Ice making assembly and semiconductor ultra-silence ice water all-in-one machine device based on TEC

Abstract

An ice making assembly and a semiconductor ultra-silence ice water all-in-one machine device based on a TEC are disclosed, a second TEC refrigeration module comprises a second semiconductor refrigeration sheet, the hot surface of the second semiconductor refrigeration sheet is connected with a second water cooling plate, and the cold surface of the second semiconductor refrigeration sheet is connected with an ice making forming mechanism; the ice-making forming mechanism comprises a forming ice tray connected with the cold surface of the second semiconductor chilling plate, a plurality of forming pipes are fixedly arranged below the forming ice tray, and the forming pipes are inserted into the ice-making groove; in the ice making and forming mechanism, a water tank is arranged below an ice making tank, an ice tank rotating shaft is arranged on the side of the ice making tank, and the ice tank rotating shaft is in transmission connection with an output shaft of a turnover motor; the water tank comprises an upper flow guide structure and a connecting frame, an ice storage tank is arranged in the connecting frame, and an ice container is arranged below the ice storage tank. According to the utility model, refrigeration water and ice making are integrated, ice water of 5 DEG C is used for making ice, the ice maker has the characteristics of small size and low noise, and the ice water of various water temperatures can be drunk quickly.

Description

Technical Field

[0001] The utility model relates to a semiconductor super silent ice water integrated machine device based on TEC. Background Art

[0002] Most of the ice water integrated machines for making bullet ice on the market at present generally use a ice pushing mechanism to drop the bullet ice inside the ice making cavity into a funnel, and then shovel it into an ice storage box. The bullet ice will fall twice, and multiple bullet ice will pile up during the second fall, and it is very easy to break the ice, resulting in the bullet ice not being able to be concentrated in the ice storage box without damage, thus easily affecting the normal use experience of the bullet ice. Single-temperature cold water may limit its adaptability and flexibility and is not sufficient to meet the needs of all users in different situations. Moreover, the ice makers on the market usually use normal temperature water to directly make ice, the waiting time for equipment use is too long, and basically use compressors for refrigeration, and the noise is relatively large and not suitable for use in quiet environments such as offices and bedrooms.

[0003] CN116262006A discloses an ice making and heating type water dispenser, including a fixed plastic part, the fixed plastic part is fixed with a water supply module, a control system circuit board, a heating module and a semiconductor refrigeration module. The water supply module conveys normal temperature water to the heating module and the semiconductor refrigeration module through a silica gel hose. The control system circuit board controls the heating module to heat the normal temperature water, and the control system circuit board controls the semiconductor refrigeration module to freeze the normal temperature water. A water receiving box is connected to the water outlet of the heating module. This solution solves the problems of hot water and hot air spraying and cold and hot water backflow, but does not give any technical inspiration on how to improve the ice making rate and quality. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is: The utility model provides a mechanical device without an ice pushing mechanism and with single-time ice deicing, which can simultaneously provide cold water at different water temperatures and directly make ice with low-temperature cold water, and is a super silent ice water integrated machine. Users can conveniently obtain ice cubes and cold water on the same device, and greatly shorten the ice making time, improving the user experience.

[0005] The technical solution of the utility model is specifically as follows:

[0006] An ice making component includes an ice making and forming mechanism and a second TEC refrigeration module. Among them, the second TEC refrigeration module includes a second semiconductor refrigeration sheet, the hot surface of the second semiconductor refrigeration sheet is connected to a second water cooling plate, and the cold surface of the second semiconductor refrigeration sheet is connected to the ice making and forming mechanism; the ice making and forming mechanism includes a forming ice tray connected to the cold surface of the second semiconductor refrigeration sheet, and a plurality of forming tubes are fixedly arranged below the forming ice tray, and the forming tubes are inserted into an ice making groove;

[0007] In the ice-making and forming mechanism, a water tank is arranged below the ice-making tank, and an ice tank rotating shaft is arranged on the side of the ice-making tank. The ice tank rotating shaft is in transmission connection with the output shaft of the turning motor; the water tank includes a diversion structure at the upper part and a connecting frame. A storage ice tank is arranged inside the connecting frame, and an ice liner is arranged below the storage ice tank.

[0008] A diversion plate is arranged obliquely on the side of the diversion structure, and a diversion edge is arranged on the ice-making tank;

[0009] The rear side plate of the connecting frame is a vertical plate. The storage ice tank is an open container. Leakage holes are arranged on the bottom floor plate of the storage ice tank. The rear side plate of the open container is in front of the rear side plate.

