Wafer film pasting device

Abstract

The utility model provides a wafer film pasting device which comprises a vacuum adsorption unit and a foot switch connected with the vacuum adsorption unit, and the foot switch drives the vacuum adsorption unit to adsorb a wafer when being treaded. And when the foot switch is not treaded, the vacuum adsorption unit is driven to release the wafer. According to the configuration, the foot switch is arranged to control the vacuum adsorption unit to adsorb or release the wafer, and an operator does not need to manually open or close the vacuum adsorption unit, so that the hands of the operator are liberated to assist in fixing the wafer, ensure that the wafer film is not misplaced, and improve the yield.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, and particularly relates to a wafer film sticking device. Background Art

[0002] Generally, the circuit side of a wafer, that is, the side where the chip functions are completed, is called the front side, and the other side is the back side. During the wafer processing, for various purposes, a thin film is often required to be attached to the surface of the wafer, and usually a wafer film sticking device is used to stick the film on the wafer. Specifically, the wafer is first vacuum adsorbed and then the film is stuck. For ultra-thin wafers, the warping situation is more serious, and it is easy to slide during film sticking, and manual assistance with both hands is required to fix the wafer. However, when the device is operating, the vacuum button needs to be manually operated to adsorb the wafer, which causes the operator to be unable to release both hands to assist in fixing the wafer, easily resulting in misalignment of the wafer film sticking, affecting the quality of the wafer, and reducing the yield rate of the chips. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a wafer film sticking device to solve the problem that the current wafer film sticking device needs to manually turn on the vacuum adsorption, resulting in the inability to manually assist in fixing the wafer, and the wafer is prone to displacement and sliding.

[0004] To solve the above technical problems, the utility model provides a wafer film sticking device, which includes a vacuum adsorption unit and a foot switch connected to the vacuum adsorption unit. When the foot switch is depressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the foot switch is not depressed, it will drive the vacuum adsorption unit to release the wafer.

[0005] Optionally, the wafer film sticking device further includes a manual switch. When the manual switch is pressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the manual switch is not pressed, it will drive the vacuum adsorption unit to release the wafer.

[0006] Optionally, the vacuum adsorption unit includes an adsorbent and a solenoid valve arranged on the adsorbent, and the manual switch and the foot switch are connected to the solenoid valve.

[0007] Optionally, the wafer film sticking device further includes a vacuum indicator connected to the vacuum adsorption unit.

[0008] Optionally, the wafer film sticking device further includes a temperature controller connected to the vacuum adsorption unit.

[0009] Optionally, the wafer film sticking device further includes a power switch for connecting or disconnecting the power supply.

[0010] Optionally, the wafer film attaching device further includes a power indicator unit for indicating the state of the power switch.

[0011] Optionally, the wafer film attaching device further includes a temperature regulating switch for regulating the temperature of the vacuum adsorption unit.

[0012] Optionally, the wafer film attaching device further includes a temperature regulating indicator unit for indicating the working state of the temperature regulating switch.

[0013] Optionally, the vacuum adsorption unit is configured to adsorb the wafer gradually from the center of the wafer in an inward-outward direction.

[0014] In summary, in the wafer film attaching device provided by the present utility model, the wafer film attaching device includes a vacuum adsorption unit and a foot switch connected to the vacuum adsorption unit. When the foot switch is depressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the foot switch is not depressed, it will drive the vacuum adsorption unit to release the wafer. With such a configuration, by setting a foot switch to control the adsorption or release of the wafer by the vacuum adsorption unit, it is not necessary for the operator to manually turn on or off the vacuum adsorption unit, liberating the hands of the operator to assist in fixing the wafer, ensuring that the wafer film is not misaligned, and improving the yield rate. Description of the Drawings

[0015] Those of ordinary skill in the art should understand that the provided drawings are used to better understand the present utility model and do not constitute any limitation to the scope of the present utility model. Among them:

[0016] Figure 1 is a schematic diagram of a wafer film attaching device according to an embodiment of the present utility model;

[0017] Figure 2 is a schematic diagram of an internal control circuit of a wafer film attaching device according to an embodiment of the present utility model. Detailed Description of the Embodiments

[0018] To make the objectives, advantages, and features of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, only for the purpose of facilitating and clearly assisting in explaining the objectives of the embodiments of the present utility model. In addition, the structures shown in the drawings are often part of the actual structures. In particular, the emphasis to be shown in each drawing is different, and sometimes different scales are used.

