Wafer test carrying platform
By designing slidable stages and transmission components, the problem that existing test stages cannot be adapted to wafers of multiple sizes is solved, and the testing efficiency and operational convenience are improved.
Patent Information
- Application Number
- CN202422344746.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-25
AI Technical Summary
The existing test stages cannot be adapted to wafers of multiple sizes, resulting in inconvenient operation and inefficient testing.
A wafer test stage is designed, including a base, a transmission assembly and multiple stages. Through the meshing connection of gears and ring gears, the radial sliding of the stage is realized, and the spacing is adjusted to accommodate wafers of different sizes.
The adaptation of wafers of different sizes is achieved, and the testing efficiency and operation convenience are improved.
Smart Images
Figure CN223140764U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of semiconductor wafer manufacturing, and particularly to a wafer testing stage. Background Art
[0002] During the semiconductor wafer manufacturing process, it is necessary to test the manufactured wafers; during testing, the wafers are placed on a testing stage for testing.
[0003] The specifications of existing testing stages and wafers are generally customized on a one-to-one basis, that is, wafers of one size correspond to one testing stage. Therefore, when processing wafers of multiple specifications, multiple testing stages need to be used, which brings inconvenience to the operation of staff and also reduces the efficiency of wafer testing. Summary of the Utility Model
[0004] In view of this, the purpose of this application is to provide a wafer testing stage to solve the problem that existing testing stages cannot adapt to wafers of multiple sizes.
[0005] To achieve the above technical purpose, this application provides a wafer testing stage, including: a base, a transmission component, and multiple carriers;
[0006] The multiple carriers are arranged around the base, and the multiple carriers are slidably arranged along the radial direction of their circumferences;
[0007] A gear ring is arranged on the base;
[0008] A rack is connected to the carrier;
[0009] The transmission component includes: multiple gears;
[0010] The gears are meshed with the rack and the gear ring, and the multiple gears are connected to the multiple carriers in a one-to-one correspondence.
[0011] Further, a groove is arranged inside the carrier;
[0012] The grooves of the multiple carriers enclose a wafer placement area.
[0013] Further, a notch is arranged on the edge of at least one groove.
[0014] Further, the outer edge of the groove is inclined.
[0015] Further, the transmission component further includes: a motor;
[0016] The output end of the motor is connected to the base for driving the base to rotate.
[0017] Further, a connecting shaft is fixedly arranged on the base;
[0018] The output end of the motor is fixedly connected to the connecting shaft.
[0019] Further, the gear ring is arranged on the inner circumference of the base.
[0020] Further, there are four of the loading platforms.
[0021] Further, the loading platform is fan-shaped.
[0022] Further, when the loading platform slides to the innermost side, the sides of adjacent loading platforms abut against each other.
[0023] As can be seen from the above technical solutions, the present application provides a wafer testing stage, including: a base, a transmission assembly, and a plurality of loading platforms; the plurality of loading platforms are arranged around the base in a surrounding manner, and the plurality of loading platforms are slidably arranged along the radial direction of their surrounding; a gear ring is arranged on the base; a rack is connected to the loading platform; the transmission assembly includes: a plurality of gears; the gears are meshed with the rack and the gear ring, and the plurality of gears are connected to the plurality of loading platforms in a one-to-one correspondence.
[0024] In the wafer testing stage provided by this solution, the loading platform can be used for placing wafers, and when the base is rotated, it can drive a plurality of gears to rotate, and then drive the loading platform to slide through the rack to adjust the distance between the loading platforms, so as to achieve the effect of adapting to wafers of different sizes, and effectively solve the problem that the existing testing stage cannot adapt to wafers of multiple sizes. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0026] Figure 1 It is a schematic diagram of the overall structure of a wafer testing stage provided by an embodiment of the present application;
[0027] Figure 2 It is a side view of a wafer testing stage provided by an embodiment of the present application;
[0028] Figure 3 It is a schematic diagram of the inside of the base of a wafer testing stage provided by an embodiment of the present application;
[0029] Figure 4Schematic diagram of a base and a transmission assembly of a wafer test stage provided by an embodiment of the present application. Detailed implementation manners
[0030] The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope claimed by the present application.
[0031] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0032] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.
[0033] Please refer to Figures 1 to 4 , a wafer test stage provided in the embodiments of the present application includes: a base 10, a transmission assembly 20, and a plurality of carriers 30.
