Connecting rod type wafer edge searching and positioning mechanism
Through the connecting rod wafer edge positioning mechanism, the single-axis fitting wafer center and sensor scanning is used to solve the problems of high cost and complex control of existing wafer calibrators, and low-cost and high-precision wafer positioning is achieved. It is suitable for six-inch and eight-inch wafers, simplifying the control process and improving operating efficiency.
Patent Information
- Application Number
- CN202421962910.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-14
AI Technical Summary
Existing wafer calibrators are costly and complex in control, which can easily lead to positioning failure and long supply cycles, making it difficult to efficiently compatible with the positioning requirements of six-inch and eight-inch wafers.
A connecting rod wafer edge-finding positioning mechanism is used to fit the center of the wafer through a single axis through the wafer appearance accuracy, and the positioning point is obtained in combination with sensor scanning, cancel the linkage of X\Y\θ motion axis, and use a mechanical structure to replace the imaging system.
It realizes low-cost and high-precision wafer positioning, is compatible with six-inch and eight-inch wafers, reduces equipment costs, improves positioning accuracy and operating efficiency, and simplifies the control process.
Smart Images

Figure CN223140726U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a connecting rod type wafer edge finding and positioning mechanism. Background Technique
[0002] During the full-automatic processing of wafers, generally, a wafer manipulator places the wafer from a loading container onto a wafer calibrator in an adsorption and transportation manner. After the imaging system mounted on the calibrator takes an overall identification photo of the wafer to judge its position, the combined displacement of three moving axes of X / Y / θ (where the θ moving axis represents rotation around the Z axis) is used to move the wafer center and the system-set origin to concentricity. The imaging system then uses the method of identification and photography again to capture the positioning flat edge of a six-inch wafer or the positioning point of an eight-inch wafer, and then the wafer manipulator moves to the system-set center of the circle to transport the wafer to the processing stage. Currently, when evaluating the equipment scheme of the wafer calibrator, the cost is extremely high, and the overall cost of the imaging equipment needs to be controlled; the control process is complex and cumbersome, requiring the combined use of three moving axes of X / Y / θ and the imaging system. If there is a system operation error or abnormal axis control, it is easy to cause positioning failure and increase the risk of handling damage; the manufacturing process of the calibrator is complex, the supply time of its used parts is long, and it is difficult to control the equipment manufacturing cycle.
[0003] In view of the above defects, the designer actively conducts research and innovation in order to create a connecting rod type wafer edge finding and positioning mechanism, making it more valuable in industry. Content of the Utility Model
[0004] To solve any one of the above technical problems, the purpose of the utility model is to provide a connecting rod type wafer edge finding and positioning mechanism.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme:
[0006] The connecting rod type wafer edge finding and positioning mechanism includes a trajectory substrate and a wafer suction cup installed in the middle of the trajectory substrate.
[0007] The bottom of the trajectory substrate is connected to the lower transmission substrate through a power connecting plate. A centering turntable is installed between the transmission substrate and the trajectory substrate. A second servo motor is installed on one side of the bottom of the transmission substrate. The driving end at the top of the second servo motor is connected to a driving gear located above the transmission substrate. The driving gear meshes with a driven gear installed at the bottom of the centering turntable.
[0008] A number of connecting rod assemblies are evenly distributed along the circumferential direction on the centering turntable. The connecting rod assembly includes a guide sleeve, a connecting rod and a sliding shaft. The inner bottom of the connecting rod is rotatably installed on the centering turntable. A sliding shaft is rotatably installed at the outer top of the connecting rod. A sliding shaft follower groove is formed on the track substrate directly above the sliding shaft. The sliding shaft is located in the sliding shaft follower groove. A guide sleeve is installed at the top of the sliding shaft. The guide sleeve is located above the track substrate.
[0009] As a further improvement of the present utility model, a centering main shaft is installed at the bottom of the wafer chuck. The bottom of the centering main shaft sequentially passes through the track substrate, the centering turntable and the transmission substrate. On the other side of the transmission substrate, a stepping motor is installed through a stepping motor mounting plate. The driving end at the bottom of the stepping motor is sequentially connected to the bottom of the centering main shaft through a driving synchronous pulley, a synchronous belt and a driven synchronous pulley.
[0010] As a further improvement of the present utility model, the centering main shaft is installed on the track substrate through a first tapered roller bearing, the centering main shaft is installed on the centering turntable through a second tapered roller bearing, and the centering main shaft is installed on the transmission substrate through a first deep groove ball bearing.
