Wafer detection equipment based on X-ray

Abstract

The utility model discloses a wafer detection device based on X-ray, which comprises a fixed frame and an X-ray lamp holder fixedly arranged at the upper end of the fixed frame, when the device is used for detecting a wafer, a telescopic plate is opened, the wafer is placed in a connecting pipe, the connecting pipe is pulled downwards, the connecting pipe drives the telescopic pipe to stretch, and the X-ray lamp holder is fixed on the fixed frame. When a wafer is detected, the connecting rod moves to be inserted into the detection platform, the movable block is extruded by the side wall of the detection platform to slide into the first sliding groove, the movable block is pushed outwards by the first spring to be clamped in the clamping block, fixing of the connecting pipe is automatically completed, and the X-ray lamp holder is turned on to detect the wafer. According to the wafer detection equipment device based on the X-ray, after a wafer is placed in the connecting pipe, the connecting pipe can be pulled downwards until the detection platform is wrapped, the connecting pipe is automatically fixed, the X-ray can be directly guided into the wafer when the wafer is irradiated with the X-ray, and the situation that the physical health of detection personnel is affected due to X-ray leakage during detection is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer detection device based on X-ray. Background Technique

[0002] A wafer is called so because of its circular shape. Wafers can be used to fabricate silicon semiconductor integrated circuits. Multiple chips can be cut from one wafer, and the chips are packaged to form the chips seen in daily life. During the wafer production process, there may be defects such as damage, dirt, scratches, and cracks on both the front and back sides of the wafer. These defects will affect the performance of the chips, so it is necessary to perform appearance detection on the wafers.

[0003] Due to the penetrability of X-ray, it can be used in wafer detection, and the front and back sides of the wafer can be detected at one time without turning it over. However, due to manual operation, since X-ray is highly harmful to the human body, direct or indirect irradiation of X-ray to the staff should be avoided during wafer detection, and building an isolation room will greatly slow down the wafer detection efficiency.

[0004] Therefore, we propose a wafer detection device based on X-ray to solve the problems mentioned above. Content of the Utility Model

[0005] The utility model provides a wafer detection device based on X-ray, which solves the problem mentioned in the above background technique that due to the penetrability of X-ray, it can be used in wafer detection, and the front and back sides of the wafer can be detected at one time without turning it over. However, due to manual operation, since X-ray is highly harmful to the human body, direct or indirect irradiation of X-ray to the staff should be avoided during wafer detection, and building an isolation room will greatly slow down the wafer detection efficiency.

[0006] The utility model provides the following technical solution: A wafer detection device based on X-ray includes a fixed frame and an X-ray lamp head fixedly installed at the upper end of the fixed frame. A detection platform is fixedly installed at the lower end of the fixed frame. An active component is installed at the lower end of the X-ray lamp head. The active component includes a fixed tube fixedly installed at the lower end of the X-ray lamp head. A telescopic tube is fixedly installed at the lower end of the fixed tube. A connecting tube is fixedly installed at the lower end of the telescopic tube. A U-shaped groove is formed in the side wall of the connecting tube. A telescopic plate is slidably connected in the U-shaped groove. First chutes are formed in the peripheral side walls inside the connecting tube. Active blocks are slidably connected in the first chutes. A first spring is fixedly installed between each active block and the side wall of the corresponding first chute. Clamping blocks are fixedly installed on the four side walls of the detection platform.

[0007] As an alternative embodiment of the present utility model, between the upper and lower inner walls of the telescopic tube, a second spring is fixedly installed in common; on the side wall of the telescopic plate, a connecting plate is fixedly installed; and on the side wall of the connecting tube, a handle is fixedly installed.

[0008] As an alternative embodiment of the present utility model, inside the connecting tube, a ring is fixedly installed, and a placement groove is formed in the middle of the ring.

[0009] As an alternative embodiment of the present utility model, on the four inner walls of the connecting tube, second chutes are formed, and sliders are slidably connected in the second chutes. The outer side wall of the lower end of the slider is an arc surface, and the slider extends into the placement groove.

