Annealing equipment

Abstract

The utility model relates to the technical field of heat treatment, particularly provides annealing equipment, and aims to solve the problem that the annealing effect is affected due to non-uniform heating of a perovskite film caused by the conventional annealing platform. In order to achieve the purpose, the annealing equipment comprises a tank body, a heat conducting liquid storage tank, a heat conducting liquid storage tank and a heat conducting liquid storage tank, the heat conduction film covers the opening in the top of the tank body, so that the lower surface of the heat conduction film is in contact with the heat conduction liquid, and heat of the heat conduction liquid is conducted to a to-be-annealed part placed on the upper surface of the heat conduction film; and the heating device is used for heating the heat conduction liquid. Heat generated by the heating device is conducted to the heat conduction liquid firstly, uniform distribution of the heat is achieved, large-area contact between the heat conduction liquid and the lower surface of the heat conduction film is achieved, large-area contact between the upper surface of the heat conduction film and the to-be-annealed part is achieved, and therefore the to-be-annealed part is heated more evenly, and the good annealing effect is achieved. And in addition, heat conduction liquid can be prevented from being adhered to the to-be-annealed part, and then the situation that cleaning operation is added after annealing treatment is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heat treatment, and particularly provides an annealing device. Background Art

[0002] Due to the advantages of high efficiency and low cost, perovskite solar cells have developed rapidly in recent years. In the process of preparing perovskite solar cells, it is necessary to perform high-temperature annealing on the wet perovskite thin film, aiming to remove the solvent and promote the crystallization of perovskite crystals. The annealing treatment can improve the crystal structure of the material, reduce the hindrance of grain boundaries and defects to electron movement, and thus improve the electron mobility.

[0003] Generally, the substrate coated with the wet perovskite thin film is placed on the annealing platform for annealing treatment. Since the annealing platform generates heat by energizing the arranged resistance wires, the heating temperature at the position directly opposite to the resistance wire is relatively high, and the heating temperature at the position directly opposite to the area between the resistance wires is relatively low. Therefore, the perovskite thin film is unevenly heated, and the effect of the annealing treatment is adversely affected.

[0004] Therefore, a new technical solution is needed in this field to solve the above problems. Summary of the Utility Model

[0005] The utility model aims to solve the above technical problems, that is, to solve the problem that the existing annealing platform causes uneven heating of the perovskite thin film and affects the annealing effect.

[0006] The utility model provides an annealing device, which includes: a tank body, which is suitable for containing a heat-conducting liquid; a heat-conducting film, which covers the opening at the top of the tank body, so that the lower surface of the heat-conducting film contacts the heat-conducting liquid and conducts the heat of the heat-conducting liquid to the workpiece to be annealed placed on the upper surface of the heat-conducting film; a heating device, which is used to heat the heat-conducting liquid.

[0007] In the preferred technical solution of the above annealing device, the four peripheral edges of the heat-conducting film are hermetically connected to the four peripheral edges of the opening.

[0008] In the preferred technical solution of the above annealing device, the heating device is arranged outside the tank body.

[0009] In the preferred technical solution of the above annealing device, a heat-conducting buffer layer is arranged between the heating device and the tank body, so that the heat generated by the heating device is conducted to the heat-conducting liquid through the heat-conducting buffer layer and the tank body in sequence.

[0010] In the preferred technical solution of the above annealing device, the heat-conducting buffer layer includes a layered cavity formed between the heating device and the tank body, and the layered cavity is filled with a heat-conducting medium.

[0011] In a preferred technical solution of the above annealing device, the heat-conducting medium is heat-conducting metal particles.

[0012] In a preferred technical solution of the above annealing device, the heating device is arranged below the bottom plate of the tank body.

[0013] In a preferred technical solution of the above annealing device, the annealing device is configured with a disturbance device for promoting the flow of the heat-conducting liquid in the tank body.

[0014] In a preferred technical solution of the above annealing device, the disturbance device includes a rotating shaft arranged in the tank body and a stirring member fixed on the rotating shaft.

