Semiconductor packaging device

Abstract

The utility model relates to the field of packaging, and discloses a semiconductor packaging device. The semiconductor packaging device comprises a device body, an upper carrying body is arranged at the upper end of the device body, a plurality of sliding grooves are formed in the side face of the upper carrying body, side protection plates are arranged in the sliding grooves, and a plurality of threaded holes are formed in the surfaces of the side protection plates. A plurality of inner rectangular plates are arranged in the side protection plates, and the inner rectangular plates reduce the overall weight of the side protection plates while ensuring that the side protection plates protect the interior of the upper carrying main body, meanwhile, ventilation of assemblies is also ensured, workers can conveniently use the upper carrying main body for operation, and the assemblies arranged in the upper carrying main body can be conveniently protected; therefore, when the equipment is not used, assembly damage caused by mistaken touch is avoided, and the operation time of the equipment is prolonged.

Description

Technical Field

[0001] This application belongs to the field of packaging technology, and specifically relates to a semiconductor packaging device. Background Art

[0002] Semiconductor packaging significantly reduces the space requirements of a circuit board by integrating multiple chips or functional modules within a single package. By encapsulating multiple functional modules within a single device, the number of external connection points and solder joints is reduced, thereby decreasing the potential for poor contact and soldering defects. This design enhances the overall reliability of the package and reduces the risk of failures caused by connection problems. Modern semiconductor packaging designs typically include effective heat dissipation mechanisms such as heat sinks or heat sinks. These designs help manage and dissipate the heat generated within the package, preventing overheating, thereby protecting the chips and improving their operating stability. Packaging can reduce power consumption losses. Higher integration levels and optimized power management designs contribute to improved energy efficiency and extended battery life, which is particularly important in portable devices.

[0003] For example, the published patent with the publication number CN210778491U discloses a semiconductor packaging device, which includes a workbench, a fixed bracket, a machine head, and a machine cover. The fixed bracket is installed on the top of the workbench, the machine head is slidably arranged outside the fixed bracket, the machine cover is movably arranged outside the machine head, and a threaded drive clamping and fixing mechanism is arranged inside the machine head. The machine cover is fixed to the machine head through the clamping and fixing mechanism. This semiconductor packaging device, different from the prior art, uses a threaded drive clamping method for disassembly and assembly fixation, abandoning the traditional method of using the elastic force of a compression spring for clamping and fixing. This enables the device to still perform effective and stable disassembly and assembly fixation after long-term use, thereby ensuring the normal and stable packaging of semiconductors.

[0004] However, in the common use of this application for the equipment, there is no protective structure provided for the equipment components. As a result, the components are easily damaged when the equipment is not in use, which is inconvenient for subsequent operation and use. Summary of the Utility Model

[0005] The purpose of this application is to provide a semiconductor packaging device to solve the above-mentioned problem of facilitating the protection of equipment components.

[0006] The technical solution adopted in this application is as follows: A semiconductor packaging device includes a device main body. An upper mounting main body is provided at the upper end of the device main body. A plurality of sliding grooves are formed on the side surface of the upper mounting main body. A side protection plate is arranged inside the sliding grooves. A plurality of threaded holes are formed on the surface of the side protection plate. A plurality of inner rectangular plates are arranged inside the side protection plate. A handle is fixedly connected to the side surface of the side protection plate at the lower end position of the inner rectangular plate. A plurality of fixing bolts are threadedly connected to the side surface of the device main body. The other end of the fixing bolt passes through the device main body and is threadedly connected to the corresponding threaded hole on the side surface of the side protection plate.

[0007] By adopting the above technical solution, during the use of the device, the staff can use the side protection plate to cooperate with the sealing door to protect the components arranged inside the device, so as to provide protection for the device when it is not in use, which is beneficial to extending the service life of the device components. When not in use, the staff first takes out the fixing bolts from the device main body, then holds the handle and pulls the side protection plate located inside the sliding groove downward. After pulling it to a suitable position, the staff reinserts the fixing bolts back into the device main body and then connects the corresponding threaded holes to fix the position of the side protection plate. During operation, the staff takes out the fixing bolts from the device main body, then holds the handle and pulls the side protection plate upward. After pulling it to a suitable position, the staff reinserts the fixing bolts back into the device main body and restricts the position of the side protection plate by connecting the threaded holes. The inner rectangular plates reduce the overall weight of the side protection plate while ensuring the protection of the inside of the upper mounting main body by the side protection plate, and also ensure the ventilation of the components, which is convenient for the staff to operate and is convenient for protecting the components arranged inside the upper mounting main body, so as to avoid damage to the components caused by accidental touch when the device is not in use and extend the operation time of the device.

