Forward and reverse dual-purpose chip mounting equipment

Abstract

The utility model discloses a positive and inverted dual-purpose chip mounting device, which comprises a base, an X-axis displacement mechanism, a Y-axis displacement mechanism, a substrate adsorption structure, a chip pickup structure, a finished product adsorption structure, a substrate bin, a chip bin, a finished product bin, a chip positive and inverted structure, a chip mounting head and a high-temperature heating table, the substrate adsorption structure, the finished product adsorption structure and the chip mounting head are sequentially mounted on the X-axis displacement mechanism, the substrate bin and the finished product bin are fixedly mounted on the left side of the base, the high-temperature heating table is fixedly mounted on the right side of the finished product bin, the chip forward and backward mounting structure is fixedly mounted on the right side of the high-temperature heating table, and the chip forward and backward mounting structure is fixedly mounted on the right side of the high-temperature heating table. The Y-axis displacement mechanism is fixedly installed on the right side of the chip forward and reverse installation structure, the chip picking structure is installed on the Y-axis displacement mechanism, and the chip stock bin is fixedly installed on the front side of the chip forward and reverse installation structure.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and particularly relates to a patch device that can be used for both front and back mounting of chips. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, a diode is a device made of a semiconductor. A semiconductor refers to a material whose conductivity can be controlled and whose range can be from an insulator to a conductor. From the perspective of both technology and economic development, the importance of semiconductors is extremely great. Most of today's electronic products, such as the core units in computers, mobile phones, or digital recorders, are extremely closely related to semiconductors.

[0003] A chip refers to a silicon wafer containing an integrated circuit. It is very small in size and is often a part of a computer or other electronic device. It belongs to the semiconductor field. During the packaging process of a chip, it is necessary to perform chip patching on a single chip, and the processes of front mounting and back mounting of the chip need to be considered. Therefore, how to achieve front mounting and back mounting of the chip at the same time with a lower cost is a problem that needs to be considered. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a patch device that can be used for both front and back mounting of chips to solve the defects mentioned in the above background art.

[0005] To achieve the above purpose, a patch device that can be used for both front and back mounting of chips is provided, including: a base, an X-axis displacement mechanism, a Y-axis displacement mechanism, a substrate adsorption structure, a chip picking structure, a finished product adsorption structure, a substrate magazine, a chip magazine, a finished product magazine, a chip front-back mounting structure, a patch head, and a high-temperature heating table. The X-axis displacement mechanism is fixedly installed on the base. The substrate adsorption structure, the finished product adsorption structure, and the patch head are sequentially installed on the X-axis displacement mechanism from left to right. The substrate magazine and the finished product magazine are fixedly installed on the left side of the base. The substrate magazine is arranged on the left side of the finished product magazine. The high-temperature heating table is fixedly installed on the right side of the finished product magazine. The high-temperature heating table is located on the moving route of the patch head. The chip front-back mounting structure is fixedly installed on the right side of the high-temperature heating table. The Y-axis displacement mechanism is fixedly installed on the right side of the chip front-back mounting structure. The chip picking structure is installed on the Y-axis displacement mechanism. The chip magazine is fixedly installed on the front side of the chip front-back mounting structure.

[0006] Furthermore, the chip flip-chip structure includes: a chip flip-chip displacement motor, a chip flip-chip displacement electric track, a face-up nozzle, a face-up nozzle rotation motor, a face-up nozzle vacuum suction accessory, a flip-chip nozzle, a flip-chip nozzle rotation motor, and a flip-chip nozzle vacuum suction accessory. The chip flip-chip displacement electric track is fixedly installed on the base. The chip flip-chip displacement motor is arranged at one end of the chip flip-chip displacement electric track. The face-up nozzle is installed on the chip flip-chip displacement electric track through a face-up nozzle fixing member. The face-up nozzle is connected to the face-up nozzle rotation motor and the face-up nozzle vacuum suction accessory. The flip-chip nozzle is fixed on the base through a flip-chip nozzle fixing member and is located at the other end of the chip flip-chip displacement electric track. The flip-chip nozzle is connected to the flip-chip nozzle rotation motor and the flip-chip nozzle vacuum suction accessory.

