Heat dissipation device and communication equipment

Abstract

The utility model relates to a heat dissipation device and communication equipment. The heat dissipation device comprises a heat dissipation structural member, the first side surface of the heat dissipation structural member comprises a heat conduction contact area used for making heat conduction contact with a heating source, and the first side surface is further provided with a mounting groove; the refrigerant heat conduction pipe is arranged in the mounting groove, and the refrigerant heat conduction pipe comprises a first pipe section and a second pipe section which are connected; the projection of the first pipe section on the first side surface is at least partially located in the heat conduction contact area, and the projection of the second pipe section on the first side surface extends out in the direction away from the heat conduction contact area. And the first pipe section is exposed out of the heat dissipation structural part from the notch of the mounting groove so as to be in heat conduction contact with a heating source. The heat dissipation device is high in heat dissipation efficiency and can meet the heat dissipation requirements of small-size and high-power equipment.

Description

Technical Field

[0001] The utility model relates to the field of communication technologies, and particularly to a heat dissipation device and a communication device. Background Art

[0002] The quality of heat dissipation design of communication products is directly related to the cost, reliability, volume and weight of the products. Working under high temperature conditions for a long time will reduce the reliability and service life of electronic devices, and even burn out components in severe cases. How to effectively dissipate heat in a limited space has become a key issue in the current design of communication products. Most of the existing heat dissipation devices for outdoor or indoor communication devices are natural heat dissipation. Its main structure is that the heat source contacts the heat dissipation housing through a heat conduction medium, conducts the heat to the outer surface of the heat dissipation housing, and conducts the heat to the air through the heat dissipation characteristics of the outer surface of the heat dissipation housing. However, the heat dissipation efficiency of the heat dissipation device with this structure is relatively low, and it cannot meet the heat dissipation requirements of small-size, high-power devices in particular. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a heat dissipation device and a communication device with relatively high heat dissipation efficiency, which can meet the heat dissipation requirements of small-size, high-power devices.

[0004] An embodiment of the present application provides a heat dissipation device, which is applied to a communication device. The heat dissipation device includes:

[0005] A heat dissipation structural member, the first side surface of the heat dissipation structural member includes a heat conduction contact area for thermally contacting a heat source, and an installation groove is further provided on the first side surface; and

[0006] A refrigerant heat conduction tube is arranged in the installation groove. The refrigerant heat conduction tube includes a first tube section and a second tube section connected to each other; at least part of the projection of the first tube section on the first side surface is located in the heat conduction contact area, and the projection of the second tube section on the first side surface extends in a direction away from the heat conduction contact area;

[0007] The first tube section exposes out of the heat dissipation structural member from the notch of the installation groove for thermally contacting the heat source.

[0008] In one embodiment, the first tube section is flush with the heat conduction contact area in the groove depth direction of the installation groove; or the first tube section protrudes from the heat conduction contact area in the groove depth direction of the installation groove.

[0009] In one embodiment, the installation groove includes a first groove section and a second groove section. The first groove section is opened in the heat conduction contact area, and the second groove section is opened in the area on the first side surface other than the heat conduction contact area;

[0010] The first tube section is arranged in the first groove section, and the second tube section is arranged in the second groove section.

[0011] In one embodiment, the heat dissipation structural member further includes a second side surface opposite to the first side surface, and a plurality of heat dissipation fins are arranged at intervals along a preset direction on the second side surface;

[0012] The second pipe section extends along the preset direction.

[0013] In one embodiment, the number of the refrigerant heat conduction pipes is multiple, and the first pipe section and the second pipe section of the same refrigerant heat conduction pipe form an included angle;

[0014] The first pipe sections of the multiple refrigerant heat conduction pipes are parallel to each other and are arranged in a row along the first direction.

[0015] In one embodiment, the second pipe sections of the multiple refrigerant heat conduction pipes are located on the same side of the corresponding first pipe sections along the first direction.

[0016] In one embodiment, the heat dissipation device further includes a refrigerant heat conduction sheet for contacting with a heat source;

[0017] The refrigerant heat conduction sheet is arranged in the heat conduction contact area and contacts the first pipe section of the refrigerant heat conduction pipe.

