Wafer transfer equipment

Abstract

The utility model provides wafer transfer equipment, which comprises a rotating platform provided with a mounting part; the bearing device comprises a bearing part for bearing a wafer; the storage device comprises a storage part for storing the wafer; the bottom of the bearing device and the bottom of the storage device are each provided with an adjusting mechanism, and the bearing device and the storage device are adjustably installed in the installation part through the adjusting mechanisms. The bearing device and the storage device of the wafer transfer equipment can be adjusted to any needed included angle in the horizontal direction, and the flexible included angle adjusting function enables the equipment to be seamlessly matched with a specific production process and fine process requirements, so that optimization of the layout of a production line is promoted, and the overall production efficiency is remarkably improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing process equipment manufacturing, and particularly relates to a wafer transfer device. Background Art

[0002] In the field of semiconductor manufacturing, the transfer and positioning of wafers are core links to ensure production efficiency and product quality. With the continuous development of semiconductor technology and the growing market demand for product diversification, traditional fixed membrane positioning devices have shown their deficiencies in adaptability. In the prior art, the designs of the carrier film and the target film are usually limited to relatively parallel configurations, lacking the ability to form any angle on the horizontal plane. This design limitation restricts the flexible adjustment of the wafer angle during the production process and is difficult to meet the requirements of the best positioning for specific processes. Due to the fixed angles of the carrier film and the target film, it is impossible to flexibly choose to place the wafer flat or vertically according to specific needs during the production process, which is particularly limited in complex processes that require multi-angle positioning. This limitation not only restricts the adaptability and flexibility of the production process but also may affect the potential of process innovation and product development. In addition, the fixed-angle configuration also affects the use effect of the picking device. When used in conjunction with the carrier film and the target film with fixed angles, the function of the picking device will be restricted, and the optimal wafer transfer path and positioning accuracy cannot be achieved. Summary of the Utility Model

[0003] To solve all or part of the above problems in the prior art, the utility model provides a wafer transfer device, which can flexibly adjust the relative angle between the carrying part and the storage part according to production requirements to adapt to changing production needs.

[0004] To achieve the above object, the utility model provides the following technical solutions:

[0005] A wafer transfer device includes: a rotating platform, on which an installation part is provided; a carrying device, including a carrying part for carrying wafers; a storage device, including a storage part for storing wafers; adjustment mechanisms are provided at the bottoms of the carrying device and the storage device, and the carrying device and the storage device are adjustably installed in the installation part through the adjustment mechanisms. The carrying device and the storage device of this wafer transfer device can be adjusted to any required angle in the horizontal direction. This flexible angle adjustment function enables the device to seamlessly match specific production processes and fine process requirements, thereby promoting the optimization of the production line layout and significantly improving the overall production efficiency.

[0006] The installation part is a circular groove formed in the rotating platform. The adjustment mechanism includes a guiding structure and a fixing structure. The guiding structure is placed in the circular groove and is in sliding fit with the circular groove. The fixing structure is detachably and fixedly connected to the rotating platform. The design of the circular groove provides a clear installation path for the loading device and the storage device, and simplifies the operation of the adjustment mechanism. Users can make precise adjustments through simple operations.

[0007] The guiding structure is at least one sliding bearing, and the sliding bearing slides smoothly in the circular groove. Bearings generally have a simple structure and low maintenance requirements, which makes the maintenance and servicing of the equipment easier and reduces the maintenance cost.

[0008] The fixing structure adopts a bolt fixing method. Mounting holes are provided on both sides of the bottom of the loading device and the storage device, and threaded holes are provided at corresponding positions on the rotating platform. The bolts pass through the mounting holes and are fixedly connected to the threaded holes in the circular groove. The bolt fixing method allows for the quick installation and disassembly of the loading device and the storage device, facilitating maintenance and upgrading.

