Forming tool of PDMS micro-printing layer

Abstract

The utility model relates to the technical field of biochip preparation, in particular to a forming tool of a PDMS (polydimethylsiloxane) micro-printing layer, which comprises a cover plate, a mold plate, a silicon wafer layer and a bottom plate which are sequentially arranged from top to bottom, and the silicon wafer layer comprises an outer frame plate and a silicon wafer; during use, the silicon wafer is embedded in a frame of the outer frame plate, and the cover plate, the mold plate, the outer frame plate and the bottom plate are fastened and connected in series through bolts. The outer frame plate is used for fixing the silicon wafer, no matter what shape the silicon wafer is, only the frame groove of the outer frame plate needs to be designed into the shape matched with the silicon wafer, fixing of the silicon wafer is achieved, it can be guaranteed that the installation position of the silicon wafer and the specification of the micro-printing layer are uniform every time die disassembly and die assembly are conducted, the percent of pass is high, and the tool is suitable for the silicon wafers of various specifications.

Description

Technical Field

[0001] The utility model relates to the technical field of biochip preparation, in particular to a forming tooling for a PDMS microprinting layer. Background Art

[0002] PDMS, the raw material required for preparing the microprinting layer, is a silicone-based polymer material with good chemical stability. After being mixed with a curing agent, it will cure at a certain temperature to obtain an elastic microprinting layer. However, a large number of bubbles will be generated during the mixing process. Vacuum pumping can make the bubbles float to the liquid surface and burst. After a certain period of time, the bubbles will disappear. The PDMS material has good adhesiveness. The micro-nano structure on the silicon wafer can be transferred to the PDMS by pouring. After heating and curing, the micro-nano structure on the silicon wafer can be replicated onto the PDMS. Generally, the silicon wafer is pressed in the mold. After each pouring, the mold needs to be disassembled to remove the formed microprinting layer, and then the mold is closed for the next pouring. However, the shape of the silicon wafer affects the fixing accuracy of its mold, which in turn leads to differences in the specifications of the produced microprinting layers. After the microprinting layer is made into a microfluidic chip through a series of processes, it will affect the use effect. Summary of the Invention

[0003] In order to solve the above-mentioned problem of the adaptability between the silicon wafer and the mold, the utility model provides a forming tooling for a PDMS microprinting layer, which is convenient to use and can quickly and accurately install the silicon wafer. The technical scheme adopted by the utility model is as follows:

[0004] A forming tooling for a PDMS microprinting layer includes a cover plate, a mold plate, a silicon wafer layer and a bottom plate arranged in sequence from top to bottom. The silicon wafer layer includes an outer frame plate and a silicon wafer. When in use, the silicon wafer is embedded in the frame of the outer frame plate, and the cover plate, the mold plate, the outer frame plate and the bottom plate are fastened and connected in series with bolts.

[0005] In the above-mentioned forming tooling for a PDMS microprinting layer, the silicon wafer is square, and two micro-nano printing areas are provided on the silicon wafer, and two forming cavities are provided on the corresponding mold plate.

[0006] In the above-mentioned forming tooling for a PDMS microprinting layer, the cover plate is provided with an injection hole and an exhaust hole, and both the injection hole and the exhaust hole communicate with the forming cavity.

[0007] In the above-mentioned forming tooling for a PDMS microprinting layer, the cover plate, the mold plate, the outer frame plate and the bottom plate are all made of acrylic material.

[0008] The beneficial effects of the present utility model are as follows: The silicon wafer is fixed by using the outer frame plate. No matter what shape the silicon wafer is, it only needs to design the frame groove of the outer frame plate to match the shape of the silicon wafer to achieve the fixation of the silicon wafer. Each time the mold is disassembled and assembled, the installation position of the silicon wafer can be guaranteed. The specifications of the micro-printing layer are unified and the qualified rate is high, and this tooling is suitable for silicon wafers of various specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram when the embodiment of the present utility model is in use;

[0010] Figure 2 It is a schematic structural diagram of the embodiment of the present utility model.

[0011] In the figure: 1 is the cover plate, 2 is the bottom plate, 3 is the mold plate, 4 is the silicon wafer layer, 11 is the injection hole, 12 is the exhaust hole, 31 is the molding cavity, 41 is the outer frame plate, and 42 is the silicon wafer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0012] The technical content of the present utility model will be described in detail below with reference to the accompanying drawings.

[0013] This embodiment is a molding tooling for a PDMS micro-printing layer, which includes a cover plate 1, a mold plate 3, a silicon wafer layer 4, and a bottom plate 2 arranged in sequence from top to bottom, and the whole is in a square structure, and is fastened and connected at the four corners with bolts or other connecting parts, which is convenient for disassembly and assembly.

[0014] The silicon wafer layer 4 includes an outer frame plate 41 and a silicon wafer 42, and the outer frame plate 41 and the silicon wafer 42 have the same thickness. When in use, the silicon wafer 42 is embedded in the frame of the outer frame plate 41. In this embodiment, the silicon wafer 42 is square, and there are two micro-nano printing areas on the silicon wafer 42, and there are two molding cavities 31 on the corresponding mold plate 3.

[0015] The cover plate 1 is provided with an injection hole 11 and an exhaust hole 12, and both the injection hole 11 and the exhaust hole 12 communicate with the molding cavity 31. When pouring, the PDMS material is injected into the molding cavity 31 from the injection hole 11, and air or bubbles are discharged from the exhaust hole 12.

[0016] The cover plate 1, the mold plate 3, the outer frame plate 41, and the bottom plate 2 are all made of acrylic material, and other materials can also be selected in some embodiments.

Claims

1. A forming tool for a PDMS microprinting layer, characterized in that: It includes a cover plate (1), a mold plate (3), a silicon wafer layer (4), and a bottom plate (2) arranged in sequence from top to bottom. The silicon wafer layer (4) includes an outer frame plate (41) and silicon wafers (42). During use, the silicon wafers (42) are embedded in the frame of the outer frame plate (41), and the cover plate (1), the mold plate (3), the outer frame plate (41), and the bottom plate (2) are fastened and connected in series with bolts.

2. The forming tooling for the PDMS microprinting layer according to claim 1, wherein: The silicon wafers (42) are square, and two micro-nano printing areas are provided on the silicon wafers (42), and two forming cavities (31) are provided on the corresponding mold plate (3).

3. The forming tooling for the PDMS microprinting layer according to claim 2, characterized in that: The cover plate (1) is provided with an injection hole (11) and an exhaust hole (12), and both the injection hole (11) and the exhaust hole (12) communicate with the forming cavity (31).

4. The forming tooling for the PDMS microprinting layer according to claim 1, characterized in that: The cover plate (1), the mold plate (3), the outer frame plate (41), and the bottom plate (2) are all made of acrylic material.

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