Plastic packaging device for multi-layer stacked chips

Abstract

The utility model discloses a plastic packaging device for multilayer stacked chips, and relates to the technical field of chip processing, the plastic packaging device comprises a workbench, the top of the workbench is provided with an adjusting and limiting assembly, a first output shaft and a second output shaft can drive a first telescopic shaft and a second telescopic shaft to stretch out and draw back, and the use angles of a first locking block and a second locking block can be adjusted. A first locking block and a second locking block can be conveniently connected and installed with a first fixing plate and a second fixing plate through a first locking rod and a second locking rod, the first fixing plate and the second fixing plate can guide and limit multiple layers of chips through limiting base plates on the inner side faces, and two reinforcing frames can reinforce the use stability of the limiting base plates; the adjusting blocks rise and fall in the adjusting grooves, the two limiting plates are installed on the left side face of the first fixing plate and the left side face of the second fixing plate through the multiple limiting bolts, the two adjusting blocks can be conveniently used in a limiting mode, and the two calibrated scales can be used for measuring the height of the multiple layers of chips.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, and particularly relates to a plastic encapsulation device for multi-layer stacked chips. Background Art

[0002] In the existing chip stacking technology, most of them adopt the FOW (flow over wire) stacking technology or the stack-die technology for stacking. The higher the chips are stacked, the more difficult it is to control the wire bonding of the top-layer chips, which easily causes unstable wire bonding. And in the existing technology, the misaligned stacking process is mostly adopted, and the chips are stacked obliquely, with an unstable structure and easy to collapse. Moreover, with the existing stacking technology, the overall size of the packaging structure is relatively large, which is not conducive to the miniaturization design of electronic products.

[0003] In the patent with the publication number CN111816625B, a multi-layer chip stacking structure and a multi-layer chip stacking method are proposed. In this patent, it includes a multi-layer chip stacking structure, a first plastic encapsulation body, a conductive column, a boss, a wire, a second plastic encapsulation body, a solder ball, a first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a protective film. The first plastic encapsulation body 130 plays a supporting role to improve the chip stacking strength. A step portion 133 is formed on the first plastic encapsulation body 130, and the opening position and number of the step portion 133 are determined according to the actual situation, which can realize the stacking of more chips and reduce the overall packaging size of the product. By opening through holes in the first plastic encapsulation body 130 and filling conductive materials in the through holes to form conductive columns 131 for realizing the electrical connection between the flip chip and the substrate 110, the first pads 151 and the second pads 152 at the bottom of the flip chip adopt a bump structure, and using the eutectic soldering principle, the flip chip is connected to the conductive column 131, which can greatly improve the chip transmission rate and signal transmission quality, can realize the integration of multiple chips on one substrate 110, improve the chip integration degree, and reduce the packaging process, reduce the required packaging materials, and reduce the packaging cost. However, there are still the following problems in this patent:

[0004] When the existing plastic encapsulation work is carried out on multi-layer stacked chips, it cannot guide and limit chips with different height dimensions, resulting in poor stability during plastic encapsulation.

[0005] In view of the above problems, it is necessary to design a plastic encapsulation device for multi-layer stacked chips to overcome the above problems. Summary of the Utility Model

[0006] The main purpose of the utility model is to provide a plastic encapsulation device for multi-layer stacked chips, which can effectively solve the problems in the background art.

[0007] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0008] Plastic encapsulation device for multi-layer stacked chips, including a workbench, and an adjustment and limiting component is arranged on the top of the workbench;

