Device for measuring square resistance

By setting up a cleaning mechanism in the measuring device and using gas to clean the probe surface, the problem of reduced measurement accuracy and increased cost caused by probe contamination is solved, and higher measurement accuracy and reduced replacement frequency are achieved.

CN223139722UActive Publication Date: 2025-07-22SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
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Patent Information

Application Number
CN202421381590.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2025-07-22
Estimated Expiration
2034-06-17

AI Technical Summary

Technical Problem

In the prior art, probes are susceptible to contamination when measuring wafer block resistance, resulting in a decrease in measurement accuracy and increasing replacement frequency and cost.

Method used

A device for measuring block resistance is designed, and a cleaning mechanism is used to purify the probe surface through gas to avoid wear and maintain the cleanliness of the probe.

Benefits of technology

Improves the accuracy of the probe measuring block resistance, and reduces the probe replacement frequency and measurement cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a device for measuring square resistance. The device comprises a measuring cavity, a probe, a bearing platform and a cleaning mechanism, the bearing table is arranged in the measuring cavity and used for bearing a wafer, and the probe is arranged in the measuring cavity and used for measuring square resistance on the surface of the wafer; the cleaning mechanism is arranged on one side wall of the measuring cavity, and the cleaning mechanism is used for spraying gas to clean the probe. According to the device for measuring the square resistance provided by the utility model, the cleaning mechanism is arranged on the measuring cavity, and the cleaning mechanism adopts gas to purge and clean the surface of the probe, so that the probe is prevented from being abraded while the surface of the probe is ensured to be clean, the accuracy when the probe measures the square resistance is ensured, the frequency of replacing the probe is reduced, and the working efficiency is improved. Therefore, the measurement cost is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer measurement, in particular to a device for measuring sheet resistance. Background Art

[0002] The semiconductor wafer manufacturing process mainly includes physical vapor deposition (PVD) processes such as front-side metallization process (Sputter) of the wafer, or back-side metallization (Sputter) and vacuum evaporation. In the above processes, sheet resistance (thin-film resistance) can be formed on one side of the wafer.

[0003] The RES machine is a semiconductor machine for measuring sheet resistance. It mainly measures the sheet resistance through a double-probe four-probe instrument. The measurement principle of the double-probe four-probe tester is to use the four-probe double-position combination measurement technology and perform two electrical measurements by using the combination transformation of current probes and voltage probes. During the measurement process of the RES machine, due to the continuous contact between the four probes and the wafer surface, the probe tips may be contaminated by small particles on the wafer surface, which may affect the final measurement result.

[0004] In the prior art, to solve the problem of probe contamination, a ceramic sheet is used to contact the probe tips, and the method of friction is used to clean the tips. However, this method greatly increases the loss of the probe tips, reduces the measurement accuracy, and also speeds up the probe replacement frequency, thereby increasing the measurement cost. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a device for measuring sheet resistance, which reduces the measurement cost and improves the measurement accuracy of sheet resistance.

[0006] To achieve the above purpose, in a first aspect, the utility model provides a device for measuring sheet resistance, including a measurement chamber, probes, a carrier table, and a cleaning mechanism;

[0007] The carrier table is arranged in the measurement chamber and is used for carrying the wafer

[0008] The probes are arranged in the measurement chamber and are used for measuring the sheet resistance on the surface of the wafer;

[0009] The cleaning mechanism is arranged on one side wall of the measurement chamber, and the cleaning mechanism is used for spraying gas to clean the probes.

[0010] In some embodiments, the cleaning mechanism includes an air inlet pipe and a cleaning member;

[0011] The cleaning member is axially provided with a cleaning hole, and an air inlet hole is opened at the bottom of the cleaning member, and the air inlet hole is communicated with the cleaning hole;

[0012] One end of the intake pipe is connected to the intake hole for delivering gas into the cleaning hole.

[0013] The diameter of the probe is smaller than the inner diameter of the cleaning hole so that the probe can pass through the cleaning hole.

[0014] In some embodiments, the cleaning mechanism further includes an exhaust pipe.

[0015] An air outlet hole is formed in the side wall of the cleaning member, which is disposed near the top end of the cleaning member, and the air outlet hole communicates with the cleaning hole.

[0016] One end of the exhaust pipe is connected to the air outlet hole, and the other end is used for exhausting gas from the measurement chamber.

[0017] In some embodiments, the number of the probes is N, and the N probes are arranged at intervals in sequence, where N is a positive integer greater than or equal to 1.

[0018] The number of the cleaning holes is the same as that of the probes, and each cleaning hole is used to clean a corresponding probe.