[0010] As an alternative embodiment of the present utility model, on the upper end of the detection platform, a boss is fixedly installed. When the slider moves, it can contact the boss, and the diameter of the boss is smaller than the inner diameter of the placement groove.

[0011] As an alternative embodiment of the present utility model, on the side of the connecting tube, a bellows is fixedly installed. One end of the bellows is fixedly installed at the lower end of the X-ray lamp head. Inside the bellows, a switch is fixedly installed. One end of the switch is fixedly installed with a pull rope, and one end of the pull rope is fixedly installed at the lower end of the inner wall of the bellows. The switch is electrically connected to the X-ray lamp head.

[0012] The present utility model has the following beneficial effects:

[0013] 1. When using this device to detect a wafer, open the telescopic plate, place the wafer into the connecting tube, pull the connecting tube downward. The connecting tube drives the telescopic tube to stretch, and the connecting rod moves to be inserted into the detection platform. The movable block is squeezed by the side wall of the detection platform to slide into the first chute, and the movable block is pushed out by the first spring and stuck in the block, automatically completing the fixation of the connecting tube. Then turn on the X-ray lamp head to detect the wafer. After placing the wafer into the connecting tube, the connecting tube can be pulled downward to wrap the detection platform, automatically completing the fixation of the connecting tube. When irradiating the wafer with X-rays, the X-rays can be directly introduced into the wafer, avoiding the leakage of X-rays during detection and affecting the health of the detection personnel.

[0014] 2. With the cooperation among the corrugated pipe, switch, pull rope, detection platform, clamping block, convex platform, fixed pipe, telescopic pipe, spring II, U-shaped groove, telescopic plate, connecting plate, handle, connecting pipe, chute I, movable block, spring I, chute II, slider, ring and placement groove, when the device detects the wafer, it can make the wafer stay at the upper end of the detection platform during the process of adjusting the wafer downward, and automatically turn on the X-ray lamp head to irradiate and detect it during the movement. After the detection is completed, the X-ray lamp head automatically turns off, which can reduce the leakage of X-rays. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. is a schematic diagram of the overall structure of the present invention.

[0016] Figure 2 FIG. is a schematic diagram of the overall sectional structure of the present invention.

[0017] Figure 3 FIG. is a schematic diagram of the sectional structure of the movable component system of the present invention.

[0018] Figure 4 FIG. is the Figure 3 enlarged schematic diagram of part A in the present invention.

[0019] In the figure: 1, fixed frame; 2, X-ray lamp head; 21, corrugated pipe; 22, switch; 23, pull rope; 3, detection platform; 31, clamping block; 32, convex platform; 4, movable component; 41, fixed pipe; 42, telescopic pipe; 43, spring II; 44, U-shaped groove; 45, telescopic plate; 451, connecting plate; 46, handle; 47, connecting pipe; 471, chute I; 472, movable block; 473, spring I; 474, chute II; 475, slider; 48, ring; 481, placement groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figure 1 - Figure 3, An X-ray based wafer inspection device, including a fixed frame 1 and an X-ray lamp head 2 fixedly installed at the upper end of the fixed frame 1. A detection platform 3 is fixedly installed at the lower end of the fixed frame 1. An active component 4 is installed at the lower end of the X-ray lamp head 2. The active component 4 includes a fixed tube 41 fixedly installed at the lower end of the X-ray lamp head 2. A telescopic tube 42 is fixedly installed at the lower end of the fixed tube 41. A connecting tube 47 is fixedly installed at the lower end of the telescopic tube 42. A U-shaped groove 44 is formed on the side wall of the connecting tube 47. A telescopic plate 45 is slidably connected in the U-shaped groove 44. Sliding grooves 471 are formed on the inner side walls around the inside of the connecting tube 47. Moving blocks 472 are slidably connected in the sliding grooves 471 respectively. A first spring 473 is fixedly installed between each moving block 472 and the side wall of the corresponding sliding groove 471. Clamping blocks 31 are fixedly installed on the side walls of the four sides of the detection platform 3.

