Pressing structure for assisting warped wafer adsorption and integrated circuit test equipment
By using a combined structure of bracket, pressing plate and planarity adjustment parts in integrated circuit testing equipment, the problem of warped wafers requiring adapter plates in test equipment is solved, and the overall adsorption and cost reduction of wafers are achieved.
Patent Information
- Application Number
- CN202422158655.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-03
AI Technical Summary
Existing integrated circuit testing equipment needs to install additional adapter plates when dealing with warped wafers, resulting in complex structure, large space and high cost problems.
The pressing structure that assists the adsorption of warping wafers is adopted, including a bracket, a pressing plate and a planarity adjuster. By flattening the warping wafer with the pressing plate and the slide table, the adapter plate is cancelled, and the movement of the robot and the slide table is used to achieve full adsorption of the wafer.
The comprehensive adsorption of wafers is achieved, and the uneven phenomenon caused by warping is avoided. It has a simple structure, low cost and good applicability.
Smart Images
Figure CN223140750U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit testing equipment, in particular to a pressing structure for assisting in adsorbing warped wafers and an integrated circuit testing equipment. Background Art
[0002] In the prior art, when integrated circuit testing equipment such as a probe station and an AOI device detect warped wafers, a transfer plate structure is usually required to flatten the warped wafers to assist in adsorption. The specific steps are as follows:
[0003] 1. A manipulator transports the wafer below the transfer plate;
[0004] 2. The Bernoulli transfer plate adsorbs and flattens the warped wafer;
[0005] 3. The wafer stage moves below the transfer plate to pick up and adsorb the warped wafer.
[0006] However, the above method requires an additional transfer plate. The transfer plate occupies a large space and has a complex structure, increasing the wafer transfer cost. Content of the Utility Model
[0007] The purpose of the utility model is to provide a pressing structure for assisting in adsorbing warped wafers and an integrated circuit testing equipment, which do not require a transfer plate. The pressing plate can assist the wafer stage to adsorb the wafer comprehensively, avoid the phenomenon of uneven wafer adsorption caused by wafer warping, and has a simple structure and low cost.
[0008] To achieve the above purpose, the utility model provides the following technical solutions:
[0009] In a first aspect, the utility model provides a pressing structure for assisting in adsorbing warped wafers, including a bracket, a pressing plate, and a flatness adjusting member. The pressing plate is used to be arranged above the wafer stage of the integrated circuit testing equipment and can cooperate with the wafer stage to press the wafer placed above the wafer stage. The pressing plate is connected to the bracket. The flatness adjusting member is clamped between the pressing plate and the bracket, and an anti-scratch layer is provided on the side of the pressing plate facing away from the bracket.
[0010] Further, the pressing structure further includes a heat insulation member corresponding to the flatness adjusting member one by one, and the heat insulation member is clamped between the pressing plate and the flatness adjusting member.
[0011] Further, the bracket is provided with an image acquisition member for acquiring wafer images. The image acquisition member is arranged on the side of the pressing plate facing away from the wafer stage and is disposed opposite to the pressing plate.
[0012] Further, the pressing plate is connected to the bracket through a connecting member, and the connecting member sequentially penetrates through the pressing plate, the heat insulation member, and the flatness adjusting member and is inserted into the bracket.
[0013] Further, the heat insulation member, the flatness adjusting member, and the connecting member are all configured in multiple numbers. The heat insulation member and the flatness adjusting member are arranged in one-to-one correspondence in the vertical direction to form a plurality of gasket assemblies. Each connecting member penetrates through the pressing plate and sequentially penetrates through each gasket assembly and is inserted into the bracket.
[0014] Further, a plurality of the gasket assemblies are all arranged close to the edge of the pressing plate, and the plurality of gasket assemblies are spaced apart.
[0015] Further, a through groove is formed on the side of the pressing plate facing away from the bracket. The connecting member penetrates through the through groove, and the end face of the connecting member away from the bracket is received in the through groove.
[0016] Further, the pressing structure further includes a fastening member. The fastening member extends into the bracket from the side of the bracket and abuts against the side surface of the connecting member to limit the position of the connecting member relative to the bracket.
