Miniaturized cooperative processing module protection structure

Abstract

The utility model discloses a miniaturized coprocessing module protection structure, which relates to the technical field of coprocessing module protection structures, and comprises an arc-shaped interface circuit board, an upper cover, a bottom plate and an electromagnetic shielding ring, the bottom plate is arranged at the lower part of the arc-shaped interface circuit board, the upper cover is arranged at the upper part of the arc-shaped interface circuit board, and the electromagnetic shielding ring is arranged at the lower part of the arc-shaped interface circuit board. A groove for placing an electromagnetic shielding ring is formed in the side wall of the bottom plate, the electromagnetic shielding ring is arranged in the groove in the side wall of the bottom plate, heat conduction pads with different thicknesses are pasted on a heating device of the arc-shaped interface circuit board, and the electromagnetic shielding ring is arranged between the upper cover and the bottom plate. The interface board is tightly attached to the mounting surface of the coprocessing module, module testing and later maintenance are easier, the product failure rate can be reduced, the cost and the maintenance cost can be reduced, customization can be carried out according to the specific application requirements of the interface board, and the use conditions of diversified products are met.

Description

Technical Field

[0001] The utility model relates to the technical field of protection structures for collaborative processing modules, and specifically to a miniaturized protection structure for collaborative processing modules. Background Art

[0002] With the continuous progress of collaborative processing module technology, higher requirements are put forward for the processor circuit board in terms of transmission efficiency, anti-interference ability, etc. The circuit board of the collaborative processing module is developing towards the direction of integration and miniaturization. The core devices on the circuit board of the collaborative processing module are very sensitive to adverse factors such as heat generation and electromagnetic interference. Without a suitable protection structure, it will affect its processing efficiency and even cause abnormal functions of the collaborative processing module.

[0003] At present, the existing protection structures are complex in design and single in function, and some are not easy to implement in terms of technology. Therefore, designing a miniaturized protection structure with multiple functions such as support and shielding for the collaborative processing module is an urgent technical problem to be solved at present. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a miniaturized protection structure for a collaborative processing module to solve the problems of complex design, single function, and difficulty in implementation in terms of technology proposed in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A miniaturized protection structure for a collaborative processing module includes an arc-shaped interface circuit board, an upper cover, a bottom plate, and an electromagnetic shielding ring. The lower part of the arc-shaped interface circuit board is the bottom plate, the upper part of the arc-shaped interface circuit board is the upper cover. A groove for placing the electromagnetic shielding ring is opened on the side wall of the bottom plate, and the electromagnetic shielding ring is arranged in the groove on the side wall of the bottom plate.

[0007] As a further scheme of the utility model: Three heat-conducting rubber pads with a thickness of 0.5 mm and two heat-conducting rubber pads with a thickness of 1 mm are pasted on the heat-generating devices on the arc-shaped interface circuit board.

[0008] As a further scheme of the utility model: One shielding pad with a thickness of 0.81 mm is placed on the socket flange of the J30J - 37ZKNP64 socket on the arc-shaped interface circuit board.

[0009] As a further scheme of the utility model: Six M2.5 screw holes adapted to screws are opened on the bottom surface of the bottom plate.

[0010] As a further scheme of the utility model: The screw is an M2.5X8 hexagon socket head cap screw.

[0011] As a further solution of the utility model: the shielding pad is provided with the J30J-37ZKNP64 socket on the arc-shaped interface circuit board, and a square hole and two small round holes are opened in the middle of the shielding pad.

[0012] As a further solution of the utility model: two M3 threaded holes are symmetrically opened on the arc surface of the upper cover, 15 heat sinks are opened in the middle of the upper cover, a long slot hole and two small round holes are opened on the left side of the upper cover, and a boss and a groove are left inside the upper cover.

[0013] As a further solution of the utility model: two M3 threaded holes are symmetrically opened on the arc surface of the bottom plate.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The utility model adopts an arc-shaped bottom plate and upper cover to completely wrap the interface circuit board of the collaborative processing module, which not only provides support, but also plays the role of electromagnetic shielding, heat dissipation and waterproofing;

[0016] 2. The utility model adopts 6 screws to fix the bottom plate and the upper cover together, and has a simple and beautiful appearance, which is suitable for industrial mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Exploded view of the protective structure of the miniaturized collaborative processing module.

[0018] Figure 2 Schematic diagram of the upper cover structure in the protective structure of the miniaturized collaborative processing module.

[0019] Figure 3 Schematic diagram of the bottom plate structure in the miniaturized collaborative processing module protection structure.

[0020] Figure 4 This is a front view schematic of the arc-shaped interface circuit board of the miniaturized collaborative processing module protection structure.

[0021] Figure 5 Schematic diagram of the back side of the arc-shaped interface circuit board of the miniaturized collaborative processing module protection structure.

[0022] Figure 6 This is the product appearance drawing of the miniaturized collaborative processing module protection structure.