[0010] A TEC-based semiconductor ultra-quiet ice water integrated machine device adopting the above ice-making component includes a base, a housing component sleeved outside the base. A water storage component, a refrigeration component, an ice-making component, a discharging component, a heat dissipation component, a power supply and an electrical control system are arranged on the base inside the housing component; among them,

[0011] The water storage component is arranged inside the housing component. The water storage component includes a water storage tank body, and drinking water for supplying water is stored in the water storage tank body;

[0012] The refrigeration component is arranged inside the housing component and is communicated with the water storage component for preparing ice water;

[0013] The ice-making component is arranged inside the housing component and is communicated with the refrigeration component. When ice is needed, the ice water in the refrigeration component is conveyed into the ice-making component to make ice;

[0014] The heat dissipation component is respectively connected with the refrigeration component and the ice-making component;

[0015] The discharging component is arranged on the housing component for discharging the media in the refrigeration component and the ice-making component; the discharging component includes solid discharging and liquid discharging.

[0016] The refrigeration component includes an ice liner and a first TEC refrigeration module connected to the ice liner; the first TEC refrigeration module includes a first semiconductor refrigeration sheet. A cold-end fin is fixedly connected to the cold end of the first semiconductor refrigeration sheet. The cold-end fin is located inside the ice liner and contacts with water; a first water-cooling plate is arranged at the hot end of the first semiconductor refrigeration sheet, and the first water-cooling plate is connected with water inlets and outlets.

[0017] Thermal conductive materials are evenly applied between the cold-end fin and the cold end of the first semiconductor refrigeration sheet and between the first water-cooling plate and the hot end of the first semiconductor refrigeration sheet.

[0018] The ice liner is communicated with the water storage tank body of the water storage component through a pipeline; the hose of the water storage tank body is connected to the ice liner through a first electromagnetic valve, and a temperature controller and a temperature sensor are arranged inside the ice liner.

[0019] The heat dissipation component includes a heat dissipation water tank and a water-cooled radiator system. A number of water-cooled radiators are provided in the water-cooled radiator system; the water-cooled radiator system connects the first water-cooled plate of the refrigeration component and the second water-cooled plate of the ice-making component in series through pipelines.

[0020] Fans are installed on the water-cooled radiators of the water-cooled radiator system.

[0021] The beneficial effects of the present utility model are as follows: The present utility model solves the problems of the existing ice-water integrated machine that provides a single ice-water temperature and has a long ice-making time, reduces the space volume while improving the integrity of the collected ice cubes, and proposes a super silent ice-water integrated machine. By adopting the semiconductor ice-making technology, the refrigerated water and ice-making are integrated into one, and ice is made using 5°C ice water, which has the characteristics of small volume and low noise, and solves the problem that ice water at multiple water temperatures can be quickly drunk. Therefore, a super silent ice-water integrated machine device based on TEC is developed, which can provide cold water at multiple temperatures simultaneously, improve the ice-making rate, and enhance the convenience and experience of users. Description of the Drawings

[0022] Figure 1 is the external view of the present utility model;

[0023] Figure 2 is the overall structure diagram of the present utility model;

[0024] Figure 3 is the structure diagram of the refrigeration component;

[0025] Figure 4 is the structure diagram of the ice-making component;

[0026] Figure 5 is the structure diagram of the ice-making forming mechanism and the second TEC refrigeration module;

[0027] Figure 6 is the structure diagram of the formed ice tray and the forming pipe;

[0028] Figure 7 is the working principle diagram of the TEC refrigeration module;

[0029] Figure 8 is the structure of the ice storage tank;

[0030] Figure 9 is the cross-sectional view of the diversion structure of the ice-making component. Detailed Embodiments

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0032] As Figure 1 、 Figure 2 shown, a semiconductor ultra-quiet ice water integrated machine device based on TEC includes a base 4, and a housing assembly 100 is sleeved outside the base 4. A water storage assembly, a refrigeration assembly 3, an ice making assembly 1, a discharge assembly, a heat dissipation assembly, a power supply 6 and an electrical control system are arranged on the base 4 inside the housing assembly 100; wherein,

[0033] The water storage assembly is arranged inside the housing assembly 100, and the water storage assembly includes a water storage tank body 8, and drinking water for supplying water is stored in the water storage tank body 8;

[0034] The refrigeration assembly 3 is arranged inside the housing assembly 100 and is communicated with the water storage assembly for preparing ice water;

[0035] The ice making assembly 1 is arranged inside the housing assembly 100 and is communicated with the refrigeration assembly 3. When ice is needed, the ice water in the refrigeration assembly 3 is conveyed into the ice making assembly to make ice;

[0036] The heat dissipation assembly is respectively connected to the refrigeration assembly and the ice making assembly;

[0037] The discharge assembly 101 is arranged on the housing assembly 100 for discharging the media in the refrigeration assembly 3 and the ice making assembly 1; the discharge assembly 101 includes solid discharge and liquid discharge; in order to facilitate liquid discharge, a drip tray 102 is arranged below the liquid discharge.