[0017] Further, the extending direction of the fastening member is perpendicular to the extending direction of the connecting member.
[0018] In a second aspect, the present utility model further provides an integrated circuit testing device, including a wafer stage and the pressing structure for assisting in adsorbing a warped wafer as described in the above solution. The wafer stage is located below the pressing plate, and the wafer stage can move relative to the pressing plate in the horizontal direction and the vertical direction so that the pressing plate can press the wafer placed above the wafer stage.
[0019] The pressing structure for assisting in adsorbing a warped wafer and the integrated circuit testing device provided by the present utility model can produce the following beneficial effects:
[0020] Before use, the pressing structure for assisting in adsorbing a warped wafer provided by the present utility model can adjust the flatness of the pressing plate through the flatness adjusting member. Subsequently, during use, a manipulator is used to transport the wafer to the suction cup of the wafer stage. At this time, the edge of the wafer may warp and leak air, forming a semi-adsorbed state. The wafer stage can move the wafer to below the pressing plate and then lift the wafer, and the pressing plate is used to press the wafer to assist in adsorbing the wafer, and the anti-scratch layer can prevent the pressing plate from scratching the wafer.
[0021] Compared with the prior art, the pressing structure for assisting in the adsorption of warped wafers provided in the first aspect of the present utility model does not require a transfer plate. The pressing plate cooperates with the wafer stage to flatten the wafer placed on the wafer stage, thereby achieving the full adsorption of the wafer, avoiding the problem of uneven wafer adsorption caused by wafer warping, and having a simple structure and low cost.
[0022] Compared with the prior art, the integrated circuit testing equipment provided in the second aspect of the present utility model cancels the setting of the transfer plate. By moving the wafer stage, the warped wafer is flattened by cooperating with the pressing plate above it, so as to achieve the full adsorption of the wafer by the wafer stage, with a simple structure, low cost, and good applicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0024] Figure 1 It is a three-dimensional structure diagram of the pressing structure for assisting in the adsorption of warped wafers provided in the embodiment of the present utility model;
[0025] Figure 2 It is a three-dimensional structure diagram of the pressing plate in the first perspective provided in the embodiment of the present utility model;
[0026] Figure 3 It is a three-dimensional structure diagram of the pressing plate in the second perspective provided in the embodiment of the present utility model;
[0027] Figure 4 It is a front view of the pressing structure for assisting in the adsorption of warped wafers (without an image acquisition member) provided in the embodiment of the present utility model;
[0028] Figure 5 For Figure 4 the A - A cross-sectional view;
[0029] Figure 6 For Figure 5 the enlarged view at B;
[0030] Reference numerals: 1 - bracket; 2 - pressing plate; 21 - through groove; 3 - flatness adjusting member; 4 - heat insulation member; 5 - connecting member; 6 - fastening member; 7 - image acquisition member. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0031] The technical solution of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0032] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0033] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0034] The following will describe in detail the specific implementation manners of the present utility model in conjunction with the accompanying drawings. It should be understood that the specific implementation manners described herein are only used to illustrate and explain the present utility model, and are not used to limit the present utility model.
[0035] An embodiment of the first aspect of the present utility model is to provide a pressing structure for assisting in warping and adsorbing a wafer, as Figures 1 to 6 shown, including a bracket 1, a pressing plate 2, and a flatness adjusting member 3. The pressing plate 2 is used to be arranged above the wafer stage of the integrated circuit testing equipment and can cooperate with the wafer stage to press the wafer placed above the wafer stage; the pressing plate 2 is connected to the bracket 1, the flatness adjusting member 3 is clamped between the pressing plate 2 and the bracket 1, and an anti-scratch layer is provided on the side of the pressing plate 2 facing away from the bracket 1.
[0036] Before use, the flatness of the pressing plate 2 can be adjusted by the flatness adjusting member 3 so that the pressing plate 2 is parallel to the surface of the wafer stage for carrying the wafer. Subsequently, during use, a manipulator is used to transfer the wafer to the suction cup of the wafer stage. At this time, the edge of the wafer may warp and leak air, resulting in a semi-adsorbed state. The wafer stage can move the wafer to the lower side of the pressing plate 2 and then lift the wafer, and use the pressing plate 2 to press the wafer to flatten the wafer, thereby achieving the effect of auxiliary adsorption. The anti-scratch layer on the pressing plate 2 can prevent the pressing plate 2 from scratching the wafer.
