Wafer clamping device of ion implanter and ion implanter

Abstract

The utility model relates to a wafer clamping device of an ion implanter and the ion implanter. Comprising a clamping moving part which is located on the periphery of a to-be-processed wafer and can move relative to a first direction; the first direction is the radial direction of the wafer to be processed; the clamping piece base is fixed on the clamping moving piece and can move along with the movement of the clamping moving piece; the clamping contact piece is configured to abut against the outer edge of the to-be-processed wafer in the radial direction of the to-be-processed wafer; the clamping contact piece comprises a fixing part and a clamping part which are fixed with each other, the fixing part is inserted into the clamping piece base along a second direction, and the clamping piece base is provided with a mounting hole matched with the fixing part; the clamping part protrudes out of the clamping piece base in the second direction, and the clamping part is provided with at least one circle of circular clamping ring in the first direction; the second direction is the axial direction of the wafer to be processed. According to the technical scheme, the production cost can be reduced, and the wafer processing quality can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and particularly to a wafer clamping device and an ion implanter for an ion implanter. Background Art

[0002] In semiconductor manufacturing, a large number of doping processes are required to obtain different electrical properties in various regions of the semiconductor and form various electronic components. The most commonly used doping process is ion implantation, which needs to be implemented in a dedicated ion implanter. In an ion implanter, a doped workpiece, such as a wafer, needs to be fixed by a clamping device and then ion implantation is carried out. The clamping device may include a gripper and a guide. The design and manufacturing quality of the components in the clamping device directly affect the yield of the wafer and the production cost.

[0003] However, in the prior art, there are some inherent problems in the design and use of these components. The wear rate of the clamping device is relatively fast and the service life is relatively short. This not only increases the production cost, but also increases the workload of maintenance. Frequent maintenance and replacement not only affect the production efficiency, but also may pose potential risks to the wafer processing process. Summary of the Utility Model

[0004] In view of this, the present application provides a wafer clamping device and an ion implanter for an ion implanter to solve at least one problem in the background art.

[0005] To achieve the above object, the technical solution of the present application is realized as follows:

[0006] In a first aspect, an embodiment of the present application provides a wafer clamping device for an ion implanter, including a plurality of clamping components circumferentially distributed around a wafer to be processed for clamping the wafer to be processed. The clamping component includes:

[0007] A clamping moving member located on the outer periphery of the wafer to be processed and capable of moving relative to a first direction; the first direction is the radial direction of the wafer to be processed;

[0008] A clamping member base fixed on the clamping moving member and capable of moving following the movement of the clamping moving member;

[0009] The clamping contact is configured to radially abut against the outer edge of the wafer to be processed; the clamping contact includes a fixed part and a clamping part that are fixedly connected to each other. The fixed part is inserted into the clamping part base along the second direction, and the clamping part base is provided with a mounting hole adapted to the fixed part; the clamping part protrudes from the clamping part base in the second direction, and at least one circular clamping ring is arranged on the clamping part in the first direction; the second direction is the axial direction of the wafer to be processed.

[0010] Optionally, the cross-sectional area of the clamping part in the first direction is larger than the aperture of the mounting hole, and a gap of 0.6 mm - 3 mm is preset between the bottom end surface of the clamping part and the top end surface of the clamping part base.

[0011] Optionally, the clamping contact is made of silicon carbide.

[0012] Optionally, the clamping part includes a body and the clamping ring, and the clamping ring protrudes from the outer surface of the body in the first direction of the body.

[0013] Optionally, the fixed part is a cylinder, and the mounting hole is a cylindrical hole.

[0014] Optionally, the shape of the clamping moving part is cylindrical, and the axis direction is the second direction.

[0015] Optionally, the clamping moving part can move in the first direction and / or the second direction so that the clamping contact contacts the wafer to be processed.

[0016] Optionally, the clamping part base is detachably fixed to the clamping moving part by screws; the clamping part base is sleeved on the clamping moving part from the second direction, the clamping moving part is provided with a threaded hole in the first direction, and the clamping part base is provided with a through hole in the first direction. The screw passes through the through hole and is screwed into the threaded hole to fix the clamping part base to the clamping moving part.