[0009] The loading device further includes a first base, a first connecting part, and a first moving mechanism. The first connecting part is rotatably connected to the first base through at least one rotating shaft. A first locking mechanism for locking a specific angle of the first connecting part is provided at the end of the rotating shaft. The first moving mechanism is installed on the first connecting part, and the loading part is arranged on the first moving mechanism. The first connecting part is rotatably connected to the first base through the rotating shaft, enabling the loading device to be adjusted to different angles relative to the base to meet diverse wafer transfer and positioning requirements.

[0010] The first moving mechanism includes a first transverse movement part and a first lifting part. The first transverse movement part and the first lifting part drive the loading part to move horizontally and vertically through a driving motor. The combined use of the first transverse movement part and the first lifting part provides adjustment capabilities in multiple directions, enabling the loading part to flexibly reach the desired position.

[0011] The storage device further includes a second base, a second connecting part, and a second moving mechanism. The second connecting part is rotatably connected to the second base through at least one rotating shaft. A second locking mechanism for locking a specific angle of the second connecting part is provided at the end of the rotating shaft. The second moving mechanism is installed on the second connecting part, and the storage part is arranged on the second moving mechanism. The second connecting part is rotatably connected to the second base through the rotating shaft, enabling the storage device to be adjusted to different angles relative to the base to meet diverse wafer storage requirements.

[0012] The second moving mechanism includes a second transverse movement part and a second lifting part. The second transverse movement part and the second lifting part drive a motor to move the storage part horizontally and vertically. The coordinated operation of the second transverse movement part and the second lifting part provides the ability to adjust in multiple directions, enabling the storage part to flexibly reach different storage positions.

[0013] Marks or scales are provided at the edge of the circular groove; a shock absorption device is arranged at the bottom of the rotating platform. The marks or scales are designed to enable users to quickly and accurately adjust the positions and angles of the loading device and the storage device. The shock absorption device can ensure the stability of the equipment operation and avoid wafer damage or transfer errors caused by vibration.

[0014] It further includes a picking device, which is arranged at the center position of the circular groove and is located between the loading device and the storage device; the picking device includes a rotating mechanism and a picking and placing part connected thereto. The picking and placing part sucks the wafer on the loading device and rotates to the storage device for storage. The coordinated operation of the rotating mechanism and the picking and placing part enables the wafer to be accurately sucked from the loading device and transferred to the storage device.

[0015] The utility model has at least the following beneficial effects:

[0016] 1) Due to the flexibility of the equipment design, the loading device and the storage device can be adjusted to any required included angle in the horizontal direction. This innovative adjustment mechanism enables the equipment to perfectly adapt to diverse production processes and meet fine process requirements. In particular, the sliding fit design of the circular groove not only provides a smooth sliding path but also ensures the precise positioning of the loading device and the storage device during the adjustment process, thereby improving the accuracy and reliability of wafer transfer.

[0017] 2) The design of the rotating shaft, combined with the coordinated action of the transverse movement part and the lifting part in the first moving mechanism and the second moving mechanism, provides multi-dimensional adjustment capabilities for the precise transfer of wafers. This multi-axial adjustment mechanism enables the wafer to achieve more complex movement trajectories during the transfer process. Whether it is moving horizontally or lifting vertically, precise control can be achieved. Such a design significantly improves the flexibility and efficiency of wafer transfer, and at the same time ensures high adaptability and high success rate under different transfer requirements. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the specific embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 This is a schematic structural diagram of a wafer transfer device according to an embodiment of the present utility model.

[0020] Figure 2 Provided by an embodiment of the present utility model Figure 1 Schematic structural diagram of the storage device in

[0021] Reference numerals: 1 - rotating platform; 101 - mounting portion; 2 - carrying device; 201 - carrying portion; 202 - first base; 203 - first connecting portion; 204 - first locking mechanism; 3 - storage device; 301 - storage portion; 302 - second base; 303 - second connecting portion; 304 - second locking mechanism; 4 - guiding structure; 5 - fixing structure. Specific embodiments

[0022] Next, the technical solutions in the specific embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] The implementation of the present utility model will be described in detail below in conjunction with specific embodiments.