[0037] Compared with the prior art, the pressing structure for auxiliary adsorption of warped wafers provided in the above embodiment does not require a transfer plate. The pressing plate 2 cooperates with the wafer stage to flatten the wafer placed on the wafer stage, thereby achieving full adsorption of the wafer and avoiding the problem of wafer unevenness caused by wafer warping. The structure is simple, the cost is low, and the applicable range is relatively large.
[0038] Among them, optionally, as Figure 2 and Figure 3 shown, the pressing plate 2 can be made of heat-insulating sheet metal. The bottom surface of the pressing plate 2 facing away from the bracket 1 is the surface for extruding the wafer, and the flatness adjusting member 3 can be made of a rubber gasket.
[0039] It should be noted that adjusting the flatness of the pressing plate 2 can be regarded as adjusting the flatness of the bottom surface of the pressing plate 2 facing away from the bracket 1.
[0040] When adjusting the flatness of the pressing plate 2, it can be achieved by controlling the pressing force of the pressing plate 2 on each part of the rubber gasket. At the place where the pressing force of the pressing plate 2 is greater, the height of this part of the pressing plate is higher. At the place where the pressing force of the pressing plate 2 is smaller, the height of this part of the pressing plate is lower. Furthermore, the flatness of the pressing plate 2 is adjusted, so that when the wafer presses the pressing plate 2, the wafer is more evenly stressed, better assisting the wafer stage to fully adsorb the wafer, and the wafer is adsorbed flat.
[0041] In addition, optionally, the anti-scratch layer can be made of anti-static Teflon tape, and the anti-scratch layer is directly attached to the side of the pressing plate 2 facing away from the bracket 1, which is convenient for the setting of the anti-scratch layer.
[0042] In an alternative embodiment, as Figure 6 shown, the pressing structure further includes a heat-insulating member 4, and the heat-insulating member 4 is clamped between the pressing plate 2 and the flatness adjusting member 3.
[0043] As Figure 1 shown, the bracket 1 is provided with an image acquisition member 7 for acquiring the image of the wafer. The image acquisition member 7 is arranged on the side of the pressing plate facing away from the wafer stage and is disposed opposite to the pressing plate.
[0044] In the above-described embodiment, during use, when the image acquisition member 7 operates, heat is generated and transferred to the pressing plate 2. The arrangement of the heat insulation member 4 can reduce the transfer of heat from the pressing plate 2 to the flatness adjustment member 3, and reduce the influence caused by the heat conduction of the pressing plate 2 on the flatness adjustment member 3.
[0045] The material of the heat insulation member 4 can be, but is not limited to, a resin material. The resin material has the properties of high temperature resistance and heat insulation, and can effectively reduce the transfer of heat to the bracket 1.
[0046] In an alternative embodiment, as Figure 6 shown, the pressing plate 2 is connected to the bracket 1 through a connecting member 5. The connecting member 5 sequentially passes through the pressing plate 2, the heat insulation member 4, and the flatness adjustment member 3 and is inserted into the bracket 1.
[0047] In the above-described embodiment, the connecting member 5 can not only connect the pressing plate 2 and the bracket 1, but also limit and fix the heat insulation member 4 and the flatness adjustment member 3, making the pressing structure for assisting in warped wafer adsorption simpler, without the need to additionally provide a limiting member to ensure that the heat insulation member 4 and the flatness adjustment member 3 are stably clamped between the pressing plate 2 and the bracket 1.
[0048] Among them, the connecting member 5 can be a screw, a pin, etc., which is convenient for the user to operate.
[0049] In an alternative embodiment, as Figure 2 shown, the heat insulation member 4, the flatness adjustment member 3, and the connecting member 5 are all configured in multiple numbers. The heat insulation member 4 and the flatness adjustment member 3 are arranged in one-to-one correspondence in the vertical direction and form multiple gasket assemblies. Each connecting member 5 passes through the pressing plate 2 and sequentially passes through each gasket assembly and is inserted into the bracket 1.