[0022] When using this device to inspect the wafer, the telescopic plate 45 in the U-shaped groove 44 can be opened upward first. At this time, the U-shaped groove 44 is opened, and the wafer can be put into the connecting tube 47 through the U-shaped groove 44. Then, the connecting tube 47 can be pulled downward. The downward movement of the connecting tube 47 drives the upper telescopic tube 42 to stretch. Pull the connecting tube 47 downward until it approaches the detection platform 3. When the connecting rod 47 moves to insert into the detection platform 3, the moving block 472 is squeezed by the side wall of the detection platform 3 and slides into the sliding groove 471. When the connecting rod 47 slides until the clamping block 31 contacts the moving block 472, the moving block 472 is pushed outward by the first spring 473 and clamped in the clamping block 31, automatically completing the fixation of the connecting tube 47. At this time, the connecting tube can be released, and the upper X-ray lamp head 2 can be turned on to inspect the wafer. After the wafer is placed in the connecting tube 47, the connecting tube 47 can be pulled downward until it wraps the detection platform 3, and after pulling to a certain distance, the fixation of the connecting tube 47 is automatically completed. When irradiating the wafer with X-rays, the X-rays can be directly introduced into the wafer, avoiding the leakage of X-rays during detection and affecting the health of the detection personnel.

[0023] Please refer to Figure 2 - Figure 4 , A second spring 43 is fixedly installed between the upper and lower inner walls of the telescopic tube 42. A connecting plate 451 is fixedly installed on the side wall of the telescopic plate 45. A handle 46 is fixedly installed on the side wall of the connecting tube 47. With the cooperation of the telescopic tube 42, the second spring 43, the telescopic plate 45, the connecting plate 451, the connecting tube 47 and the handle 46, the second spring 43 can pull the telescopic tube 42 upward in its natural state.

[0024] A circular ring 48 is fixedly installed inside the connecting tube 47. A placement groove 481 is formed in the middle of the circular ring 48. With the cooperation of the connecting tube 47, the circular ring 48 and the placement groove 481, the wafer is placed into the connecting tube 47 through the placement groove 481.

[0025] The inner walls of the four sides of the connecting pipe 47 are all provided with second chutes 474. Sliders 475 are slidably connected in the second chutes 474. The outer side wall of the lower end of the slider 475 is an arc surface. The slider 475 extends out into the placement groove 481. With the cooperation among the connecting pipe 47, the second chute 474, the slider 475 and the placement groove 481, the wafer is initially placed on a plurality of sliders 475.

[0026] A boss 32 is fixedly installed at the upper end of the detection platform 3. When the slider 475 moves, it can contact the boss 32. The diameter of the boss 32 is smaller than the inner diameter of the placement groove 481. With the cooperation among the detection platform 3, the boss 32, the slider 475 and the placement groove 481, after the connecting pipe 47 is inserted into the detection platform 3, the slider 475 will be squeezed out by the boss 32.

[0027] A bellows 21 is fixedly installed on the side of the connecting pipe 47. One end of the bellows 21 is fixedly installed at the lower end of the X-ray lamp head 2. A switch 22 is fixedly installed inside the bellows 21. One end of the switch 22 is fixedly installed with a pull rope 23. One end of the pull rope 23 is fixedly installed at the lower end of the inner wall of the bellows 21. The switch 22 is electrically connected to the X-ray lamp head 2. With the cooperation among the connecting pipe 47, the bellows 21, the X-ray lamp head 2, the switch 22 and the pull rope 23, when the connecting pipe 47 is inserted downward into the detection platform 3, the X-ray lamp head 2 can be automatically turned on to detect the wafer.