[0011] As a further improvement of the present utility model, bearing retaining rings are installed at the bottoms of the first tapered roller bearing and the second tapered roller bearing and are locked through first lock nuts. A bearing retaining ring is installed at the bottom of the first deep groove ball bearing and is locked through a second lock nut.
[0012] As a further improvement of the present utility model, a rotary joint is installed at the bottom of the centering main shaft, and a collar is installed on the centering main shaft above the driven synchronous pulley.
[0013] As a further improvement of the present utility model, a sensor detection unit is provided on one side of the track substrate. The sensor detection unit includes a sensor driving component and a sensor component. The sensor driving component includes a speed reducer and a first servo motor. The speed reducer is installed at the bottom on one side of the track substrate through a speed reducer mounting part. A first servo motor is installed at the bottom of the speed reducer. The top of the speed reducer is connected to a sensor bracket located above the track substrate through a coupling. The sensor component is installed on the sensor bracket. The sensor component sequentially includes a scanning sensor receiving end and a scanning sensor transmitting end that are adapted to each other from bottom to top.
[0014] As a further improvement of the present utility model, the stepping motor mounting plate is installed on the transmission substrate through a tensioning block.
[0015] As a further improvement of the present utility model, an induction piece is installed on the centering turntable. A photoelectric sensor adapted to the above-mentioned induction piece is installed on the transmission substrate below the induction piece. Limit blocks are installed on the transmission substrate on both sides of the photoelectric sensor.
[0016] As a further improvement of the present utility model, the bottom of the sliding shaft is mounted on the connecting rod through two first gaskets, and at least one second deep groove ball bearing is mounted on the sliding shaft above the connecting rod, and the second deep groove ball bearing is located in the follower groove of the sliding shaft.
[0017] As a further improvement of the present utility model, the inner bottom of the connecting rod is mounted on the connecting pin, the bottom of the connecting pin is mounted in the pin hole on the lower centering turntable, a bushing hole is provided in the centering turntable above the pin hole, an oil-free bushing is mounted on the connecting pin in the bushing hole, a second gasket is mounted above the oil-free bushing, and retaining rings are mounted on the connecting pins on both the upper and lower sides of the inner bottom of the connecting rod and are locked by a sliding shaft nut.
[0018] By means of the above solution, the present utility model has at least the following advantages:
[0019] The present utility model can be compatible with six-inch and eight-inch wafer operations simultaneously.
[0020] The present utility model uses a connecting rod type jaw to position the wafer by fitting the center of the wafer according to the outer shape accuracy of the wafer with a single axis, and no longer uses the X\Y\θ three-axis linkage of the wafer aligner to complete this action.
[0021] The present utility model scans the overall shape of the wafer by a sensor to obtain the positioning flat edge of a six-inch wafer or the positioning point of an eight-inch wafer, instead of completing it by the imaging system of the aligner taking a picture of the whole wafer for recognition. Without using the imaging system, the cost is low. Compared with the wafer aligner of the same level, the overall cost is about one-third of it.
[0022] The structure of the present utility model is simply installed, the mechanical positioning accuracy is accurate and reliable, and problems such as excessive positioning error or positioning failure caused by abnormal control system will not occur, which provides great convenience for the overall development of the equipment.
[0023] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly and implement it according to the content of the specification, the following takes the preferred embodiment of the present utility model and combines with the drawings to describe in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained according to these drawings.
[0025] Figure 1 It is a schematic structural diagram of a connecting rod type wafer edge finding and positioning mechanism of the present utility model;
[0026] Figure 2 is Figure 1 a schematic diagram of the internal structure;
[0027] Figure 3 is Figure 1 a schematic diagram of the structure of the middle connecting rod assembly.
[0028] Among them, the meanings of the reference numerals in the figures are as follows.