[0019] As used in the present utility model, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally used in the sense of including "and / or", the term "several" is generally used in the sense of including "at least one", the term "at least two" is generally used in the sense of including "two or more", in addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features, "one end" and "the other end" as well as "proximal end" and "distal end" generally refer to two corresponding parts, which include not only the endpoints, the terms "mounted", "connected", "coupled" shall be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, it may be the communication inside two elements or the interaction relationship between two elements. In addition, as used in the present utility model, one element being disposed on another element generally only means that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the two elements may be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, and cannot be construed as indicating or implying the spatial position relationship between the two elements, that is, one element may be inside, outside, above, below or on one side of the other element, etc. in any orientation, unless otherwise explicitly stated in the context. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model may be understood according to specific circumstances.

[0020] Refer to Figure 1 and Figure 2, the present utility model schematically provides a wafer film attaching device, which includes a vacuum adsorption unit and a foot switch (S1) connected to the vacuum adsorption unit. The vacuum adsorption unit can adsorb the wafer by means of vacuum adsorption. After the wafer is adsorbed, the operator can attach a film to the wafer. In an embodiment, the vacuum adsorption unit includes an adsorbing member, for example, a vacuum adsorption disc. A plurality of air suction holes are provided on the surface of the vacuum adsorption disc, and the wafer is adsorbed through the air suction holes. When the foot switch is depressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the foot switch is not depressed, it will drive the vacuum adsorption unit to release the wafer. Specifically, when the foot switch is depressed, it will drive the vacuum adsorption unit to open the internal vacuum channel, thereby vacuum-adsorbing the wafer. When the foot switch is not depressed, the internal vacuum channel of the vacuum adsorption unit is in a closed state and cannot adsorb the wafer. With such a configuration, by setting the foot switch to control the adsorption or release of the wafer by the vacuum adsorption unit, the operator steps on the foot switch with the foot to make the vacuum adsorption unit adsorb the wafer, or does not step on the foot switch to make the vacuum adsorption unit release the wafer, without the operator manually opening or closing the vacuum adsorption unit, liberating the hands of the operator to assist in fixing the wafer, ensuring that the wafer film attachment does not shift or slide, and improving the yield rate.

[0021] Preferably, the vacuum adsorption unit is used to gradually adsorb the wafer from the center of the wafer and in the direction from the inside to the outside. In this way, it is possible to avoid damage to the wafer caused by the vacuum adsorption unit adsorbing the wafer all at once.

[0022] Optionally, the wafer film attaching device further includes a manual switch (S2). When the manual switch is pressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the manual switch is not pressed, it will drive the vacuum adsorption unit to release the wafer. In this way, this embodiment still retains the function of manually opening and closing the vacuum adsorption unit.

[0023] Further, the vacuum adsorption unit includes an adsorbing member and a solenoid valve (U) provided on the adsorbing member. The manual switch and the foot switch are connected to the solenoid valve. The adsorbing member is, for example, a vacuum adsorption disc, and the adsorbing member is arranged on the vacuum pipeline. When the manual switch is pressed or the foot switch is depressed, it will cause the branch of the solenoid valve where the control circuit inside the wafer film attaching device is located to form a loop, thereby connecting the circuit inside the solenoid valve, and the solenoid valve is opened, so that the adsorbing member performs vacuum adsorption on the wafer.

[0024] Further, the wafer film attaching device further includes a vacuum indicator connected to the vacuum adsorption unit, which is used to indicate the vacuum degree of the vacuum adsorption unit.

[0025] Further, the wafer film laminating device further includes a temperature controller (thermostat) connected to the vacuum adsorption unit. Those skilled in the art can understand that the thermostat undergoes physical deformation inside the switch according to the temperature change of the working environment, thereby generating certain special effects, a series of automatic control components that generate conduction or disconnection actions, or the different principles of the working states of electronic components at different temperatures to provide temperature data for the circuit, so that the circuit can collect the temperature data. In this way, the temperature of the vacuum adsorption unit is collected.