[0050] In the above-described embodiment, the connecting member 5 can ensure the stability of the position of each gasket assembly relative to the bracket 1. Since the gasket assemblies are configured in multiple numbers, when the flatness of the pressing plate 2 needs to be adjusted, the user can achieve this by adjusting the depth of each connecting member 5 extending into the bracket 1.
[0051] In an alternative embodiment, as Figure 2 shown, multiple gasket assemblies are all arranged close to the edge of the pressing plate 2, and the multiple gasket assemblies are spaced apart.
[0052] The fact that multiple gasket assemblies are all arranged close to the edge of the pressing plate 2 can prevent a large change in the levelness of the bracket 1 when the connecting member 5 extends into the bracket 1 by a small depth, and is convenient for the user to more precisely adjust the levelness of the pressing plate 2.
[0053] As Figure 2 shown, when the shape of the pressing plate 2 is approximately rectangular, the gasket assemblies are configured in four numbers, and the four gasket groups are respectively arranged close to the four corners of the pressing plate 2.
[0054] In an alternative embodiment, as Figure 3 shown, a through groove 21 is formed on the side of the pressing plate 2 facing away from the bracket 1, the connecting member 5 passes through the through groove 21, and the end face of the connecting member 5 facing away from the bracket 1 is received in the through groove 21.
[0055] The above setting can prevent the end face of the connecting member 5 facing away from the bracket 1 from obstructing the wafer when the wafer abuts against the side of the pressing plate 2 facing away from the bracket 1.
[0056] It should be noted that the shape of the through groove 21 can be adapted to the shape of the end of the connecting member 5 facing away from the bracket 1.
[0057] In an alternative embodiment, as Figure 6 shown, the pressing structure further includes a fastener 6, the fastener 6 extends into the bracket 1 from the side of the bracket 1 and abuts against the side surface of the connecting member 5 to limit the position of the connecting member 5 relative to the bracket 1.
[0058] The above setting of the fastener 6 can largely prevent the connecting member 5 from loosening, thereby ensuring the connection stability and flatness of the pressing plate 2.
[0059] Specifically, the fastener 6 can be but is not limited to a screw.
[0060] During use, after the flatness adjusting member 3 is compressed to a suitable thickness by the connecting member 5, the fastener 6 is screwed into the bracket 1 so that the fastener 6 abuts against the side surface of the connecting member 5, thereby limiting the position of the connecting member 5 relative to the bracket 1.
[0061] In an alternative embodiment, as Figure 6 shown, the extending direction of the fastener 6 is perpendicular to the extending direction of the connecting member 5, that is, a squeezing force is applied to the connecting member 5 along the radial direction of the connecting member 5, thereby restricting the loosening of the connecting member 5.
[0062] An embodiment of the second aspect of the present invention is to provide an integrated circuit testing device. The integrated circuit testing device provided by the embodiment of the second aspect of the present invention includes the above pressing structure for assisting in warping and adsorbing a wafer.
[0063] The integrated circuit testing device provided by the second aspect of the present invention has the pressing structure for assisting in warping and adsorbing a wafer provided by the embodiment of the first aspect of the present invention, and thus has all the beneficial effects of the pressing structure for assisting in warping and adsorbing a wafer provided by the embodiment of the first aspect of the present invention.
[0064] In an alternative embodiment, the integrated circuit testing device further includes a wafer stage, the wafer stage is located below the pressing plate 2, and the wafer stage can move relative to the pressing plate 2 in the horizontal direction and the vertical direction so that the pressing plate 2 can press the wafer placed above the wafer stage.
[0065] During use, the manipulator transports the wafer to the suction cup of the wafer stage. At this time, the edge of the wafer may warp and leak air, resulting in a semi-adsorbed state. The wafer stage can first move horizontally with the wafer to the lower part of the pressing plate, and then move vertically to lift the wafer. The pressing plate 2 is used to press the wafer to adjust the flatness of the wafer, facilitating the full adsorption of the wafer.