[0018] In one embodiment, floating support columns are further arranged on one side of the refrigerant heat conduction sheet facing the heat conduction contact area.

[0019] In one embodiment, the surface of the first pipe section facing the refrigerant heat conduction sheet is configured to have a shape matching the surface of the refrigerant heat conduction sheet.

[0020] A second aspect of the embodiments of the present application provides a communication device, including an electronic device and the foregoing heat dissipation device, and the heat dissipation device is arranged on the electronic device.

[0021] The beneficial effects of the foregoing heat dissipation device and communication device:

[0022] By arranging the refrigerant heat conduction pipes in the installation groove of the heat dissipation structural member, the refrigerant heat conduction pipes include a first pipe section and a second pipe section, and the first pipe section exposes out of the heat dissipation structural member from the notch of the installation groove for thermally contacting with a heat source. Therefore, on the one hand, the heat of the heat source can be transferred to the heat dissipation structural member through the first pipe section and the second pipe section, and on the other hand, it can be transferred to the heat dissipation structural member through the heat conduction contact area, and then the heat dissipation of the heat source is realized through the heat exchange between the heat dissipation structural member and the air.

[0023] Since the projection of the first pipe section on the first side surface is at least partially located in the heat-conducting contact area, the first pipe section protrudes from the notch of the installation groove outside the heat-dissipating structure member, so that the first pipe section is used for heat-conducting contact with the heat source. The heat of the heat source can be transferred to the first pipe section and then to the second pipe section through the first pipe section. Since the projection of the second pipe section on the first side surface extends away from the heat-conducting contact area, in other words, the second pipe section can extend to a larger range in the heat-dissipating structure member. Compared with the heat-conducting contact area, the second pipe section can transfer the local heat of the heat source to a larger area within its extended range. Even if the volume of the heat source is small and the contact area between the heat source and the heat-conducting contact area and the first pipe section is small, more areas on the heat-dissipating structure member can participate in heat conduction through the extension of the second pipe section, thereby increasing the range of heat conduction and improving the efficiency of heat conduction. It is particularly suitable for the heat-dissipation requirements of small-volume and high-power heat sources. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is an exploded structural schematic diagram of a heat-dissipating device according to some embodiments of the present application.

[0026] Figure 2 It is a side cross-sectional view of a heat-dissipating device according to some embodiments of the present application.

[0027] Figure 3 It is Figure 2 a partial enlarged view of part A of

[0028] Figure 4 It is a cross-sectional view of the mating relationship between the installation groove and the refrigerant heat-conducting pipe.

[0029] Figure 5 It is a schematic diagram of the heat-dissipating structure member in a heat-dissipating device according to some embodiments of the present application when viewed from the bottom.

[0030] Figure 6 It is a schematic diagram of the cooperation between the refrigerant heat-conducting pipe and the refrigerant heat-conducting fin in a heat-dissipating device according to some embodiments of the present application.

[0031] Figure 7 It is a schematic diagram of the heat-dissipating structure member in a heat-dissipating device according to some embodiments of the present application;

[0032] Figure 8 It is a schematic diagram of performing thermal simulation in a heat-dissipating device according to some embodiments of the present application;

[0033] Figure 9 Schematic diagram of the interfacial contact between the refrigerant heat-conducting sheet and the refrigerant heat-conducting tube in the heat dissipation device according to some embodiments of the present application;

[0034] Figure 10 Schematic diagram of the interfacial contact of another structure between the refrigerant heat-conducting sheet and the refrigerant heat-conducting tube in the heat dissipation device according to some embodiments of the present application.

[0035] Reference numerals in the drawings:

[0036] 100, heat dissipation device;

[0037] 1, heat dissipation structural member; 10, first side surface; 101, second side surface; 11, heat-conducting contact area; 12, installation groove; 121, first groove section; 122, second groove section; 13, heat dissipation fins;

[0038] 2, refrigerant heat-conducting tube; 21, first tube section; 22, second tube section;

[0039] 3, PCB board; 31, heat source; 4, heat-conducting medium;

[0040] 5, refrigerant heat-conducting sheet; 51, floating support column;

[0041] F, first direction; S, second direction. Detailed embodiments

[0042] In order to make the above objects, features and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0043] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0045] In the present utility model, unless otherwise clearly defined and limited, terms such as "installed", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0046] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0047] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0048] The heat dissipation device and communication device of the embodiments of the present application will be described below with reference to the accompanying drawings.