[0019] In some embodiments, the intake pipe includes a main intake pipe and N sub-intake pipes.

[0020] N connection holes are formed at intervals on one side wall of the main intake pipe, one ends of the N sub-intake pipes are respectively connected to the corresponding N connection holes, and the other ends of the N sub-intake pipes are respectively connected to the corresponding intake holes.

[0021] In some embodiments, the cleaning mechanism further includes a first telescopic mechanism and a rotating mechanism.

[0022] The first telescopic mechanism is disposed on one side wall of the measurement chamber. The telescopic mechanism has a first telescopic end, and the first telescopic end can telescopically move towards the direction of the probe.

[0023] The rotating mechanism is rotatably disposed on the first telescopic end.

[0024] The cleaning member is disposed on the rotating mechanism.

[0025] Both the intake pipe and the exhaust pipe are telescopic pipes.

[0026] In some embodiments, the device for measuring sheet resistance further includes a second telescopic mechanism disposed on the inner side wall of the top of the measurement chamber. The second telescopic mechanism has a second telescopic end, and the second telescopic end can telescopically move towards the direction of the carrier.

[0027] The probe is disposed on the second telescopic end.

[0028] In some embodiments, the device for measuring sheet resistance further includes a sealing mechanism movably arranged on the top of the cleaning member;

[0029] When the sealing mechanism is opened, the probe can pass through the sealing mechanism and penetrate into the cleaning hole;

[0030] When the probe is located in the cleaning hole, the sealing mechanism closes and abuts against the outer side wall of the probe to seal the cleaning hole.

[0031] In some embodiments, the sealing mechanism includes a driver and a plurality of sealing members;

[0032] The plurality of sealing members are annularly arranged on the top of the cleaning member, and one end of the sealing member is a sealing end;

[0033] The driver is connected to the sealing member and is used to drive the sealing member to move;

[0034] When the driver drives the plurality of sealing members to approach each other, the plurality of sealing ends enclose a sealing hole, and the inner diameter of the sealing hole is equal to the outer diameter of the probe.

[0035] In some embodiments, a buffer portion is provided on the surface of the sealing end;

[0036] When the driver drives the plurality of sealing members to approach each other, the buffer portion contacts the outer side wall of the probe.

[0037] The beneficial effects of the device for measuring sheet resistance provided by the present utility model are as follows:

[0038] 1. By providing a cleaning mechanism on the measurement chamber, the cleaning mechanism uses gas to purge and clean the surface of the probe, ensuring the cleanliness of the probe surface while avoiding abrasion of the probe, thereby ensuring the accuracy of the probe when measuring sheet resistance.

[0039] 2. Reduces the frequency of probe replacement, thereby reducing the measurement cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a schematic structural diagram of the device for measuring sheet resistance according to the embodiment provided by the present utility model;

[0041] Figure 2 is a partial structural diagram of the cleaning mechanism according to the embodiment provided by the present utility model;

[0042] Figure 3 is a cross-sectional view of the cleaning member along its axial direction according to the embodiment provided by the present utility model;

[0043] Figure 4Schematic diagram of the structure when the probe is cleaned by the measuring square resistance device provided by the present utility model;

[0044] Figure 5 Schematic diagram of the structure of the seal provided by the present utility model;

[0045] Figure 6 Schematic diagram of the structure when the seal and the cleaning part cooperate to clean the probe provided by the present utility model.

[0046] Reference signs:

[0047] Measurement chamber 1, probe 2, carrier table 3, cleaning mechanism 4, air inlet pipe 41, main air inlet pipe 411, sub-air inlet pipe 412, cleaning part 42, cleaning hole 421, air inlet hole 422, air outlet hole 423, air outlet pipe 43, first telescopic mechanism 44, first telescopic end 441, rotating mechanism 45, second telescopic mechanism 5, second telescopic end 51, seal 6, sealing end 611, sealing hole 612, air inlet pump 7, air outlet pump 8. Detailed implementation manners

[0048] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the field to which the present utility model belongs. The words such as "including" used herein are intended to mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The "connection" described herein can be a direct connection or an indirect connection, that is, a connection through an intermediate object, unless otherwise specified.

[0049] In view of the problems existing in the prior art, an embodiment of the present utility model provides a device for measuring square resistance. Referring to Figure 1 as shown, the device includes a measurement chamber 1, a probe 2, a carrier table 3 and a cleaning mechanism 4. Among them, the carrier table 3 is arranged in the measurement chamber 1 and is used for carrying a wafer. The probe 2 is arranged in the measurement chamber 1 and is used for measuring the square resistance of the upper surface of the wafer. The cleaning mechanism 4 is arranged on a side wall of the measurement chamber 1, and the cleaning mechanism 4 is used for spraying gas to clean the probe 2 to remove the pollution particles on the surface of the probe 2.