[0029] Locus substrate 1, connecting rod assembly 2, wafer chuck 3, receiving end of scanning sensor 4, transmitting end of scanning sensor 5, 6 - coupling, 7 - reducer mounting part, 8 - reducer, 9 - first servo motor, 10 - driving gear, 11 - second servo motor, 12 - driven gear, 13 - tensioning block, 14 - synchronous belt, 15 - limit block, transmission substrate 16, centering turntable 17, 18 - photoelectric sensor, 19 - induction piece, centering main shaft 20, 21 - first tapered roller bearing, 22 - second tapered roller bearing, 23 - stepping motor, 24 - first lock nut, 25 - stepping motor mounting plate, 26 - first deep groove ball bearing, 27 - driving synchronous pulley, 28 - second lock nut, 29 - collar, 30 - driven synchronous pulley, 31 - rotary joint, guide sleeve 32, 33 - second deep groove ball bearing, 34 - first gasket, connecting rod 35, sliding shaft 36, 37 - second gasket, 38 - oil - free bushing, 39 - connecting pin, 40 - spacer, 41 - sliding shaft nut, power connecting plate 42. Specific embodiments
[0030] The following will further describe in detail the specific embodiments of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but do not limit the scope of the present utility model.
[0031] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed present utility model, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.
[0032] Such as Figures 1 to 3As shown in the figure, a connecting-rod type wafer edge-finding and positioning mechanism includes a track substrate 1 and a wafer suction cup 3 installed in the middle of the track substrate 1.
[0033] The bottom of the track substrate 1 is connected to the lower transmission substrate 16 through a power connecting plate 42. A centering turntable 17 is installed between the transmission substrate 16 and the track substrate 1. A second servo motor 11 is installed on one side of the bottom of the transmission substrate 16. The driving end at the top of the second servo motor 11 is connected to a driving gear 10 located above the transmission substrate 16. The driving gear 10 meshes with a driven gear 12 installed at the bottom of the centering turntable 17.
[0034] A number of connecting-rod assemblies 2 are evenly distributed along the circumferential direction on the centering turntable 17. The connecting-rod assembly 2 includes a guide sleeve 32, a connecting rod 35, and a sliding shaft 36. The inner bottom of the connecting rod 35 is rotatably installed on the centering turntable 17. A sliding shaft 36 is rotatably installed at the outer top of the connecting rod 35. A sliding shaft follower groove is provided on the track substrate 1 directly above the sliding shaft 36. The sliding shaft 36 is located in the sliding shaft follower groove. A guide sleeve 32 is installed at the top of the sliding shaft 36, and the guide sleeve 32 is located above the track substrate 1.
[0035] Preferably, a centering main shaft 20 is installed at the bottom of the wafer suction cup 3. The bottom of the centering main shaft 20 sequentially passes through the track substrate 1, the centering turntable 17, and the transmission substrate 16. On the other side of the transmission substrate 16, a stepping motor 23 is installed through a stepping motor mounting plate 25. The driving end at the bottom of the stepping motor 23 is sequentially connected to the bottom of the centering main shaft 20 through a driving synchronous pulley 27, a synchronous belt 14, and a driven synchronous pulley 30.
[0036] Preferably, the centering main shaft 20 is installed on the track substrate 1 through a first tapered roller bearing 21, the centering main shaft 20 is installed on the centering turntable 17 through a second tapered roller bearing 22, and the centering main shaft 20 is installed on the transmission substrate 16 through a first deep groove ball bearing 26.
[0037] Preferably, bearing retaining rings are installed at the bottoms of both the first tapered roller bearing 21 and the second tapered roller bearing 22 and are locked through a first locking nut 24. A bearing retaining ring is installed at the bottom of the first deep groove ball bearing 26 and is locked through a second locking nut 28.
[0038] Preferably, a rotary joint 31 is installed at the bottom of the centering main shaft 20, and a collar 29 is installed on the centering main shaft 20 above the driven synchronous pulley 30.
[0039] Preferably, a sensor detection unit is provided on one side of the track substrate 1. The sensor detection unit includes a sensor driving component and a sensor component. The sensor driving component includes a reduction gear 8 and a first servo motor 9. The reduction gear 8 is installed at the bottom on one side of the track substrate 1 through a reduction gear mounting member 7. The first servo motor 9 is installed at the bottom of the reduction gear 8. The top of the reduction gear 8 is connected to a sensor bracket located above the track substrate 1 through a coupling 6. The sensor component is installed on the sensor bracket. The sensor component includes, from bottom to top, a mutually adapted scanning sensor receiving end 4 and a scanning sensor transmitting end 5 in sequence.
[0040] Preferably, the stepping motor mounting plate 25 is installed on the transmission substrate 16 through a tensioning block 13.
