Board card aging test box

Abstract

The utility model discloses a board card aging test box, and relates to the technical field of board card test equipment. The board card aging test box comprises a high-temperature box, a box door is arranged at the opening end of the high-temperature box, an air duct assembly is arranged at the position, away from the opening end, of an inner cavity of the high-temperature box, a material carrying assembly is arranged at the position, located in front of the air duct assembly, of the inner cavity of the high-temperature box, and an air inlet is formed in one side of the back face of the high-temperature box; an air inlet is formed in the high-temperature box, an air supply assembly is inserted in an inner cavity of the air inlet, an air circulation assembly is embedded in the back face of the high-temperature box, and the air suction end of the air circulation assembly is located behind the air channel assembly. And meanwhile, horizontal air blowing of components on the circuit board is also considered, so that the temperature consistency of different circuit boards is ensured by optimizing a temperature field around the test circuit board, the cost is low, and the efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of board card testing equipment, in particular to a board card aging test chamber. Background Technique

[0002] Aging tests on electronic components or circuit boards before leaving the factory can identify defective products and reduce on-site failure rates. With the increasing requirements of users for product quality, the importance of pre-factory aging is becoming higher and higher.

[0003] However, the current incubators are not specifically optimized for such usage scenarios and usually do not have refrigeration capabilities due to cost considerations. Once the power consumption of the product is slightly higher, aging tests cannot be carried out or high-cost equipment needs to be purchased. Therefore, we propose a board card aging test chamber to solve the above problems. Content of the Utility Model

[0004] In view of the deficiencies of the prior art, the utility model provides a board card aging test chamber, which solves the problem that the profit of electronic products is relatively low and they cannot afford the low-temperature refrigeration of standard temperature test chambers.

[0005] To achieve the above objectives, the utility model is realized through the following technical solutions: a board card aging test chamber, including a high-temperature chamber, a chamber door is arranged at the opening end of the high-temperature chamber, an air duct assembly is arranged in the inner cavity of the high-temperature chamber and away from the opening end, a loading assembly is arranged in the inner cavity of the high-temperature chamber and in front of the air duct assembly, an air inlet is opened on one side of the back of the high-temperature chamber, and an air supply assembly is inserted into the inner cavity of the air inlet, a wind circulation assembly is inlaid and installed on the back of the high-temperature chamber, and the air suction end of the wind circulation assembly is located behind the air duct assembly;

[0006] A temperature sensor is inserted into one side of the top surface of the high-temperature chamber, a pressure balance port is opened at one side position of the back of the high-temperature chamber, and heaters are arranged above and below the air suction end of the wind circulation assembly in the inner cavity of the high-temperature chamber.

[0007] Preferably, the air duct assembly includes a partition plate arranged in the inner cavity of the high-temperature chamber and away from the opening end, an air inlet hole is opened at the center position of the surface of the partition plate, and air outlet holes are opened at the top and bottom of the surface of the partition plate.

[0008] Preferably, the main view shape of the partition plate is the same as the main view shape of the inner cavity of the high-temperature chamber.

[0009] Preferably, the loading assembly includes two parallel positioning frames, and the four corners of the two positioning frames are connected by four stabilizing columns;

[0010] A plurality of card holders are provided on the opposite sides of the two positioning frames, and the card holders located above and below correspond to each other one by one. Legs are provided at the four corners of the positioning frame located below.

[0011] Preferably, the air supply assembly includes an air duct inserted into the inner cavity of the air inlet, and a gas mass flow controller is connected in series in the middle of the air duct.

[0012] Preferably, the air circulation assembly includes a stabilizing frame provided on the back of the high-temperature box and a fan blade provided in the inner cavity of the high-temperature box. A motor is provided on the outer side of the stabilizing frame;

[0013] The output end of the motor is provided with a transmission shaft, and one end of the transmission shaft penetrates through the high-temperature box and is connected to the fan blade.

[0014] Preferably, it further includes a control host, and the control host is arranged on one side of the high-temperature box.

[0015] Beneficial effects

[0016] The utility model provides a board card aging test box. Compared with the prior art, the following beneficial effects are achieved:

[0017] When the board card aging test is required, first, a plurality of board cards are sequentially placed on the loading component in the vertical direction, and then the box door is closed, so that the box door and the high-temperature box can form a cavity, which can provide heat insulation to isolate the internal and external temperature conduction. Then, through the control host, the air circulation assembly can be started to operate, so that the air convection inside the cavity can be forced, and the middle air extraction and the upper and lower air outlet can be achieved through the air duct assembly to blow the vertically placed circuit board, and at the same time, the horizontal blowing of the components on the circuit board is also taken into account, so as to optimize the temperature field around the circuit board to ensure the temperature consistency of different circuit boards. And by turning on two heaters, the air inside can be heated, and the heating will cause the air to expand and the pressure to increase. At this time, the gas is discharged through the pressure balance port and the pressure balance with the external environment is achieved;

