Temperature equalizing plate with long-distance heat conduction function
By sintering multiple strands of copper wires on the capillary structure of the temperature equalization plate to form a thermal conduction cavity similar to a heat pipe, the problem of insufficient deheating power of the temperature equalization plate during long-distance heat transfer is solved, and efficient heat conduction and heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202421899099.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-07
AI Technical Summary
The heat-equipped plate has insufficient deheating power during long-distance heat transfer, and the heat pipe is limited in conduction mode, so it is difficult for the prior art to achieve efficient heat dissipation on large-area planes.
A capillary structure is provided between the upper cover and the lower cover of the temperature uniform plate, and a multi-strand copper wire is sintered on the capillary structure to form a thermal cavity similar to a heat pipe, enhancing capillary force to promote the flow of steam under a narrow channel, replacing the traditional support column to improve the smoothness of the steam channel.
Good heat conduction performance and high thermal deheat power are achieved on the temperature uniform plate with a length greater than 300mm and a width less than 15mm, thereby improving the efficiency of long-distance heat transfer.
Smart Images
Figure CN223142347U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of heat dissipation devices for electronic devices, and particularly to a vapor chamber with long-distance heat conduction. Background Art
[0002] A vapor chamber (VC) is an efficient heat dissipation device, usually made of copper (Cu) and stainless steel (SUS), and is used for electronic products with small volume and requiring rapid heat dissipation. The vapor chamber is mainly composed of an upper cover and a lower cover which are sealed. A capillary layer is arranged in the sealed inner cavity and filled with a working medium. The working medium absorbs the heat of the heat source at the evaporation end and evaporates. The steam flows to the condensation end under the action of the pressure difference and releases heat to condense. The condensed liquid returns to the evaporation end through the capillary structure to re-perform the working cycle. The capillary layer is usually a plate layer with a capillary structure. The vapor chamber has the advantage of high heat dissipation power on a relatively large plane, but when the heat transfer distance of the heat source increases, the heat dissipation power is significantly lower than that of the heat pipe. Therefore, in practical applications, heat pipes are mostly used to complete long-distance heat transfer. The heat pipe is similar to the vapor chamber in working principle, but there are differences in the conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vapor chamber is conducted on a two-dimensional plane, so the efficiency is higher. Moreover, the shape design of the heat pipe also has many limitations, which brings inconvenience to actual use.
[0003] In summary, the vapor chamber has a large heat dissipation power, but the heat transfer distance is limited. The heat pipe has a long heat transfer distance, but the heat dissipation power is limited. In view of this, it is necessary to develop a product to improve the long-distance heat transfer problem of the vapor chamber. Summary of the Utility Model
[0004] To solve the above technical problems, the utility model provides a vapor chamber with long-distance heat conduction, which makes up for the deficiency of the vapor chamber in long-distance heat transfer and still has excellent heat dissipation power when the heat transfer distance of the heat source is more than 300 mm.
[0005] The technical solution of the utility model is as follows:
[0006] A vapor chamber with long-distance heat conduction, comprising: an upper cover and a lower cover;
[0007] The upper cover is connected to the lower cover, and a chamber is formed between the upper cover and the lower cover; at least one capillary structure is arranged in the chamber, and at least one multi-strand copper wire is sintered on the capillary structure, and the multi-strand copper wire protrudes from the outer surface of the capillary structure; the chamber is filled with a working liquid.
[0008] Further, both the capillary structure and the multi-strand copper wire are arranged along the length direction of the upper cover.
[0009] Further, the capillary structure includes: a first capillary structure provided on the inner wall of the upper cover facing the lower cover and a second capillary structure provided on the inner wall of the lower cover facing the upper cover.
[0010] Further, a first groove is provided on the inner wall of the upper cover, and a second groove is provided on the inner wall of the lower cover. The upper cover and the lower cover are joined to form a chamber with the first groove and the second groove;
[0011] The first capillary structure is provided on the first groove; the second capillary structure is provided on the second groove.