[0041] Preferably, an induction piece 19 is installed on the centering turntable 17. A photoelectric sensor 18 adapted to the above-mentioned induction piece 19 is installed on the transmission substrate 16 below the induction piece 19. Limit blocks 15 are installed on the transmission substrate 16 on both sides of the photoelectric sensor 18.
[0042] Preferably, the bottom of the sliding shaft 36 is installed on the connecting rod 35 through two first gaskets 34. At least one second deep groove ball bearing 33 is installed on the sliding shaft 36 above the connecting rod 35, and the second deep groove ball bearing 33 is located in the sliding shaft follower groove.
[0043] Preferably, the inner bottom of the connecting rod 35 is installed on a connecting pin 39. The bottom of the connecting pin 39 is installed in a pin hole on the lower centering turntable 17. A bushing hole is opened in the centering turntable 17 above the pin hole. An oil-free bushing 38 is installed on the connecting pin 39 in the bushing hole. A second gasket 37 is installed above the oil-free bushing 38. Circlips 40 are installed on the connecting pin 39 on both the upper and lower sides of the inner bottom of the connecting rod 35 and are locked through a sliding shaft nut 41.
[0044] The positional relationship and connection relationship between the components of the present utility model:
[0045] The main body of the present utility model is structurally connected to the equipment using the present utility model through the track substrate 1, and all the other components of the present utility model are directly or indirectly connected to the track substrate 1. Among them, the connecting rod assembly 2 is composed of Figure 3 the components 32 - 41 shown. The guide sleeve 32 is connected to the end of the sliding shaft 36 using bolts. The second deep groove ball bearing 33, the first gasket 34 and the sliding shaft 36 are connected in cooperation to form a mating connection; the second gasket 37 (oil-free gasket), the oil-free bushing 38 and the circlip 40 are arranged as Figure 3After the shown positional relationship forms a mating connection with the connecting pin 39, the whole forms a connecting rod component with the connecting rod 35 under the threaded connection of the sliding shaft nut 41. Its second gasket 37 and oil-free bushing 38 form a mating connection with the centering turntable 17, and the second deep groove ball bearing 33 forms a sliding mating connection with the track substrate 1.
[0046] After the first tapered roller bearing 21 is embedded in the central position of the main body track substrate 1, the centering main shaft 20 forms a mating connection with the first tapered roller bearing 21. After being connected to the track substrate 1 by bolts, it is connected to the transmission substrate 16 with bolts. The first deep groove ball bearing 26 is embedded in the central position of the transmission substrate 16 to provide auxiliary support for the centering main shaft 20. At the same time, after the second locking nut 28 is connected to the centering main shaft 20 by threads, it is pressed against the inner ring of the bearing on the first deep groove ball bearing 26. Thus, the centering main shaft 20 is completely fixed under the support of the above components. As Figure 2 shown, after the second tapered roller bearing 22 is embedded in the centering turntable 17, the two form a mating connection. Then, the inner ring of the second tapered roller bearing 22 is pressed into the Figure 2 shaft shoulder position of the centering main shaft 20 as shown. After the first locking nut 24 is connected to the centering main shaft 20 by threads and then pressed against the inner ring of the second tapered roller bearing 22, the centering turntable 17 forms a rotational connection with the centering main shaft 20 under the action of the bearing. At the same time, the second deep groove ball bearings 33 on the six connecting rod assemblies 2 that are in mating connection with it form a mating with the six linear tracks (i.e., sliding shaft follower grooves) on the track substrate 1, realizing the transformation of the displacement form from circular motion to linear motion. After the driven gear 12 is centered on the boss at the central position of the centering turntable 17, it is connected to the centering turntable 17 with bolts; after the driving gear 10 forms a mating connection with the output shaft of the second servo motor 11, the anti-loosening screw in the radial direction of the gear is screwed in and pressed against the output shaft of the servo motor to achieve a reliable connection. After the second servo motor 11 and the transmission substrate 16 are reliably connected through a mating connection and a bolt connection form, the circular power of the centering turntable 17 is reliably connected.
