Ion migration resistant FPC circuit board and camera module based on circuit board

Abstract

The utility model provides an ion migration resistant FPC circuit board and a camera module based on the circuit board. The FPC circuit board resistant to ion migration comprises a plurality of network groups, wherein networks in each network group have the same electrification characteristic; the wiring spacing distance between the networks in the same network group is at least one time of line width; the wiring spacing distance between the network groups is at least two times of the line width, and the spacing distance between the holes is at least two times of the line width. According to the invention, the hole arrangement and wiring space of the FPC circuit board is saved, and the phenomenon of short circuit after module FPC ion migration caused by differential pressure and an over-close channel is prevented.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards of camera modules, and particularly relates to an FPC circuit board resistant to ion migration and a camera module based on the circuit board. Background Art

[0002] In an FPC board, between holes, between a hole and a line, and between lines, because the PCB board absorbs moisture and two metal through-holes in the board are too close to each other, electrochemical migration insulation deterioration will occur along the surface of the glass fiber of the board between the electrodes of high and low voltages, and a slight leakage phenomenon will gradually appear. This is called the electrochemical migration phenomenon, also known as the ion migration phenomenon.

[0003] Currently, the existing ion migration prevention designs mainly focus on the prevention of FPC boards, and their prevention measures are carried out around the occurrence locations, applicable after the FPC is manufactured and before the module design. This method has the following technical problems:

[0004] (1) It is impossible to carry out efficient prevention targeted, and only non-discriminatory prevention of possible situations can be carried out, with a risk of prevention failure;

[0005] (2) The occurrence locations of ion migration are random, and the investment in prevention measures is high;

[0006] (3) Relative to the camera module, the prevention effect is relatively limited and the improvement conditions are restricted. Content of the Utility Model

[0007] In order to overcome the defects existing in the above-mentioned prior art, the purpose of the utility model is to provide an FPC circuit board resistant to ion migration and a camera module based on the circuit board.

[0008] In order to achieve the above object of the utility model, the utility model provides an FPC circuit board resistant to ion migration, including a plurality of network groups, and the networks within each network group have the same charging characteristics;

[0009] The wiring interval distance between the networks within the same network group is at least 1 times the line width; the wiring interval distance between each network group is at least 2 times the line width, and the interval distance between holes is at least twice the line width.

[0010] Optionally, the network groups are:

[0011] A power supply network group, in which the voltages of the networks within the power supply network group are stable but inconsistent during operation, and without voltage during standby;

[0012] A signal network group, in which the voltages of the networks within the signal network group are stable and consistent during operation, and without voltage during standby;

[0013] Other network groups, in which the networks within the other network groups are with voltage during the standby state, and the voltage is stable and consistent.

[0014] Optionally, the power supply network group includes an AVDD network, a DVDD network, and a DOVDD network.

[0015] Optionally, the signal network group includes an MCLK network and an M IPI network.

[0016] Optionally, the other network group includes a RESET network, an SCL network, and an SDA network.

[0017] Optionally, each network in the other network group is respectively connected with a pull-up resistor for stabilizing the voltage.

[0018] Optionally, each network group is respectively connected to a connector.

[0019] Optionally, the FPC circuit board has an antioxidant coating.

[0020] This application also provides an imaging module, which uses the above-mentioned FPC circuit board resistant to ion migration.

[0021] The beneficial effects of the present utility model are:

[0022] This application groups different networks. Due to the characteristics that the same group has similar properties and different groups have different functions, it saves space for hole drilling and wiring of the FPC circuit board, and prevents the short circuit phenomenon caused by ion migration of the module FPC due to pressure difference and too close channels.

[0023] This application routes different groups of networks separately, and the distance between groups is kept more than twice the line width, and the distance between holes is also kept more than twice the line width. For within a group, since there is no pressure difference or front and back wiring is adopted, only 1 times the line width needs to be reserved. When designing, increasing the distance between groups can effectively increase the ion migration channel and reduce the module short circuit phenomenon caused by ion migration.

[0024] Since the longer the length of the module, the more serious the voltage attenuation and the more unstable the voltage, the pull-up resistor in this application stabilizes the influence of the voltage attenuation caused by the module length on the module electric field in the other network group, and indirectly improves the probability of the module occurring electrochemical phenomena.

[0025] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0027] Figure 1 It is the overall design drawing of the module;

[0028] Figure 2 It is the schematic diagram of network grouping;

[0029] Figure 3 It is the schematic diagram of network wiring;

[0030] Figure 4 It is the schematic diagram of the voltage stabilization module;

[0031] Figure 5 It is the wiring design drawing of other network groups;

[0032] Figure 6 It is the wiring design drawing of the signal network group;

[0033] Figure 7 It is the wiring design drawing of the power supply network group. Specific implementation manners

[0034] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0035] In the description of the present utility model, unless otherwise specified and defined, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the communication inside two elements. It can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific situations.