[0012] Further, at least one of the multi-strand copper wires is provided on the first capillary structure, and each of the multi-strand copper wires abuts against the second capillary structure; or
[0013] At least one of the multi-strand copper wires is provided on the second capillary structure, and each of the multi-strand copper wires abuts against the first capillary structure.
[0014] Further, at least one of the multi-strand copper wires is symmetrically provided on both the first capillary structure and the second capillary structure, and each of the multi-strand copper wires on the first capillary structure abuts against the multi-strand copper wires on the corresponding second capillary structure.
[0015] Further, the upper cover and the lower cover have the same structure that is mirror-symmetrical.
[0016] Further, the lengths of the upper cover and the lower cover are both not less than 300 mm, and the widths of the upper cover and the lower cover are both 12 mm - 15 mm.
[0017] Further, a liquid injection port is further included, and the liquid injection port is opened on the upper cover; or
[0018] On the lower cover; or
[0019] The liquid injection port is formed by splicing two half-holes respectively provided on the upper cover and the lower cover.
[0020] The beneficial technical effects of the present utility model are as follows: The present utility model provides a heat pipe with long-distance heat conduction, and capillary structures are provided on both the upper cover and the lower cover, and a multi-strand copper wire is sintered on the capillary structure of the upper cover or the lower cover. With the help of this multi-strand copper wire structure, on the one hand, it simulates the heat conduction cavity of the heat pipe, enabling the heat pipe to transfer the heat source temperature to the heat dissipation section at a relatively far distance; on the other hand, this multi-strand copper wire structure replaces the support columns in the conventional design of the heat pipe, making the steam channel smoother. Moreover, since the multi-strand copper wire itself has a capillary structure, the capillary force is further enhanced, so that the pressure of the steam in the relatively narrow channel is increased, further promoting the downward flow of the steam under the action of pressure to the heat dissipation end for heat exchange, enabling the heat pipe to still have good heat conduction performance and high heat dissipation power when its width is less than 15 mm and its length is greater than 300 mm. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is the overall assembly schematic diagram of the present utility model;
[0022] Figure 2 is the exploded schematic diagram of the present utility model;
[0023] Figure 3 is the sectional view of the present utility model;
[0024] Figure 4 is the partial enlarged view of the second capillary structure and the multi-strand copper wire of the present utility model;
[0025] Figure 5 is the schematic diagram of the upper cover of the present utility model.
[0026] Wherein:
[0027] 100 - upper cover, 101 - first groove, 102 - first ring edge, 103 - upper cover mounting part;
[0028] 200 - lower cover, 201 - second groove, 202 - second ring edge, 203 - lower cover mounting part;
[0029] 300 - multi-strand copper wire, 301 - first capillary structure, 302 - second capillary structure, 400 - liquid injection port. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0030] In order to be able to more clearly understand the technical means of the present utility model and implement it according to the content of the specification, the following combines the drawings and embodiments to further describe in detail the specific embodiments of the present utility model. The following embodiments are used to illustrate the present utility model but are not used to limit the scope of the present utility model.
[0031] As Figures 1-5 shown, the present utility model provides a heat pipe with long-distance heat conduction, which can be directly or indirectly connected to a heat source to dissipate heat from the heat source.
[0032] It includes an upper cover 100 and a lower cover 200. The upper cover 100 and the lower cover 200 are combined, and a chamber is formed between them. A capillary structure and a working liquid are provided in the chamber. To ensure the heat conduction of the heat pipe in a narrower and longer distance, multiple strands of copper wires 300 are provided on the capillary structure. The above-mentioned working liquid can be water, alcohol or other low-boiling-point liquids, so that the working liquid can absorb heat from the liquid state and evaporate into a gaseous state.
[0033] In addition, in the present utility model, the lower cover 200 serves as a heat absorption fin to connect to a heat source and absorb the heat generated by the heat source, and the upper cover 100 serves as a heat dissipation fin, so that the heat carried by the working liquid can be transferred out by the upper cover 100.