[0050] In this embodiment, by providing the cleaning mechanism 4 on the measurement chamber 1, the cleaning mechanism 4 uses gas to purge and clean the surface of the probe 2. While ensuring the cleanliness of the surface of the probe 2, it avoids abrasion of the probe 2, thereby ensuring the accuracy of the probe 2 when measuring sheet resistance.

[0051] Reference Figure 1 、 Figure 2 and Figure 3 As shown in, in some embodiments, the cleaning mechanism 4 includes an air inlet pipe 41 and a cleaning member 42. The cleaning member 42 is axially provided with a cleaning hole 421, and an air inlet hole 422 is provided at the bottom of the cleaning member 42. The air inlet hole 422 communicates with the cleaning hole 421. One end of the air inlet pipe 41 is connected to the air inlet hole 422, and the other end of the air inlet pipe 41 is connected to an external air inlet pump 7. The air inlet pump 7 is used to transport gas into the cleaning hole 421 through the air inlet pipe 41. The diameter of the probe 2 is smaller than the inner diameter of the cleaning hole 421, so that the probe 2 can pass through the cleaning hole 421.

[0052] In this embodiment, when the probe 2 needs to be cleaned, the probe 2 can be inserted into the cleaning hole 421, and then the air inlet pump 7 transports gas into the cleaning hole 421 through the air inlet pipe 41 for cleaning the surface of the probe 2.

[0053] Furthermore, an air outlet hole 423 is provided on the side wall of the cleaning member 42. The air outlet hole 423 is provided near the top end of the cleaning member 42, and the air outlet hole 423 communicates with the cleaning hole 421. The cleaning mechanism 4 further includes an air outlet pipe 43. One end of the air outlet pipe 43 is connected to the air outlet hole 423, and the other end is connected to an external air outlet pump 8. The air outlet pipe 43 is used to discharge gas from the measurement chamber 1.

[0054] In this embodiment, by providing the air outlet pipe 43 to discharge the purged gas and contaminated particles from the measurement chamber 1, contamination of the measurement chamber 1 is avoided.

[0055] In some embodiments, the number of the probes 2 is N, and the N probes 2 are arranged at intervals in sequence. N is a positive integer greater than or equal to 1. The number of the cleaning holes 421 is the same as the number of the probes 2, and each cleaning hole 421 is used to clean one corresponding probe 2.

[0056] In this embodiment, the number of the probes 2 is four, and the number of the cleaning members 42 is also set to four. The four cleaning members 42 are arranged at intervals in sequence, and each cleaning member 42 is provided with a cleaning hole 421 for cleaning each probe 2.

[0057] In some embodiments, a cleaning member 42 may also be provided, and then four cleaning holes 421 are formed at intervals on the cleaning member 42 for cleaning each probe 2.

[0058] It can be understood that in actual application, when the number of the probes 2 is set to 6 or 8, the number of the cleaning holes 421 is correspondingly set to 6 or 8, and so on.

[0059] Reference Figure 2 and Figure 3 As shown in the figure, in some embodiments, the air inlet pipe 41 includes a main air inlet pipe 411 and N sub-air inlet pipes 412. One end of the main air inlet pipe 411 is connected to an external air inlet pump 7, and N connection holes are formed at intervals on one side wall of the other end of the main air pipe. One ends of the N sub-air inlet pipes 412 are respectively connected to the corresponding N connection holes, and the other ends of the N sub-air inlet pipes 412 are respectively connected to the corresponding air inlet holes 422.

[0060] In this embodiment, since the number of the probes 2 is 4, the number of the sub-air inlet pipes 412 and the connection holes is also set to four. By adopting the method of shunting with 4 sub-air inlet pipes 412, the cleaning effect on the probes 2 in each cleaning hole 421 is ensured to be the same.

[0061] Further, in this embodiment, when the number of the cleaning members 42 is set to four, except that the side wall of the first cleaning member 42 is not provided with a through hole, the side walls of the other cleaning members 42 are all provided with through holes. The through holes are arranged corresponding to the air outlet holes 423 and conduct the cleaning holes 421. Then, a connecting pipe is used to connect the air outlet hole 423 of the first cleaning member 42 with the through hole of the second cleaning member 42, connect the air outlet hole 423 of the second cleaning member 42 with the through hole of the third cleaning member 42, connect the air outlet hole 423 of the third cleaning member 42 with the through hole of the fourth cleaning member 42, and finally connect the air outlet hole 423 of the fourth cleaning member 42 with the air outlet pipe 43. One end of the air outlet pipe 43 is connected to an external air outlet pump 8.