[0007] Furthermore, the chip picking structure includes: a Z-axis displacement track, a Z-axis displacement motor, a chip picking rotation motor, and a chip picking nozzle. The Z-axis displacement track is installed on the Y-axis displacement mechanism through a fixing member. The Z-axis displacement motor is fixedly installed at the top of the Z-axis displacement track. The Z-axis displacement track is connected to the chip picking nozzle through a chip picking nozzle fixing member. The chip picking rotation motor is fixedly installed above the chip picking nozzle. The chip picking nozzle is arranged on the left side of the Z-axis displacement track.

[0008] Furthermore, a substrate automatic feeding table is fixedly installed on the front side of the substrate magazine. A finished product automatic loading table is fixedly installed on the front side of the finished product magazine. A chip automatic feeding table is fixedly installed on the left side of the chip magazine.

[0009] Furthermore, the chip magazine and the chip automatic feeding table are replaced by a blue film loading structure.

[0010] Furthermore, a substrate vision positioning mechanism is connected to the right side of the finished product adsorption structure. A placement head vision positioning mechanism is fixedly installed on the same horizontal line on the right side of the high-temperature heating table. A chip vision positioning mechanism is connected to the left side of the chip picking nozzle. A camera positioning mechanism is arranged on the moving route of the substrate adsorption structure. The camera positioning mechanism is fixedly installed on the base and is located on the right side of the finished product magazine and on the left side of the high-temperature heating table.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows: By adding a chip flip-chip structure to the mounter, the face-up chip or flip-chip mode can be selected. That is, after picking up the chip, the chip can be placed on the chip flip-chip structure, and the selected mode can be fully automated and the chip placement can be completed. Two chip placement modes can be realized on one machine, greatly reducing the cost. Description of the Drawings

[0012] Figure 1 This is a schematic structural diagram of the present utility model;

[0013] Figure 2 This is a schematic diagram of the front and back flip-chip structure of the chip in the structure of the present utility model.

[0014] Reference numerals in the figure: 1, base; 2, X-axis displacement mechanism; 3, Y-axis displacement mechanism; 4, substrate adsorption structure; 5, chip picking structure; 51, Z-axis displacement track; 52, Z-axis displacement motor; 53, chip picking rotation motor; 54, chip picking nozzle; 55, nozzle fixing part; 6, finished product adsorption structure; 7, substrate magazine; 8, chip magazine; 9, finished product magazine; 10, chip front and back flip-chip structure; 101, chip front and back flip-chip displacement motor; 102, chip front and back flip-chip displacement track; 103, front mounting nozzle; 104, front mounting nozzle rotation motor; 105, front mounting nozzle vacuum suction accessory; 106, front mounting nozzle fixing part; 107, back mounting nozzle; 108, back mounting nozzle rotation motor; 109, back mounting nozzle vacuum suction accessory; 110, back mounting nozzle fixing part; 11, placement head; 12, high-temperature heating table; 13, substrate automatic feeding table; 14, finished product automatic loading table; 15, chip automatic feeding table; 16, substrate vision positioning mechanism; 17, placement head vision positioning mechanism; 18, chip vision positioning mechanism; 19, camera positioning mechanism. Specific embodiments

[0015] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0016] Please refer to Figure 1 , the present utility model provides a placement device that can be used for both front and back flip-chip, including: base 1, X-axis displacement mechanism 2, Y-axis displacement mechanism 3, substrate adsorption structure 4, chip picking structure 5, finished product adsorption structure 6, substrate magazine 7, chip magazine 8, finished product magazine 9, chip front and back flip-chip structure 10, placement head 11 and high-temperature heating table 12.