[0034] The upper cover 100 and the lower cover 200 of the present utility model have the same mirror-symmetrical structure, both are long plate-shaped, and both sides of one end of the upper cover 100 and the lower cover 200 along their lengths are recessed inward and extend along their lengths, respectively forming a strip-shaped upper cover mounting portion 103 and a lower cover mounting portion 203.
[0035] Among them, the lengths of the upper cover 100 and the lower cover 200 are both 300 mm, and the widths of the upper cover 100 and the lower cover 200 are both 15 mm. A rectangular first groove 101 is provided on the inner wall of the upper cover 100 facing the lower cover 200, and the first groove 101 can be formed by processing methods such as stamping, die-casting, bending or etching. A first ring 102 is provided on the periphery of the first groove 101. Similarly, a rectangular second groove 201 is provided on the inner wall of the lower cover 200 facing the upper cover 100, and a second ring 202 is provided on the periphery of the second groove 201.
[0036] The first ring 102 and the second ring 202 can be combined by brazing or diffusion welding, so that the first groove 101 of the upper cover 100 and the second groove 201 of the lower cover 200 jointly form a chamber.
[0037] The chamber has a capillary structure. The capillary structure can help the condensed working liquid to re-aggregate and flow back to re-absorb the heat of the heat source.
[0038] In the present utility model, the above-mentioned capillary structure includes a first capillary structure 301 fixed to the groove surface of the first groove 101 and a second capillary structure 302 fixed to the groove surface of the second groove 201. Both the first capillary structure 301 and the second capillary structure 302 are made of sintered copper powder, and the first capillary structure 301 has the same shape as the groove surface of the first groove 101, and the second capillary structure 302 has the same shape as the groove surface of the second groove 201.
[0039] To ensure that the heat pipe with long-distance heat conduction has good heat conduction performance even at a long distance where its length is greater than 300 mm, so that the working fluid can still efficiently absorb heat to dissipate heat from the heat source and maintain the better heat dissipation efficiency of the heat pipe, a multi-strand copper wire 300 is further provided on the second capillary structure 302 in the present utility model.
[0040] To sinter a multi-strand copper wire 300 on the second capillary structure 302, and the multi-strand copper wire 300 protrudes from the outer surface of the second capillary structure 302, the present utility model places a copper wire in the groove of a graphite mold, and then places the second groove 201 of the lower cover 200 facing the copper wire on the graphite mold. At this time, the copper wire is exactly located on the central axis of the lower cover 200 along the length direction. Copper powder is injected from the air outlet of the graphite mold so that the copper powder covers the groove surface of the second groove 201. Then, the graphite mold and the lower cover 200 on the graphite mold are put into a sintering furnace for sintering. Thus, the second capillary structure 302 is sintered on the groove surface of the second groove 201. At the same time, on the second capillary structure 302, a multi-strand copper wire 300 with a capillary structure is sintered from the above-mentioned copper wire, and the multi-strand copper wire 300 protrudes from the outer surface of the second capillary structure 302.
[0041] When the upper cover 100 and the lower cover 200 are fixedly connected, the multi-strand copper wire 300 located on the second capillary structure 302 abuts against the first capillary structure 301. Thus, the cavity of the heat pipe with long-distance heat conduction forms a cavity similar to a heat pipe for heat conduction. When the heat transfer distance from the heat source is relatively long, or due to its use or placement, for example, in an inclined or upright state, the working fluid will concentrate at the lower part of the cavity and cannot be evenly distributed in the cavity. At this time, with the help of the above-mentioned multi-strand copper wire 300, the heat pipe can transfer the heat source temperature to the heat dissipation section at a relatively far distance; on the other hand, using the multi-strand copper wire 300 structure to replace the support columns in the conventional design of the heat pipe makes the steam channel smoother, and because the multi-strand copper wire 300 itself has a capillary structure, the capillary force is further enhanced, so that the pressure of the steam in the narrower channel is increased, further promoting the downward flow of the steam under the action of pressure to the heat dissipation end for heat exchange to improve the heat dissipation efficiency.