[0049] Figure 1 It is a schematic exploded view of the heat dissipation device 100 of some embodiments of the present application.

[0050] Refer to Figure 1, an embodiment of the present application provides a heat dissipation device 100, which is applied to a communication device. The heat dissipation device 100 includes a heat dissipation structural member 1 and a refrigerant heat conduction tube 2. Here, the communication device may be, for example, a base station, or it may also be other types of communication devices.

[0051] The first side surface 10 of the heat dissipation structural member 1 includes a heat conduction contact area 11 for thermally contacting the heat source 31, and the first side surface 10 is further provided with a mounting groove 12. The refrigerant heat conduction tube 2 is disposed in the mounting groove 12. The refrigerant heat conduction tube 2 includes a connected first tube section 21 and a second tube section 22. At least a part of the projection of the first tube section 21 on the first side surface 10 is located in the heat conduction contact area 11, and the projection of the second tube section 22 on the first side surface 10 extends away from the heat conduction contact area 11. The first tube section 21 exposes out of the heat dissipation structural member 1 from the notch of the mounting groove 12 for thermally contacting the heat source 31.

[0052] By arranging the refrigerant heat conduction tube 2 in the mounting groove 12 of the heat dissipation structural member 1, the refrigerant heat conduction tube 2 includes a first tube section 21 and a second tube section 22, and the first tube section 21 exposes out of the heat dissipation structural member 1 from the notch of the mounting groove 12 for thermally contacting the heat source 31. Therefore, on the one hand, the heat of the heat source 31 can be transferred to the heat dissipation structural member 1 through the first tube section 21 and the second tube section 22, and on the other hand, it can be transferred to the heat dissipation structural member 1 through the heat conduction contact area 11, and then through the heat exchange between the heat dissipation structural member 1 and the air, the heat dissipation of the heat source 31 is realized.

[0053] Since at least a part of the projection of the first tube section 21 on the first side surface 10 is located in the heat conduction contact area 11, and the first tube section 21 exposes out of the heat dissipation structural member 1 from the notch of the mounting groove 12 so that the first tube section 21 can thermally contact the heat source 31, the heat of the heat source 31 can be transferred to the first tube section 21 and then transferred to the second tube section 22 through the first tube section 21. Since the projection of the second tube section 22 on the first side surface 10 extends away from the heat conduction contact area 11, in other words, the second tube section 22 can extend to a larger range in the heat dissipation structural member 1. Compared with directly conducting heat through the heat conduction contact area 11, the second tube section 22 can transfer the local heat of the heat source 31 to a larger area within its extension range. Even if the volume of the heat source 31 is small and the contact area between the heat source 31 and the heat conduction contact area 11 and the first tube section 21 is small, more areas on the heat dissipation structural member 1 can participate in heat conduction through the extension of the second tube section 22, thereby increasing the range of heat conduction and improving the efficiency of heat conduction. It is especially suitable for the heat dissipation requirements of small-volume and high-power heat sources 31.

[0054] In addition, the projection of the first pipe section 21 on the first side surface 10 is at least partially located in the heat conduction contact area 11, and the projection of the second pipe section 22 on the first side surface extends away from the heat conduction contact area 11, which means that when looking down at the heat dissipation structural member 1, at least part of the first pipe section 21 is located within the setting range of the heat conduction contact area 11, and the second pipe section 22 is located outside the setting range of the heat conduction contact area 11. Since the refrigerant heat conduction pipe 2 is arranged in the installation groove 12, the partial groove section of the installation groove 12 corresponding to the first pipe section 21 must also be within the setting range of the heat conduction contact area 11, and the partial groove section of the installation groove 12 corresponding to the second pipe section 22 must also be outside the setting range of the heat conduction contact area 11.