[0008] In a preferred embodiment, a sealing door is arranged on the side surface of the upper mounting main body adjacent to the side protection plate. A plurality of control buttons are arranged on the side surface of the upper mounting main body above the sealing door.

[0009] By adopting the above technical solution, the sealing door is convenient for the side protection plate to jointly provide protection for the device when it is not in use, so as to facilitate the operation of the device. The control buttons are convenient for the staff to control the use of the components inside the device.

[0010] In a preferred embodiment, a storage box is arranged at the upper end of the upper mounting main body. An alarm lamp is fixedly connected to the upper end of the upper mounting main body at the adjacent position of the storage box.

[0011] By adopting the above technical solution, the storage box is convenient for storing the packaging materials used by the device for semiconductor packaging operations, so as to ensure the normal use of the device. The alarm lamp emits light when the device fails to remind the staff.

[0012] In a preferred embodiment, a plurality of support pads are fixedly connected to the lower end of the device main body, and an extension plate is arranged on the side surface of the device main body.

[0013] By adopting the above technical solution, the support pads facilitate supporting the position of the device main body, ensure the stable position of the device main body, and facilitate subsequent operation use. The extension plate facilitates carrying items for operation use and is convenient for the staff to use.

[0014] In a preferred embodiment, a side sealing plate is arranged on the side surface of the device main body on the opposite side of the extension plate, and heat dissipation holes are arranged on the side surface of the device main body on the adjacent side of the side sealing plate.

[0015] By adopting the above technical solution, opening the side sealing plate facilitates the staff to perform regular maintenance on the components arranged inside the device main body, thereby ensuring the normal use of the device. The heat dissipation holes facilitate ventilation and heat dissipation of the device main body and ensure the normal operation of the device.

[0016] In a preferred embodiment, an operation groove is opened at the upper end of the device main body, and a conveyor belt is arranged inside the operation groove.

[0017] By adopting the above technical solution, by arranging the operation groove, it is convenient to place the conveyor belt, so that the position of the operation components can be driven by the conveyor belt, and the items that have completed the operation can be conveyed out of the device.

[0018] In a preferred embodiment, a packaging component is arranged inside the upper carrying main body, and a processing operation plate is arranged at the upper end of the conveyor belt.

[0019] By adopting the above technical solution, the packaging component is convenient for semiconductor packaging operation use and ensures the normal operation of the device. The processing operation plate is convenient for carrying the semiconductor to be packaged, thus facilitating the packaging.

[0020] In a preferred embodiment, the surfaces of the device main body and the support pads are both sprayed with anti-corrosion paint that meets the standards.

[0021] By adopting the above technical solution, the anti-corrosion paint can effectively prevent corrosion caused by moisture, chemical substances or environmental pollutants, thereby extending the service life of the packaging device. After spraying the anti-corrosion paint, the device can resist more severe environmental conditions, such as high humidity, high temperature, etc., and improve its overall durability.

[0022] In summary, due to the adoption of the above technical solutions, the beneficial effects of this application are:

[0023] In this application, during the use of the device, the staff can facilitate the protection of the components arranged inside the device by using the side protection plate in cooperation with the sealing door. Thus, when the device is not in use, it can provide protection for the device, which is conducive to extending the service life of the device components. When not in use, the staff first take out the fixing bolts from the device main body, then hold the handle and pull the side protection plate located inside the chute downward. After pulling it to the appropriate position, the staff reinsert the fixing bolts back into the device main body and then connect to the corresponding threaded holes to fix the position of the side protection plate. During operation, the staff take out the fixing bolts from the device main body, then hold the handle and pull the side protection plate upward. After pulling it to the appropriate position, the staff reinsert the fixing bolts back into the device main body and limit the position of the side protection plate by connecting to the threaded holes. The inner rectangular plate reduces the overall weight of the side protection plate while ensuring the protection of the upper-mounted main body inside by the side protection plate, and also ensures the ventilation of the components, facilitating the operation of the staff and protecting the components arranged inside the upper-mounted main body. Thus, when the device is not in use, it can avoid damage to the components caused by accidental touch and extend the operation time of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of the semiconductor packaging device of this application;

[0025] Figure 2 It is a schematic diagram of the internal structure of the semiconductor packaging device in this application;

[0026] Figure 3 It is a schematic side view of the internal structure of the semiconductor packaging device in this application;

[0027] Figure 4 It is a schematic structural diagram of the side protection plate in this application.