[0036] As Figure 1 shown, the present application provides an embodiment of an FPC circuit board resistant to ion migration, which is applied to but not limited to the camera module. In this embodiment, the networks in the FPC circuit board are divided into multiple network groups, and the networks within each network group have the same charging characteristics, while the charging characteristics between different network groups are different. In this embodiment, the following network groups are included:

[0037] Power supply network group. When the module is working, the voltages of the networks within the power supply network group are stable but inconsistent, and when the module is in standby, there is no voltage. As Figure 2 shown, the power supply network group includes the AVDD network, the DVDD network, and the DOVDD network.

[0038] Signal network group. When the module is working, the voltages of the networks within the signal network group are stable and consistent, and when the module is in standby, there is no voltage. As Figure 2As shown, the signal network group includes networks such as the MCLK network, the M IP I network (MCP / MCN, etc.).

[0039] For other network groups, when the module is working, there is voltage in each network within the other network groups. When the module is in the standby state, each network within the other network groups has voltage, and the voltage is stable and consistent. For example, Figure 2 As shown, the other network group includes the RESET network, the SCL network, and the SDA network.

[0040] In this embodiment, the area where each network group is connected to the connector is used as the network grouping module. The AVDD pin of the connector J1 is connected to the voltage stabilizing module of the other network group through the fourth capacitor C4; the DVDD pin of the connector J1 is connected to the voltage stabilizing module of the other network group through the sixth capacitor C6, the tenth capacitor C10, the eleventh capacitor C11, and the twelfth capacitor C12; the DOVDD pin of the connector J1 is connected to the voltage stabilizing module of the other network group through the fifth capacitor C5; the DGND pin of the connector J1 is directly connected to the ground.

[0041] In this embodiment, the model of the connector J1 is preferably but not limited to BM28B0.6-24DP / 2-0.35(51).

[0042] The wiring spacing distance between networks within the same network group is at least 1 times the line width, the wiring spacing distance between network groups is at least 2 times the line width, and the spacing distance between holes is at least twice the line width. For example, Figure 3 As shown, the 9th, 14th, and 15th pins of the U1 of the image sensor chip are grouped together. The networks within this group maintain a line distance of 1 time and are connected to the network grouping module, and maintain a spacing of 2 times the line width from the power supply network group and the signal network group. The DVDD network, the DOVDD network, and the AVDD network of the image sensor chip U1 are grouped together. First, they are connected in parallel and then wired, and are connected to the connector J1 through the capacitors C1 - C12. At the same time, the front and back sides of the networks within this group are wired, and the spacing from other network groups and the signal network group is more than 2 times the line width. The MCLK network and the M IP I network (MCP / MCN) of the image sensor chip U1 are grouped together. The networks within this group maintain a line distance of 1 time and are connected to the network grouping module, and maintain a spacing of 2 times the line width from the power supply network group and the other network group.

[0043] In this embodiment, the model of the image sensor chip U1 is OV08D10-GA5A-001A.

[0044] In this embodiment, the voltage stabilizing module of the other network group refers to the pull-up resistors connected to each network in the other network group for stabilizing voltage. Since the other network group in this embodiment includes the RESET network, the SCL network, and the SDA network in this embodiment, at least three pull-up resistors are required, that is, Figure 4The first resistor R1, the second resistor R2, and the third resistor R3 therein. The specific connection relationships are as follows:

[0045] One end of the first resistor R1 is connected to the power supply DOVDD, and the other end is connected to the other group of networks SCL; one end of the second resistor R2 is connected to the power supply DOVDD, and the other end is connected to the other group of networks SDA; one end of the third resistor R3 is connected to the power supply DOVDD, and the other end is connected to the other group of networks RESET.

[0046] During specific wiring, such as Figure 5 As shown, the routing of other network groups is as follows:

[0047] The connector J1 is placed on the front side. The SCL network is connected to the package of the connector J1 through a via. The other end passes through the FPC area of the module soft board and then reaches the area of the image sensor chip U1. When in the area of the image sensor U1, it is first connected to one side of the package of the first resistor R1 through a via, and then exits from the other side and is connected to the SCL network of the image sensor U1. The SCL is spaced 1 times the line width from the SDA and RESET on the left / right sides; the SDA network is connected to the package of the connector J1 through a via. The other end passes through the FPC area of the module soft board and then reaches the area of the image sensor chip U1. When in the area of the image sensor U1, it is first connected to one side of the package of the second resistor R2 through a via, and then exits from the other side and is connected to the SDA network of the image sensor U1. The SDA is 1 times the line width from the SCL on the right side and 2 times the line width from the DGND network on the left side; the RESET network is connected to the package of the connector J1 through a via. The other end passes through the FPC area of the module soft board and then reaches the area of the image sensor chip U1. When in the area of the image sensor U1, it is first connected to one side of the package of the third resistor R3 through a via, and then exits from the other side and is connected to the RESET network of the image sensor U1. The RESET is 1 times the line width from the SCL on the left side and 2 times the line width from the DGND network on the right side.