[0055] In addition, the appearance of the refrigerant heat conduction pipe 2 can be a metal round pipe, and its length is determined according to design requirements. The refrigerant heat conduction pipe 2 is filled with a refrigerant liquid, and this refrigerant liquid is sealed in the refrigerant heat conduction pipe. Further, the first side surface 10 can be, for example, the part facing the PCB board 3 where the heat source 31 is located.

[0056] Figure 2 It is a side cross-sectional view of the heat dissipation device according to some embodiments of the present application. Figure 3 is Figure 2 the partial enlarged view at A of Figure 4 It is a cross-sectional view of the mating relationship between the installation groove and the refrigerant heat conduction pipe.

[0057] In the embodiments of the present application, referring to Figure 2 、 Figure 3 、 Figure 4 , the first pipe section 21 is flush with the heat conduction contact area 11 in the groove depth direction of the installation groove 12. When the first pipe section 21 is flush with the heat conduction contact area 11 in the groove depth direction of the installation groove 12, the surface of the first pipe section 21 facing away from the bottom of the installation groove 12 can be in the same plane as the heat conduction contact area 11, which is convenient for better contact with the external component to be contacted (such as the heat source 31), and also convenient for making the contact area larger.

[0058] Or in some other embodiments, the first pipe section 21 protrudes from the heat conduction contact area 11 in the groove depth direction of the installation groove 12. When the heat conduction contact area 11 and the first pipe section 21 are in contact with the component to be contacted at the same time, it can ensure that the first pipe section 21 can reliably contact the component to be contacted (such as the heat source 31).

[0059] In the embodiments of the present application, continue to refer to Figure 1, the installation groove 12 includes a first groove section 121 and a second groove section 122. The first groove section 121 is formed in the heat conduction contact area 11, and the second groove section 122 is formed in the area on the first side surface 10 other than the heat conduction contact area 11. The first pipe section 21 is arranged in the first groove section 121, and the second pipe section 22 is arranged in the second groove section 122.

[0060] In specific implementation, the first pipe section 21 can be installed in the first groove section 121 by processes such as expansion or bonding, and the second pipe section 22 can also be installed in the second groove section 122 by processes such as expansion or bonding. In this way, the first pipe section 21 and the groove wall of the first groove section 121 have good heat conduction performance, and the second pipe section 22 and the groove wall of the second groove section 122 have good heat conduction performance. The heat of the refrigerant heat pipe 2 can be better transferred to the groove wall of the installation groove 12.

[0061] The first groove section 121 and the second groove section 122 can have an included angle so that the first pipe section 21 and the pipe section have an included angle. For example, the first groove section 121 and the second groove section 122 can be substantially perpendicular, so that the first pipe section 21 and the second pipe section 22 of the same refrigerant heat pipe 2 are substantially perpendicular. A chamfer can also be provided at the connection position of the first pipe section 21 and the second pipe section 22.

[0062] In addition, for the installation postures of the first pipe section 21 and the second pipe section 22 in the first groove section 121 and the second groove section 122, the axial directions of the first pipe section 21 and the second pipe section 22 can be parallel to the heat conduction contact area 11, so that the first pipe section 21 and the second pipe section 22 can extend to a larger area range in the heat dissipation structure member 1. Of course, the present application is not limited to this, and the second pipe section 22 can also be inclined relative to the heat conduction contact area 11.

[0063] Figure 5 It is a schematic diagram when observing the heat dissipation structure member in the heat dissipation device of some embodiments of the present application from the bottom.

[0064] In the embodiments of the present application, in combination with Figure 1 and Figure 5 , the heat dissipation structure member 1 further includes a second side surface 101 opposite to the first side surface 10. The second side surface 101 is provided with a plurality of heat dissipation fins 13 arranged at intervals along a preset direction. The second pipe section 22 extends along the preset direction.

[0065] With such a setting, the second pipe section 22 can cross more heat dissipation fins 13, and the heat can be conducted to more heat dissipation fins 13. The heat dissipation fins 13 can be, for example, heat dissipation teeth or heat dissipation fins. The heat dissipation teeth are mostly formed by processes such as die casting and extrusion profiles. The heat dissipation fins can be formed by processes such as sheet metal bending and welding teeth.