[0017] The substrate adsorption structure 4, the chip picking structure 5 and the finished product adsorption structure 6 can all move up and down, and the motion motors in the X-axis displacement mechanism 2 are all built-in motors.

[0018] Such as Figure 2As shown, the chip flip-chip structure 10 includes: a chip flip-chip displacement motor 101, a chip flip-chip displacement electric track 102, a direct mount nozzle 103, a direct mount nozzle rotation motor 104, a direct mount nozzle vacuum suction accessory 105, a flip mount nozzle 107, a flip mount nozzle rotation motor 108, and a flip mount nozzle vacuum suction accessory 109. The chip flip-chip displacement electric track 102 is fixedly installed on the base 1. The chip flip-chip displacement motor 101 is arranged at one end of the chip flip-chip displacement electric track 102. The direct mount nozzle 103 is installed on the chip flip-chip displacement electric track 102 through a direct mount nozzle fixing member 106. The direct mount nozzle 103 is connected to the direct mount nozzle rotation motor 104 and the direct mount nozzle vacuum suction accessory 105. The flip mount nozzle 107 is fixed on the base 1 through a flip mount nozzle fixing member 110 and is located at the other end of the chip flip-chip displacement electric track 102. The flip mount nozzle 107 is connected to the flip mount nozzle rotation motor 108 and the flip mount nozzle vacuum suction accessory 109. When the chip needs to be directly mounted, select the direct mount mode. After the chip picking structure 5 places the chip on the direct mount nozzle 103, the placement head 11 directly sucks the chip from the direct mount nozzle 103. When the chip needs to be flip-mounted, select the flip mount mode. After the chip picking structure 5 places the chip on the flip mount nozzle 107, the direct mount nozzle rotation motor 104 and the flip mount nozzle rotation motor 108 rotate to make the direct mount nozzle 103 and the flip mount nozzle 107 face each other. After the direct mount nozzle 103 removes the chip from the flip mount nozzle 107, the direct mount nozzle rotation motor 104 and the flip mount nozzle rotation motor 108 rotate to make the direct mount nozzle 103 and the flip mount nozzle 107 return to their original positions, and the placement head 11 sucks the chip from the direct mount nozzle 103.

[0019] The X-axis displacement mechanism 2 is fixedly installed on the base 1. The substrate adsorption structure 4, the finished product adsorption structure 6, the substrate vision positioning mechanism 16, and the placement head 11 are sequentially installed on the X-axis displacement mechanism 2 from left to right. The substrate vision positioning mechanism 16 is used to position the substrate raw material on the substrate magazine 7 to facilitate the substrate adsorption structure 4 to adsorb the substrate. A camera positioning mechanism 19 is arranged on the moving route of the substrate adsorption structure 4. The camera positioning mechanism 19 is fixedly installed on the base 1. The camera positioning mechanism 19 is located on the right side of the finished product magazine 9. The camera positioning mechanism 19 is used to check the position of the substrate adsorbed by the substrate adsorption structure 4 to facilitate placing the substrate at the accurate position of the high-temperature heating table 12 subsequently.

[0020] On the left side of the base 1, the substrate bin 7 and the finished product bin 9 are fixedly installed. The substrate bin 7 is arranged on the left side of the finished product bin 9. In front of the substrate bin 7, a substrate automatic feeding table 13 is fixedly installed. In front of the finished product bin 9, a finished product automatic loading table 14 is fixedly installed. The substrate automatic feeding table 13 automatically places the substrate on the substrate bin 7, and the finished products on the finished product bin 9 can be automatically placed on the finished product automatic loading table 14. The whole process is automated for loading and unloading, saving labor costs and improving work efficiency.