[0038] The electrical control system 9 is used to set and adjust the working parameters of the new ice water integrated machine and is responsible for monitoring and adjusting the operating state of the new ice water integrated machine.

[0039] Among them, the refrigeration assembly 3 includes an ice tank 31 and a first TEC refrigeration module 32 connected to the ice tank 31. The first TEC refrigeration module 32 is used to lower the temperature in the ice tank 31 to turn normal temperature water into ice water, ensuring the temperature control and cooling effect during the ice water preparation process.

[0040] Among them, as Figure 3As shown in the figure, the ice tank 31 is connected to the water storage tank body 8 of the water storage assembly through a pipeline. That is to say, the water source of the ice tank 31 is the water stored in the water storage tank body 8, and the water source in the water storage tank body 8 comes from an external water source, such as barreled water or tap water. Specifically, the hose of the water storage tank body 8 is connected to the ice tank 31 through the first solenoid valve. A thermostat and a temperature sensor are arranged in the ice tank 31 to monitor the water temperature in the ice tank 31 in real time. According to the water temperature selected by the user, the thermostat will adjust the opening degree of the first solenoid valve. The first solenoid valve sends the water in the water storage tank body 8 into the ice tank 31 according to the instruction of the thermostat, so that the water temperature in the ice tank 31 can be adjusted. The first solenoid valve is a mixing valve with adjustable opening degree. The outlet of the ice tank 31 is connected to the water outlet of the discharging assembly 101 through a pipeline, so that the water flow after mixing normal temperature water and cold water flows through the mixing valve to the water outlet, providing the temperature required by the user.

[0041] The first TEC refrigeration module 32 includes a first semiconductor refrigeration sheet 324. A cold-end fin 321 is fixedly connected to the cold end of the first semiconductor refrigeration sheet 324. The cold-end fin 321 is located inside the ice tank and contacts with water, and a heat-conducting material is applied to the contact surface between the two. A first water-cooling plate 323 is arranged at the hot end of the first semiconductor refrigeration sheet 324, and the first water-cooling plate 323 is connected with a water inlet and outlet 322. The first water-cooling plate 323 mainly dissipates heat from the hot surface of the first semiconductor refrigeration sheet 324, and the first water-cooling plate 323 is externally connected to a heat dissipation assembly. Heat-conducting materials are evenly applied between the cold-end fin 321 and the cold end of the first semiconductor refrigeration sheet 324, and between the first water-cooling plate 323 and the hot end of the first semiconductor refrigeration sheet 324, which can achieve sufficient heat conduction. The heat dissipation end is located on the side far from the cold-end fin. By energizing the first TEC refrigeration module 32, the temperature of the cold end of the first TEC refrigeration module 32 is lower than that of the hot end, so as to absorb the heat of the cold-end fin 321.

[0042] As Figure 4 、 Figure 5 As shown in the figure, the ice-making assembly 1 includes an ice-making and forming mechanism 11 and a second TEC refrigeration module 12. Among them, the second TEC refrigeration module 12 includes a second semiconductor refrigeration sheet 121. The hot surface of the second semiconductor refrigeration sheet 121 is connected to a second water-cooling plate 122. The second water-cooling plate 122 mainly dissipates heat from the hot surface of the second TEC refrigeration module 12, and the second water-cooling plate 122 is externally connected to a heat dissipation assembly for heat dissipation. The cold surface of the second semiconductor refrigeration sheet 121 is connected to the ice-making and forming mechanism 11. The ice-making and forming mechanism 11 includes a forming ice tray 111 connected to the cold surface of the second semiconductor refrigeration sheet 121. A plurality of forming tubes 112 are fixedly arranged below the forming ice tray 111, and the forming tubes 112 are inserted into an ice-making groove 113. The forming tubes 112 are of the prior art.