[0018] When the board card generates a high temperature, the heating of the two heaters is stopped, and at the same time, the air circulation is maintained. The temperature inside the high-temperature box is controlled by controlling the flow rate of the compressed air output by the air supply assembly and entering the high-temperature box through the air inlet. Then, the control host can also control the flow rate of the gas through the air supply assembly to control the cooling rate. Description of the drawings

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the side structure of the utility model;

[0021] Figure 3 This is a schematic cross-sectional structure diagram of the present utility model;

[0022] Figure 4 This is a schematic structure diagram of the air duct assembly of the present utility model;

[0023] Figure 5 This is a schematic side structure diagram of the material-carrying assembly of the present utility model;

[0024] Figure 6 This is a schematic structure diagram of the air supply assembly of the present utility model;

[0025] Figure 7 This is a schematic structure diagram of the air circulation assembly of the present utility model.

[0026] In the figure: 1. High-temperature box; 2. Box door; 3. Air duct assembly; 31. Partition; 32. Air inlet hole; 33. Air outlet hole; 4. Material-carrying assembly; 41. Positioning frame; 42. Stabilizing column; 43. Bracket; 44. Leg; 5. Air inlet; 6. Air supply assembly; 61. Air duct; 62. Gas mass flow controller; 7. Temperature sensor; 8. Pressure balance port; 9. Control host; 10. Air circulation assembly; 101. Motor; 102. Transmission shaft; 103. Fan blade; 104. Stabilizing frame; 11. Heater. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Please refer to Figure 1-3 , the present utility model provides a technical solution: a board card aging test box, including a high-temperature box 1, a box door 2 is arranged at the opening end of the high-temperature box 1, and it is characterized in that: an air duct assembly 3 is arranged in the inner cavity of the high-temperature box 1 and away from the opening end, a material-carrying assembly 4 is arranged in the inner cavity of the high-temperature box 1 and in front of the air duct assembly 3, an air inlet 5 is opened on one side of the back of the high-temperature box 1, and an air supply assembly 6 is inserted into the inner cavity of the air inlet 5. An air circulation assembly 10 is inlaid and installed on the back of the high-temperature box 1, and the air suction end of the air circulation assembly 10 is located behind the air duct assembly 3; a temperature sensor 7 is inserted into one side of the top surface of the high-temperature box 1, a pressure balance port 8 is opened at one side position of the back of the high-temperature box 1, heaters 11 are arranged above and below the air suction end of the air circulation assembly 10 in the inner cavity of the high-temperature box 1, and it further includes a control host 9, and the control host 9 is arranged on one side of the high-temperature box 1;

[0029] When aging tests are required for the boards, first place multiple boards vertically on the material loading component 4 in sequence, and then close the box door 2, so that the box door 2 and the high-temperature box 1 can form a cavity, which can provide heat insulation to isolate the internal and external temperature conduction. Then, through the control host 9, the air circulation component 10 can be started to operate, so that the air inside the cavity can be forced to convect, and through the air duct component 3, intermediate air extraction and upper and lower air outlet can be achieved to blow the vertically placed circuit boards, and at the same time, horizontal blowing of the components on the circuit boards on the material loading component 4 is also taken into account, so as to optimize the temperature field around the circuit boards to ensure the consistency of the temperatures of different circuit boards. And by turning on the two heaters 11, the air inside can be heated, and the heating will cause the air to expand and the pressure to increase. At this time, the gas is discharged through the pressure balance port 8 to achieve pressure balance with the external environment. When the boards generate a high amount of heat, the heating of the two heaters 11 is stopped, and at the same time, the air circulation is maintained. By controlling the flow rate of the compressed air output by the air supply component 6 and entering the high-temperature box 1 through the air inlet 5, the temperature inside the high-temperature box 1 can be reduced, so as to control the temperature inside the high-temperature box 1. Then, the control host 9 can also control the flow rate of the gas through the air supply component 6 to control the cooling rate.

[0030] Refer to Figure 3 - Figure 4 , the air duct component 3 includes a partition 31 arranged in the inner cavity of the high-temperature box 1 and far away from the opening end. An air inlet hole 32 is opened at the central position of the surface of the partition 31, and air outlet holes 33 are opened at the top and bottom of the surface of the partition 31;

[0031] Through the partition 31 in the air duct component 3, it can be installed in the inner cavity of the high-temperature box 1 and far away from the opening end, and at the same time, it can provide a space for opening the air inlet hole 32 and the two air outlet holes 33. By starting the operation of the air circulation component 10, intermediate air extraction through the air inlet hole 32 and air outlet through the two upper and lower air outlet holes 33 can be achieved to blow the vertically placed circuit boards, and at the same time, horizontal blowing of the components on the circuit boards on the material loading component 4 is also taken into account, so as to optimize the temperature field around the circuit boards to ensure the consistency of the temperatures of different circuit boards.