[0066] Further, the heat dissipation structural member 1 is made of aluminum alloy. The heat conduction contact area 11 provided on the heat dissipation structural member 1 needs to correspond to the position of the heat source 31 on the PCB board 3. The arrangement path of the refrigerant heat conduction tube 2 (the first tube section 21) needs to pass through the heat conduction contact area 11. With such a setting, the arrangement path of the second tube section 22 will have an overlapping part with the heat dissipation fins 13 when viewed from above. The principle is that the setting path of the refrigerant heat conduction tube 2 forms more intersection points with the heat dissipation fins 13, and the length of the heat dissipation channel is increased through the one-dimensional linear second tube section 22.

[0067] In the embodiment of the present application, the number of the refrigerant heat conduction tubes 2 is multiple, and the first tube section 21 and the second tube section 22 of the same refrigerant heat conduction tube 2 have an included angle. With such a setting, it is convenient for the second tube section 22 to extend to a farther area outside the heat conduction contact area 11.

[0068] The first tube sections 21 of the multiple refrigerant heat conduction tubes 2 are parallel to each other and arranged in a row along the first direction F. With such a setting, the heat on the heat source 31 can be evenly transferred to each refrigerant heat conduction tube 2.

[0069] In the embodiment of the present application, the second tube sections 22 of the multiple refrigerant heat conduction tubes 2 are located on the same side of the corresponding first tube sections 21 along the first direction F. For example, in Figure 1 , each second tube section 22 is located on the same side of the first tube section 21.

[0070] With such a setting, the first tube section 21 can be located near the edge position of the heat dissipation structural member 1, and the second tube sections 22 all extend in a direction away from the edge, resulting in better heat dissipation effect.

[0071] Specifically, when the number of the refrigerant heat conduction tubes 2 is two, the second tube section 22 of one refrigerant heat conduction tube 2 and the second tube section 22 of the other refrigerant heat conduction tube 2 are located on opposite sides along the extension direction of the first tube section 21. For example, referring to Figure 1 shown, the second tube section 22 of one refrigerant heat conduction tube 2 is located at the lower left side of the drawing, and the second tube section 22 of the other refrigerant heat conduction tube 2 is located at the upper right side of the drawing. In this way, the two refrigerant heat conduction tubes 2 can transfer heat to a larger range of the heat dissipation structural member 1, resulting in better heat dissipation effect.

[0072] In the embodiment of the present application, the heat dissipation device 100 further includes a refrigerant heat conduction sheet 5, and the refrigerant heat conduction sheet 5 is used to contact the heat source 31. The refrigerant heat conduction sheet 5 is arranged in the heat conduction contact area 11 and contacts the first tube section 21 of the refrigerant heat conduction tube 2.

[0073] With such an arrangement, when viewed from above, the refrigerant heat-conducting fin 5 and the refrigerant heat-conducting pipe 2 have an overlapping part. The heat source 31 can first conduct heat to the refrigerant heat-conducting fin 5, and then the refrigerant heat-conducting fin 5 conducts the heat to the first pipe section 21 and the second pipe section 22. The second pipe section 22 then conducts the heat to the heat dissipation structure 1. The heat is transferred according to the principle of gradient transfer, and can transfer the heat to the heat dissipation structure 1 better. On the other hand, the refrigerant heat-conducting fin 5 can directly conduct heat to the heat-conducting contact area 11, thereby conducting the heat to the heat dissipation structure 1.

[0074] By providing the refrigerant heat-conducting fin 5, the thermal conductivity coefficient can be increased through gas-liquid phase change inside the refrigerant heat-conducting fin 5, improving the heat conduction efficiency, and a channel with a relatively high thermal conductivity coefficient can be created within its own area range.

[0075] In addition, the contact between the refrigerant heat-conducting fin 5 and the heat source 31 is a two-dimensional surface contact, and the contact area of the refrigerant heat-conducting fin 5 is relatively large, which can conduct the heat on the heat source 31 to the greatest extent. In addition, by superimposing the refrigerant heat-conducting pipe 2, the refrigerant heat-conducting pipe 2 is a one-dimensional linear extension structure, which can transfer the heat on the locally provided refrigerant heat-conducting fin 5 to a larger area within its length range, realizing multi-point heat dissipation, thereby increasing the heat conduction area.