[0034] A plurality of carriers 30 are disposed around the base 10, and the plurality of carriers 30 are slidably disposed along the radial direction of their circumferences. In this embodiment, the carrier 30 is used for placing wafers. Specifically, the carrier 30 can be used as the placement area of the wafer as a whole or as a partial placement area of the wafer. The plurality of carriers 30 being disposed around means that the plurality of carriers 30 are distributed in a circular surrounding manner.
[0035] A gear ring 11 is disposed on the base 10; a rack 31 is connected to the carrier 30; the transmission assembly 20 includes: a plurality of gears 21; the gears 21 are meshed with the rack 31 and the gear ring 11, and the plurality of gears 21 are connected to the plurality of carriers 30 in a one-to-one correspondence.
[0036] In practical applications, it may further include a support base (not shown in the figure), and the base 10 is rotatably arranged on the support base; the gear 21 is rotatably arranged on the support base. When the base 10 rotates, it can drive the gear 21 to rotate through the gear ring 11, and then the gear 21 drives the rack 21 to slide radially to drive the stage 30 to slide, so as to adjust the distance between multiple stages 30 to adapt to wafers of different sizes.
[0037] In one embodiment, a groove 32 is provided on the inner side of the stage 30; the grooves 32 of multiple stages 30 enclose a wafer placement area 33.
[0038] When placing the wafer, it can be placed into the groove 32 and fixed by the edge of the groove 32. By rotating the base 10 to drive the stage 30 to slide, the overall size of the wafer placement area 33 can be adjusted to achieve the effect of adapting to wafers of different sizes.
[0039] Further, a notch 34 is provided on the edge of at least one groove 32 to facilitate the wafer to be placed into the wafer placement area 33 and taken out from the wafer placement area 33.
[0040] As an implementation manner, the outer edge of the groove 32 is inclined, which can further improve the convenience of wafer picking and placing.
[0041] In one embodiment, the transmission assembly 20 further includes: a motor (not shown in the figure); the output end of the motor is connected to the base 10 for driving the base 10 to rotate.
[0042] Specifically, the output end of the motor can be connected to the connecting shaft 12 fixed on the base 10 through a transmission shaft 22; when the motor starts, it can drive the base 10 to rotate. Among them, the motor can also be arranged on the support base.
[0043] As an implementation manner, the gear ring 11 is arranged on the inner circumference of the base 10. Correspondingly, the gear 21 is located on the inner circumference of the base 10, which can play a role in protecting the parts for transmission.
[0044] In one embodiment, there are four stages 30, and each stage 30 can be a sector with a radian of 90°.
[0045] When the stage 30 slides to the innermost side, the sides of adjacent stages 30 abut against each other, so that when the wafer test stage is not in use, multiple stages 30 can be combined into a compact circle to prevent sundries from entering the wafer test stage through the gap between the stages 30.
[0046] The above are the preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions described in the foregoing examples, or perform equivalent replacements for some of the technical features. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.
Claims
1. A wafer test carrier, characterized in that, Comprising: A base (10), a transmission assembly (20) and a plurality of carriers (30); The plurality of carriers (30) are arranged around the base (10), and the plurality of carriers (30) are slidably arranged along the radial direction of their circumferential arrangement; A gear ring (11) is arranged on the base (10); A rack (31) is connected to the carrier (30); The transmission assembly (20) comprises: a plurality of gears (21); The gears (21) are meshed with the rack (31) and the gear ring (11), and the plurality of gears (21) are connected to the plurality of carriers (30) in a one-to-one correspondence.
2. The wafer test stage according to claim 1, wherein A groove (32) is arranged inside the carrier (30); The grooves (32) of the plurality of carriers (30) enclose a wafer placement area (33).
3. The wafer test stage according to claim 2, characterized in that, A notch (34) is arranged on the edge of at least one of the grooves (32).
4. The wafer test stage according to claim 2 or 3, characterized in that, The outer edge of the groove (32) is inclined.
5. The wafer test stage according to claim 1, characterized in that, The transmission assembly (20) further comprises: a motor; The output end of the motor is connected to the base (10) for driving the base (10) to rotate.
6. The wafer test stage according to claim 5, wherein, A connecting shaft (12) is fixedly arranged on the base (10); The output end of the motor is fixedly connected to the connecting shaft (12).
7. The wafer test stage according to claim 1, wherein, The gear ring (11) is arranged on the inner circumference of the base (10).
8. The wafer test stage according to claim 1, characterized in that, There are four carriers (30).
9. The wafer test stage according to claim 1, wherein, The carrier (30) is fan-shaped.
10. The wafer test stage according to claim 9, wherein When the carrier (30) slides to the innermost side, the sides of adjacent carriers (30) are in mutual contact.