[0028] When detecting the wafer, the connecting plate 451 can be pulled up first to pull open the telescopic plate 45. At this time, the U-shaped groove 44 is opened. The wafer is placed into the placement groove 481 in the ring 48 inside the connecting pipe. At this time, the wafer stays on the slider 475. Then the telescopic plate 45 is pulled back to its original position to cover the U-shaped groove 44. At this time, the handle 46 can be pulled. The handle 46 drives the connecting pipe 47 to move downward and stretch the telescopic pipe 42. When the connecting pipe 47 moves downward to be inserted into the detection platform 3, the boss 32 at the upper end of the detection platform 3 automatically squeezes the slider 475 into the second chute 474 and slides into the second chute 474. After the slider 475 completely slides into the second chute 474, the wafer stays on the boss 32. When the connecting pipe 47 moves downward, it drives the bellows 21 on the side to stretch downward. At this time, the pull rope 23 inside the bellows 21 is stretched. When the pull rope 23 is stretched to a certain extent, the switch 22 is turned on. At this time, the X-ray lamp head 2 is automatically turned on to detect the wafer at the lower end. After the detection is completed, the connecting pipe 47 is adjusted back to its original position. At this time, the wafer stays on the boss 32. The detected wafer can be taken down to detect the next wafer. When this device detects the wafer, it can make the wafer stay at the upper end of the detection platform 3 during the process of downward adjustment of the wafer, and automatically turn on the X-ray lamp head 2 to irradiate and detect it during the movement. After the detection is completed, the X-ray lamp head 2 is automatically turned off, which can reduce the leakage of X-rays.

[0029] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0030] The above are only the preferred embodiments of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. An X-ray based wafer inspection device, comprising a fixed frame (1) and an X-ray lamp head (2) fixedly installed at the upper end of the fixed frame (1), wherein a detection platform (3) is fixedly installed at the lower end of the fixed frame (1), and is characterized in that: An active component (4) is installed at the lower end of the X-ray lamp head (2). The active component (4) includes a fixed tube (41) fixedly installed at the lower end of the X-ray lamp head (2). A telescopic tube (42) is fixedly installed at the lower end of the fixed tube (41). A connecting tube (47) is fixedly installed at the lower end of the telescopic tube (42). A U-shaped groove (44) is formed in the side wall of the connecting tube (47). A telescopic plate (45) is slidably connected in the U-shaped groove (44). First chutes (471) are formed in the peripheral side walls inside the connecting tube (47). Moving blocks (472) are slidably connected in the first chutes (471). A first spring (473) is fixedly installed between the moving blocks (472) and the side walls of the first chutes (471). Clamping blocks (31) are fixedly installed on the four side walls of the detection platform (3).

2. The X-ray based wafer inspection device according to claim 1, wherein: A second spring (43) is fixedly installed between the upper and lower walls inside the telescopic tube (42). A connecting plate (451) is fixedly installed on the side wall of the telescopic plate (45). A handle (46) is fixedly installed on the side wall of the connecting tube (47).

3. The X-ray based wafer inspection device according to claim 2, wherein: A ring (48) is fixedly installed inside the connecting tube (47). A placement groove (481) is formed in the middle of the ring (48).

4. The X-ray based wafer inspection apparatus according to claim 3, characterized in that: Second chutes (474) are formed in the four inner walls of the connecting tube (47). Sliders (475) are slidably connected in the second chutes (474). The outer side wall of the lower end of the slider (475) is an arc surface. The slider (475) extends into the placement groove (481).

5. The X-ray based wafer inspection device according to claim 4, wherein: A boss (32) is fixedly installed on the upper end of the detection platform (3). When the slider (475) moves, it can contact the boss (32). The diameter of the boss (32) is smaller than the inner diameter of the placement groove (481).

6. The X-ray based wafer inspection device according to claim 5, wherein: A corrugated pipe (21) is fixedly installed on the side of the connecting tube (47). One end of the corrugated pipe (21) is fixedly installed at the lower end of the X-ray lamp head (2). A switch (22) is fixedly installed inside the corrugated pipe (21). One end of the switch (22) is fixedly installed with a pull rope (23). One end of the pull rope (23) is fixedly installed at the lower end of the inner wall of the corrugated pipe (21). The switch (22) is electrically connected to the X-ray lamp head (2).

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