[0048] Such as Figure 6 As shown, the routing of the signal network group is as follows:

[0049] The MCLK network is connected to the package of the connector J1 through a via. The other end passes through the FPC area of the module soft board and then reaches the area of the image sensor chip U1. The MCLK is spaced 2 times the line width from the DGND on the left / right sides;

[0050] The MCP / MDP0 / MDP1 networks are respectively connected to the package of the connector J1 through a via. The other end passes through the FPC area of the module soft board and then reaches the area of the image sensor chip U1. The MCP / MDP0 / MDP1 are spaced 1 times the line width from the MCN / MDN0 / MDN1 on the left side and 2 times the line width from the DGND on the right side.

[0051] Such asFigure 7 As shown, the power network group is routed as follows:

[0052] The DOVDD network is connected to the package of connector J1 through a via. The other end passes through the FPC area of the module, and then reaches the area of image sensor chip U1. When in the area of image sensor U1, it is first connected in series with one side of the first resistor R1 / the second resistor R2 through a via, then connected to one side of the fifth capacitor C5, and then the other side of the fifth capacitor C5 leads out and is connected to the DOVDD network of image sensor U1. DOVDD is spaced 2 times the line width from the left / right DGND and overlaps with the DVDD on the back.

[0053] The DVDD network is connected to the package of connector J1 through a via. The other end passes through the FPC area of the module, and then reaches the area of image sensor chip U1. When in the area of image sensor U1, it is first connected in series with one side of the tenth capacitor C10 / the twelfth capacitor C12 through a via, and then the other side of the twelfth capacitor C12 leads out and is connected to the DVDD network of image sensor U1. DVDD is spaced 2 times the line width from the left / right DGND and overlaps with the DOVDD on the back.

[0054] The AVDD network is connected to the package of connector J1 through a via. The other end passes through the FPC area of the module, and then reaches the area of image sensor chip U1. When in the area of image sensor U1, it is first connected in series with one side of the fourth capacitor C4 through a via, and then the other side of the fourth capacitor C4 leads out and is connected to the AVDD network of image sensor U1. AVDD is spaced 2 times the line width from the left / right DGND and overlaps with the AGND on the back.

[0055] At the same time, when manufacturing the FPC circuit board, an antioxidant coating can be added to the FPC circuit board to improve the airtight performance of the module.

[0056] This application also provides a camera module, which uses the FPC circuit board with resistance to ion migration described in the above embodiment.

[0057] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0058] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An FPC circuit board resistant to ion migration, characterized in that, It includes multiple network groups, and the networks within each network group have the same charging characteristics; The wiring interval distance between the networks within the same network group is at least 1 times the line width; the wiring interval distance between each network group is at least 2 times the line width, and the interval distance between holes is at least 2 times the line width.

2. The FPC circuit board resistant to ion migration according to claim 1, wherein The network groups are as follows: Power supply network group. When working, the voltages of the networks within the power supply network group are stable but inconsistent. When in standby, there is no voltage. Signal network group. When working, the voltages of the networks within the signal network group are stable and consistent. When in standby, there is no voltage. Other network groups. When in standby state, the networks within the other network groups are charged, and the voltages are stable and consistent.

3. The FPC circuit board resistant to ion migration according to claim 2, wherein, The power supply network group includes AVDD network, DVDD network and DOVDD network.

4. The ion migration-resistant FPC circuit board according to claim 2, wherein, The signal network group includes MCLK network, M IP I network.

5. The FPC circuit board resistant to ion migration according to claim 2, characterized in that, The other network groups include RESET network, SCL network and SDA network.

6. The FPC circuit board resistant to ion migration according to claim 2 or 5, characterized in that, Pull-up resistors for stabilizing voltage are respectively connected to the networks in the other network groups.

7. The FPC circuit board resistant to ion migration according to claim 1, characterized in that Each network group is respectively connected to a connector.

8. The FPC circuit board resistant to ion migration according to claim 1, wherein The FPC circuit board has an antioxidant coating.

9. An imaging module, characterized in that, The FPC circuit board with resistance to ion migration according to any one of claims 1-8 is adopted.

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