[0062] In some embodiments, the cleaning member 42 may also not be provided with a through hole, and four air outlet pipes 43 are respectively connected to the air outlet holes 423 of the four cleaning members 42.

[0063] Reference Figure 1 、 Figure 2 and Figure 4As shown, in some embodiments, the cleaning mechanism 4 further includes a first telescopic mechanism 44 and a rotating mechanism 45. Among them, the first telescopic mechanism 44 is disposed on a side wall of the measurement chamber 1. The telescopic mechanism has a first telescopic end 441, and the first telescopic end 441 can telescopically move in the direction of the probe 2. The rotating mechanism 45 is rotatably disposed on the first telescopic end 441, and the cleaning member 42 is disposed on the rotating mechanism 45. Both the air inlet pipe 41 and the air outlet pipe 43 are telescopic pipes.

[0064] As Figure 1 shown, in this embodiment, when the probe 2 needs to measure the sheet resistance, the first telescopic end 441 drives the rotating mechanism 45 and the cleaning member 42 to retract. Subsequently, the rotating mechanism 45 rotates to drive the cleaning member 42 to rotate, so that the cleaning member 42 approaches an inner side wall of the measurement chamber 1, avoiding affecting the detection of the probe 2.

[0065] As Figure 3 and Figure 4 shown, when the probe 2 needs to be cleaned, the first telescopic end 441 drives the rotating mechanism 45 and the cleaning member 42 in the direction of the probe 2. Then the rotating mechanism 45 drives the cleaning member 42 to rotate, so that the cleaning hole 421 on the cleaning member 42 is coaxial with the probe 2. Then the probe 2 moves down and inserts into the cleaning hole 421 until the surface cleaning process of the probe 2 is completed.

[0066] In this embodiment, the first telescopic mechanism 44 can be a telescopic cylinder, and the rotating mechanism 45 can be a stepper motor.

[0067] Referring Figure 1 to the figure shown, in some embodiments, the device for measuring sheet resistance further includes a second telescopic mechanism 5 disposed on the inner side wall of the top of the measurement chamber 1. The second telescopic mechanism 5 has a second telescopic end 51, and the second telescopic end 51 can telescopically move in the direction of the carrier 3. The probe 2 is disposed on the second telescopic end 51.

[0068] In this embodiment, the second telescopic mechanism 5 is used to drive the probe 2 to rise or fall, so that the probe 2 can contact the upper surface of the wafer, or insert the probe 2 into the cleaning hole 421. Among them, the second telescopic mechanism 5 can also be selected as a telescopic cylinder.

[0069] In some embodiments, the device for measuring sheet resistance further includes a sealing mechanism movably arranged on the top of the cleaning member 42. When the sealing mechanism is opened, the probe 2 can pass through the sealing mechanism and penetrate into the cleaning hole 421. When the probe 2 is located in the cleaning hole 421, the sealing mechanism closes and abuts against the outer sidewall of the probe 2 to seal the cleaning hole 421.

[0070] In this embodiment, by arranging the sealing mechanism on the top of the cleaning member 42, when the cleaning member 42 purges and cleans the probe 2, the gas can only be discharged through the air outlet pipe 43, avoiding the gas or contaminant particles from being discharged through the upper end of the cleaning hole 421, and maintaining the cleanliness of the measurement cavity 1.

[0071] Further, referring to Figure 5 and Figure 6 as shown, the sealing mechanism includes a driver and a plurality of sealing members 6. Among them, the sealing member 6 is in a fan-shaped structure, and a plurality of sealing members 6 are annularly arranged on the top of the cleaning member 42, and each sealing member 6 can slide and adhere to the top surface of the cleaning member 42. One end of the sealing member 6 is a sealing end 611, and the sealing end 611 is in an arc-shaped structure. The driver is connected to the sealing member 6 and is used to drive the sealing member 6 to move. When the driver drives a plurality of the sealing members 6 to approach each other, a plurality of the sealing ends 611 enclose a sealing hole 612, and the inner diameter of the sealing hole 612 is equal to the outer diameter of the probe 2.

[0072] In this embodiment, when the probe 2 is inserted into the cleaning hole 421, the driver drives the sealing member 6 to move, so that each of the sealing ends 611 encloses the sealing hole 612, and the inner sidewall of the sealing hole 612 abuts against the outer sidewall of the probe 2 for sealing, thereby realizing the sealing effect on the cleaning hole 421, avoiding the leakage of gas or contaminant particles in the measurement cavity 1, and thus ensuring the cleanliness of the measurement cavity 1.