[0021] On the right side of the finished product bin 9, the high-temperature heating table 12 is fixedly installed. The substrate adsorption structure 4 moves left and right on the X-axis displacement mechanism 2, adsorbs the substrate and places the lifted substrate on the high-temperature heating table 12. The finished product adsorption structure 6 sucks the finished product after chip mounting from the high-temperature heating table 12 and moves left on the X-axis displacement mechanism 2 to the finished product bin 9 and then places the finished product into the finished product bin 9. At the same time, when the substrate adsorption structure 4 moves left, it can adsorb the next substrate from the substrate bin 7.

[0022] The high-temperature heating table 12 is located on the moving route of the placement head 11. On the same horizontal line on the right side of the high-temperature heating table 12, a placement head 11 vision positioning mechanism is fixedly installed. The placement head 11 has the functions of adsorbing the chip and heating. After the placement head 11 sucks the chip, it moves to the placement head 11 vision positioning mechanism to position the chip. After positioning, the chip is placed into the substrate on the high-temperature heating table 12, and at the same time, chip mounting and heating are completed.

[0023] On the right side of the high-temperature heating table 12, the chip flip-chip structure 10 is fixedly installed. On the right side of the chip flip-chip structure 10, the Y-axis displacement mechanism 3 is fixedly installed. The chip pickup structure 5 is installed on the Y-axis displacement mechanism 3. In front of the chip flip-chip structure 10, the chip bin 8 is fixedly installed. On the left side of the chip bin 8, a chip automatic feeding table 15 is fixedly installed. The chip automatic feeding table 15 automatically places the chips on the chip bin 8 for the chip pickup mechanism to pick up the chips. The chip pickup mechanism moves on the Y-axis displacement mechanism 3 to place the chips on the chip flip-chip structure 10. The reasonable layout makes the moving line process reasonable and improves the overall work efficiency.

[0024] The chip picking structure 5 includes: a Z-axis displacement track 51, a Z-axis displacement motor 52, a chip picking rotary motor 53, and a chip picking nozzle 54. The Z-axis displacement track 51 is installed on the Y-axis displacement mechanism 3 through a fixing member. The Z-axis displacement motor 52 is fixedly installed at the top of the Z-axis displacement track 51. The Z-axis displacement track 51 is connected to the chip picking nozzle 54 through a chip picking nozzle 54 fixing member. The chip picking rotary motor 53 is fixedly installed above the chip picking nozzle 54. The chip picking nozzle 54 is arranged on the left side of the Z-axis displacement track 51. A chip vision positioning mechanism 18 is connected to the left side of the chip picking nozzle 54. The chip picking structure 5 moves on the Y-axis displacement mechanism 3, so that after the chip vision positioning mechanism 18 locates the position of the chip on the chip magazine 8 and moves again, the Z-axis displacement motor 52 is started, and the chip picking rotary motor and the chip picking nozzle 54 move down along the Z-axis displacement track 51, and then the picking nozzle picks up the chip. The chip picking rotary motor 53 controls the angle of the picking nozzle to make the angle of the picking nozzle for picking up the chip accurate.

[0025] Specifically, a blue film loading structure is used to replace the chip magazine 8 and the chip automatic feeding table 15. At this time, other components are copied along the right mirror surface of the equipment to form two sets of equipment. The two sets of equipment can share the blue film loading structure. At this time, the two sets of equipment can work simultaneously, improving the work efficiency. The blue film loading structure adopts the existing technology. For example, a blue film loading mechanism is disclosed in the Chinese utility model patent application No. CN202222358982.4, with the patent name of COC blue film loading mechanism.

