Cover plate with thermoelectric performance

Abstract

The utility model discloses a cover plate with thermoelectric performance, comprising a glass layer, the upper surface of the glass layer is provided with a zirconium rhodium layer, the upper surface of the zirconium rhodium layer is provided with a bismuth tritelluride layer, the upper surface of the bismuth tritelluride layer is provided with a lead telluride layer, and the upper surface of the lead telluride layer is provided with a silicon nitride layer. And the extension areas of the zirconium rhodium layer, the bismuth tritelluride layer and the lead telluride layer are consistent. Zirconium dirhodium is used as a bottom layer, so that good adhesiveness and stability are achieved, and a solid foundation is provided for the whole coating layer. Bismuth tritelluride is used as an intermediate layer, and the excellent thermoelectric performance of bismuth tritelluride is utilized, so that the functions of energy conversion and temperature sensing are realized. The lead telluride is used as the top layer, the thermoelectric performance of the coating layer is further enhanced, and the thickness and composition of the coating layer can be adjusted according to specific requirements. The cover plate with the thermoelectric performance not only has excellent adhesive force and stability, but also has excellent thermoelectric performance, and can be applied to energy conversion, temperature sensing and the like.

Description

Technical Field

[0001] The utility model relates to a cover plate assembly, and more precisely, to a cover plate with thermoelectric performance. Background Art

[0002] Traditional glass cover plates have become difficult to meet the complex requirements of modern electronic devices in terms of functionality, energy efficiency, and environmental adaptability. For example, they do not have thermoelectric performance and are prone to falling off, affecting the performance of the cover plate.

[0003] Chinese invention patent document CN115124253B discloses an antireflection coated optical cover plate with high transmittance, including a glass substrate, and high-transmittance antireflection coating layers are fixedly arranged on two surfaces of the glass substrate respectively; the high-transmittance antireflection coating layer is mainly made of the following raw materials in parts by weight: 60-70 parts of a solvent, 25-35 parts of silica sol, 5-10 parts of multi-layer refraction powder, 1-3 parts of silicon carbide, 1-3 parts of a pore-forming agent, and 1-3 parts of a film-forming auxiliary agent; the multi-layer refraction powder is formed by sequentially coating a high-refractive-index layer with a refractive index n1 of 1.8-2.7 and a low-refractive-index layer with a refractive index n2 of 1.4-1.7 on the surface of a base material; the base material is inorganic glass powder; the high-refractive-index layer is titanium dioxide; the low-refractive-index layer is silica. The thickness of the high-transmittance antireflection coating layer is 210-250 nm. The multi-layer refraction powder is prepared by the following method: Sa. Mix tetrabutyl titanate and ethanol evenly to obtain a premixed solution; Sb. Add the base material to a hydrochloric acid solution, ultrasonically disperse for 10-20 min, then add the premixed solution, stir for 40-60 min, filter, dry, calcine, and cool down. At this time, the high-refractive-index layer is coated on the surface of the base material to obtain a semi-finished product; Sc. Add the semi-finished product to silica sol, ultrasonically disperse for 10-20 min, stir for 60-100 min, filter, dry, calcine, and cool down. At this time, the low-refractive-index layer is coated on the surface of the high-refractive-index layer to obtain the multi-layer refraction powder; wherein, the weight ratio of tetrabutyl titanate, the base material, and silica sol is (1-3):(9-11):(14-16). The silica sol in the raw materials of the multi-layer refraction powder is the same as the silica sol in the raw materials of the high-transmittance antireflection coating layer, and the weight ratio of tetrabutyl titanate, ethanol, and the hydrochloric acid solution is (1-3):(15-25):(75-85), and the mass concentration of the hydrochloric acid solution is 3-5%. In step Sb, the calcination temperature is 600-650 °C and the calcination time is 3-5 h; in step Sc, the calcination temperature is 600-650 °C and the calcination time is 3-5 h. The silica sol is prepared by the following method: Mix ethanol and water evenly, then add tetraethyl orthosilicate and methyltriethoxysilane, stir and mix evenly, then add a catalyst, heat up to 60-70 °C, stir for 3-5 h, and cool down to obtain silica sol; wherein, the weight ratio of tetraethyl orthosilicate, methyltriethoxysilane, ethanol, and water is (9-11):(4-6):(45-55):(15-25), and the addition amount of the catalyst is 2-5 wt% of the total amount of tetraethyl orthosilicate and methyltriethoxysilane. The solvent is isopropanol; the pore-forming agent is polyacrylate; the film-forming auxiliary agent is propylene glycol monomethyl ether acetate.

