Rack of semiconductor packaging equipment

Abstract

The utility model provides a frame of semiconductor packaging equipment, which comprises a base, the top of the base is provided with a supporting plate in a sliding manner along the vertical direction, and the top of the supporting plate is provided with two first movable plates in a horizontal transverse sliding manner and two second movable plates in a horizontal longitudinal sliding manner; the two first movable plates slide oppositely or oppositely on the top of the supporting plate, and the two second movable plates slide oppositely or oppositely on the top of the supporting plate; two lead screws are horizontally and transversely arranged in the supporting plate in a rotating mode, a two-way lead screw is horizontally and longitudinally arranged in the supporting plate in a rotating mode, and the two lead screws are in transmission fit with the two-way lead screw through transmission pieces. The two screw rods are in one-to-one corresponding threaded connection with the two first movable plates, and the two second movable plates are in one-to-one corresponding threaded connection with two threaded sections of the bidirectional screw rod; in addition, the opposite sides of the two first movable plates and the two second movable plates are connected with clamping plates through elastic pieces. And the overall automation degree is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a frame of a semiconductor packaging device. Background Technique

[0002] Semiconductor packaging refers to the process of processing wafers that have passed testing into independent chips according to product models and functional requirements. This process needs to be completed using semiconductor packaging equipment, and the semiconductor packaging equipment needs to be limited and fixed on a frame for use.

[0003] A patent with the publication number of CN220233122U discloses a frame of a semiconductor packaging device, which is provided with a base, a locking ring, a handle, a longitudinal threaded rod, a transverse displacement block, a mounting seat, a bending plate, a transverse threaded rod, a transverse threaded block, etc. When an operator uses it, first pull out the locking ring to release the restraint of the locking ring on the handle, and then rotate the handle to drive the longitudinal threaded rod to rotate, so that the transverse moving block displaces, thereby driving the mounting seat and the bending plate to perform longitudinal horizontal displacement. Similarly, rotate the handle to drive the transverse threaded rod to rotate, so that the transverse moving block displaces, and then drive the bending plate to perform transverse horizontal displacement. Finally, use the rectangular space surrounded by four bending plates to fix the packaging device.

[0004] However, when the above-mentioned scheme fixes the packaging device, it is necessary to rotate the handle to separately control the longitudinal horizontal movement and the transverse horizontal movement of the bending plate, resulting in a cumbersome operation process for the entire limiting and fixing process and a low degree of automation. At the same time, rotating the handle to stepwise adjust the positions of multiple bending plates will also increase the time for fixing the packaging device, thereby reducing the fixing efficiency of the above-mentioned scheme for the packaging device. Content of the Utility Model

[0005] To solve the problems in the background technique, the utility model provides a frame of a semiconductor packaging device.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] A frame of a semiconductor packaging device includes a base, a support plate is slidably arranged vertically on the top of the base, two first movable plates are slidably arranged horizontally and transversely on the top of the support plate, and two second movable plates are slidably arranged horizontally and longitudinally on the top of the support plate; the two first movable plates slide towards or away from each other on the top of the support plate, and the two second movable plates slide towards or away from each other on the top of the support plate; two lead screws are horizontally and transversely rotatably arranged in the support plate, and a double lead screw is horizontally and longitudinally rotatably arranged, and the two lead screws are in transmission cooperation with the double lead screw through transmission parts; the two lead screws are threadedly connected to the two first movable plates in one-to-one correspondence, and the two second movable plates are threadedly connected to the two threaded sections of the double lead screw in one-to-one correspondence; in addition, clamping plates are connected to the opposite sides of the two first movable plates and the two second movable plates through elastic members.

[0008] Further, a motor is fixedly installed on the outer surface of the pallet, and the output shaft of the motor is coaxially and fixedly connected to one end of the bidirectional lead screw.

[0009] Further, a second bevel gear is coaxially and fixedly sleeved on the outer surface of the bidirectional lead screw, and a first bevel gear is coaxially and fixedly arranged on each of the two lead screws. The second bevel gear meshes and drives with the two first bevel gears; an installation groove is formed in the pallet, and the first bevel gear and the two second bevel gears are all located in the installation groove.

[0010] Further, the elastic member includes a spring and a telescopic rod. Springs and telescopic rods are arranged between the first movable plate and the clamping plate and between the second movable plate and the clamping plate. The spring is sleeved on the outer surface of the telescopic rod; one end of the spring and the telescopic rod on the same side between the first movable plate and the clamping plate is fixedly connected to the first movable plate, and the other end on the same side is fixedly connected to the clamping plate; one end of the spring and the telescopic rod on the same side between the second movable plate and the clamping plate is fixedly connected to the second movable plate, and the other end on the same side is fixedly connected to the clamping plate.

[0011] The present application has the following beneficial effects:

[0012] 1. Through the arrangement of the transmission member, while the clamping plate horizontally and laterally fixes the semiconductor packaging device, it can also horizontally and longitudinally fix the semiconductor packaging device, thereby improving the fixing efficiency of the device for the packaging device while simplifying the operation, and the overall automation degree is relatively high.