[0047] As Figure 2As shown, with the centering spindle 20 fixed at both ends by bearings, the degrees of freedom other than rotation are fixed. After the collar 29 is fitted and connected to the centering spindle 20, the inner diameter of the collar is changed by tightening with bolts, so as to achieve a tight fit connection with the centering spindle 20. The driven synchronous pulley 30 is inserted into the rear end face of the centering spindle 20 and is in close contact with the end face of the collar 29. After its inner diameter forms a fit connection with the centering spindle 20, three check screws evenly distributed in the circumferential direction are screwed in and pressed against the circumferential surface of the centering spindle 20 to achieve a tight connection between the driven synchronous pulley 30 and the centering spindle 20. After the stepping motor 23 and the mounting plate of the stepping motor 25 are connected with ordinary bolts, the driving synchronous pulley 27 is installed on the output shaft of the stepping motor 23. The mounting plate 25 of the stepping motor is connected to the transmission substrate 16 by bolts. The synchronous belt 14 completes power transmission with the driving synchronous pulley 27 and the driven synchronous pulley 30 in the form of belt drive. After the receiving end 4 and the transmitting end 5 of the scanning sensor are fixed on the track substrate 1 through the adjusting link, they are connected to the output shaft of the reducer 8 by the coupling 6. After the reducer 8 and the first servo motor 9 are connected in the form of positioning fit plus bolts, the track substrate 1 and the reducer 8 are fixed by the reducer mounting part 7. The receiving end 4 and the transmitting end 5 of the scanning sensor are two components of the wafer scanning sensor. Here, in order to realize the automatic operation process of the equipment, the power provided by the first servo motor 9 mainly acts to prevent the scanning sensor from interfering with the position of the clamping jaw (i.e., the guide sleeve 32) when the clamping jaw automatically clamps the wafer based on the principle of the swing arm.
[0048] The working principle and process of the present utility model:
[0049] The present utility model can be compatible with the edge-finding and positioning functions of 6-inch wafers and 8-inch wafers. The working parameters of each structure corresponding to wafers of different sizes can be set and retrieved during the automatic operation process of the equipment. When operating on an 8-inch wafer, the wafer is placed on the wafer chuck 3 by the wafer manipulator. At this time, the center position of the wafer is uncertain. The second servo motor 11 needs to rotate to drive the centering turntable 17 to rotate. The connecting rod assembly 2 connected to it by fit will pull one end when the centering turntable 17 rotates. The other end of the connecting rod is connected to the linear track of the track substrate 1, and the displacement is converted into linear motion. The ends of the six connecting rod assemblies 2 distributed in a circle move linearly towards the center of the track substrate 1 at the same time, so the diameter of the circle formed by the 6 guide sleeves 32 decreases, and the 8-inch wafer is pushed to the center position of the track substrate 1.
[0050] After the wafer is positioned to complete the above actions, the equipment automation process turns on the vacuum signal. After the wafer is adsorbed by the wafer chuck 3, the second servo motor 11 reverses, driving the centering turntable 17 to reverse. The six link assemblies 2 are fully opened and no longer constrain the center of the wafer. At this time, due to the vacuum adsorption of the wafer chuck 3, the wafer will not have other displacements. The first servo motor 9 rotates to move the receiving end 4 and the transmitting end 5 of the scanning sensor to the upper and lower sides of the wafer in the form of a swing arm. At the same time, about half of the light spot emitted and received by the scanning sensor is blocked by the wafer. At this time, the stepping motor 23 rotates. Driven by the synchronous belt 14, the centering spindle 20 rotates synchronously, driving the eight-inch wafer to rotate at the same speed. When the wafer rotates outside the positioning point, the length of the light spot blocked by the wafer is fixed, and the analog value formed by the length of the light spot received by the receiving end 4 of the scanning sensor is fixed. When the positioning point of the eight-inch wafer rotates to coincide with the light spot emitted by the transmitting end 5 of the scanning sensor, since the positioning point at this place is similar to a notch and the length of the light spot blocked by the wafer changes, the analog value of the length of the light spot received by the receiving end 4 of the scanning sensor changes. After being judged by the equipment system, the current angular position of the stepping motor 23 is the position where the positioning point of the eight-inch wafer is located. At this time, the eight-inch wafer has completed all positioning actions. The system records this position and makes the stepping motor 23 rotate a certain angle to the position where the wafer is to be transported. Then the system disconnects the vacuum signal, the adsorption force of the wafer chuck 3 disappears, and the wafer is transported to the processing stage by the wafer manipulator for the next operation process.