[0066] It should be noted that there are various structures capable of realizing the horizontal movement of the wafer stage, and there are also various structures capable of realizing the vertical movement of the wafer stage. For example, mechanisms that perform linear motion such as air cylinders, hydraulic cylinders, and linear motors. The fixed end of the vertical movement structure can be installed at the movable end of the horizontal movement structure. The horizontal movement structure drives the vertical movement structure to move horizontally, and the movable end of the vertical movement structure drives the suction cup of the wafer stage to move up and down in the vertical direction.
[0067] The above-mentioned structure capable of realizing the horizontal movement of the wafer stage can only realize the X-direction movement or the Y-direction movement on the horizontal plane; it can also realize both the X-direction movement and the Y-direction movement. At this time, the structure can include two mechanisms that perform linear motion.
[0068] Of course, it is also possible to install the fixed end of the horizontal movement structure at the movable end of the vertical movement structure. The vertical movement structure drives the horizontal movement structure to move vertically, and the movable end of the horizontal movement structure drives the suction cup of the wafer stage to move horizontally.
[0069] In summary, there are various structures capable of realizing the movement of the suction cup on the wafer stage in the horizontal and vertical directions. For the sake of brevity, no further examples will be given here.
[0070] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An auxiliary pressing structure for warped wafer adsorption, characterized in that It includes a bracket (1), a pressing plate (2) and a flatness adjusting member (3). The pressing plate (2) is used to be arranged above the wafer stage of the integrated circuit testing equipment and can cooperate with the wafer stage to press the wafer placed above the wafer stage. The pressing plate (2) is connected to the bracket (1). The flatness adjusting member (3) is clamped between the pressing plate (2) and the bracket (1), and an anti-scratch layer is provided on the side of the pressing plate (2) facing away from the bracket (1).
2. The pressing structure according to claim 1, wherein The pressing structure further includes heat insulation members (4) provided in one-to-one correspondence with the flatness adjusting members (3). The heat insulation members (4) are clamped between the pressing plate (2) and the flatness adjusting members (3).
3. The pressing structure according to claim 2, wherein, The bracket (1) is equipped with an image acquisition member (7) for acquiring the image of the wafer. The image acquisition member (7) is arranged on the side of the pressing plate (2) facing away from the wafer stage and is disposed opposite to the pressing plate (2).
4. The pressing structure according to claim 2, wherein The pressing plate (2) is connected to the bracket (1) through a connecting member (5). The connecting member (5) sequentially penetrates through the pressing plate (2), the heat insulation member (4) and the flatness adjusting member (3) and is inserted into the bracket (1).
5. The pressing structure according to claim 4, wherein The heat insulation members (4), the flatness adjusting members (3) and the connecting members (5) are all configured in multiple numbers. The heat insulation members (4) and the flatness adjusting members (3) are arranged in one-to-one correspondence in the vertical direction to form multiple gasket assemblies. Each connecting member (5) penetrates through the pressing plate (2) and sequentially penetrates through each gasket assembly and then is inserted into the bracket (1).
6. The pressing structure according to claim 5, wherein, Multiple gasket assemblies are all arranged close to the edge of the pressing plate (2), and the multiple gasket assemblies are spaced apart.
7. The pressing structure according to claim 4, wherein, A through groove (21) is formed on the side of the pressing plate (2) facing away from the bracket (1). The connecting member (5) penetrates through the through groove (21), and the end face of the connecting member (5) facing away from the bracket (1) is received in the through groove (21).
8. The pressing structure according to any one of claims 4-7, characterized in that, The pressing structure further includes a fastening member (6). The fastening member (6) extends into the bracket (1) from the side of the bracket (1) and abuts against the side face of the connecting member (5) to limit the position of the connecting member (5) relative to the bracket (1).
9. The pressing structure according to claim 8, wherein, The extending direction of the fastening member (6) is perpendicular to the extending direction of the connecting member (5).
10. An integrated circuit testing device, characterized in that, It includes a wafer stage and the pressing structure according to any one of claims 1-9. The wafer stage is located below the pressing plate (2). The wafer stage can move relative to the pressing plate (2) in the horizontal direction and the vertical direction so that the pressing plate (2) can press the wafer placed above the wafer stage.