[0026] Working principle: The substrate automatic feeding table 13 automatically places the substrate raw material onto the substrate bin 7, and the chip automatic feeding table 15 automatically places the chip raw material onto the chip bin 8. The substrate adsorption structure 4 and the substrate vision positioning mechanism 16 move in the direction of the substrate bin 7 along the X-axis displacement mechanism 2 until the substrate vision positioning mechanism 16 reaches above the substrate bin 7 to position the substrate. Then, the substrate adsorption structure 4 and the substrate vision positioning mechanism 16 move away from the substrate bin 7 along the X-axis displacement mechanism 2 until the substrate adsorption structure 4 reaches above the substrate bin 7 to pick up the substrate and then continues to move away from the substrate bin 7 to above the camera vision positioning mechanism. After the camera vision positioning mechanism obtains the positioning of the substrate on the substrate adsorption structure 4, it continues to move away from the substrate bin 7 to above the high-temperature heating table 12. The substrate adsorption structure 4 places the picked-up substrate onto the high-temperature heating table 12. The chip picking structure 5 moves along the Y-axis displacement mechanism 3, so that after the chip vision positioning mechanism 18 positions the chip on the chip bin 8, it moves again. The Z-axis displacement motor 52 is started, and the chip picking rotating motor and the chip picking nozzle 54 move down along the Z-axis displacement track 51, and then the picking nozzle picks up the chip. When the chip needs to be face-up mounted, the face-up mounting mode is selected. The chip picking structure 5 places the chip onto the face-up mounting nozzle 103, and then the placement head 11 moves in the direction of the chip face-up / face-down mounting structure 10 along the X-axis displacement mechanism 2 and directly picks up the chip from the face-up mounting nozzle 103. When the chip needs to be face-down mounted, the face-down mounting mode is selected. After the chip picking structure 5 places the chip onto the face-down mounting nozzle 107, the face-up mounting nozzle rotating motor 104 and the face-down mounting nozzle rotating motor 108 rotate, so that the face-up mounting nozzle 103 and the face-down mounting nozzle 107 face each other. The face-up mounting nozzle 103 takes the chip from the face-down mounting nozzle 107, and then the face-up mounting nozzle rotating motor 104 and the face-down mounting nozzle rotating motor 108 rotate, so that the face-up mounting nozzle 103 and the face-down mounting nozzle 107 return to their original positions. The placement head 11 moves in the direction of the chip face-up / face-down mounting structure 10 along the X-axis displacement mechanism 2 and picks up the chip from the face-up mounting nozzle 103. After the placement head 11 picks up the chip, it moves away from the chip face-up / face-down mounting structure 10 along the X-axis displacement mechanism 2 to above the placement head 11 vision positioning system. The placement head 11 vision positioning system positions the chip picked up by the placement head 11. The placement head 11 continues to move away from the chip face-up / face-down mounting structure 10 along the X-axis displacement mechanism 2 to the high-temperature heating table 12, and places the chip onto the substrate on the high-temperature heating table 12 to complete the heating and placement. The finished product adsorption structure 6 moves away from the substrate bin 7 along the X-axis displacement mechanism 2 to above the high-temperature heating table 12 and then picks up the finished product, and then moves towards the substrate bin 7 until the finished product adsorption structure 6 reaches above the finished product bin 9 and places the finished product into the finished product bin 9. After the finished product bin is full, the finished product is placed on the finished product automatic feeding table 14 through the finished product automatic feeding table 14. The substrate adsorption structure 4 and the substrate vision positioning mechanism 16 continue to move in the direction of the substrate bin 7 along the X-axis displacement mechanism 2 to pick up the next substrate, and the chip picking structure 5 continues to work to pick up the next chip, and the process is repeated in a cycle to complete the placement process;This is the entire process of the operation of this flip-chip and surface-mount dual-use equipment.