[0076] The core of this solution is that at least part of the structures at one end of the refrigerant heat-conducting fin 5 and the refrigerant heat-conducting pipe 2 overlap with each other, and the two are combined to construct a heat conduction channel formed by overlapping a two-dimensional plane and a one-dimensional line, which can further improve the heat conduction efficiency between the heat and the heat dissipation structure 1.

[0077] On the other hand, in the stacking direction of the refrigerant heat-conducting fin 5 and the refrigerant heat-conducting pipe 2, the heat transfers from the heat source 31 to the refrigerant heat-conducting fin 5, then to the refrigerant heat-conducting pipe 2, and then to the heat dissipation structure 1, realizing a three-dimensional heat conduction channel, which can make the heat conduction effect better.

[0078] In addition, the overlapping (nesting) position at one end of the refrigerant heat-conducting fin 5 and the refrigerant heat-conducting pipe 2 needs to be calculated in combination with the actual layout of the PCB board 3 and the overall heat consumption. The network formed after the refrigerant heat-conducting fin 5 and the refrigerant heat-conducting pipe 2 are nested needs to follow the principle of heat gradient transfer. Further, the pre-pressure of the refrigerant heat-conducting pipe 2 and the installation groove 12 needs to be combined with the heat flux density and cooperate with the refrigerant heat-conducting fin 5, and the two are arranged in a mutually accommodating and nested manner. As for the mating dimensions of the mutual nesting of the refrigerant heat-conducting fin 5 and the refrigerant heat-conducting pipe 2, they need to be calculated in combination with the elastic modulus of the material itself, the heat flux density, and the thermal conductivity coefficient of the heat-conducting medium to achieve the best three-dimensional integrated heat dissipation of points, lines, and surfaces.

[0079] Figure 8 It is a schematic diagram of thermal simulation in the heat dissipation device of some embodiments of this application; Figure 9Schematic diagram of the interface contact between the refrigerant heat-conducting sheet and the refrigerant heat-conducting tube in the heat dissipation device according to some embodiments of the present application; Figure 10 Schematic diagram of the interface contact of another structure between the refrigerant heat-conducting sheet and the refrigerant heat-conducting tube in the heat dissipation device according to some embodiments of the present application.

[0080] In specific implementation, thermal simulation can be first performed according to the heat input value required by the system, as Figure 8 shown, and then the heat dissipation paths of key heat dissipation components, such as heat sources, can be planned according to the simulation results. It can be understood that the heat dissipation paths need to be adaptively changed in combination with the actual structure of the product.

[0081] Then, according to the heat dissipation value of the key heat dissipation component, it is determined whether to adopt the heat dissipation device of the present application.

[0082] In the case of adopting the heat dissipation device of the present application, it is also necessary to determine the interface contact form between the refrigerant heat-conducting tube 2 and the refrigerant heat-conducting sheet 5.

[0083] The interface contact form can refer to Figure 9 、 Figure 10 shown. In the Figure 9 interface contact form, the refrigerant heat-conducting tube 2 protrudes towards the refrigerant heat-conducting sheet 5 and contacts the refrigerant heat-conducting sheet 5. In the Figure 10 interface contact form described, the refrigerant heat-conducting tube 2 is recessed in the direction away from the refrigerant heat-conducting sheet 5, and the refrigerant heat-conducting sheet 5 is placed in the recess. Figure 9 and Figure 10 The heat dissipation performances of the two interface contact methods described are basically equivalent, and the specific selection can be considered jointly in combination with multiple factors such as the system board layout and the product structure characteristics.