[0004] However, the base material of this patent is inorganic glass powder. Then, tetrabutyl titanate is used to convert it into titanium dioxide, which is coated on the surface of the inorganic glass powder to form a high refractive index layer. After that, silica sol is used to convert it into silica, which is coated on the surface of the high refractive index layer to form a low refractive index layer. By utilizing the synergistic effect among inorganic glass powder, titanium dioxide, and silica, the usage effect of the multi-layer refractive powder is effectively increased, and the transmittance, acid resistance, and weather resistance of the antireflection coated optical cover plate are further improved. However, this structure cannot solve the thermoelectric performance of the existing coated cover plate. Summary of the Invention

[0005] Based on this, in view of the above technical problems, it is necessary to provide a cover plate with thermoelectric performance. The cover plate with thermoelectric performance includes a glass layer. On the upper surface of the glass layer, there is a zirconium rhodium dioxide layer. On the upper surface of the zirconium rhodium dioxide layer, there is a bismuth telluride layer. On the upper surface of the bismuth telluride layer, there is a lead telluride layer. The extended areas of the zirconium rhodium dioxide layer, the bismuth telluride layer, and the lead telluride layer are the same. Using zirconium rhodium dioxide as the bottom layer, it has good adhesion and stability, providing a solid foundation for the entire coating layer. Bismuth telluride is used as the intermediate layer. Utilizing its excellent thermoelectric performance, the functions of energy conversion and temperature sensing are realized. Lead telluride is used as the top layer, further enhancing the thermoelectric performance of the coating layer, and its thickness and composition can be adjusted according to specific requirements. This cover plate with thermoelectric performance not only has excellent adhesion and stability but also has excellent thermoelectric performance, and can be used in applications such as energy conversion and temperature sensing. By adjusting the thickness and composition of each layer, the performance of the coating layer can be customized to meet the performance requirements of glass cover plates for different electronic devices. This coating layer also has multifunctionality, such as optical filtering, antireflection, etc., providing more comprehensive protection for electronic devices.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A cover plate with thermoelectric performance, characterized in that the cover plate with thermoelectric performance includes a glass layer. On the upper surface of the glass layer, there is a zirconium rhodium dioxide layer. On the upper surface of the zirconium rhodium dioxide layer, there is a bismuth telluride layer. On the upper surface of the bismuth telluride layer, there is a lead telluride layer. The extended areas of the zirconium rhodium dioxide layer, the bismuth telluride layer, and the lead telluride layer are the same.

[0008] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present invention, the thickness of the zirconium rhodium dioxide layer is between 50 nanometers and 100 nanometers, the thickness of the bismuth telluride layer is between 200 nanometers and 300 nanometers, and the thickness of the lead telluride layer is between 150 nanometers and 200 nanometers.

[0009] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the thickness of the zirconium rhodium dichloride layer is 80 nanometers, the thickness of the bismuth telluride layer is 250 nanometers, and the thickness of the lead telluride layer is 180 nanometers.

[0010] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the zirconium rhodium dichloride layer, the bismuth telluride layer, and the lead telluride layer are all deposited films.

[0011] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, isolation layers are provided on the side walls of the glass layer, the zirconium rhodium dichloride layer, the bismuth telluride layer, and the lead telluride layer.

[0012] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the extending direction of the isolation layer is perpendicular to the extending direction of the glass layer.

[0013] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the isolation layer is a polyurethane film.

[0014] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the thickness of the isolation layer is between 60 nanometers and 100 nanometers.

[0015] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the thickness of the isolation layer is 80 nanometers.

[0016] As a preferred embodiment of the cover plate with thermoelectric performance provided by the present utility model, the isolation layer is a chemically deposited film.

[0017] Compared with the prior art, the present utility model has the following beneficial effects:

[0018] The present utility model provides a cover plate with thermoelectric performance. Using zirconium rhodium dichloride as the bottom layer, it has good adhesion and stability, providing a solid foundation for the entire coating layer. Bismuth telluride is used as the intermediate layer, and with its excellent thermoelectric performance, the functions of energy conversion and temperature sensing are realized. Lead telluride is used as the top layer, further enhancing the thermoelectric performance of the coating layer, and its thickness and composition can be adjusted according to specific requirements. This cover plate with thermoelectric performance not only has excellent adhesion and stability but also has excellent thermoelectric performance, and can be used in applications such as energy conversion and temperature sensing. By adjusting the thickness and composition of each layer, the performance of the coating layer can be customized to meet the performance requirements of glass cover plates for different electronic devices. This coating layer also has multifunctionality, such as optical filtering and anti-reflection, providing more comprehensive protection for electronic devices.

[0019] In addition, an isolation layer can be provided on the side walls of the glass layer, zirconium dirhodide layer, bismuth telluride trisulfide layer, and lead telluride layer. The extension direction of the isolation layer is perpendicular to the extension direction of the glass layer. The isolation layer is a polyurethane film. By using the polyurethane film as the isolation layer, the side walls of the glass layer, zirconium dirhodide layer, bismuth telluride trisulfide layer, and lead telluride layer can be protected against water, effectively improving the reliability of the cover plate.