[0017] Optionally, the wafer clamping device of the ion implanter includes three clamping components, which are evenly arranged in the circumferential direction of the wafer to be processed.

[0018] In a second aspect, an embodiment of the present application provides an ion implanter, including the wafer clamping device of any one of the above ion implanters.

[0019] The wafer clamping device and ion implanter provided by the embodiment of the present application include: a clamping moving member located on the outer periphery of the wafer to be processed and capable of moving relative to a first direction; the first direction is the radial direction of the wafer to be processed; a clamping member base fixed on the clamping moving member and capable of moving following the movement of the clamping moving member; a clamping contact member configured to abut against the outer edge of the wafer to be processed from the radial direction of the wafer to be processed; the clamping contact member includes a fixed part and a clamping part fixed to each other, the fixed part is inserted into the clamping member base along a second direction, and the clamping member base is provided with a mounting hole adapted to the fixed part; the clamping part protrudes from the clamping member base in the second direction, and at least one circular clamping ring is arranged on the clamping part in the first direction; the second direction is the axial direction of the wafer to be processed. It can be seen that in the wafer clamping device and ion implanter of the embodiment of the present application, at least one circular clamping ring is arranged on the clamping part in the first direction to reduce the contact area with the wafer to be processed, that is, to reduce the wear of the wafer and the clamping part; in addition, the clamping contact member can rotate around the axis of the mounting hole relative to the fixed part according to the wear condition of the clamping ring to adjust the contact surface with the wafer to be processed, reduce the wear of the clamping part, reduce the workload of maintenance, reduce the production cost and improve the wafer processing quality. Therefore, the wafer clamping device and ion implanter of the embodiment of the present application can reduce the production cost and improve the wafer processing quality.

[0020] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0021] The drawings described herein are used to provide a further understanding of the present application, constitute a part of the present application, and the schematic embodiments and descriptions thereof are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0022] Figure 1 It is a schematic diagram of the wafer clamping device of the ion implanter provided by the embodiment of the present application;

[0023] Figure 2 is Figure 1 a schematic diagram of the projection in the top view direction;

[0024] Figure 3 It is a schematic diagram of the wafer clamping device of the ion implanter provided by the embodiment of the present application clamping the wafer.

[0025] Description of the Reference Numerals:

[0026] 10. Clamping assembly; 11. Clamping moving part; 12. Clamping part base; 13. Clamping contact part; 131. Fixed part; 132. Clamping part; 1321. Clamping ring; 14. Screw; 20. Wafer to be processed. Detailed implementation manners

[0027] To make the technical solutions and beneficial effects of this application more obvious and understandable, the following provides a detailed description by listing specific embodiments. Among them, the drawings are not necessarily drawn to scale, and local features can be enlarged or reduced to more clearly show the details of local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0028] In the description of this application, the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of simplifying the description of this application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, that is, it cannot be understood as a limitation to this application.

[0029] In this application, the terms "first" and "second" are only used for the purpose of clear description, and cannot be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined with "first" and "second" can clearly include at least one of such features. In the description of this application, "a plurality of" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc.; unless otherwise clearly and specifically defined.

[0030] In this application, unless otherwise clearly defined, terms such as "installation", "connection", "connection", "fixation", "setting", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can also be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0031] In this application, unless otherwise clearly defined, when a first feature is "on", "above", "over" or "upon" a second feature, or "under", "below", or "beneath" a second feature, it may be that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact through an intermediate medium. Moreover, when a first feature is "above", "over" or "upon" a second feature, it may be that the first feature is directly above or obliquely above the second feature, or it may simply indicate that the horizontal height of the first feature is higher than that of the second feature. When a first feature is "under", "below" or "beneath" a second feature, it may be that the first feature is directly below or obliquely below the second feature, or it may simply indicate that the horizontal height of the first feature is lower than that of the second feature.

[0032] To thoroughly understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. The preferred embodiments of this application are described in detail below. However, in addition to these detailed descriptions, this application may also have other implementation manners.