[0013] 2. Through the arrangement of the elastic member, the device can limit and fix more models of packaging devices, has a wider application range, and better practicability. Description of the Drawings

[0014] By referring to the drawings and reading the following detailed description, the above and other purposes, features, and advantages of the exemplary embodiments of the present utility model will become easily understood. In the drawings, several embodiments of the present utility model are shown in an exemplary rather than restrictive manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0015] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0016] Figure 2 is the present utility model Figure 1 is a partially enlarged schematic diagram at A in

[0017] Figure 3 is a structural schematic diagram of the transmission member of the present utility model.

[0018] Description of the Reference Numerals:

[0019] 1. Base; 2. Support plate; 201. Installation groove; 202. First chute; 203. Second chute; 3. Motor; 4. Loading rack; 5. Unloading rack; 6. Connecting plate; 7. Clamping plate; 8. Spring; 9. First movable plate; 10. Telescopic rod; 11. Bidirectional lead screw; 12. First bevel gear; 13. Lead screw; 14. Second movable plate; 15. Second bevel gear. Detailed implementation manner

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Those skilled in the art should know that the embodiments described below are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] As Figures 1 - 3 shown, the technical solution adopted by the present invention is as follows: A frame of a semiconductor packaging device includes a base 1. A loading rack 4 is provided on the left side of the base 1, and an unloading rack 5 is provided on the right side of the base 1. Both the loading rack 4 and the unloading rack 5 are fixedly connected to the base 1 through a connecting plate 6. An electric push rod is fixedly embedded and installed inside the base 1. The telescopic shaft of the electric push rod slidably penetrates through the top of the base 1, and the telescopic shaft of the electric push rod is fixedly connected to a support plate 2. The vertical height of the support plate 2 can be adjusted through the electric push rod.

[0022] Two first chutes 202 are horizontally and transversely opened on the top of the support plate 2, and two second chutes 203 are horizontally and longitudinally opened. The two first chutes 202 are symmetrically arranged facing each other, and the two second chutes 203 are symmetrically arranged facing each other. A first movable plate 9 is slidably arranged in a limited manner in each first chute 202, and the two first movable plates 9 slide towards or away from each other on the top of the support plate 2. A second movable plate 14 is slidably arranged in a limited manner in each second chute 203, and the two second movable plates 14 slide towards or away from each other on the top of the support plate 2.

[0023] Two lead screws 13 are horizontally and transversely rotatably arranged inside the support plate 2, and a bidirectional lead screw 11 is horizontally and longitudinally rotatably arranged. Both ends of the bidirectional lead screw 11 are rotatably connected to the support plate 2, and both ends of the two lead screws 13 are rotatably connected to the support plate 2. The two lead screws 13 are arranged facing each other, and both lead screws 13 are in transmission cooperation with the bidirectional lead screw 11 through transmission parts.

[0024] The two first movable plates 9 correspond to the two lead screws 13 one by one. Each first movable plate 9 is in threaded cooperation with the corresponding lead screw 13. The first movable plate 9, the lead screw 13 and the ball form a ball screw pair. The two second movable plates 14 correspond to the two threaded segments of the bidirectional lead screw 11 one by one. Each second movable plate 14 is in threaded cooperation with the corresponding threaded segment of the bidirectional lead screw 11. The second movable plate 14, the bidirectional lead screw 11 and the ball form a ball screw pair.

[0025] A motor 3 is also fixedly installed on the outer surface of the support plate 2. The output shaft of the motor 3 is coaxially and fixedly connected to one end of the bidirectional lead screw 11. When the motor 3 is started, the output shaft of the motor 3 drives the bidirectional lead screw 11 to rotate, and the bidirectional lead screw 11 drives the two second movable plates 14 to approach each other.

[0026] A second bevel gear 15 is coaxially and fixedly sleeved on the outer surface of the bidirectional lead screw 11. A first bevel gear 12 is coaxially and fixedly arranged at one end of each of the two lead screws 13 facing each other. The second bevel gear 15 is in meshing transmission with the two first bevel gears 12 and always remains in a meshing state. An installation groove 201 is formed in the support plate 2, and the first bevel gear 12 and the two second bevel gears 15 are all located in the installation groove 201.

[0027] The rotation of the bidirectional lead screw 11 will drive the second bevel gear 15 to rotate. The second bevel gear 15 drives the two lead screws 13 to rotate synchronously through the first bevel gear 12, so as to drive the two second movable plates 14 to approach each other.

[0028] In addition, clamping plates 7 are fixedly connected to the facing sides of the two first movable plates 9 and the facing sides of the two second movable plates 14 through elastic members. The elastic members include springs 8 and telescopic rods 10. Springs 8 and telescopic rods 10 are provided between the first movable plate 9 and the clamping plate 7 and between the second movable plate 14 and the clamping plate 7. The spring 8 is sleeved on the outer surface of the telescopic rod 10, and the telescopic direction of the spring 8 is the same as that of the telescopic rod 10.

[0029] When the spring 8 and the telescopic rod 10 are between the first movable plate 9 and the clamping plate 7, one end of the spring 8 is fixedly connected to the first movable plate 9, and the other end of the spring 8 is fixedly connected to the clamping plate 7. One end of the telescopic rod 10 is fixedly connected to the first movable plate 9, and the other end of the telescopic rod 10 is fixedly connected to the clamping plate 7.