[0020] In addition, the isolation layer can be a chemically deposited film. Since the isolation layer is a chemically deposited film, a film with a more uniform thickness can be obtained, further improving the reliability of the isolation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the solutions in the present utility model, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the following-described drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a schematic diagram of the hierarchical structure of the cover plate with thermoelectric performance of the present utility model;

[0023] Figure 2 For Figure 1 a detailed enlarged view of area A of the schematic diagram of the hierarchical structure of the cover plate with thermoelectric performance in

[0024] Figure 3 It is a schematic diagram of the hierarchical structure of another embodiment of the cover plate with thermoelectric performance of the present utility model;

[0025] Figure 4 For Figure 3 a detailed enlarged view of area B of the schematic diagram of the hierarchical structure of the cover plate with thermoelectric performance in

[0026] The markings in the drawings are explained as follows: 1. Glass layer; 2. Zirconium dirhodide layer; 3. Bismuth telluride trisulfide layer; 4. Lead telluride layer; 5. Isolation layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] In order to enable those skilled in the art to better understand the solutions of the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some of the embodiments of the present utility model, rather than all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] As described in the background art, for conventional glass covers, it has become difficult to meet the complex requirements of modern electronic devices in terms of functionality, energy efficiency, and environmental adaptability. For example, they do not have thermoelectric properties and are prone to detachment, affecting the performance of the cover.

[0029] To solve this technical problem, the present utility model provides a cover with thermoelectric properties, including a glass layer 1. On the upper surface of the glass layer 1, there is a zirconium rhodium dioxide layer 2. On the upper surface of the zirconium rhodium dioxide layer 2, there is a bismuth telluride layer 3. On the upper surface of the bismuth telluride layer 3, there is a lead telluride layer 4. The extension areas of the zirconium rhodium dioxide layer 2, the bismuth telluride layer 3, and the lead telluride layer 4 are the same. The thickness of the zirconium rhodium dioxide layer 2 is between 50 nanometers and 100 nanometers, the thickness of the bismuth telluride layer 3 is between 200 nanometers and 300 nanometers, and the thickness of the lead telluride layer 4 is between 150 nanometers and 200 nanometers. The zirconium rhodium dioxide layer 2, the bismuth telluride layer 3, and the lead telluride layer 4 are all deposited thin films.

[0030] Through the above structural design, using zirconium rhodium dioxide as the bottom layer, it has good adhesion and stability, providing a solid foundation for the entire coating layer. Bismuth telluride is used as the intermediate layer, and with its excellent thermoelectric properties, it realizes the functions of energy conversion and temperature sensing. Lead telluride is used as the top layer, further enhancing the thermoelectric properties of the coating layer, and its thickness and composition can be adjusted according to specific requirements. The cover with thermoelectric properties not only has excellent adhesion and stability but also has excellent thermoelectric properties, and can be used in applications such as energy conversion and temperature sensing. By adjusting the thickness and composition of each layer, the performance of the coating layer can be customized to meet the performance requirements of glass covers for different electronic devices. This coating layer also has multifunctionality, such as optical filtering and anti-reflection, providing more comprehensive protection for electronic devices.

[0031] To enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be described in detail below with reference to the drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making the protection scope of the present utility model more clearly defined.

[0032] It should be noted that, without conflict, the embodiments in the present utility model and the features and technical solutions in the embodiments can be combined with each other.

[0033] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0034] As Figure 1 and Figure 2As shown, the cover plate with thermoelectric properties includes a glass layer 1. A zirconium rhodium dioxide layer 2 is provided on the upper surface of the glass layer 1. A bismuth telluride layer 3 is provided on the upper surface of the zirconium rhodium dioxide layer 2. A lead telluride layer 4 is provided on the upper surface of the bismuth telluride layer 3. The extended areas of the zirconium rhodium dioxide layer 2, the bismuth telluride layer 3, and the lead telluride layer 4 are the same.

[0035] The thickness of the zirconium rhodium dioxide layer 2 is between 50 nanometers and 100 nanometers. The thickness of the bismuth telluride layer 3 is between 200 nanometers and 300 nanometers. The thickness of the lead telluride layer 4 is between 150 nanometers and 200 nanometers.

[0036] Preferably, the thickness of the zirconium rhodium dioxide layer 2 is 80 nanometers, the thickness of the bismuth telluride layer 3 is 250 nanometers, and the thickness of the lead telluride layer 4 is 180 nanometers.

[0037] It should be noted that the zirconium rhodium dioxide layer 2, the bismuth telluride layer 3, and the lead telluride layer 4 are all deposited films.

[0038] The working mode of this embodiment will be described below.