[0028] Reference numerals in the figures: 1, device main body; 2, support backing plate; 3, side sealing plate; 4, conveyor belt; 5, extension plate; 6, sealing door; 7, control button; 8, alarm lamp; 9, storage box; 10, upper-mounted main body; 11, fixing bolt; 12, side protection plate; 13, inner rectangular plate; 14, handle; 15, packaging component; 16, processing operation plate; 17, heat dissipation hole; 18, threaded hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the scope of protection of this application.

[0030] Embodiment:

[0031] Referring to Figures 1-4 , a semiconductor packaging device includes a device main body 1. An upper mounting main body 10 is provided at the upper end of the device main body 1. A plurality of sliding grooves are formed on the side surface of the upper mounting main body 10. Side protection plates 12 are arranged inside the sliding grooves. A plurality of threaded holes 18 are arranged on the surface of the side protection plates 12. A plurality of inner rectangular plates 13 are arranged inside the side protection plates 12. A handle 14 is fixedly connected to the side surface of the side protection plate 12 at the lower end position of the inner rectangular plate 13. A plurality of fixing bolts 11 are threadedly connected to the side surface of the device main body 1. The other end of the fixing bolt 11 passes through the device main body 1 and is threadedly connected to the corresponding threaded hole 18 on the side surface of the side protection plate 12. During the use of the device, the staff can use the side protection plate 12 to cooperate with the sealing door 6 to protect the components arranged inside the device, so as to provide protection for the device when the device is not in use, which is beneficial to extending the service life of the device components. When not in use, the staff first takes out the fixing bolt 11 from the device main body 1, then holds the handle 14 and pulls the side protection plate 12 located inside the sliding groove downward. After pulling to a suitable position, the staff reinserts the fixing bolt 11 back into the device main body 1 and then connects to the corresponding threaded hole 18 to fix the position of the side protection plate 12. During operation, the staff takes out the fixing bolt 11 from the device main body 1, then holds the handle 14 and pulls the side protection plate 12 upward. After pulling to a suitable position, the staff reinserts the fixing bolt 11 back into the device main body 1 and restricts the position of the side protection plate 12 by connecting to the threaded hole 18. The inner rectangular plate 13 reduces the overall weight of the side protection plate 12 while ensuring the protection of the side protection plate 12 for the inside of the upper mounting main body 10, and also ensures the ventilation of the components, facilitating the operation of the staff and protecting the components arranged inside the upper mounting main body 10, so as to avoid component damage caused by accidental touch when the device is not in use and extend the operation time of the device.

[0032] Referring to Figures 1-3 , a sealing door 6 is arranged on the side surface of the upper mounting main body 10 adjacent to the side protection plate 12. A plurality of control buttons 7 are arranged on the side surface of the upper mounting main body 10 above the sealing door 6. The sealing door 6 and the side protection plate 12 jointly provide protection for the device when the device is not in use, facilitating the operation of the device. The control buttons 7 facilitate the staff to control the use of the components inside the device.

[0033] Referring to Figures 1-3, a storage box 9 is provided at the upper end of the upper mounting body 10. An alarm lamp 8 is fixedly connected adjacent to the storage box 9 at the upper end of the upper mounting body 10. The storage box 9 is convenient for storing the packaging materials used in the semiconductor packaging operation of the equipment, thus ensuring the normal use of the equipment. The alarm lamp 8 emits light when the equipment fails to remind the staff.

[0034] Refer to Figures 1-3 , a plurality of support pads 2 are fixedly connected to the lower end of the equipment body 1. An extension plate 5 is provided on the side of the equipment body 1. The support pads 2 are convenient for supporting the position of the equipment body 1, ensuring the stable position of the equipment body 1 and facilitating subsequent operations. The extension plate 5 is convenient for carrying the items used in the operation, making it convenient for the staff to use.

[0035] Refer to Figures 1-3 , a side sealing plate 3 is provided on the side of the equipment body 1 on the opposite side of the extension plate 5. A heat dissipation hole 17 is provided on the side of the equipment body 1 adjacent to the side sealing plate 3. By opening the side sealing plate 3, it is convenient for the staff to perform regular maintenance on the components provided inside the equipment body 1, thus ensuring the normal use of the equipment. The heat dissipation hole 17 is convenient for ventilating and dissipating heat from the equipment body 1, ensuring the normal operation of the equipment.

[0036] Refer to Figures 1-3 , an operation slot is opened at the upper end of the equipment body 1. A conveyor belt 4 is provided inside the operation slot. By providing the operation slot, it is convenient to place the conveyor belt 4, and thus the position of the operation components can be moved by the conveyor belt 4, and the items that have completed the operation can be conveyed out of the equipment.