[0024] In an embodiment of the present utility model, with reference to Figure 1 , Figure 2 As shown, a wafer transfer device is provided, and its main components include: a rotating platform 1, a carrying device 2, and a storage device 3. It further includes a picking device located between the carrying device 2 and the storage device 3 for precisely picking and transferring wafers between the two. An installation portion 101 is provided on the rotating platform 1, providing a stable installation and positioning basis for the carrying device 2 and the storage device 3. The carrying device 2 includes a carrying portion 201 for carrying wafers, which can reliably place the wafers and ensure the stability of the wafers during the transfer process. The storage device 3 is provided with a storage portion 301 for storing wafers, used for storing the picked wafers for convenient management and subsequent operations. Among them, adjustment mechanisms are provided at the bottoms of the carrying device 2 and the storage device 3, which enable the carrying device 2 and the storage device 3 to be flexibly installed in the installation portion 101 of the rotating platform 1. Through these adjustment mechanisms, the positions and angles of the carrying device 2 and the storage device 3 can be finely adjusted to meet the specific requirements of various wafer transfer operations, thereby improving the flexibility and accuracy of the entire transfer process.

[0025] In this embodiment, a circular groove is specially designed on the rotating platform 1 as the mounting portion 101, which is specifically used to receive and guide the positioning and movement of the carrying device 2 and the storage device 3. The adjusting mechanism consists of two parts, including a guiding structure 4 and a fixing structure 5. The guiding structure 4 includes at least one sliding bearing, and these sliding bearings can smoothly slide within the circular groove to ensure the smoothness and accuracy of the movement of the carrying device 2 and the storage device 3 within the circular groove. The fixing structure 5 adopts a bolt fixing method to achieve a detachable fixed connection between the carrying device 2 and the storage device 3 and the rotating platform 1. Specifically, mounting holes are provided on both sides of the bottom of the carrying device 2 and the storage device 3, and threaded holes are provided at the corresponding positions on the rotating platform 1. The bolts pass through these mounting holes and cooperate with the threaded holes within the circular groove to complete the fixed installation.

[0026] The circular groove opened on the rotating platform 1 is not only used to guide the positioning and movement of the carrying device 2 and the storage device 3, but also specially provided with marks or scales at its edge. These marks or scales are used to indicate the rotation angle of the rotating platform 1, helping the operator accurately control the position and posture of the device to ensure the accuracy of wafer transfer. To reduce the influence of vibration during the operation on the wafer transfer accuracy, a shock absorption device is specially provided at the bottom of the rotating platform 1. This shock absorption device can effectively absorb and reduce the vibration caused by equipment operation or the external environment, improving the stability of the device and the accuracy of transfer.

[0027] The carrying device 2 further includes a first base 202, a first connecting portion 203, and a first moving mechanism. The first base 202 serves as the basic part of the carrying device 2, providing stable support for the entire device. The first connecting portion 203 is rotatably connected to the first base 202 through at least one rotating shaft, allowing the first connecting portion 203 to rotate relative to the first base 202 to achieve multi-angle positioning. The first locking mechanism 204 is provided at the end of the rotating shaft and is used to lock the first connecting portion 203 at a specific angle to ensure the stability and accuracy during wafer transfer. The first moving mechanism is installed on the first connecting portion 203 and is responsible for achieving the precise movement of the carrying portion 201. The first moving mechanism includes a first transverse movement portion and a first lifting portion. The first transverse movement portion is responsible for moving the carrying portion 201 in the horizontal direction, and the driving motor is used to position the carrying portion 201 on the transverse track. The first lifting portion is responsible for lifting and lowering the carrying portion 201 in the vertical direction, and the driving motor is used to position the carrying portion 201 on the longitudinal track. The carrying portion 201 is provided on the first moving mechanism and is used to actually carry the wafer. Through the coordinated action of the first transverse movement portion and the first lifting portion, the carrying portion 201 can accurately move and position in the horizontal and vertical directions to adapt to different transfer and operation requirements.