[0015] In a preferred technical solution of the above annealing device, the annealing device is configured with a temperature detection device for detecting the temperature of the heat-conducting liquid.

[0016] In the case of adopting the above technical solution, the annealing device includes: a tank body, which is suitable for containing a heat-conducting liquid; a heat-conducting film, which covers the opening at the top of the tank body so that the lower surface of the heat-conducting film contacts the heat-conducting liquid and conducts the heat of the heat-conducting liquid to the workpiece to be annealed placed on the upper surface of the heat-conducting film; a heating device for heating the heat-conducting liquid.

[0017] With such an arrangement, when using the above annealing device to anneal a workpiece to be annealed (such as a glass substrate coated with a wet perovskite thin film), the workpiece to be annealed is placed on the upper surface of the heat-conducting film, the tank body contains the heat-conducting liquid, the heat-conducting liquid contacts the lower surface of the heat-conducting film, the heating device heats the heat-conducting liquid, and the heat of the heat-conducting liquid is transferred to the workpiece to be annealed through the heat-conducting film. That is to say, the heat generated by the heating device is first conducted to the heat-conducting liquid to achieve uniform distribution of heat. The heat-conducting liquid makes large-area contact with the lower surface of the heat-conducting film, and the upper surface of the heat-conducting film makes large-area contact with the workpiece to be annealed, so that the workpiece to be annealed is heated more uniformly and a good annealing effect is achieved. In addition, this can also avoid the adhesion of the heat-conducting liquid on the workpiece to be annealed, thereby avoiding the situation of increasing the cleaning operation after the annealing treatment.

[0018] Preferably, the four peripheral edges of the heat-conducting film are hermetically connected to the four peripheral edges of the opening at the top of the tank body.

[0019] With such an arrangement, the heat-conducting liquid is in a sealed cavity, which can avoid the occurrence of the situation where gaseous substances decomposed by some heat-conducting liquid overflow when the local temperature is too high.

[0020] Preferably, the heating device is arranged outside the tank body.

[0021] With such an arrangement, compared with the case where the heating device is arranged inside the tank body, the risk of decomposition due to excessive local temperature of the heat-conducting liquid can be reduced.

[0022] Preferably, a heat-conducting buffer layer is arranged between the heating device and the tank body, so that the heat generated by the heating device is conducted to the heat-conducting liquid through the heat-conducting buffer layer and the tank body in sequence.

[0023] With such an arrangement, the heat transfer area between the heating device and the heat-conducting liquid can be increased, and the situation of excessive local heating temperature of the heat-conducting liquid can be avoided, further reducing the risk of decomposition due to excessive local temperature of the heat-conducting liquid.

[0024] Preferably, the annealing equipment is configured with a disturbance device for promoting the flow of the heat-conducting liquid in the tank body.

[0025] With such an arrangement, the disturbance device can make the heat-conducting liquid flow in the tank body, thereby accelerating the rise of the temperature of the heat-conducting liquid and making the temperature of the heat-conducting liquid more balanced.

[0026] Preferably, the annealing equipment is configured with a temperature detection device for detecting the temperature of the heat-conducting liquid.

[0027] With such an arrangement, the temperature of the heat-conducting liquid can be better controlled, and then the workpiece to be annealed can be annealed within a more accurate annealing temperature range. Description of the Drawings

[0028] The following describes the preferred embodiments of the present invention with reference to the drawings, in which:

[0029] Figure 1 is a cross-sectional schematic view of an annealing equipment according to an embodiment of the present invention in a use state.

[0030] List of Reference Numerals:

[0031] 1. Tank body; 11. First bottom plate; 12. First side plate; 2. Heat-conducting film; 3. Heat-conducting liquid; 4. Base; 41. Second bottom plate; 42. Second side plate; 51. Partition plate; 52. Heat-conducting metal particles; 6. Resistance wire; 7. Disturbance device; 71. Rotating shaft; 72. Stirring blade; 8. Temperature sensor; 9. Substrate. Detailed Embodiments

[0032] First of all, those skilled in the art should understand that the embodiments described below are only used to explain the technical principle of the present invention and are not intended to limit the protection scope of the present invention.