[0027] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flip-chip and surface-mount dual-use chip mounter, comprising: Base (1), X-axis displacement mechanism (2), Y-axis displacement mechanism (3), substrate adsorption structure (4), chip picking structure (5), finished product adsorption structure (6), substrate magazine (7), chip magazine (8), finished product magazine (9), chip flip-chip structure (10), placement head (11) and high-temperature heating table (12), characterized in that: the X-axis displacement mechanism (2) is fixedly installed on the base (1), and the substrate adsorption structure (4), the finished product adsorption structure (6) and the placement head (11) are sequentially installed on the X-axis displacement mechanism (2) from left to right. The substrate magazine (7) and the finished product magazine (9) are fixedly installed on the left side of the base (1). The substrate magazine (7) is arranged on the left side of the finished product magazine (9). The high-temperature heating table (12) is fixedly installed on the right side of the finished product magazine (9). The high-temperature heating table (12) is located on the moving route of the placement head (11). The chip flip-chip structure (10) is fixedly installed on the right side of the high-temperature heating table (12). The Y-axis displacement mechanism (3) is fixedly installed on the right side of the chip flip-chip structure (10). The chip picking structure (5) is installed on the Y-axis displacement mechanism (3). The chip magazine (8) is fixedly installed on the front side of the chip flip-chip structure (10).

2. The flip-chip and surface-mount dual-use chip mounter according to claim 1, characterized in that: The chip flip-chip structure (10) includes: chip flip-chip displacement motor (101), chip flip-chip displacement electric track (102), direct mount nozzle (103), direct mount nozzle rotation motor (104), direct mount nozzle vacuum suction accessory (105), flip mount nozzle (107), flip mount nozzle rotation motor (108) and flip mount nozzle vacuum suction accessory (109). The chip flip-chip displacement electric track (102) is fixedly installed on the base (1). The chip flip-chip displacement motor (101) is arranged at one end of the chip flip-chip displacement electric track (102). The direct mount nozzle (103) is installed on the chip flip-chip displacement electric track (102) through a direct mount nozzle fixing member (106). The direct mount nozzle (103) is connected to the direct mount nozzle rotation motor (104) and the direct mount nozzle vacuum suction accessory (105). The flip mount nozzle (107) is fixed to the base (1) through a flip mount nozzle fixing member (110) and is located at the other end of the chip flip-chip displacement electric track (102). The flip mount nozzle (107) is connected to the flip mount nozzle rotation motor (108) and the flip mount nozzle vacuum suction accessory (109).

3. The flip-chip and face-down bonding dual-use chip mounter according to claim 1, characterized in that: The chip picking structure (5) includes: a Z-axis displacement track (51), a Z-axis displacement motor (52), a chip picking rotary motor (53), and a chip picking nozzle (54). The Z-axis displacement track (51) is installed on the Y-axis displacement mechanism (3) through a fixing member. The Z-axis displacement motor (52) is fixedly installed at the top of the Z-axis displacement track (51). The Z-axis displacement track (51) is connected to the chip picking nozzle (54) through a chip picking nozzle (54) fixing member. The chip picking rotary motor (53) is fixedly installed above the chip picking nozzle (54). The chip picking nozzle (54) is disposed on the left side of the Z-axis displacement track (51).

4. A flip-chip and down-top dual-use chip mounter according to claim 1, characterized in that: A substrate automatic feeding table (13) is fixedly installed on the front side of the substrate magazine (7). A finished product automatic loading table (14) is fixedly installed on the front side of the finished product magazine (9). A chip automatic feeding table (15) is fixedly installed on the left side of the chip magazine (8).

5. A flip-chip and surface-mount dual-use chip mounter according to claim 4, wherein: The chip magazine (8) and the chip automatic feeding table (15) are replaced by a blue film feeding structure.

6. The flip-chip and surface-mount dual-use chip mounter according to claim 3, wherein: A substrate vision positioning mechanism (16) is connected to the right side of the finished product adsorption structure (6). A vision positioning mechanism for the placement head (11) is fixedly installed on the same horizontal line on the right side of the high-temperature heating table (12). A chip vision positioning mechanism (18) is connected to the left side of the chip picking nozzle (54). A camera positioning mechanism (19) is disposed on the moving route of the substrate adsorption structure (4). The camera positioning mechanism (19) is fixedly installed on the base (1). The camera positioning mechanism (19) is located on the right side of the finished product magazine (9) and on the left side of the high-temperature heating table (12).

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