[0030] When the spring 8 and the telescopic rod 10 are between the second movable plate 14 and the clamping plate 7, one end of the spring 8 is fixedly connected to the second movable plate 14, and the other end of the spring 8 is fixedly connected to the clamping plate 7. One end of the telescopic rod 10 is fixedly connected to the second movable plate 14, and the other end of the telescopic rod 10 is fixedly connected to the clamping plate 7.

[0031] When the two first movable plates 9 approach each other, they will drive the two clamping plates 7 connected to themselves to approach each other, so as to horizontally and laterally clamp and fix the semiconductor packaging equipment on the top of the pallet 2. When the two second movable plates 14 approach each other, they will drive the two clamping plates 7 connected to themselves to approach each other, so as to horizontally and longitudinally clamp and fix the semiconductor packaging equipment on the top of the pallet 2. At the same time, through the arrangement of the spring 8 and the telescopic rod 10, the frame of the semiconductor packaging equipment can limit and fix more models of packaging equipment, with a wider application range and better practicability.

[0032] Working principle: During use, the operator places the packaging equipment on the top of the pallet 2. Start the motor 3, and the output shaft of the motor 3 drives the bidirectional lead screw 11 to rotate. The rotation of the bidirectional lead screw 11 will drive the two second movable plates 14 to slide in the second chute 203 where they are located, so that the two second movable plates 14 approach each other. When the two second movable plates 14 approach each other, they will drive the two clamping plates 7 connected to themselves to approach each other through the spring 8 and the telescopic rod 10, so as to horizontally and longitudinally clamp and fix the semiconductor packaging equipment on the top of the pallet 2.

[0033] Meanwhile, the rotation of the bidirectional lead screw 11 will also drive the second bevel gear 15 to rotate. The second bevel gear 15 drives the two lead screws 13 to rotate synchronously through the two first bevel gears 12, so as to drive the two second movable plates 14 to approach each other, and further horizontally and laterally clamp and fix the semiconductor packaging equipment on the top of the pallet 2. The operation of clamping and fixing the packaging equipment is simplified, and the efficiency of fixing the packaging equipment is improved.

[0034] In addition, during the horizontal and vertical clamping of the packaging equipment in the above operation, the spring 8 will be compressed and the telescopic rod 10 will contract. The spring 8 can not only play a buffering role in this process, but also enable the frame of the semiconductor packaging equipment to limit and fix more models of packaging equipment, with a wider application range.

[0035] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A frame of a semiconductor packaging device, characterized in that, It includes a base (1), on the top of the base (1), a supporting plate (2) is slidably arranged in the vertical direction. On the top of the supporting plate (2), two first movable plates (9) are slidably arranged horizontally and transversely, and two second movable plates (14) are slidably arranged horizontally and longitudinally; the two first movable plates (9) slide towards or away from each other on the top of the supporting plate (2), and the two second movable plates (14) slide towards or away from each other on the top of the supporting plate (2); in the supporting plate (2), two lead screws (13) are rotatably arranged horizontally and transversely, and a double lead screw (11) is rotatably arranged horizontally and longitudinally. The two lead screws (13) are in transmission cooperation with the double lead screw (11) through transmission parts; the two lead screws (13) are threadedly connected to the two first movable plates (9) one by one, and the two second movable plates (14) are threadedly connected to the two threaded sections of the double lead screw (11) one by one; in addition, clamping plates (7) are connected to the facing sides of the two first movable plates (9) and the two second movable plates (14) through elastic parts.

2. The frame of the semiconductor packaging device according to claim 1, wherein, A motor (3) is fixedly installed on the outer surface of the supporting plate (2), and the output shaft of the motor (3) is coaxially and fixedly connected to one end of the double lead screw (11).

3. The frame of the semiconductor packaging device according to claim 1, characterized in that, A second bevel gear (15) is coaxially and fixedly sleeved on the outer surface of the double lead screw (11), and a first bevel gear (12) is coaxially and fixedly arranged on each of the two lead screws (13). The second bevel gear (15) is in meshing transmission with the two first bevel gears (12); an installation groove (201) is formed in the supporting plate (2), and the first bevel gear (12) and the two second bevel gears (15) are all located in the installation groove (201).

4. The frame of the semiconductor packaging device according to claim 1, wherein, The elastic part includes a spring (8) and a telescopic rod (10). A spring (8) and a telescopic rod (10) are arranged between the first movable plate (9) and the clamping plate (7) and between the second movable plate (14) and the clamping plate (7). The spring (8) is sleeved on the outer surface of the telescopic rod (10); one end of the spring (8) and the telescopic rod (10) on the same side between the first movable plate (9) and the clamping plate (7) is fixedly connected to the first movable plate (9), and the other end on the same side is fixedly connected to the clamping plate (7); one end of the spring (8) and the telescopic rod (10) on the same side between the second movable plate (14) and the clamping plate (7) is fixedly connected to the second movable plate (14), and the other end on the same side is fixedly connected to the clamping plate (7).

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