[0028] The storage device 3 further includes a second base 302, a second connection part 303, and a second moving mechanism. The second base 302 constitutes a stable support part of the storage device 3, providing a solid foundation for the entire storage device 3. The second connection part 303 is rotatably connected to the second base 302 through at least one rotating shaft, enabling the second connection part 303 to rotate relative to the second base 302 to achieve multi-angle adjustment and positioning. The second locking mechanism 304 is provided at the end of the rotating shaft for locking the second connection part 303 at a specific angle to ensure the stability and accuracy of the storage device 3 during operation. The second moving mechanism is installed on the second connection part 303 and is responsible for achieving the precise movement and positioning of the storage part 301. The second moving mechanism includes a second lateral movement part and a second lifting part. The second lateral movement part is responsible for moving the storage part 301 in the horizontal direction and positioning the storage part 301 on the lateral track through a driving motor. The second lifting part is responsible for lifting and lowering the storage part 301 in the vertical direction and positioning the storage part 301 on the longitudinal track through a driving motor. The storage part 301 is arranged on the second moving mechanism and is used for carrying and storing wafers. Through the coordinated actions of the second lateral movement part and the second lifting part, the storage part 301 can perform precise movement and positioning in the horizontal and vertical directions to meet different storage and retrieval requirements.

[0029] The picking device is installed at the center position of the circular groove of the rotating platform 1 and consists of a rotating mechanism and a picking and placing part. Such a layout allows the picking device to directly operate on any position within the circular groove, including the corresponding positions of the carrying device 2 and the storage device 3. The rotating mechanism enables the picking and placing part to rotate around the center of the circular groove to achieve precise positioning and access to wafers at different positions within the circular groove. The picking and placing part is a key component of the picking device and is responsible for performing the wafer sucking action. The picking and placing part precisely controls to suck the wafer from the carrying device 2 and, with the assistance of the rotating mechanism, transports the wafer to the storage device 3. Before transporting the wafer to the storage device 3, the picking and placing part will go through a series of detection processes to ensure the correctness and quality of the wafer. This may include detecting the size, shape, position, and functionality of the wafer. After being detected and confirmed to be correct, the picking and placing part transports the wafer to the storage device 3 for storage. This process may involve placing the wafer at a predetermined storage position for subsequent processing or use.

[0030] During the specific operation process of this wafer transfer device, the user first places the carrier device 2 and the storage device 3 in the circular groove according to the specific production requirements. Through the adjustment mechanism of the rotating platform 1, the user can precisely adjust the positions and angles of the carrier device 2 and the storage device 3 in the circular groove, ensuring that the carrier part 201 and the storage part 301 can be adjusted to any required included angle as needed, which is crucial for the precise transfer of wafers. Once adjusted to the ideal position and angle, the fixing structure 5 comes into play and firmly fixes the carrier device 2 and the storage device 3 on the rotating platform 1. This step ensures that during the wafer transfer and operation process, the device will not move accidentally, thus guaranteeing the safety of the operation and the integrity of the wafer. When the state of the carrier part 201 or the storage part 301 needs to be changed during the production process, the user can operate the corresponding locking mechanism to release the fixed state and then rotate the rotating shaft. In this way, the user can choose to place the carrier part 201 or the storage part 301 flat or vertically according to the needs to adapt to different operation requirements, such as in different processing steps or inspection processes. The entire operation process is designed to be simple and fast, enabling the user to flexibly adjust the device according to the specific production requirements, ensuring high efficiency and high precision in wafer transfer and positioning. This flexibility and simplicity greatly improve the efficiency of the production process, while also reducing the complexity of the operation, making the device more user-friendly and suitable for various semiconductor production environments.