[0032] Refer to Figure 3 , Figure 4 , the front view shape of the partition 31 is the same as the front view shape of the inner cavity of the high-temperature box 1, and the partition 31 can be stably installed and fixed.

[0033] Refer to Figure 3 , Figure 5 , the material loading component 4 includes two parallel positioning frames 41, and the four corners of the two positioning frames 41 are connected by four stabilizing columns 42; a plurality of card racks 43 are arranged on the opposite sides of the two positioning frames 41, and the upper card racks 43 and the lower card racks 43 correspond to each other one by one. Legs 44 are arranged at the four corners of the lower positioning frame 41;

[0034] Through the four stabilizing columns 42 in the material loading component 4, the two positioning frames 41 can be installed and fixed, so as to form a support frame. Since a plurality of card holders 43 are arranged on the opposite sides of the two positioning frames 41, and the upper card holders 43 and the lower card holders 43 correspond to each other one by one, the two card holders 43 corresponding to each other up and down can vertically insert and install the board card, which can facilitate the subsequent blowing of the board card. At the same time, through the four legs 44, stable support can be provided, thereby improving the stability of the board card blowing.

[0035] Refer to Figure 2 、 Figure 6 As shown in FIGS.

[0036] Since one end of the air duct 61 is installed in the inner cavity of the air inlet 5, and the gas mass flow controller 62 is connected in series on the air duct 61, the flow rate of the compressed air output by the gas mass flow controller 62 is controlled and enters the high-temperature box 1 through the air inlet 5 to cool the inner cavity of the high-temperature box 1, so as to control the temperature in the high-temperature box 1. At the same time, the host computer 9 can also control the flow rate of the gas through the gas mass flow controller 62 to control the cooling rate.

[0037] Refer to Figure 3 、 Figure 7 As shown in FIGS.

[0038] Through the motor 101 in the air circulation component 10, it can be installed on the back of the high-temperature box 1 through the stabilizing frame 104 and connected to the fan blade 103 located in the high-temperature box 1 through the transmission shaft 102. By starting the motor 101 to run, the fan blade 103 can be driven to rotate at a high speed, so that the fan blade 103 can draw air from the air inlet hole 32, and then the drawn air will flow down and down along the inner wall of the high-temperature box 1, and then flow out through the upper and lower air outlet holes 33 to realize the blowing of the vertically placed circuit board.

[0039] During operation, when aging tests are required for the circuit boards, first place multiple circuit boards vertically on the material loading component 4 in sequence, and then close the chamber door 2, enabling the chamber door 2 and the high-temperature chamber 1 to form a cavity, which can provide heat insulation to isolate the internal and external temperature conduction. Then, through the control host 9, the air circulation component 10 can be started to operate, forcing the air convection inside the cavity. And through the air duct component 3, intermediate air extraction and upper and lower air outlet are achieved to blow the vertically placed circuit boards, while also taking into account the horizontal blowing of the components on the circuit boards, thus optimizing the temperature field around the circuit boards to ensure the temperature consistency of different circuit boards. By turning on the two heaters 11, the air inside can be heated up, and the heating will cause the air to expand and the pressure to increase. At this time, the gas is discharged through the pressure balance port 8 to achieve pressure balance with the external environment. When the circuit boards generate a high amount of heat, the heating of the two heaters 11 is stopped, while maintaining the air circulation. By controlling the flow rate of the compressed air output by the air supply component 6 and entering the high-temperature chamber 1 through the air inlet 5, the temperature inside the high-temperature chamber 1 can be reduced, thereby controlling the temperature inside the high-temperature chamber 1. Then, the control host 9 can also control the flow rate of the gas through the air supply component 6 to control the cooling rate.

[0040] Through the partition 31 in the air duct component 3, it can be installed in the inner cavity of the high-temperature chamber 1 and far away from the opening end, and can also provide a space for opening the air inlet hole 32 and the two air outlet holes 33. By starting the air circulation component 10 to operate, intermediate air extraction through the air inlet hole 32 and air outlet through the two upper and lower air outlet holes 33 can be achieved to blow the vertically placed circuit boards, while also taking into account the horizontal blowing of the components on the circuit boards on the material loading component 4, thus optimizing the temperature field around the circuit boards to ensure the temperature consistency of different circuit boards.