[0073] In some embodiments, a buffer portion is arranged on the surface of the sealing end 611. The buffer portion can be prepared from rubber. When the driver drives a plurality of the sealing members 6 to approach each other, the buffer portion contacts the outer sidewall of the probe 2.

[0074] In this embodiment, by arranging the buffer portion on the surface of the sealing end 611, damage to the probe 2 caused by the sealing member 6 during the process of sealing the cleaning hole 421 is avoided.

[0075] As described above, it is only the specific implementation manner of the embodiments of the present application. However, the protection scope of the embodiments of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of the present application should be covered within the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the protection scope of the claims.

Claims

1. A device for measuring sheet resistance, characterized in that, It includes a measurement chamber, a probe, a carrier stage, and a cleaning mechanism; The carrier stage is disposed inside the measurement chamber and is used to carry a wafer. The probe is disposed inside the measurement chamber and is used to measure the sheet resistance of the wafer surface. The cleaning mechanism is disposed on one side wall of the measurement chamber, and the cleaning mechanism is used to spray gas to clean the probe.

2. The device for measuring sheet resistance according to claim 1, characterized in that, The cleaning mechanism includes an air inlet pipe and a cleaning member; The cleaning member is axially provided with a cleaning hole, and an air inlet hole is provided at the bottom of the cleaning member, and the air inlet hole communicates with the cleaning hole. One end of the air inlet pipe is connected to the air inlet hole for delivering gas into the cleaning hole. The diameter of the probe is smaller than the inner diameter of the cleaning hole so that the probe can pass through the cleaning hole.

3. The device for measuring sheet resistance according to claim 2, wherein, The cleaning mechanism further includes an air outlet pipe; An air outlet hole is provided on the side wall of the cleaning member, and the air outlet hole is disposed near the top end of the cleaning member, and the air outlet hole communicates with the cleaning hole. One end of the air outlet pipe is connected to the air outlet hole, and the other end is used to discharge gas from the measurement chamber.

4. The device for measuring sheet resistance according to claim 3, wherein, The number of the probes is N, and the N probes are arranged at intervals in sequence, where N is a positive integer greater than or equal to 1; The number of the cleaning holes is the same as the number of the probes, and each cleaning hole is used to correspondingly clean one of the probes.

5. The device for measuring sheet resistance according to claim 4, wherein The air inlet pipe includes a main air inlet pipe and N sub-air inlet pipes; N connection holes are spaced apart on one side wall of the main air inlet pipe, and one ends of the N sub-air inlet pipes are respectively connected to the corresponding N connection holes, and the other ends of the N sub-air inlet pipes are respectively connected to the corresponding air inlet holes.

6. The device for measuring sheet resistance according to any one of claims 3 to 5, characterized in that The cleaning mechanism further includes a first telescoping mechanism and a rotating mechanism; The first telescoping mechanism is disposed on one side wall of the measurement chamber, and the telescoping mechanism has a first telescoping end, and the first telescoping end can telescopically move towards the direction of the probe. The rotating mechanism is rotatably disposed on the first telescoping end; The cleaning member is disposed on the rotating mechanism; Both the air inlet pipe and the air outlet pipe are telescopic pipes.

7. The device for measuring sheet resistance according to claim 1, characterized in that, It further includes a second telescoping mechanism disposed on the inner side wall of the top of the measurement chamber, and the second telescoping mechanism has a second telescoping end, and the second telescoping end can telescopically move towards the direction of the carrier stage; The probe is disposed on the second telescoping end.

8. The device for measuring sheet resistance according to claim 2, characterized in that, It further includes a sealing mechanism movably disposed on the top of the cleaning member; When the sealing mechanism is opened, the probe can pass through the sealing mechanism and penetrate into the cleaning hole; When the probe is located inside the cleaning hole, the sealing mechanism closes and abuts against the outer side wall of the probe to seal the cleaning hole.

9. The device for measuring sheet resistance according to claim 8, wherein, The sealing mechanism includes a driver and a plurality of sealing members; The plurality of sealing members are annularly disposed on the top of the cleaning member, and one end of the sealing member is a sealing end; The driver is connected to the sealing member and is used to drive the sealing member to move; When the driver drives the plurality of sealing members to approach each other, the plurality of sealing ends enclose a sealing hole, and the inner diameter of the sealing hole is equal to the outer diameter of the probe.

10. The device for measuring sheet resistance according to claim 9, characterized in that, A buffer portion is provided on the surface of the sealing end; When the driver drives the plurality of sealing members to approach each other, the buffer portion contacts the outer side wall of the probe.

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