[0033] The inventors of this application found the following technical problems in the research and development of the wafer clamping device of the ion implanter:

[0034] First, the frequent contact and relative movement between the clamping contact member 13 and the wafer 20 to be processed will cause rapid wear of the clamping contact member 13. In the existing design, the contact surface between the clamping contact member 13 and the wafer 20 to be processed is only provided with a semi-circle in the circumferential direction, and the contact area is relatively large. Usually, it can only be used for one production cycle (about one month), which means that the clamping contact member 13 needs to be replaced frequently. This not only increases the production cost, but also increases the workload of PM (preventive maintenance) and maintenance. Frequent maintenance and replacement not only affect the production efficiency, but also may pose potential risks to the processing process of the wafer 20 to be processed.

[0035] Secondly, the small design gap between the clamping base 12 and the clamping contact member 13 in the wafer axial direction is a common problem. Due to the too small gap, obvious friction will occur between the clamping base 12 and the clamping contact member 13 during the working process, and then tiny particles will be generated. These tiny particles will adhere to the surface of the wafer 20 to be processed, seriously affecting the yield of the wafer 20 to be processed. Although the particle contamination can be reduced by increasing the cleaning steps, this undoubtedly increases the production cost and time cost.

[0036] In addition, the material of the clamping contact member 13 is also a key factor leading to the problem. Currently, the clamping contact member 13 usually adopts a structure in which a silicon carbide coating is bonded outside a graphite body. Although this structure has certain wear resistance and hardness, the different materials are only bonded by physical action, resulting in the easy falling off of the silicon carbide coating. Once the silicon carbide coating falls off, it will contaminate the wafer 20 to be processed, further affecting the yield of the wafer 20 to be processed.

[0037] In summary, the above technical problems in the prior art not only increase the production cost, but also seriously affect the yield of the wafer 20 to be processed. Therefore, it is necessary to improve and optimize these components to improve the efficiency and yield of the semiconductor manufacturing process.

[0038] Therefore, through further research and development by the inventor, the following technical solution is proposed.

[0039] In view of the technical problems in the related art, an embodiment of the present application provides a wafer clamping device for an ion implanter. The wafer clamping device of the ion implanter includes a plurality of clamping components 10 that are circumferentially evenly distributed around the wafer 20 to be processed to clamp the wafer 20 to be processed. Refer to Figures 1-3 , the clamping component 10 includes:

[0040] A clamping moving part 11, located on the outer periphery of the wafer 20 to be processed, capable of moving relative to the first direction; the first direction is the radial direction of the wafer 20 to be processed;

[0041] A clamping part base 12, fixed on the clamping moving part 11, capable of moving following the movement of the clamping moving part 11;

[0042] A clamping contact part 13, configured to abut against the outer edge of the wafer 20 to be processed from the radial direction of the wafer 20 to be processed; the clamping contact part 13 includes a fixed part 131 and a clamping part 132 that are fixedly connected to each other. The fixed part 131 is inserted into the clamping part base 12 along the second direction, and the clamping part base 12 is provided with a mounting hole adapted to the fixed part 131; the clamping part 132 protrudes from the clamping part base 12 in the second direction, and at least one circular clamping ring 1321 is provided on the clamping part 132 in the first direction; the second direction is the axial direction of the wafer 20 to be processed.

[0043] Here, the outer edge of the wafer 20 to be processed may be the cylindrical surface of the outer circumference of the wafer.

[0044] It can be understood that the clamping contact part 13 clamps the wafer from the circumferential direction of the wafer, similar to a chuck in machining. However, the clamping force is relatively small compared to that in machining to avoid damaging the wafer.

[0045] It can be understood that the clamping contact part 13 is fixed on the clamping part base 12 through the fixed part 131, and the movement of the clamping contact part 13 is realized by the clamping moving part 11 driving the clamping part base 12.