[0009] The adjustment and limiting component includes a support plate arranged at the rear end of the middle part of the top of the workbench. A double-shaft drive motor is arranged on the top of the support plate. A first output shaft is arranged on the right side of the double-shaft drive motor. A first telescopic shaft is arranged on the right side of the first output shaft. A first locking block is installed on the right side of the first telescopic shaft. A second output shaft is arranged on the left side of the double-shaft drive motor. A second telescopic shaft is arranged on the left side of the second output shaft. A second locking block is installed on the left side of the second telescopic shaft. A first locking rod is installed on the front of the first locking block. A second locking rod is installed on the front of the second locking block. A first fixing plate is installed on the front of the first locking rod. A second fixing plate is installed on the front of the second locking rod. Limiting pads are installed on the inner sides of the first fixing plate and the second fixing plate. Adjustment grooves are formed on the fronts of the first fixing plate and the second fixing plate. Adjusting blocks are installed on the inner walls of the two adjustment grooves. A limiting plate is installed on the front of the two adjusting blocks. Limiting bolts are installed at the four corners of the front of the two limiting plates. A scale is installed in the middle of the front of the two limiting plates. Reinforcing frames are installed on the tops of the first fixing plate and the second fixing plate.

[0010] As a preferred scheme of the present utility model, the support plate is fixedly connected to the double-shaft drive motor, and the double-shaft drive motor is respectively connected to the first telescopic shaft and the second telescopic shaft through the first output shaft and the second output shaft for transmission.

[0011] As a preferred scheme of the present utility model, both the first telescopic shaft and the second telescopic shaft are threadedly connected to the first locking block and the second locking block respectively, and the first locking block is threadedly connected to the first locking rod.

[0012] As a preferred scheme of the present utility model, the second locking block is threadedly connected to the second locking rod, the first locking rod is threadedly connected to the first fixing plate, and the second locking rod is threadedly connected to the second fixing plate.

[0013] As a preferred scheme of the present utility model, both the first fixing plate and the second fixing plate are fixedly connected to the two reinforcing frames respectively, and both the first fixing plate and the second fixing plate are fixedly connected to the two limiting pads respectively.

[0014] As a preferred scheme of the present utility model, the two adjusting blocks are in contact with the inner walls of the adjustment grooves, the two adjusting blocks are fixedly connected to the two scales respectively, the two adjusting blocks are fixedly connected to the two limiting plates respectively, and the two limiting plates are respectively threadedly connected to the fronts of the first fixing plate and the second fixing plate through a plurality of the limiting bolts.

[0015] Beneficial effects

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. For the plastic encapsulation device of the multi-layer stacked chip, the first output shaft and the second output shaft can drive the first telescopic shaft and the second telescopic shaft to expand and contract, so as to adjust the use angles of the first locking block and the second locking block. The first locking rod and the second locking rod facilitate the connection and installation of the first locking block and the second locking block with the first fixing plate and the second fixing plate. The first fixing plate and the second fixing plate can use the limiting pads on the inner side to guide and limit the multi-layer chips. The two reinforcing frames can reinforce the use stability of the limiting pads. The adjusting block moves up and down in the adjusting groove, and the two limiting plates are installed on the left side surfaces of the first fixing plate and the second fixing plate by a plurality of limiting bolts, which is convenient for limiting the use of the two adjusting blocks. The two scales can measure the height of the multi-layer chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the overall structural schematic diagram of the utility model;

[0019] Figure 2 is the structural schematic diagram of the adjusting and limiting component of the utility model;

[0020] Figure 3 is the structural schematic diagram of the limiting pad of the utility model.

[0021] In the figure: 1. Workbench; 2. Adjusting and limiting component; 201. Support plate; 202. Biaxial drive motor; 203. First output shaft; 204. Second output shaft; 205. First telescopic shaft; 206. Second telescopic shaft; 207. First locking block; 208. Second locking block; 209. First locking rod; 210. Second locking rod; 211. First fixing plate; 212. Second fixing plate; 213. Limiting pad; 214. Adjusting groove; 215. Adjusting block; 216. Limiting plate; 217. Limiting bolt; 218. Scale; 219. Reinforcing frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] In order to make the technical means, creative features, achieved purposes and functions of the utility model easy to understand, the utility model will be further described below in conjunction with specific embodiments.