[0033] It should be noted that in the description of the utility model, terms indicating directions or positional relationships such as "left" and "right" are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0034] In addition, it should also be noted that in the description of the present utility model, unless otherwise clearly specified and defined, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a direct connection or an indirect connection. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0035] Based on the problem that the existing annealing platform mentioned in the background art can cause uneven heating of the perovskite film and affect the annealing effect, the present utility model provides an annealing device, which includes: a tank body, in which a heat-conducting liquid is suitable for being contained; a heat-conducting film, which covers the opening at the top of the tank body, so that the lower surface of the heat-conducting film contacts the heat-conducting liquid and conducts the heat of the heat-conducting liquid to the workpiece to be annealed placed on the upper surface of the heat-conducting film; a heating device, which is used to heat the heat-conducting liquid.

[0036] With such a setting, when using the above annealing device to anneal the workpiece to be annealed, the workpiece to be annealed is placed on the upper surface of the heat-conducting film, the tank body contains the heat-conducting liquid, the heat-conducting liquid contacts the lower surface of the heat-conducting film, the heating device heats the heat-conducting liquid, and the heat of the heat-conducting liquid is transferred to the workpiece to be annealed through the heat-conducting film. That is to say, the heat generated by the heating device is first conducted to the heat-conducting liquid to achieve uniform distribution of heat. The heat-conducting liquid has a large-area contact with the lower surface of the heat-conducting film, and the upper surface of the heat-conducting film has a large-area contact with the workpiece to be annealed, so that the workpiece to be annealed is heated more evenly and a good annealing effect is achieved. In addition, this can also avoid the adhesion of the heat-conducting liquid to the workpiece to be annealed, thereby avoiding the situation of increasing the cleaning operation after the annealing treatment.

[0037] Next, refer to Figure 1 for a detailed introduction to the annealing device of the present utility model. Among them, Figure 1 is a schematic cross-sectional view of an annealing device according to an embodiment of the present utility model in a use state.

[0038] As Figure 1As shown in the figure, the annealing device includes a tank body 1. The tank body 1 includes a first bottom plate 11 and four first side plates 12. The four first side plates 12 are located above the first bottom plate 11. The lower edges of the four first side plates 12 are respectively and hermetically connected to the four peripheral edges of the first bottom plate 11. The side edges of the four first side plates 12 are sequentially and hermetically connected end to end. Thus, the first bottom plate 11 and the first side plates 12 form the tank body 1. At the opening at the top of the tank body 1, a heat conduction film 2 is provided. The four peripheral edges of the heat conduction film 2 are hermetically connected to the four peripheral edges of the opening at the top of the tank body 1. The heat conduction film 2 and the tank body 1 enclose a sealed cavity, and a heat conduction liquid 3 is contained in this cavity. Among them, the heat conduction film 2 can be made of polyimide, polytetrafluoroethylene, polyphenylene sulfide or other suitable high molecular materials, etc.; the heat conduction liquid 3 can be dimethyl silicone oil, polystyrene-based heat conduction oil, polymer-based heat conduction oil, etc.