[0046] The clamping ring 1321 can reduce the contact area with the wafer 20 to be processed; the clamping ring 1321 is a complete circle. After severe wear, the clamping ring 1321 can be rotated to adjust the contact surface and continue to be used. The rotation is carried out with the axis of the fixing part 131 relative to the axis of the mounting hole as the axis. Compared with the semi-circle in the prior art, the service life can be increased by nearly one time.

[0047] Further, a plurality of clamping rings 1321 can be arranged axially on the wafer, further reducing the wear of the clamping ring 1321.

[0048] In the wafer clamping device of the ion implanter according to the embodiment of the present application, the clamping part 132 is provided with at least one circle of circular clamping rings 1321 in the first direction to reduce the contact area with the wafer 20 to be processed, that is, to reduce the wear of the wafer and the clamping part 132; in addition, the clamping contact part 13 can rotate with the axis of the fixing part 131 relative to the axis of the mounting hole according to the wear condition of the clamping ring 1321 to adjust the contact surface with the wafer 20 to be processed, reduce the wear of the clamping part 132, reduce the workload of maintenance, and also reduce the damage to the wafer. Therefore, the production cost can be reduced and the wafer processing quality can be improved.

[0049] In some other embodiments of the present application, the cross-sectional area of the clamping part 132 in the first direction is larger than the aperture of the mounting hole, and a gap of 0.6 mm - 3 mm is preset between the bottom end surface of the clamping part 132 and the top end surface of the clamping part base 12.

[0050] In this way, the generation of fine particles due to friction between the clamping part base 12 and the clamping contact part 13, and thus the contamination of the wafer surface can be reduced. The gap between the bottom end surface of the clamping part 132 and the top end surface of the clamping part base 12 is marked as G in the drawing.

[0051] In some other embodiments of the present application, the clamping contact part 13 is made of silicon carbide.

[0052] Here, being made of silicon carbide means that the whole is silicon carbide. In this way, it not only has good wear resistance, but also will not fall off due to the failure of the adhesive.

[0053] In some other embodiments of the present application, the clamping part 132 includes a main body and the clamping ring 1321, and the clamping ring 1321 protrudes from the outer surface of the main body in the first direction of the main body.

[0054] In this way, the contact area with the wafer can be reduced, and the damage to the wafer can be reduced.

[0055] Specifically, the surface of the clamping ring 1321 facing the wafer can be an arc surface convex towards the wafer. In this way, the contact between the clamping ring 1321 and the wafer is a line contact, which can further reduce the damage to the wafer.

[0056] In some other embodiments of the present application, the fixing part 131 is a cylinder, and the mounting hole is a cylindrical hole.

[0057] In this way, the structure is simple and the installation is fast.

[0058] In some other embodiments of the present application, the shape of the clamping moving part 11 is cylindrical, and the axis direction is the second direction.

[0059] In this way, it is easy to process and the cost is low. And the axis direction is the second direction, that is, the axis direction of the wafer 20 to be processed. In this way, the clamping moving part 11 has a greater supporting force in the axial direction of the wafer.

[0060] In some other embodiments of the present application, the clamping moving part 11 can move in the first direction and / or the second direction so that the clamping contact part 13 contacts the wafer 20 to be processed.

[0061] By moving the clamping moving part 11, the clamping contact part 13 can be moved to a more suitable position to better contact the wafer 20 to be processed.

[0062] In some other embodiments of the present application, the clamping part base 12 is detachably fixed to the clamping moving part 11 by screws 14; the clamping part base 12 is sleeved on the clamping moving part 11 from the second direction. The clamping moving part 11 is provided with a threaded hole in the first direction, and the clamping part base 12 is provided with a through hole in the first direction. The screw 14 passes through the through hole and is screwed into the threaded hole to fix the clamping part base 12 to the clamping moving part 11.

[0063] Connected by screws 14, the structure is simple, reliable, easy to process, and the cost is low.

[0064] In some other embodiments of the present application, the wafer clamping device of the ion implanter includes three clamping components 10, which are evenly arranged in the circumferential direction of the wafer 20 to be processed.

[0065] It can be understood that the chuck in mechanical processing is generally a three-jaw chuck. The three jaws are more likely to make the center of the clamped part coincide with the center of the chuck, making the clamping more reliable. Therefore, the wafer clamping device of this embodiment includes three clamping components 10, which has a similar effect.

