higher, and the processing residual stress smaller. Under certain conditions, the subsequent polishing process can be omitted, saving costs for customers, and improving the yield and quality.

[0031] Particularly, the second moving plate 4 is located below the first moving plate 3. The first side surface is the upper surface of the inclined plane block 5, and the second side surface is the lower surface of the inclined plane block 5. The first side surface is horizontal, and the second side surface is inclined relative to the horizontal plane, and the inclination angle is less than 45°. The inclination angle here is determined by the reduction ratio, and the reduction ratio is flexibly selected according to the feed requirement. The smaller the inclination angle, the smaller the conversion ratio of the horizontal displacement of the inclined plane block 5 to the vertical displacement of the second moving plate 4, and the higher the micro-feed accuracy.

[0032] Specifically, the second-level feed assembly includes a first motor 6, a first lead screw 7, and a first nut 8. The first lead screw 7 is arranged along the first side surface. The first motor 6 is installed on the first moving plate 3 and is located at one end of the first lead screw 7. The first motor 6 is used to drive the first lead screw 7 to rotate. The first nut 8 is installed on the inclined plane block 5 and is in threaded cooperation with the first lead screw 7.

[0033] Preferably, the inclined plane block 5 is respectively connected to the first moving plate 3 and the second moving plate 4 through a guide rail pair 9, and the guide rail pair 9 is used to guide and limit the relative movement between the inclined plane block 5 and the first moving plate 3 or the second moving plate 4. Among them, the limit means that according to the up-and-down arrangement positions of the first moving plate 3, the inclined plane block 5, and the second moving plate 4, the guide rail pair 9 prevents the inclined plane block 5 from separating from the first moving plate 3 and the second moving plate 4 from separating from the inclined plane block 5, undertakes a function similar to hanging, and meets the connection requirements.

[0034] Specifically, the first-stage feeding assembly includes a second motor 10, a second lead screw 11, and a second nut 12. The second lead screw 11 is arranged along the vertical guide rail 2. The second motor 10 is installed on the column 1 and located at one end of the second lead screw 11. The second motor 10 is used to drive the second lead screw 11 to rotate. The second nut 12 is installed on the first moving plate 3 and is in threaded cooperation with the second lead screw 11.

[0035] Specific working principle:

[0036] The second motor 10 rotates, driving the second lead screw 11 to rotate. Since the rotational freedom of the second nut 12 is restricted, the second nut 12 can only move linearly along the second lead screw 11, thereby driving the first moving plate 3 to move up and down along the vertical guide rail 2, and driving the second moving plate 4 through the inclined plane block 5 to achieve the first-stage feeding;

[0037] When the first motor 6 rotates, it drives the first lead screw 7 to rotate. Since the rotational freedom of the first nut 8 is restricted, the first nut 8 can only move linearly along the first lead screw 7, thereby driving the inclined plane block 5 to move along the first side through the connecting block 13. And the second side of the inclined plane block 5 is also in sliding cooperation with the second moving plate 4. The second moving plate 4 can only move along the vertical guide rail 2. Thus, the inclined plane block 5 drives the second moving plate 4 to move up and down further to achieve the second-stage feeding, that is, a more micro feeding movement.

[0038] It can be seen that the micro-feeding mechanism of this wafer thinning machine increases the accuracy of micro-feeding with little change to the structure and function of the existing wafer thinning machine, has small improvement, and thus small technical risks. It belongs to iterative innovation, which not only introduces new technologies but also retains the original stability. The previous accumulated experience and stability can be inherited, and it has high industrial significance.

[0039] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. Micro-feed mechanism of a wafer thinning machine, characterized in that, Comprising: A column (1) is provided with a vertical guide rail (2) thereon. A first moving plate (3) and a second moving plate (4) are slidably arranged on the vertical guide rail (2). An inclined block (5) is arranged between the first moving plate (3) and the second moving plate (4). A first side surface of the inclined block (5) is in contact with and slidably engaged with the first moving plate (3), and a second side surface of the inclined block (5) is in contact with and slidably engaged with the second moving plate (4). The first side surface and the second side surface are not parallel. The second moving plate (4) is used for mounting a grinding spindle; A primary feed assembly for driving the first moving plate (3) to move along the vertical guide rail (2); A secondary feed assembly for driving the inclined block (5) to move along the first moving plate (3), thereby driving the second moving plate (4) to move along the vertical guide rail (2) while approaching or departing from the first moving plate (3).

2. The fine feed mechanism of the wafer thinning machine according to claim 1, characterized in that, The second moving plate (4) is located below the first moving plate (3). The first side surface is the upper surface of the inclined block (5), and the second side surface is the lower surface of the inclined block (5). The first side surface is horizontal, and the second side surface is inclined relative to the horizontal plane, and the inclination angle is less than 45°.

3. The micro-feed mechanism of the wafer thinning machine according to claim 2, characterized in that, The secondary feed assembly includes a first motor (6), a first lead screw (7), and a first nut (8). The first lead screw (7) is arranged along the first side surface. The first motor (6) is mounted on the first moving plate (3) and is located at one end of the first lead screw (7). The first motor (6) is used for driving the first lead screw (7) to rotate. The first nut (8) is mounted on the inclined block (5) and is in threaded engagement with the first lead screw (7).

4. The micro-feed mechanism of the wafer thinning machine according to claim 1, characterized in that, The inclined block (5) is respectively connected in a mating manner with the first moving plate (3) and the second moving plate (4) through a guide rail pair (9). The guide rail pair (9) is used for guiding and limiting the relative movement between the inclined block (5) and the first moving plate (3) or the second moving plate (4).

5. The micro-feed mechanism of the wafer thinning machine according to claim 1, characterized in that The primary feed assembly includes a second motor (10), a second lead screw (11), and a second nut (12). The second lead screw (11) is arranged along the vertical guide rail (2). The second motor (10) is mounted on the column (1) and is located at one end of the second lead screw (11). The second motor (10) is used for driving the second lead screw (11) to rotate. The second nut (12) is mounted on the first moving plate (3) and is in threaded engagement with the second lead screw (11).

Images