[0039] As Figure 1 shown in the figure, a base 4 is provided below the tank body 1. The base 4 includes a second bottom plate 41 and four second side plates 42. The four second side plates 42 are located above the second bottom plate 41. The lower edges of the four second side plates 42 are respectively and hermetically connected to the four peripheral edges of the second bottom plate 41. The side edges of the four second side plates 42 are sequentially and hermetically connected end to end. The second bottom plate 41 and the second side plates 42 form a trough-shaped base 4. The upper edges of the four second side plates 42 are respectively and hermetically connected to the four peripheral edges of the first bottom plate 11, thereby realizing the connection between the base 4 and the tank body 1. A cavity is formed between the base 4 and the first bottom plate 11 of the tank body 1. A horizontal partition plate 51 is provided in this cavity. The partition plate 51 divides this cavity into an upper and a lower distributed first layered sub-cavity and second layered sub-cavity. Among them, the first bottom plate 11, the first side plates 12, the second bottom plate 41, the second side plates 42, and the partition plate 51 are all made of heat-conducting materials, such as iron, aluminum or other metals or metal alloys with good heat-conducting performance, etc. The first layered sub-cavity is filled with heat-conducting metal particles 52. For example, the heat-conducting metal particles 52 can be iron powder, aluminum powder, copper powder, etc. A resistance wire 6 as a heating device is provided in the second layered sub-cavity. The resistance wire 6 is meanderingly distributed in the horizontal plane. When the resistance wire 6 is energized, the resistance wire 6 can generate a large amount of heat. The partition plate 51 and the heat-conducting metal particles 52 form a heat-conducting buffer layer between the resistance wire 6 and the tank body 1.

[0040] As Figure 1 shown in the figure, six disturbing devices 7 are provided in the tank body 1. The disturbing device 7 includes a rotating shaft 71 provided on the first bottom plate 11 and extending vertically upward and a stirring blade 72 fixed to the upper end of the rotating shaft 71. The disturbing device 7 further includes a motor (not shown in the figure) for driving the rotating shaft 71 to rotate. Two temperature sensors 8 are also provided in the tank body 1. The temperature sensors 8 are used to detect the temperature of the heat conduction liquid 3 in the tank body 1. The annealing device further includes a controller. The resistance wire 6, the motor of the disturbing device 7, and the temperature sensors 8 are all communicatively connected to the controller.

[0041] When annealing the substrate 9 coated with a wet perovskite thin film, the substrate 9 coated with the wet perovskite thin film is placed on the upper surface of the heat conduction film 2, and the heat conduction liquid 3 in the tank body 1 contacts the lower surface of the heat conduction film 2. The controller controls the resistance wire 6 to be energized and controls the motor to drive the rotating shaft 71 to rotate. The heat generated by the resistance wire 6 is sequentially conducted to the heat conduction liquid 3 in the tank body 1 through the partition plate 51, the heat conduction metal particles 52, and the first bottom plate 11. The stirring blade 72 rotates as the rotating shaft 71 rotates, and the stirring blade 72 drives the surrounding heat conduction liquid 3 to flow, so that the heat conduction liquid 3 in different regions in the tank body 1 flows relatively, making the temperature rise of the heat conduction liquid 3 in the tank body 1 more uniform. The heat of the heat conduction liquid 3 is conducted to the substrate 9 coated with the wet perovskite thin film through the heat conduction film 2, thereby realizing the annealing treatment of the substrate 9 coated with the wet perovskite thin film. During this process, the temperature sensor 8 detects the temperature information of the heat conduction liquid 3 at its location in real time and sends it to the controller. The controller controls the heating power of the resistance wire 6 and the energization and de-energization of the resistance wire 6 according to the temperature information detected by the temperature sensor 8, so as to maintain the temperature of the heat conduction liquid 3 within the expected temperature range.

[0042] The heat generated by the resistance wire 6 as the heating device is first transferred to the heat conduction liquid 3, and then the heat conduction liquid 3 transfers the heat to the substrate 9 coated with the wet perovskite thin film through the heat conduction film 2, increasing the heat conduction surface, making the substrate 9 coated with the wet perovskite thin film heat more evenly and achieving a good annealing effect. In addition, since the heat conduction film 2 separates the heat conduction liquid 3 from the substrate 9 coated with the wet perovskite thin film, this can also prevent the heat conduction liquid 3 from adhering to the substrate 9 coated with the wet perovskite thin film, thereby avoiding the situation of increasing the cleaning operation after the annealing treatment.

[0043] The four peripheral edges of the heat conduction film 2 are hermetically connected to the four peripheral edges of the opening at the top of the tank body 1. The heat conduction film 2 and the tank body 1 enclose a sealed cavity, and the heat conduction liquid 3 is placed in this sealed cavity, which can prevent the gaseous substances decomposed by part of the heat conduction liquid 3 when the local temperature is too high from overflowing.