[0043] It should be noted that heat-conducting materials are evenly applied between the forming ice tray 111 and the cold end of the second semiconductor refrigeration sheet 121, and between the second water-cooling plate 122 and the hot end of the second semiconductor refrigeration sheet 121, which can achieve sufficient heat conduction. The hot end is located on the side away from the forming ice tray 111. By energizing the second semiconductor refrigeration sheet 121, the temperature of the cold end of the second semiconductor refrigeration sheet 121 is lower than that of the hot end, so as to absorb the heat of the forming ice tray 111. The forming ice tray 111 adopts heat insulation measures. The main purpose of the heat insulation layer is to reduce the heat loss at the cold end and further improve the ice-making speed. By changing the current direction of the upper and lower second semiconductor refrigeration sheets 121, the temperature raising and lowering functions of the forming ice tray 111 are realized.

[0044] In the ice-making and forming mechanism 11, the ice-making tank 113 is communicated with the water storage tank body 8 through a pipeline, and an ice-making water pump is arranged in the pipeline, so that the water in the water storage tank body 8 can enter the ice-making tank 113. A water tank 115 is arranged below the ice-making tank 113, and an ice tank rotating shaft 114 is arranged on the side of the ice-making tank 113. The ice tank rotating shaft 114 is in transmission connection with the output shaft of the flipping motor 118, and the body of the flipping motor 118 is arranged on the side of the water tank 115. The water tank 115 includes a guiding structure 116 at the upper part and a connecting frame 117. A ice storage tank 2 is arranged inside the connecting frame 117, and an ice liner 31 is arranged below the ice storage tank 2.

[0045] As Figure 8 、 Figure 9 shown, an inclined guiding plate 1161 is arranged on the side of the guiding structure 116, and a guiding edge 1131 is arranged on the ice-making tank 113. The flipping motor 118 controls the ice tank rotating shaft 114 to only rotate towards the direction of the guiding plate 1161.

[0046] The rear side plate 1171 of the connecting frame 117 is a vertical plate. The ice storage tank 2 is an open container, and a water leakage hole 22 is arranged on the bottom plate of the ice storage tank 2. The rear side plate 21 of the open container is located in front of the rear side plate 1171.

[0047] After the ice-making is completed, the whole ice block adheres to the forming ice tray 111 and the forming pipe 112, and the remaining water after ice-making remains in the ice-making tank 113. During operation, the flipping motor 118 controls the ice tank rotating shaft 114 to rotate, and the remaining water in the ice-making tank 113 flows downward along the guiding plate 1161, and the remaining water flows to the ice liner 31 along the rear side plate 1171 all the time. If a small amount of water enters the ice storage tank 2, the water leakage hole 22 at the bottom of the ice storage tank 2 also flows the water to the ice liner 31.

[0048] In the diversion structure 116, there is an inclined diversion plate, which enables the water in the ice-making tank 113 to flow back into the ice tank. Moreover, the bottom is designed with a large-space slope, which not only facilitates the water to flow back into the ice tank, but also provides a certain upward overflow space when the amount of returned water is large. A hollow structure is designed at the lowest point of the bottom of the ice storage tank 2, which facilitates the small amount of water flowing into the ice storage tank 2 to flow downward. After the water in the ice-making tank 113 is poured out, the ice-forming tray 111 starts to de-ice, and the ice cubes directly fall into the ice storage tank 2 along the diversion plate, completing a complete ice-making process. This structural design solves the problem of the damage to the integrity of ice cubes caused by most secondary ice shoveling on the market, and saves volume at the same time.

[0049] The refrigeration component 3 and the ice-making component 1 are the core components of the new ice-water integrated machine. The two can be respectively connected to the heat dissipation component, or they can share a set of heat dissipation components. The heat dissipation component includes a heat dissipation water tank and a water-cooled row heat dissipation system 7, and several water-cooled rows are arranged in the water-cooled row heat dissipation system 7. The water-cooled heat dissipation system adopts a closed-loop water-cooled system to ensure that the heat source can be effectively dissipated. The water-cooled row heat dissipation system 7 connects the first water-cooled plate 323 of the refrigeration component 3 and the second water-cooled plate 122 of the ice-making component 1 in series through pipelines, and dissipates heat through the heat dissipation fins and cooling pipelines in the water-cooled rows. The water-cooled row heat dissipation system 7 is also connected with a water-cooled pump and a heat dissipation water tank 5.