[0023] As Figures 1-3 shown, the plastic encapsulation device of the multi-layer stacked chip includes a workbench 1, and an adjusting and limiting component 2 is arranged on the top of the workbench 1;

[0024] The adjusting and limiting assembly 2 includes a support plate 201 arranged at the rear end in the middle of the top of the workbench 1. A dual-axis drive motor 202 is arranged on the top of the support plate 201. A first output shaft 203 is arranged on the right side of the dual-axis drive motor 202. A first telescopic shaft 205 is arranged on the right side of the first output shaft 203. A first locking block 207 is installed on the right side of the first telescopic shaft 205. A second output shaft 204 is arranged on the left side of the dual-axis drive motor 202. A second telescopic shaft 206 is arranged on the left side of the second output shaft 204. A second locking block 208 is installed on the left side of the second telescopic shaft 206. A first locking rod 209 is installed on the front of the first locking block 207. A second locking rod 210 is installed on the front of the second locking block 208. A first fixing plate 211 is installed on the front of the first locking rod 209. A second fixing plate 212 is installed on the front of the second locking rod 210. Limiting pads 213 are installed on the inner sides of the first fixing plate 211 and the second fixing plate 212. Adjusting grooves 214 are formed on the fronts of the first fixing plate 211 and the second fixing plate 212. Adjusting blocks 215 are installed on the inner walls of the two adjusting grooves 214. A limiting plate 216 is installed on the front of the two adjusting blocks 215. Limiting bolts 217 are installed at the four corners on the front of the two limiting plates 216. A scale 218 is installed in the middle of the front of the two limiting plates 216. Reinforcing frames 219 are installed on the tops of the first fixing plate 211 and the second fixing plate 212;

[0025] The support plate 201 is fixedly connected to the dual-axis drive motor 202. The dual-axis drive motor 202 is in transmission connection with the first telescopic shaft 205 and the second telescopic shaft 206 through the first output shaft 203 and the second output shaft 204 respectively; The first telescopic shaft 205 and the second telescopic shaft 206 are both in threaded connection with the first locking block 207 and the second locking block 208. The first locking block 207 is in threaded connection with the first locking rod 209; The second locking block 208 is in threaded connection with the second locking rod 210. The first locking rod 209 is in threaded connection with the first fixing plate 211. The second locking rod 210 is in threaded connection with the second fixing plate 212; The first fixing plate 211 and the second fixing plate 212 are both fixedly connected to the two reinforcing frames 219. The first fixing plate 211 and the second fixing plate 212 are both fixedly connected to the two limiting pads 213; The two adjusting blocks 215 are in contact with the inner walls of the adjusting grooves 214. The two adjusting blocks 215 are fixedly connected to the two scales 218. The two adjusting blocks 215 are fixedly connected to the two limiting plates 216. The two limiting plates 216 are both in threaded connection with the fronts of the first fixing plate 211 and the second fixing plate 212 through a plurality of limiting bolts 217;

[0026] Among them, the first output shaft 203 and the second output shaft 204 are arranged to drive the first telescopic shaft 205 and the second telescopic shaft 206 to expand and contract, so as to adjust the use angles of the first locking block 207 and the second locking block 208. The first locking rod 209 and the second locking rod 210 are arranged to facilitate the connection and installation of the first locking block 207 and the second locking block 208 with the first fixing plate 211 and the second fixing plate 212. The first fixing plate 211 and the second fixing plate 212 can guide and limit the multi-layer chips by means of the limiting pads 213 on the inner side. The two reinforcing frames 219 arranged can reinforce the use stability of the limiting pads 213. The adjusting block 215 moves up and down in the adjusting groove 214, and the two limiting plates 216 are installed on the left side surfaces of the first fixing plate 211 and the second fixing plate 212 by a plurality of limiting bolts 217, which is convenient for limiting the use of the two adjusting blocks 215. The two graduated scales 218 can measure the height of the multi-layer chips.