[0044] It should be noted that this is only a relatively preferred setting method, and adjustments can be made in actual applications. For example, the four peripheral edges of the heat conduction film 2 are not hermetically connected to the four peripheral edges of the opening at the top of the tank body 1, and the four corners of the heat conduction film 2 are connected to the edges of the opening at the top of the tank body 1 by ropes.

[0045] A cavity is formed between the base 4 and the first bottom plate 11 of the tank body 1. A horizontal partition plate 51 is arranged in this cavity. The partition plate 51 divides this cavity into a first-layered sub-cavity and a second-layered sub-cavity which are distributed up and down. The first-layered sub-cavity is filled with heat-conducting metal particles 52, and a heating resistor wire 6 as a heating device is arranged in the second-layered sub-cavity. The partition plate 51 and the heat-conducting metal particles 52 form a heat-conducting buffer layer between the resistor wire 6 and the tank body 1. In this way, the heat generated by the resistor wire 6 is conducted to the heat-conducting liquid 3 through the heat-conducting buffer layer and the tank body 1 in sequence, which can increase the heat transfer area between the resistor wire 6 and the heat-conducting liquid 3, and avoid the situation that the heat-conducting liquid is locally overheated, reducing the risk of decomposition of the heat-conducting liquid 3 due to local overheating.

[0046] It should be noted that the first-layered sub-cavity is filled with heat-conducting metal particles 52, and the partition plate 51 and the heat-conducting metal particles 52 form a heat-conducting buffer layer between the resistor wire 6 and the tank body 1. This is only a specific setting method, and it can be adjusted in actual applications. For example, the first-layered sub-cavity is filled with heat-conducting oil as a heat-conducting medium, and the partition plate 51 and the heat-conducting oil form a heat-conducting buffer layer between the resistor wire 6 and the tank body 1, or the heat-conducting buffer layer can also be set as a metal plate thicker than the first bottom plate 11 of the tank body 1. In addition, the heat-conducting buffer layer and the resistor wire 6 are arranged below the tank body 1 in sequence. This is also a specific setting method, and it can be adjusted in actual applications. For example, in a more preferred setting method, a heat-conducting buffer layer and a resistor wire 6 are arranged below and on the outer sides of the four sides of the tank body 1 in sequence. The resistor wire 6 can also be replaced with an electric heating rod, a gas furnace or other suitable heating devices, etc. In addition, a heat-conducting buffer layer is arranged between the resistor wire 6 as a heating device and the tank body 1. This is also a more preferred setting method, and it can be adjusted in actual applications. For example, in a specific setting method, there is no heat-conducting buffer layer between the resistor wire 6 as a heating device and the tank body 1, and the resistor wire 6 as a heating device is directly arranged on the outer side of the tank body 1; in another specific setting method, the resistor wire 6 as a heating device is directly arranged in the tank body 1 so that the resistor wire 6 contacts the heat-conducting liquid 3 to directly heat the heat-conducting liquid 3.

[0047] Six disturbing devices 7 are arranged in the tank body 1. The disturbing device 7 includes a rotating shaft 71 arranged on the first bottom plate 11 and extending vertically upward and a stirring blade 72 fixed at the upper end of the rotating shaft 71. The disturbing device 7 also includes a motor (not shown in the figure) for driving the rotating shaft 71 to rotate. In this way, the heat-conducting liquid 3 can be made to flow in the tank body 1 through the disturbing device 7, thereby accelerating the rise of the temperature of the heat-conducting liquid 3 and making the temperature of the heat-conducting liquid 3 more balanced.