[0050] After the water absorbs heat through the water-cooled plate, it is transported to the water-cooled row heat dissipation system 7 by the water-cooled pump, and exchanges heat with the surrounding air on the water-cooled rows of the water-cooled row heat dissipation system 7. After the water absorbs heat through the first water-cooled plate 323 and the second water-cooled plate 122, it is transported to the water-cooled row heat dissipation system 7 by the water-cooled pump, and exchanges heat with the surrounding air on the heat dissipation fins of the water-cooled row heat dissipation system 7. At the same time, a fan is installed on the water-cooled row to accelerate the air flow and enhance the heat dissipation effect. The cooled water is transported back to the heat source again, and this process repeats. The water-cooled pump is responsible for transporting the water from the water-cooled row to the heat source, and then transporting the hot water back to the water-cooled row 32.

[0051] Furthermore, a fan is installed on the water-cooled row of the water-cooled row heat dissipation system 7 for auxiliary heat dissipation.

[0052] The water storage component includes a water storage tank body 8, a water storage inlet pipe, a water storage outlet pipe, a cold water pump, and an ice-making pump; the water storage outlet pipe is arranged at the bottom of the water storage tank body 8. The water storage tank body 8 is used to store normal temperature drinking water, and the water storage tank body supplies water to the refrigeration component through the water storage delivery pipe and the cold water pump. The ice-making pump is responsible for transporting the water in the water storage tank body 8 to the ice-making tank 113 through pipelines. It should be noted that the connection of the water storage tank body, pipelines and pumps is a technology well-known to those skilled in the art, and how to arrange the pipelines can be arranged according to specific situations.

[0053] The discharging assembly 2 includes a solid discharging device and a liquid discharging channel; the solid discharging system is arranged on the housing assembly 100 for discharging solid ice cubes; the liquid discharging channel is used for discharging liquid drinking water and is connected to the ice tank 31.

[0054] The solid discharging system includes an ice storage tank 2. After ice making is completed, the current direction of the semiconductor refrigeration sheet is changed to heat the forming tube 112 in the forming ice tray 111, ensuring that the ice cubes fall off quickly and completely and enter the ice storage tank 2.

[0055] The electrical control system 9 is used to set and adjust the working parameters of the ultra - quiet ice water machine, and is responsible for monitoring and regulating the operating state of the ultra - quiet ice water machine. The electrical control system 9 mainly realizes functions such as driving operation, control logic, safety protection, and fault diagnosis. It is responsible for driving, controlling, and protecting the normal operation of the ultra - quiet ice water machine, and users can operate and set through the control panel.

[0056] The working principle of the present utility model is:

[0057] The refrigeration assembly and the ice making assembly are the core components of the ultra - quiet ice water machine, and each includes a set of TEC refrigeration module and a water - cooled heat dissipation system. Among them, the refrigeration assembly and the ice making assembly share a set of heat dissipation system. The refrigeration assembly is used to reduce the temperature in the ice tank, turning normal temperature water into ice water at 5°C, ensuring temperature control and cooling effect during the ice - making water process; the ice making assembly is used to reduce the temperature in the ice - making tank, turning ice water into ice cubes, ensuring temperature control and cooling effect during the ice - making process. In the heat dissipation system, the water - cooled plates of the refrigeration assembly and the ice making assembly are connected in series through pipes, and the water - cooled row is connected through pipes. Heat dissipation is carried out through the heat dissipation fins and cooling pipelines in the water - cooled row, and a fan is installed on the water - cooled row to assist in heat dissipation.

[0058] The present utility model is a TEC - based semiconductor ultra - quiet ice water machine device designed based on a semiconductor refrigeration sheet. Both refrigeration and heating of this device are realized through the semiconductor refrigeration sheet. The ice - making unit of this product contains two refrigeration sheets, with a compact volume, small power, low cost. Through the mixing water tank, it can quickly meet the cold water drinking needs of various water temperatures, and uses cold water for ice - making, and has relatively low noise, basically only the sound of the fan, meeting the needs of the home bedroom. It greatly improves the flexibility of user use and the ice - making rate, achieving the purpose of energy - saving and high efficiency.

[0059] The above - mentioned are only the preferred embodiments of the present utility model. It should be noted that for those skilled in the art, without departing from the overall concept of the present utility model, several changes and improvements can still be made, and these should also be regarded as the protection scope of the present utility model.