[0051] When processing a six-inch wafer, the principle of locating the center of the wafer is exactly the same as that of an 8-inch wafer. The rotation angle of the second servo motor 11 is different from that of the 8-inch wafer. This part can be completed by calling the 6-inch processing parameters when the equipment performs a fully automatic operation process. After completing the positioning of the center of the wafer, the flat edge position of the six-inch wafer needs to be determined. The positioning reference points of the six-inch wafer and the eight-inch wafer are quite different. The eight-inch is a semicircular notch-shaped positioning point, while the six-inch wafer is a positioning flat edge. After the wafer is completely adsorbed by the wafer suction cup 3, the first servo motor 9 rotates to move the scanning sensor receiving end 4 and the scanning sensor transmitting end 5 to the upper and lower sides of the wafer in the form of a swing arm action. At the same time, the light spot emitted and received by the scanning sensor is about half blocked by the wafer. At this time, the stepper motor 23 rotates, and under the drive of the synchronous belt 14, the centering spindle 20 rotates synchronously, driving the six-inch wafer to rotate at the same speed. Because when the wafer rotates outside the positioning flat edge, the light spot The length blocked by the wafer is fixed, and the analog value formed by the spot length received by the scanning sensor receiving end 4 is fixed. When the flat edge of the six-inch wafer rotates to the point where the analog value of the spot length received by the scanning sensor receiving end 4 changes, the system records the position of the stepper motor 23 as the first endpoint position of the flat edge; then the stepper motor 23 continues to rotate, and when the analog value of the spot length received by the scanning sensor receiving end 4 is the same as the position of the previous analog value, the system records the position of the stepper motor 23 as the second endpoint position of the flat edge, and then takes the midpoint position of the two recorded positions, that is, the 6-inch wafer completes all flat edge positioning, and then proceeds to the next operation process.
[0052] The utility model uses a simple connecting rod structure, and accurately combines various machined parts and edge scanning sensors to realize the centering and edge finding function of the wafer, completely replacing the expensive and long-delivery wafer aligner. After continuous testing, this mechanical connecting rod centering structure has a final centering accuracy of about 0.05 after wafer centering, and a repeat positioning accuracy of 0.01.
[0053] The flat edge angle positioning accuracy of the six-inch wafer reaches 0.05 degrees, and the repeat positioning accuracy reaches 0.01 degrees; the positioning point finding accuracy of the eight-inch wafer reaches 0.08 degrees, and the repeat positioning accuracy reaches 0.04 degrees.
[0054] The timing starts from the placement of the wafer on the device to complete centering and positioning of the flat edge or positioning point, with a cumulative time of about 8 seconds. The operation efficiency is relatively high, and the mechanical structure positioning greatly improves the operation accuracy, saving time for the overall processing efficiency of the equipment.
[0055] The utility model does not use an imaging system, has simple control, is easy to debug, greatly saves time and material costs, and makes a huge contribution to the overall cost control of the equipment. Its cost and efficiency win a certain degree of market competitive advantage for the equipment.
[0056] The wafer is positioned by using a link-type gripper to fit the center of the wafer circle according to the wafer shape accuracy through a single axis, and the three motion axes of X / Y / θ of the wafer aligner are no longer used to complete this action. The overall shape of the wafer is scanned by a sensor to obtain the positioning flat edge of a six-inch wafer or the positioning points of an eight-inch wafer, which is no longer completed by the imaging system of the aligner after photographing and identifying the overall wafer. The imaging system is not used, and the cost is low. Compared with wafer aligners of the same level, the overall cost is about one-third of theirs. The mechanical positioning accuracy is accurate and reliable, and problems such as excessive positioning errors or positioning failures caused by abnormal control systems will not occur.
[0057] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.
[0058] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection, it may be a mechanical connection, it may be an electrical connection, it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.
[0059] The above description is only a preferred embodiment of the present invention and is not used to limit the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the technical principle of the present invention, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. Link-type wafer edge-finding and positioning mechanism, including a trajectory substrate (1) and a wafer suction cup (3) installed in the middle of the trajectory substrate (1); characterized in that: The bottom of the track substrate (1) is connected to the underlying transmission substrate (16) through a power connection plate (42). A centering turntable (17) is installed between the transmission substrate (16) and the track substrate (1). A second servo motor (11) is installed on one side of the bottom of the transmission substrate (16). The driving end at the top of the second servo motor (11) is connected to a driving gear (10) located above the transmission substrate (16). The driving gear (10) meshes with a driven gear (12) installed at the bottom of the centering turntable (17). A number of link assemblies (2) are evenly distributed along the circumferential direction on the centering turntable (17). The link assembly (2) includes a guide sleeve (32), a link (35), and a sliding shaft (36). The inner bottom of the link (35) is rotatably installed on the centering turntable (17). A sliding shaft (36) is rotatably installed at the outer top of the link (35). A sliding shaft follower groove is formed on the track substrate (1) directly above the sliding shaft (36). The sliding shaft (36) is located within the sliding shaft follower groove. A guide sleeve (32) is installed at the top of the sliding shaft (36). The guide sleeve (32) is located above the track substrate (1).