[0084] The embodiments of the present application can improve the heat dissipation ability of the heat dissipation device 100 without affecting the layout space of the PCB board 3. By utilizing the local rapid conduction method of the refrigerant heat-conducting sheet 5 and the length advantage of the refrigerant heat-conducting tube 2, the heat conduction speed of the heat source 31 on the PCB board 3 can be effectively improved without affecting the layout of the PCB board 3. Moreover, the heat dissipation ability is flexible and variable. In the same or the same series of products, in order to cope with different ambient temperatures, the heat dissipation ability can be adjusted. By changing the combination method of the refrigerant heat-conducting sheet 5 and the refrigerant heat-conducting tube 2, the control of the heat dissipation ability can be achieved. Different heat dissipation devices 100 with different heat dissipation efficiencies are derived. In other words, the heat generation amount can be calculated according to the overall system power of the device, and the heat dissipation forms of the heat dissipation device 100 can be proportioned in different situations according to the cost requirements and system requirements. Thus, the changes of multiple heat dissipation forms can be compatible.

[0085] Furthermore, the refrigerant heat conducting sheet 5 and the refrigerant heat conducting pipe 2 included in the heat dissipation device 100 can be replaced by other forms, or they can be selected according to the actual working environment of the product. However, the heat dissipation structure 1 can remain unchanged, thereby achieving the advantages of satisfying the heat dissipation capacity of the product and saving costs. The product can also be platformized to expand the reuse capacity. From the perspective of product platformization, the heat dissipation device 100 of the present application is more flexible and changeable when dealing with different usage environments, meeting the platformization requirements. In addition, the heat dissipation device 100 of the embodiment of the present application will also facilitate rapid product iteration. For the layout of the PCB board 3, the heat consumption of different iteration processes of the same board products will be different. The heat dissipation device 100 of the present application provides a more favorable iterative operating environment for board debugging, and also provides a guarantee for obtaining more accurate heat consumption data for board iteration.

[0086] For old equipment, it is only necessary to simply upgrade its structure and apply the heat dissipation device 100 in the embodiment of the present application to the old equipment, thereby upgrading the heat dissipation performance of the old equipment, and other modules in the old equipment do not need to be adjusted. The heat dissipation device 100 in the embodiment of the present application can also effectively increase the equipment's adaptability to ambient temperature. Under the same heat generation condition, the allowable ambient temperature can be increased by another 3°C.

[0087] Figure 6 This is a schematic diagram of the cooperation between the refrigerant heat conducting pipe and the refrigerant heat conducting sheet in the heat dissipation device of some embodiments of the present application. Figure 7 Schematic diagram of a heat dissipation structure in a heat dissipation device according to some embodiments of the present application.

[0088] Reference Figure 6 , Figure 7 When used, the refrigerant heat conducting pipe 2 is first set in the installation groove 12 by compression expansion or bonding. Then the refrigerant heat conducting sheet 5 is placed on the refrigerant heat conducting pipe 2, and the heat conducting medium 4 can be filled between the refrigerant heat conducting sheet 5 and the refrigerant heat conducting pipe 2 to effectively increase the heat conduction speed. The PCB board 3 with the heat source 31 can be fixed on the heat dissipation structure 1 by screws, etc., and the heat source 31 on the PCB board 3 is in close contact with the refrigerant heat conducting sheet 5 through the heat conducting medium 4. Thereby, the heat source 31 is pressed tightly on the refrigerant heat conducting sheet 5.

[0089] In the embodiment of the present application, the appearance of the refrigerant heat conductive sheet 5 is mainly square and sheet-like. Its material is a metal with a high thermal conductivity. The interior of the refrigerant heat conductive sheet 5 can be made hollow, and the refrigerant can be poured and sealed inside the refrigerant heat conductive sheet 5. During specific operation, the refrigerant heat conductive sheet 5 is similar to the refrigerant heat conductive pipe 2, and the refrigerant liquid inside is realized to flow rapidly, and the thermal conductivity is increased by the phase change between the gas phase and the liquid phase, so as to realize the rapid conduction of heat.

[0090] In the present application, refer toFigure 1 On one side of the refrigerant heat-conducting fin 5 facing the heat-conducting contact area 11, there is also a floating support column 51 provided. Such a setting can increase the adaptability of the refrigerant heat-conducting fin 5 to heat sources 31 of different sizes.