Claims

1. An ice-making component, characterized in that: It includes an ice-making and forming mechanism (11) and a second TEC refrigeration module (12). Among them, the second TEC refrigeration module (12) includes a second semiconductor refrigeration sheet (121). The hot surface of the second semiconductor refrigeration sheet (121) is connected to the second water-cooling plate (122), and the cold surface of the second semiconductor refrigeration sheet (121) is connected to the ice-making and forming mechanism (11); The ice-making and forming mechanism (11) includes a forming ice tray (111) connected to the cold surface of the second semiconductor refrigeration sheet (121). A number of forming tubes (112) are fixedly arranged below the forming ice tray (111), and the forming tubes (112) are inserted into the ice-making groove (113). In the ice-making and forming mechanism (11), a water tank (115) is arranged below the ice-making groove (113), and an ice groove rotating shaft (114) is arranged on the side of the ice-making groove (113). The ice groove rotating shaft (114) is in transmission connection with the output shaft of the flipping motor (118); The water tank (115) includes a guiding structure (116) on the upper part and a connecting frame (117). A storage ice tank (2) is arranged in the connecting frame (117), and an ice tank (31) is arranged below the storage ice tank (2).

2. The ice-making component according to claim 1, wherein: An inclined guiding plate (1161) is arranged on the side of the guiding structure (116), and a guiding edge (1131) is arranged on the ice-making groove (113). The rear side plate (1171) of the connecting frame (117) is a vertical plate. The storage ice tank (2) is an open container. Leakage holes (22) are arranged on the bottom floor of the storage ice tank (2). The rear side plate (21) of the open container is in front of the rear side plate (1171).

3. A TEC-based semiconductor ultra-quiet ice water integrated machine device using the ice-making component described in claim 1, characterized in that: It includes a base (4). A housing assembly (100) is sleeved outside the base (4). A water storage assembly, a refrigeration assembly (3), an ice-making assembly (1), a discharging assembly, a heat dissipation assembly, a power supply (6) and an electrical control system are arranged on the base (4) inside the housing assembly (100); Among them, The water storage assembly is arranged inside the housing assembly (100). The water storage assembly includes a water storage tank body (8), and drinking water for supplying water is stored in the water storage tank body (8). The refrigeration assembly (3) is arranged inside the housing assembly (100) and is communicated with the water storage assembly for preparing ice water. The ice-making assembly (1) is arranged inside the housing assembly (100) and is communicated with the refrigeration assembly (3). When ice is needed, the ice water in the refrigeration assembly (3) is transported into the ice-making assembly to make ice. The heat dissipation assembly is respectively connected to the refrigeration assembly and the ice-making assembly. The discharging assembly (101) is arranged on the housing assembly (100) for discharging the media in the refrigeration assembly (3) and the ice-making assembly (1); The discharging assembly (101) includes solid discharging and liquid discharging.

4. The semiconductor ultra-silent ice water integrated machine device based on TEC according to claim 3, characterized in that: The refrigeration assembly (3) includes an ice tank (31) and a first TEC refrigeration module (32) connected to the ice tank (31); the first TEC refrigeration module (32) includes a first semiconductor refrigeration sheet (324), and a cold-end fin (321) is fixedly connected to the cold end of the first semiconductor refrigeration sheet (324), and the cold-end fin (321) is located inside the ice tank and in contact with water; a first water-cooling plate (323) is provided at the hot end of the first semiconductor refrigeration sheet (324), and the first water-cooling plate (323) is connected with a water inlet and outlet (322).

5. The semiconductor ultra-silent ice water integrated machine device based on TEC according to claim 4, wherein: Thermal conductive material is evenly applied between the cold-end fin (321) and the cold end of the first semiconductor refrigeration sheet (324), and between the first water-cooling plate (323) and the hot end of the first semiconductor refrigeration sheet (324).

6. The semiconductor super-silent ice water integrated machine device based on TEC according to claim 4, wherein: The ice tank (31) is connected to the water storage tank body (8) of the water storage assembly through a pipeline; the hose of the water storage tank body (8) is connected to the ice tank (31) through a first solenoid valve, and a temperature controller and a temperature sensor are arranged in the ice tank (31).

7. A semiconductor ultra-silent ice water integrated machine device based on TEC according to claim 3, characterized in that: The heat dissipation assembly includes a heat dissipation water tank and a water-cooled row heat dissipation system (7), and a plurality of water-cooled rows are arranged in the water-cooled row heat dissipation system (7); the water-cooled row heat dissipation system (7) connects the first water-cooling plate (323) of the refrigeration assembly (3) and the second water-cooling plate (122) of the ice-making assembly (1) in series through a pipeline.

8. The semiconductor ultra-silent ice water integrated machine device based on TEC according to claim 7, characterized in that: Fans are installed on the water-cooled rows of the water-cooled row heat dissipation system (7).

Images