2. The link-type wafer edge finding and positioning mechanism according to claim 1, characterized in that, A centering main shaft (20) is installed at the bottom of the wafer suction cup (3). The bottom of the centering main shaft (20) sequentially passes through the track substrate (1), the centering turntable (17), and the transmission substrate (16). On the other side of the transmission substrate (16), a stepping motor (23) is installed through a stepping motor mounting plate (25). The driving end at the bottom of the stepping motor (23) is sequentially connected to the bottom of the centering main shaft (20) through a driving synchronous pulley (27), a synchronous belt (14), and a driven synchronous pulley (30).
3. The link type wafer edge finding and positioning mechanism according to claim 2, wherein, The centering main shaft (20) is installed on the track substrate (1) through a first tapered roller bearing (21). The centering main shaft (20) is installed on the centering turntable (17) through a second tapered roller bearing (22). The centering main shaft (20) is installed on the transmission substrate (16) through a first deep groove ball bearing (26).
4. The link-type wafer edge searching and positioning mechanism according to claim 3, characterized in that, Bearing retaining rings are installed at the bottoms of both the first tapered roller bearing (21) and the second tapered roller bearing (22) and are locked through a first locking nut (24). A bearing retaining ring is installed at the bottom of the first deep groove ball bearing (26) and is locked through a second locking nut (28).
5. The link-type wafer edge finding and positioning mechanism according to claim 2, wherein A rotary joint (31) is installed at the bottom of the centering main shaft (20). A collar (29) is installed on the centering main shaft (20) above the driven synchronous pulley (30).
6. The connecting rod type wafer edge finding and positioning mechanism according to claim 1, wherein, A sensor detection unit is provided on one side of the trajectory substrate (1). The sensor detection unit includes a sensor driving assembly and a sensor assembly. The sensor driving assembly includes a speed reducer (8) and a first servo motor (9). The speed reducer (8) is installed at the bottom on one side of the trajectory substrate (1) through a speed reducer mounting member (7). A first servo motor (9) is installed at the bottom of the speed reducer (8). The top of the speed reducer (8) is connected to a sensor bracket located above the trajectory substrate (1) through a coupling (6). The sensor assembly is installed on the sensor bracket. The sensor assembly sequentially includes a scanning sensor receiving end (4) and a scanning sensor transmitting end (5) that are adapted to each other from bottom to top.
7. The link-type wafer edge finding and positioning mechanism according to claim 2, wherein The stepping motor mounting plate (25) is installed on the transmission substrate (16) through a tensioning block (13).
8. The link-type wafer edge-finding and positioning mechanism according to claim 1, wherein An induction piece (19) is installed on the centering turntable (17). A photoelectric sensor (18) adapted to the above-mentioned induction piece (19) is installed on the transmission substrate (16) below the induction piece (19). Limit blocks (15) are installed on the transmission substrate (16) on both sides of the photoelectric sensor (18).
9. The connecting rod type wafer edge searching and positioning mechanism according to claim 1, wherein The bottom of the sliding shaft (36) is installed on the connecting rod (35) through two first gaskets (34). At least one second deep groove ball bearing (33) is installed on the sliding shaft (36) above the connecting rod (35). And the second deep groove ball bearing (33) is located in the sliding shaft follower groove.
10. The link-type wafer edge finding and positioning mechanism according to claim 1, wherein, The inner bottom of the connecting rod (35) is installed on a connecting pin (39). The bottom of the connecting pin (39) is installed in a pin hole on the lower centering turntable (17). A bushing hole is opened in the centering turntable (17) above the pin hole. An oil-free bushing (38) is installed on the connecting pin (39) in the bushing hole. A second gasket (37) is installed above the oil-free bushing (38). Spacer rings (40) are installed on the connecting pin (39) on both the upper and lower sides of the inner bottom of the connecting rod (35) and are locked through a sliding shaft nut (41).
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Wafer clamping mechanism
CN121358251A