[0031] The wafer transfer device of the present utility model is designed specifically to meet the requirements for high-precision and high-efficiency wafer transfer in semiconductor production. It is particularly suitable for operation scenarios where the carrier part 201 and the storage part 301 need to be adjusted to specific positions and angles due to process requirements, such as precise positioning, picking up, placing, and transferring of wafers. The design of the device allows for quick adjustment and fixation of the positions and angles of the carrier device 2 and the storage device 3, reducing the setup time during the production process and thus improving the overall production efficiency.

[0032] In summary, the wafer transfer device of the present utility model can not only improve production efficiency and product quality but also reduce operation time and production costs, providing a more efficient and reliable solution for semiconductor production.

[0033] It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present utility model, several improvements and modifications can still be made to the present utility model, and these improvements and modifications also fall within the scope protected by the claims of the present utility model.

Claims

1. A wafer transfer device, characterized in that, Comprising: A rotating platform (1) provided with a mounting portion (101) thereon; A carrying device (2) including a carrying portion (201) for carrying wafers; A storage device (3) including a storage portion (301) for storing wafers; Adjusting mechanisms are provided at the bottoms of the carrying device (2) and the storage device (3), and the carrying device (2) and the storage device (3) are adjustably mounted in the mounting portion (101) through the adjusting mechanisms.

2. The device according to claim 1, characterized in that, The mounting portion (101) is a circular groove formed in the rotating platform (1), the adjusting mechanism includes a guiding structure (4) and a fixing structure (5), the guiding structure (4) is placed in the circular groove and is in sliding fit with the circular groove, and the fixing structure (5) is detachably and fixedly connected to the rotating platform (1).

3. The device according to claim 2, characterized in that, The guiding structure (4) includes at least one sliding bearing, and the sliding bearing slides smoothly in the circular groove.

4. The device according to claim 2, wherein The fixing structure (5) adopts a bolt fixing method. Mounting holes are provided on both sides of the bottom of the carrying device (2) and the storage device (3), and threaded holes are provided at corresponding positions on the rotating platform (1). The bolts pass through the mounting holes and are fixedly connected to the threaded holes of the circular groove.

5. The device according to claim 1, characterized in that, The carrying device (2) further includes a first base (202), a first connecting portion (203) and a first moving mechanism. The first connecting portion (203) is rotatably connected to the first base (202) through at least one rotating shaft. A first locking mechanism (204) for locking a specific angle of the first connecting portion (203) is provided at the end of the rotating shaft. The first moving mechanism is mounted on the first connecting portion (203), and the carrying portion (201) is provided on the first moving mechanism.

6. The device according to claim 5, wherein, The first moving mechanism includes a first transverse movement portion and a first lifting portion. The first transverse movement portion and the first lifting portion move the carrying portion (201) horizontally and vertically through a driving motor.

7. The device according to claim 1, characterized in that, The storage device (3) further includes a second base (302), a second connecting portion (303) and a second moving mechanism. The second connecting portion (303) is rotatably connected to the second base (302) through at least one rotating shaft. A second locking mechanism (304) for locking a specific angle of the second connecting portion (303) is provided at the end of the rotating shaft. The second moving mechanism is mounted on the second connecting portion (303), and the storage portion (301) is provided on the second moving mechanism.

8. The device according to claim 7, characterized in that, The second moving mechanism includes a second transverse movement portion and a second lifting portion. The second transverse movement portion and the second lifting portion move the storage portion (301) horizontally and vertically through a driving motor.

9. The device according to claim 2, characterized in that, Marks or scales are provided at the edge of the circular groove; a shock absorption device is provided at the bottom of the rotating platform (1).

10. The device according to claim 2, characterized in that, It further includes a picking device, which is arranged at the central position of the circular groove and is located between the carrying device (2) and the storage device (3); the picking device includes a rotating mechanism and a picking and placing part which are connected, and the picking and placing part sucks the wafer on the carrying device (2) and rotates to the storage device (3) for storage.

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