[0037] Refer to Figures 1-3 , a packaging component 15 is provided inside the upper mounting body 10. A processing operation board 16 is provided at the upper end of the conveyor belt 4. The packaging component 15 is convenient for performing semiconductor packaging operations, ensuring the normal operation of the equipment. The processing operation board 16 is convenient for carrying the semiconductor to be packaged, thus facilitating the packaging process.

[0038] Refer to Figures 1-3 , the surfaces of the equipment body 1 and the support pads 2 are both sprayed with anti-corrosion paint that meets the standards. The anti-corrosion paint can effectively prevent corrosion caused by moisture, chemical substances or environmental pollutants, thereby extending the service life of the packaging device. After spraying the anti-corrosion paint, the equipment can resist more severe environmental conditions, such as high humidity, high temperature, etc., improving its overall durability.

[0039] The implementation principle of an embodiment of the semiconductor packaging device in this application is:

[0040] During the use of the device, the staff can facilitate the protection of the components installed inside the device by using the side protection plate 12 in cooperation with the sealing door 6. Thus, when the device is not in use, protection is provided for the device, which is conducive to extending the service life of the device components. When the device is not in use, the staff first remove the fixing bolts 11 from the device main body 1, then hold the handle 14 and pull the side protection plate 12 located inside the chute downward. After pulling it to the appropriate position, the staff reinsert the fixing bolts 11 back into the device main body 1 and then connect to the corresponding threaded holes 18 to fix the position of the side protection plate 12. During operation, the staff remove the fixing bolts 11 from the device main body 1, then hold the handle 14 and pull the side protection plate 12 upward. After pulling it to the appropriate position, the staff reinsert the fixing bolts 11 back into the device main body 1 and limit the position of the side protection plate 12 by connecting to the threaded holes 18. The inner rectangular plate 13 reduces the overall weight of the side protection plate 12 while ensuring the protection of the upper-mounted main body 10 inside by the side protection plate 12. At the same time, it also ensures the ventilation of the components, facilitating the operation of the staff and the protection of the components installed inside the upper-mounted main body 10. Thus, when the device is not in use, component damage caused by accidental touch is avoided, and the operation time of the device is extended. By using this structure, it is convenient to provide protection for the components inside the device when the device is not in use. At the same time, it also ensures the ventilation of the device and avoids moisture affecting the use of the device, which is beneficial to the daily operation of the device.

[0041] The above embodiments are only used to illustrate the technical solutions of the present application, not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor packaging device, comprising a device main body (1), characterized in that: At the upper end of the device main body (1), there is an upper mounting main body (10). A plurality of sliding grooves are formed on the side surface of the upper mounting main body (10). Inside the sliding grooves, there are side protection plates (12). On the surface of the side protection plates (12), there are a plurality of threaded holes (18). Inside the side protection plates (12), there are a plurality of inner rectangular plates (13). At the lower end position of the inner rectangular plates (13) on the side surface of the side protection plates (12), there are fixedly connected handles (14). On the side surface of the device main body (1), there are a plurality of fixing bolts (11) threadedly connected. The other end of the fixing bolts (11) passes through the device main body (1) and is threadedly connected to the corresponding threaded holes (18) on the side surface of the side protection plates (12).

2. The semiconductor packaging device according to claim 1, characterized in that: On the side surface of the upper mounting main body (10), adjacent to the side protection plates (12), there is a sealing door (6). On the side surface of the upper mounting main body (10), above the sealing door (6), there are a plurality of control buttons (7).

3. A semiconductor packaging device according to claim 1, characterized in that: At the upper end of the upper mounting main body (10), there is a storage box (9). At the upper end of the upper mounting main body (10), adjacent to the storage box (9), there is a fixedly connected alarm lamp (8).

4. A semiconductor packaging device as claimed in claim 1, wherein: At the lower end of the device main body (1), there are a plurality of support pads (2) fixedly connected. On the side surface of the device main body (1), there is an extension plate (5).

5. A semiconductor packaging device according to claim 1, characterized in that: On the side surface of the device main body (1), on the opposite side of the extension plate (5), there is a side sealing plate (3). On the side surface of the device main body (1), adjacent to the side sealing plate (3), there are heat dissipation holes (17).

6. The semiconductor packaging device according to claim 1, wherein: At the upper end of the device main body (1), there is an operation groove. Inside the operation groove, there is a conveyor belt (4).

7. The semiconductor packaging device according to claim 6, characterized in that: Inside the upper mounting main body (10), there is a packaging component (15). Above the conveyor belt (4), there is a processing operation plate (16).

8. A semiconductor packaging device according to claim 1, characterized in that: The surfaces of the device main body (1) and the support pads (2) are both sprayed with anti-corrosion paint that meets the standards.

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