[0041] Through the four stabilizing columns 42 in the material loading component 4, the two positioning frames 41 can be installed and fixed, forming a support framework. Since multiple card holders 43 are provided on the opposite sides of the two positioning frames 41, and the upper card holders 43 and the lower card holders 43 correspond to each other one by one, the two card holders 43 corresponding to each other up and down can vertically insert and install the circuit boards, facilitating the subsequent blowing of the circuit boards. At the same time, through the four legs 44, stable support can be provided, further enhancing the stability of the circuit board blowing.

[0042] Since one end of the air duct 61 is installed in the inner cavity of the air inlet 5, and the gas mass flow controller 62 is connected in series on the air duct 61, the flow rate of the compressed air output by the gas mass flow controller 62 is controlled, and the high-temperature chamber 1 is cooled by entering the high-temperature chamber 1 through the air inlet 5, thereby controlling the temperature inside the high-temperature chamber 1. At the same time, the control host 9 can also control the flow rate of the gas through the gas mass flow controller 62 to control the cooling rate.

[0043] Through the motor 101 in the air circulation component 10, it can be installed on the back of the high-temperature box 1 through the stabilizing frame 104, and can also be connected to the fan blade 103 located in the high-temperature box 1 through the transmission shaft 102. By starting the motor 101 to operate, the fan blade 103 can be driven to rotate at a high speed, and then the fan blade 103 can draw air from the air inlet hole 32. Then the drawn air will flow downward and downward along the inner wall of the high-temperature box 1, and then can be discharged through the upper and lower air outlet holes 33 to blow the vertically placed circuit board.

[0044] In summary, the device achieves intermediate air extraction and upper and lower air outlet through the air duct component 3 and the air circulation component 10 to blow the vertically placed circuit board, and at the same time takes into account the horizontal blowing of the components on the circuit board, so as to optimize the temperature field around the circuit board to ensure the consistency of the temperatures of different circuit boards. It has low cost and high efficiency.

[0045] At the same time, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

Claims

1. A board card aging test chamber, comprising a high-temperature chamber (1), wherein a chamber door (2) is arranged at the opening end of the high-temperature chamber (1), and is characterized in that: A wind duct assembly (3) is arranged in the inner cavity of the high-temperature box (1) and away from the opening end. A material loading assembly (4) is arranged in the inner cavity of the high-temperature box (1) and in front of the wind duct assembly (3). An air inlet (5) is formed on one side of the back surface of the high-temperature box (1), and a gas supply assembly (6) is inserted into the inner cavity of the air inlet (5). A wind circulation assembly (10) is inlaid and installed on the back surface of the high-temperature box (1), and the air suction end of the wind circulation assembly (10) is located behind the wind duct assembly (3). A temperature sensor (7) is inserted into one side of the top surface of the high-temperature box (1). A pressure balance port (8) is formed at one side position of the back surface of the high-temperature box (1). Heaters (11) are arranged above and below the air suction end of the wind circulation assembly (10) in the inner cavity of the high-temperature box (1).

2. The board card aging test chamber according to claim 1, characterized in that: The wind duct assembly (3) includes a partition plate (31) arranged in the inner cavity of the high-temperature box (1) and away from the opening end. An air inlet hole (32) is formed at the central position of the surface of the partition plate (31). Air outlet holes (33) are formed at the top and bottom of the surface of the partition plate (31).

3. The board card aging test chamber according to claim 2, wherein: The front view shape of the partition plate (31) is the same as the front view shape of the inner cavity of the high-temperature box (1).

4. The board card aging test chamber according to claim 1, characterized in that: The material loading assembly (4) includes two positioning frames (41) arranged in parallel. The four corners of the two positioning frames (41) are connected by four stabilizing columns (42). A plurality of clamping frames (43) are arranged on the opposite surfaces of the two positioning frames (41), and the clamping frames (43) located above and the clamping frames (43) located below correspond to each other one by one. Legs (44) are arranged at the four corners of the lower positioning frame (41).

5. The board card aging test chamber according to claim 1, wherein: The gas supply assembly (6) includes a gas guide pipe (61) inserted into the inner cavity of the air inlet (5). A gas mass flow controller (62) is connected in series in the middle of the gas guide pipe (61).

6. The board card aging test chamber according to claim 1, characterized in that: The wind circulation assembly (10) includes a stabilizing frame (104) arranged on the back surface of the high-temperature box (1) and a fan blade (103) arranged in the inner cavity of the high-temperature box (1). A motor (101) is arranged on the outer side of the stabilizing frame (104). An output shaft of the motor (101) is provided with a transmission shaft (102), and one end of the transmission shaft (102) penetrates through the high-temperature box (1) and is connected to the fan blade (103).

7. The board card aging test chamber according to claim 1, characterized in that: A control host (9) is further included, and the control host (9) is arranged on one side of the high-temperature box (1).

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