[0091] Furthermore, in combination with Figure 3 and Figure 4 , the surface of the first pipe section 21 facing the refrigerant heat-conducting fin 5 is configured in a shape matching the surface of the refrigerant heat-conducting fin 5.

[0092] For example, when the surface of the refrigerant heat-conducting fin 5 is a plane, the surface of the first pipe section 21 facing the refrigerant heat-conducting fin 5 is also a plane, which facilitates the formation of good contact between the refrigerant heat-conducting fin 5 and the first pipe section 21.

[0093] In addition, a heat-conducting medium is also interposed between the refrigerant heat-conducting fin 5 and the heat-conducting contact area 11.

[0094] Such a setting can make the contact between the refrigerant heat-conducting fin 5 and the heat-conducting contact area 11 better when the surface roughness of the refrigerant heat-conducting fin 5 is relatively large. Of course, a heat-conducting medium can also be provided between the refrigerant heat-conducting fin 5 and the heat source 31. The heat-conducting medium can be, for example, silicone grease or silica gel.

[0095] In the embodiment of the present application, as Figure 7 shown, the heat-dissipating structural member 1 can be integrally configured as an open frame shape to facilitate the installation of structures such as PCB boards.

[0096] The embodiment of the present application also provides a communication device, which includes an electronic device and a heat-dissipating device 100 provided on the electronic device. The structure, function, heat-dissipating principle, etc. of the heat-dissipating device 100 have been described in detail above and will not be elaborated here.

[0097] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0098] The above-described embodiments only represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A heat dissipation device, applied to a communication device, characterized in that, The heat dissipation device includes: A heat dissipation structural member, wherein a first side surface of the heat dissipation structural member includes a heat conduction contact area for thermally contacting a heat source, and an installation groove is further provided on the first side surface; and A refrigerant heat conduction tube disposed in the installation groove, the refrigerant heat conduction tube including a first tube section and a second tube section connected to each other; a projection of the first tube section on the first side surface is at least partially located in the heat conduction contact area, and a projection of the second tube section on the first side surface extends in a direction away from the heat conduction contact area; The first tube section exposes out of the heat dissipation structural member from the notch of the installation groove for thermally contacting the heat source.

2. The heat dissipation device according to claim 1, wherein The first tube section is flush with the heat conduction contact area in the depth direction of the installation groove; or The first tube section protrudes from the heat conduction contact area in the depth direction of the installation groove.

3. The heat dissipation device according to claim 1, wherein The installation groove includes a first groove section and a second groove section, the first groove section is opened in the heat conduction contact area, and the second groove section is opened in an area on the first side surface other than the heat conduction contact area; The first tube section is disposed in the first groove section, and the second tube section is disposed in the second groove section.

4. The heat dissipation device according to claim 1, characterized in that, The heat dissipation structural member further includes a second side surface opposite to the first side surface, and a plurality of heat dissipation fins are provided on the second side surface at intervals along a preset direction; The second tube section extends along the preset direction.

5. The heat dissipation device according to claim 1, wherein The number of the refrigerant heat conduction tubes is multiple, and an included angle exists between the first tube section and the second tube section of the same refrigerant heat conduction tube; The first tube sections of the multiple refrigerant heat conduction tubes are parallel to each other and are arranged in a row along a first direction.

6. The heat dissipation device according to claim 5, wherein The second tube sections of the multiple refrigerant heat conduction tubes are located on the same side corresponding to the first tube sections along the first direction.

7. The heat dissipation device according to any one of claims 1-6, characterized in that, The heat dissipation device further includes a refrigerant heat conduction sheet for contacting the heat source; The refrigerant heat conduction sheet is disposed in the heat conduction contact area and contacts the first tube section of the refrigerant heat conduction tube.

8. The heat dissipation device according to claim 7, wherein, Floatable support columns are further provided on a side of the refrigerant heat conduction sheet facing the heat conduction contact area.

9. The heat dissipation device according to claim 7, wherein A surface of the first tube section facing the refrigerant heat conduction sheet is configured to have a shape matching the surface of the refrigerant heat conduction sheet.

10. A communication device, characterized in that, An electronic device and the heat dissipation device according to any one of claims 1-9, the heat dissipation device being disposed on the electronic device.

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