[0023] As shown in the figure: 1. Arc interface circuit board; 2. Upper cover; 3. Bottom plate; 4. Electromagnetic shielding ring; 5. Screws. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figures 1 to 6 In the embodiment of the utility model, a miniaturized collaborative processing module protection structure includes an arc-shaped interface circuit board 1, an upper cover 2, a bottom plate 3, an electromagnetic shielding ring 4 and a screw 5. The lower part of the arc-shaped interface circuit board 1 is the bottom plate 3, and the upper part of the arc-shaped interface circuit board 1 is the upper cover 2. The main heating components on the arc-shaped interface circuit board 1 are pasted with 3 pieces of thermal conductive adhesive pads with a thickness of 0.5 mm and 2 pieces of thermal conductive adhesive pads with a thickness of 1 mm. A shielding pad with a thickness of 0.81 mm is placed on the flange of the arc-shaped interface circuit board 1J30J-37ZKNP64 socket. The shielding pad is provided by the arc-shaped interface circuit board 1J30J-37ZKNP64 socket. Shielding A square hole and two small round holes are opened in the middle of the pad, and two M3 threaded holes are symmetrically opened on the arc surface of the upper cover 2 for external connection; 15 heat sinks are opened in the middle of the upper cover 2 for the heat transfer of the heating device to the outside; a long slot hole and two small round holes are opened on the left side of the upper cover 2, so that the J30J-37ZKNP64 socket extends from the upper cover 2; a boss and a groove are left inside the upper cover 2, so that the main heating device on the arc interface circuit board 1 is closely attached to the upper cover 2 through the thermal conductive rubber film and the shielding pad, and two M3 threaded holes are symmetrically opened on the arc surface of the bottom plate 3 for external connection; a groove for placing the electromagnetic shielding ring 4 is opened on the side wall of the bottom plate 3;

[0026] An electromagnetic shielding ring 4 is arranged in the groove of the side wall of the base plate 3, and 6 M2.5 screw holes compatible with the screws 5 are opened on the bottom surface of the base plate 3. The screws 5 are M2.5X8 hexagon socket screws. The base plate 3 and the upper cover 2 are pressed together by the 6 M2.5X8 hexagon socket screws, and the two M2X16 screws of the J30J-37ZKNP64 socket are passed through the two small round holes of the upper cover 2. The upper cover 2 and the arc interface circuit board 1 are pressed together on the back of the arc interface circuit board with 2 M2 nuts, and the electromagnetic shielding ring 4 is arranged in the groove of the side wall of the base plate 3, and then the arc interface circuit board 1 and the upper cover 2 are placed in the base plate 3 as a whole, the electromagnetic shielding ring 4 is compacted, and the base plate 3 and the upper cover 2 are fixed together with 6 screws 5.

[0027] The working principle of the utility model is:

[0028] The arc-shaped interface circuit board 1 and the upper cover 2 are closely attached through a heat-conducting film and a shielding gasket to achieve good heat dissipation. The upper cover 2 and the bottom plate 3 are closely attached through an electromagnetic shielding ring 4 to shield the entire arc-shaped interface circuit board 1 of the small co-processing module and prevent external electromagnetic interference. Six screws 5 are fixedly connected to the upper cover 2 from the bottom of the bottom plate 3, making the structure appearance simple, and only a J30J-37ZKNP64 socket is retained.

[0029] Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A protection structure for a miniaturized collaborative processing module, comprising an arc-shaped interface circuit board (1), an upper cover (2), a bottom plate (3) and an electromagnetic shielding ring (4), characterized in that: The lower part of the arc-shaped interface circuit board (1) is a base plate (3), the upper part of the arc-shaped interface circuit board (1) is an upper cover (2), a groove for placing an electromagnetic shielding ring (4) is opened on the side wall of the base plate (3), and the electromagnetic shielding ring (4) is arranged in the groove of the side wall of the base plate (3).

2. The protection structure of the miniaturized collaborative processing module according to claim 1, characterized in that: The heating element on the arc-shaped interface circuit board (1) is pasted with three pieces of thermal conductive adhesive pads with a thickness of 0.5 mm and two pieces of thermal conductive adhesive pads with a thickness of 1 mm.

3. The protection structure of the miniaturized collaborative processing module according to claim 1, wherein: A shielding gasket with a thickness of 0.81 mm is placed on the flange of the J30J-37ZKNP64 socket of the arc-shaped interface circuit board (1).

4. The protection structure of the miniaturized cooperative processing module according to claim 1, wherein: The bottom surface of the base plate (3) is provided with six M2.5 screw holes that are compatible with the screws (5).

5. The protection structure of the miniaturized collaborative processing module according to claim 4, wherein: The screw (5) is an M2.5X8 hexagon socket screw.

6. The protection structure of the miniaturized collaborative processing module according to claim 3, characterized in that: The shielding pad is provided with the J30J-37ZKNP64 socket on the arc-shaped interface circuit board (1), and a square hole and two small round holes are provided in the middle of the shielding pad.

7. The protection structure of the miniaturized collaborative processing module according to claim 1, wherein: Two M3 threaded holes are symmetrically opened on the arc surface of the upper cover (2), 15 heat sinks are opened in the middle of the upper cover (2), a long slot hole and two small round holes are opened on the left side of the upper cover (2), and a boss and a groove are left inside the upper cover (2).

8. The protection structure of the miniaturized co-processing module according to claim 1, characterized in that: Two M3 threaded holes are symmetrically formed on the arc-shaped surface of the bottom plate (3).

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