[0042] In addition, a liquid injection port 400 is further provided on the upper cover mounting portion 103 of the upper cover 100. The liquid injection port 400 is mainly used to inject the working fluid into the heat pipe after vacuum pumping, and after the liquid injection is completed, the liquid injection port 400 should be closed so that a closed cavity is formed inside the heat pipe with long-distance heat conduction.
[0043] In addition, according to actual usage requirements, multiple multi-strand copper wires 300 can be sintered on the second capillary structure 302 of the lower cover 200, and each multi-strand copper wire 300 abuts against the first capillary structure 301. Alternatively, a multi-strand copper wire 300, or multiple multi-strand copper wires 300, can also be sintered on the first capillary structure 301 of the upper cover 100.
[0044] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A heat pipe with long-distance heat conduction for temperature equalization, characterized in that, Comprising: An upper cover (100) and a lower cover (200); The upper cover (100) is connected to the lower cover (200), and a chamber is formed between the upper cover (100) and the lower cover (200); at least one capillary structure is provided in the chamber, and at least one multi-strand copper wire (300) is sintered on the capillary structure, and the multi-strand copper wire (300) protrudes from the outer surface of the capillary structure; the chamber is filled with a working liquid.
2. The heat conduction and temperature equalizing plate with long-distance heat conduction according to claim 1, characterized in that, Both the capillary structure and the multi-strand copper wire (300) are arranged along the length direction of the upper cover (100).
3. The heat pipe with remote heat conduction and uniform temperature according to claim 2, wherein, The capillary structure includes: a first capillary structure (301) provided on the inner wall of the upper cover (100) facing the lower cover (200) and a second capillary structure (302) provided on the inner wall of the lower cover (200) facing the upper cover (100).
4. The heat conduction and temperature equalization plate with long-distance heat conduction according to claim 3, wherein, The inner wall of the upper cover (100) is provided with a first groove (101), the inner wall of the lower cover (200) is provided with a second groove (201), and the upper cover (100) and the lower cover (200) are connected to form a chamber with the first groove (101) and the second groove (201); The first capillary structure (301) is provided on the first groove (101); the second capillary structure (302) is provided on the second groove (201).
5. The heat conduction heat pipe with long-distance heat conduction according to claim 4, characterized in that At least one of the multi-strand copper wires (300) is provided on the first capillary structure (301), and each of the multi-strand copper wires (300) abuts against the second capillary structure (302); or At least one of the multi-strand copper wires (300) is provided on the second capillary structure (302), and each of the multi-strand copper wires (300) abuts against the first capillary structure (301).
6. The heat pipe with remote heat conduction and uniform temperature according to claim 4, characterized in that At least one of the multi-strand copper wires (300) is symmetrically provided on both the first capillary structure (301) and the second capillary structure (302), and each of the multi-strand copper wires (300) on the first capillary structure (301) abuts against the multi-strand copper wires (300) on the corresponding second capillary structure (302).
7. The heat pipe with remote heat conduction and uniform temperature according to claim 1, characterized in that The upper cover (100) and the lower cover (200) are of the same mirror-symmetrical structure.
8. The heat conduction and temperature equalizing plate with long-distance heat conduction according to claim 1, characterized in that, The lengths of both the upper cover (100) and the lower cover (200) are not less than 300 mm, and the widths of both the upper cover (100) and the lower cover (200) are 12 mm - 15 mm.
9. The heat pipe with remote heat conduction and uniform temperature according to claim 1, wherein It further includes a liquid injection port (400), and the liquid injection port (400) is opened on the upper cover (100); or On the lower cover (200); or The liquid injection port is formed by splicing two half-holes respectively provided on the upper cover (100) and the lower cover (200).