[0048] It should be noted that the disturbance device 7 being set in the above structure is only a specific setting method, and it can be adjusted in actual applications. For example, in a specific setting method, the stirring blades 72 are replaced with stirring rods or other suitable stirring members; in another specific setting method, the disturbance device is set to include a circulation pipe with both ends respectively communicating with the inside of the tank body 1 and a circulation pump connected in series on the circulation pipe. Under the driving action of the circulation pump, the heat-conducting liquid 3 in the tank body 1 flows into the circulation pipe from one end of the circulation pipe and flows back into the tank body 1 from the other end of the circulation pipe, so as to realize the flow of the heat-conducting liquid 3 in the tank body 1. In addition, it is also a relatively preferred setting method that the annealing equipment is equipped with a disturbance device, and it can be adjusted in actual applications. For example, the annealing equipment is not equipped with a disturbance device.

[0049] Two temperature sensors 8 are arranged in the tank body 1, which can detect the temperature information of the heat-conducting liquid 3 in the tank body 1 in real time, so as to control the heating power, power-on and power-off of the resistance wire 6 according to the temperature information of the heat-conducting liquid 3, so that the heat-conducting liquid 3 is within the expected temperature range, and the substrate 9 coated with the wet perovskite thin film is annealed within a more accurate annealing temperature range.

[0050] It should be noted that arranging the temperature sensors 8 in the tank body 1 to detect the temperature information of the heat-conducting liquid 3 is only a relatively specific setting method, and it can be adjusted in actual applications. For example, in a specific setting method, an infrared temperature sensor is arranged outside the tank body 1 to indirectly detect the temperature of the heat-conducting liquid 3 through the infrared temperature sensor, or other suitable temperature detection devices can also be set for the annealing device. In addition, it is also a relatively preferred setting method that the annealing device is equipped with a temperature detection device, and it can be adjusted in actual applications. For example, in a specific setting method, the annealing device is not equipped with a temperature detection device, and the parameters such as the power and working duration of the resistance wire 6 are determined through experiments when heating the heat-conducting liquid 3 to the expected temperature range, so as to control the resistance wire 6 to work according to the determined parameters during the annealing operation, and further make the heat-conducting liquid 3 within the expected temperature range. In addition, the annealing equipment of the present invention can also be used for the annealing treatment of other plate-shaped workpieces or workpieces of other shapes.

[0051] So far, the technical solution of the present invention has been described in combination with the preferred embodiments shown in the drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. An annealing device, characterized in that, The annealing device includes: a tank body, which is adapted to hold a heat-conducting liquid therein; a heat-conducting film, which covers the opening at the top of the tank body, so that the lower surface of the heat-conducting film contacts the heat-conducting liquid and conducts the heat of the heat-conducting liquid to the workpiece to be annealed placed on the upper surface of the heat-conducting film; a heating device, which is used to heat the heat-conducting liquid.

2. The annealing apparatus according to claim 1, characterized in that, The four peripheral edges of the heat-conducting film are hermetically connected to the four peripheral edges of the opening.

3. The annealing device according to claim 1, characterized in that, The heating device is arranged outside the tank body.

4. The annealing device according to claim 3, wherein, A heat-conducting buffer layer is arranged between the heating device and the tank body, so that the heat generated by the heating device is conducted to the heat-conducting liquid through the heat-conducting buffer layer and the tank body in sequence.

5. The annealing device according to claim 4, characterized in that, The heat-conducting buffer layer includes a layered cavity formed between the heating device and the tank body, and a heat-conducting medium is filled in the layered cavity.

6. The annealing device according to claim 5, characterized in that, The heat-conducting medium is heat-conducting metal particles.

7. The annealing apparatus according to any one of claims 3 to 6, characterized in that, The heating device is arranged below the bottom plate of the tank body.

8. The annealing apparatus according to any one of claims 1 to 6, characterized in that, The annealing device is configured with a perturbation device for promoting the flow of the heat-conducting liquid in the tank body.

9. The annealing apparatus according to claim 8, wherein, The perturbation device includes a rotating shaft arranged in the tank body and a stirring member fixed on the rotating shaft.

10. The annealing apparatus according to any one of claims 1 to 6, characterized in that, The annealing device is configured with a temperature detection device, which is used to detect the temperature of the heat-conducting liquid.

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