[0039] Using zirconium rhodium dioxide as the bottom layer, it has good adhesion and stability, providing a solid foundation for the entire coating layer. Bismuth telluride is used as the intermediate layer, and with its excellent thermoelectric properties, it realizes the functions of energy conversion and temperature sensing. Lead telluride is used as the top layer, further enhancing the thermoelectric properties of the coating layer, and its thickness and composition can be adjusted according to specific requirements.

[0040] The cover plate with thermoelectric properties not only has excellent adhesion and stability, but also has excellent thermoelectric properties, and can be used in applications such as energy conversion and temperature sensing. By adjusting the thickness and composition of each layer, the performance of the coating layer can be customized to meet the performance requirements of glass cover plates for different electronic devices. This coating layer also has multifunctionality, such as optical filtering, anti-reflection, etc., providing more comprehensive protection for electronic devices.

[0041] The cover plate with thermoelectric properties provided in Embodiment 1 is further optimized. Specifically, an isolation layer 5 is provided on the side walls of the glass layer 1, the zirconium rhodium dioxide layer 2, the bismuth telluride layer 3, and the lead telluride layer 4.

[0042] The extending direction of the isolation layer 5 is perpendicular to the extending direction of the glass layer 1. The isolation layer 5 is a polyurethane film.

[0043] It should be noted that the thickness of the isolation layer 5 is between 60 nanometers and 100 nanometers. Preferably, the thickness of the isolation layer 5 is 80 nanometers.

[0044] The working mode of this embodiment will be described below.

[0045] With the isolation layer 5 made of polyurethane film, the side walls of the glass layer 1, zirconium dirhodide layer 2, bismuth telluride trisulfide layer 3, and lead telluride layer 4 can be protected against water, effectively improving the reliability of the cover plate.

[0046] The cover plate with thermoelectric performance provided in Embodiment 1 or 2 is further optimized. Specifically, the isolation layer 5 is a chemically deposited film.

[0047] The working mode of this embodiment will be described below.

[0048] Since the isolation layer 5 is a chemically deposited film, a film with a more uniform thickness can be obtained, further improving the reliability of the isolation layer 5.

[0049] The terms "coupled" and "coupled to" involved in the embodiments of the present application should be understood in a broad sense. For example, it can refer to a direct physical connection or an indirect connection realized through electronic devices, such as a connection realized through resistors, inductors, capacitors, or other electronic devices.

[0050] In the present utility model, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0051] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The drawings show the preferred embodiments of the present application, but do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present application in other related technical fields is equally within the scope of the patent protection of the present application.

Claims

1. A cover plate with thermoelectric properties, characterized in that, The cover plate with thermoelectric properties described above comprises a glass layer (1), on the upper surface of which a zirconium rhodium dioxide layer (2) is provided, on the upper surface of which a bismuth telluride layer (3) is provided, and on the upper surface of which a lead telluride layer (4) is provided. The extension areas of the zirconium rhodium dioxide layer (2), the bismuth telluride layer (3) and the lead telluride layer (4) are the same.

2. The cover plate with thermoelectric properties according to claim 1, wherein, The thickness of the zirconium rhodium dioxide layer (2) is between 50 nm and 100 nm, the thickness of the bismuth telluride layer (3) is between 200 nm and 300 nm, and the thickness of the lead telluride layer (4) is between 150 nm and 200 nm.

3. The cover plate with thermoelectric properties according to claim 1, characterized in that, The thickness of the zirconium rhodium dioxide layer (2) is 80 nm, the thickness of the bismuth telluride layer (3) is 250 nm, and the thickness of the lead telluride layer (4) is 180 nm.

4. The cover plate with thermoelectric properties according to claim 1, characterized in that, The zirconium rhodium dioxide layer (2), the bismuth telluride layer (3) and the lead telluride layer (4) are all deposited thin films.

5. The cover plate having thermoelectric properties according to claim 1, characterized in that, Isolation layers (5) are provided on the side walls of the glass layer (1), the zirconium rhodium dioxide layer (2), the bismuth telluride layer (3) and the lead telluride layer (4).

6. The cover plate with thermoelectric properties according to claim 5, characterized in that, The extension direction of the isolation layer (5) is perpendicular to the extension direction of the glass layer (1).

7. The cover plate with thermoelectric properties according to claim 5, characterized in that, The isolation layer (5) is a polyurethane thin film.

8. The cover plate with thermoelectric properties according to claim 7, characterized in that, The thickness of the isolation layer (5) is between 60 nm and 100 nm.

9. The cover plate with thermoelectric properties according to claim 8, characterized in that, The thickness of the isolation layer (5) is 80 nm.

10. The cover plate with thermoelectric properties according to claim 8, characterized in that, The isolation layer (5) is a chemically deposited thin film.

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