[0066] The embodiment of the present application also provides an ion implanter, and the ion implanter includes the wafer clamping device of the ion implanter described above.

[0067] For the ion implanter according to the embodiment of the present application, at least one circular clamping ring 1321 is provided in the first direction on the clamping part 132 to reduce the contact area with the wafer 20 to be processed, that is, to reduce the wear of the wafer and the clamping part 132. In addition, the clamping contact part 13 can rotate relative to the axis of the mounting hole with the fixed part 131 as the axis according to the wear condition of the clamping ring 1321 to adjust the contact surface with the wafer 20 to be processed, reduce the wear of the clamping part 132, reduce the workload of maintenance, reduce the production cost and improve the wafer processing quality.

[0068] It should be understood that the above embodiments are all exemplary and do not cover all possible implementation manners included in the claims. Without departing from the scope of the disclosure of the present application, various deformations and changes can be made on the basis of the above embodiments. Similarly, any combination of the technical features of the above embodiments can be made to form other embodiments of the present application that may not be clearly described. Therefore, the above embodiments only represent several implementation manners of the present application and do not limit the protection scope of the patent of the present application.

Claims

1. A wafer clamping device of an ion implanter, characterized in that, Comprising a plurality of clamping components that are circumferentially evenly distributed on the wafer to be processed and clamp the wafer to be processed, the clamping components including: A clamping moving member, located on the outer periphery of the wafer to be processed, capable of moving relative to the first direction; the first direction is the radial direction of the wafer to be processed; A clamping member base, fixed on the clamping moving member, capable of moving along with the movement of the clamping moving member; A clamping contact member, configured to abut against the outer edge of the wafer to be processed from the radial direction of the wafer to be processed; the clamping contact member includes a fixed portion and a clamping portion that are fixedly connected to each other. The fixed portion is inserted into the clamping member base along the second direction, and the clamping member base is provided with a mounting hole adapted to the fixed portion; the clamping portion protrudes from the clamping member base in the second direction, and at least one circular clamping ring is provided on the clamping portion in the first direction; the second direction is the axial direction of the wafer to be processed.

2. The wafer clamping device of the ion implanter according to claim 1, wherein, The cross-sectional area of the clamping portion in the first direction is larger than the aperture of the mounting hole, and a gap of 0.6 mm - 3 mm is preset between the bottom end surface of the clamping portion and the top end surface of the clamping member base.

3. The wafer clamping device of the ion implanter according to claim 1, characterized in that The clamping contact member is made of silicon carbide.

4. The wafer clamping device of the ion implanter according to claim 1, wherein, The clamping portion includes a body and the clamping ring, and the clamping ring protrudes from the outer surface of the body in the first direction of the body.

5. The wafer clamping device of the ion implanter according to claim 2, characterized in that, The fixed portion is a cylinder, and the mounting hole is a cylindrical hole.

6. The wafer clamping device of the ion implanter according to claim 1, wherein, The shape of the clamping moving member is cylindrical, and the axis direction is the second direction.

7. The wafer clamping device of the ion implanter according to claim 6, characterized in that, The clamping moving member can move in the first direction and / or the second direction so that the clamping contact member contacts the wafer to be processed.

8. The wafer clamping device of the ion implanter according to any one of claims 1-7, characterized in that, The clamping member base is detachably fixed to the clamping moving member by screws; the clamping member base is sleeved on the clamping moving member from the second direction. The clamping moving member is provided with a threaded hole in the first direction, and the clamping member base is provided with a through hole in the first direction. The screw passes through the through hole and is screwed into the threaded hole to fix the clamping member base to the clamping moving member.

9. The wafer clamping device of the ion implanter according to any one of claims 1-7, characterized in that, The wafer clamping device of the ion implanter includes three clamping components, which are evenly arranged in the circumferential direction of the wafer to be processed.

10. An ion implanter, characterized in that, Including the wafer clamping device of the ion implanter according to any one of claims 1 - 9.

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