[0027] It should be noted that the present utility model is a plastic sealing device for multi-layer stacked chips. When in use, the chips to be plastic-sealed are placed in the middle of the top of the workbench 1. The double-shaft drive motor 202 drives the first output shaft 203 and the second output shaft 204 to drive the first telescopic shaft 205 and the second telescopic shaft 206 to expand and contract, so that the first locking block 207 and the second locking block 208 expand and contract left and right. Through the first locking rod 209 and the second locking rod 210, the first fixing plate 211 and the second fixing plate 212 are driven to expand and contract left and right, so as to limit and guide both sides of the chips, improving the use stability of plastic-sealing the chips. The two limiting pads 213 limit and guide the chips, and the two reinforcing frames 219 can support the stability of the two in use. The two graduated scales 218 can adjust the use height by the two adjusting blocks 215 moving up and down in the adjusting groove 214. The two limiting plates 216 are threadedly connected to the front surfaces of the first fixing plate 211 and the second fixing plate 212 by a plurality of limiting bolts 217, which can facilitate the adjustment of the use of the graduated scales 218 and measure the multi-layer chips.

[0028] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art of this industry should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. Plastic encapsulation device for multi-layer stacked chips, comprising a workbench (1), characterized in that: A regulating and limiting component (2) is provided on the top of the workbench (1); The regulating and limiting component (2) includes a support plate (201) arranged at the rear end of the middle part of the top of the workbench (1). A double-shaft drive motor (202) is provided on the top of the support plate (201). A first output shaft (203) is arranged on the right side of the double-shaft drive motor (202). A first telescopic shaft (205) is arranged on the right side of the first output shaft (203). A first locking block (207) is installed on the right side of the first telescopic shaft (205). A second output shaft (204) is arranged on the left side of the double-shaft drive motor (202). A second telescopic shaft (206) is arranged on the left side of the second output shaft (204). A second locking block (208) is installed on the left side of the second telescopic shaft (206). A first locking rod (209) is installed on the front of the first locking block (207). A second locking rod (210) is installed on the front of the second locking block (208). A first fixing plate (211) is installed on the front of the first locking rod (209). A second fixing plate (212) is installed on the front of the second locking rod (210). Limiting pads (213) are installed on the inner sides of the first fixing plate (211) and the second fixing plate (212). Adjusting grooves (214) are formed on the fronts of the first fixing plate (211) and the second fixing plate (212). Adjusting blocks (215) are installed on the inner walls of the two adjusting grooves (214). A limiting plate (216) is installed on the front of the two adjusting blocks (215). Limiting bolts (217) are installed at the four corners on the front of the two limiting plates (216). A scale (218) is installed in the middle of the front of the two limiting plates (216). Reinforcing frames (219) are installed on the tops of the first fixing plate (211) and the second fixing plate (212).

2. The plastic encapsulation device for the multi-layer stacked chip according to claim 1, wherein: The support plate (201) is fixedly connected to the double-shaft drive motor (202), and the double-shaft drive motor (202) is in transmission connection with the first telescopic shaft (205) and the second telescopic shaft (206) through the first output shaft (203) and the second output shaft (204) respectively.

3. The plastic encapsulation device for the multi-layer stacked chip according to claim 1, wherein: The first telescopic shaft (205) and the second telescopic shaft (206) are both in threaded connection with the first locking block (207) and the second locking block (208), and the first locking block (207) is in threaded connection with the first locking rod (209).

4. The plastic encapsulation device for the multi-layer stacked chip according to claim 1, characterized in that: The second locking block (208) is in threaded connection with the second locking rod (210), the first locking rod (209) is in threaded connection with the first fixing plate (211), and the second locking rod (210) is in threaded connection with the second fixing plate (212).

5. The plastic encapsulation device for the multi-layer stacked chip according to claim 1, wherein: The first fixing plate (211) and the second fixing plate (212) are both fixedly connected to the two reinforcing frames (219), and the first fixing plate (211) and the second fixing plate (212) are both fixedly connected to the two limiting pads (213).

6. The plastic encapsulation device for the multi-layer stacked chip according to claim 1, characterized in that: The two adjusting blocks (215) are in contact with the inner wall of the adjusting groove (214). The two adjusting blocks (215) are fixedly connected to the two scale rulers (218). The two adjusting blocks (215) are fixedly connected to the two limiting plates (216). Both of the two limiting plates (216) are threadedly connected to the front surfaces of the first fixing plate (211) and the second fixing plate (212) through a plurality of the limiting bolts (217).

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