[0026] Further, the wafer film laminating device further includes power switches (S3, S4), and the power switches are used to connect or disconnect the power supply (AC), so that the wafer film laminating device is connected to the power supply to start working, or disconnect the power supply to stop. Even further, the wafer film laminating device further includes a power indication unit, and the power indication unit is used to indicate the state of the power switch, such as indicating that the power switch is in the state of connecting to the power supply or disconnecting from the power supply. In one embodiment, the power indication unit may be a power indicator light (L), and the state of the power switch is indicated by the color change or brightness change of the power indicator light.

[0027] Further, the wafer film laminating device further includes a temperature adjustment switch, and the temperature adjustment switch is used to adjust the temperature of the vacuum adsorption unit to increase or decrease the temperature of the vacuum adsorption unit. Even further, the wafer film laminating device further includes a temperature adjustment indication unit, and the temperature adjustment indication unit is used to indicate the working state of the temperature adjustment switch, such as indicating that the temperature adjustment switch is in the state of increasing temperature adjustment or decreasing temperature adjustment. In one embodiment, the temperature adjustment indication unit may be temperature adjustment indicator lights (D1, D2), and the working state of the temperature adjustment switch is indicated by the color change or brightness change of the temperature adjustment indicator lights.

[0028] The usage process of the wafer film laminating device in this embodiment is as follows: First, turn on the power switch so that the wafer film laminating device is connected to the power supply to enter the standby state, then place the wafer on the vacuum adsorption unit, step on the foot switch so that the vacuum adsorption unit is turned on to adsorb the wafer, and finally the operator applies the film to the wafer with both hands.

[0029] Although the present utility model is disclosed above with preferred embodiments, the above embodiments are not intended to limit the present utility model. For any person skilled in the art, without departing from the scope of the technical solution of the present utility model, many possible changes and modifications can be made to the technical solution of the present utility model by using the technical content disclosed above, or modified into equivalent embodiments with equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present utility model without departing from the content of the technical solution of the present utility model still belong to the scope of protection of the technical solution of the present utility model.

Claims

1. A wafer film attaching device, characterized in that, It includes a vacuum adsorption unit and a foot switch connected to the vacuum adsorption unit. When the foot switch is depressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the foot switch is not depressed, it will drive the vacuum adsorption unit to release the wafer.

2. The wafer film laminating device according to claim 1, characterized in that, The wafer film laminating device further includes a manual switch. When the manual switch is pressed, it will drive the vacuum adsorption unit to adsorb the wafer, and when the manual switch is not pressed, it will drive the vacuum adsorption unit to release the wafer.

3. The wafer film attaching device according to claim 2, wherein The vacuum adsorption unit includes an adsorbent and a solenoid valve provided on the adsorbent. The manual switch and the foot switch are connected to the solenoid valve.

4. The wafer film attaching device according to claim 1, wherein The wafer film laminating device further includes a vacuum indicator connected to the vacuum adsorption unit.

5. The wafer film attaching device according to claim 1, characterized in that The wafer film laminating device further includes a temperature controller connected to the vacuum adsorption unit.

6. The wafer film attaching device according to claim 1, wherein, The wafer film laminating device further includes a power switch for connecting or disconnecting the power supply.

7. The wafer laminating device according to claim 6, wherein The wafer film laminating device further includes a power indication unit for indicating the state of the power switch.

8. The wafer film attaching device according to claim 1, characterized in that, The wafer film laminating device further includes a temperature adjustment switch for adjusting the temperature of the vacuum adsorption unit.

9. The wafer film laminating device according to claim 8, wherein, The wafer film laminating device further includes a temperature adjustment indication unit for indicating the working state of the temperature adjustment switch.

10. The wafer film attaching device according to claim 1, characterized in that, The vacuum adsorption unit is used to gradually adsorb the wafer from the center of the wafer and in the direction from the inside to the outside.

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