Photoelectron component laser cutting device

Abstract

The utility model provides a photoelectron component laser cutting device which comprises a cutting table, a movable positioning table located at the top of the cutting table and a laser cutter located above the movable positioning table, the movable positioning table comprises a base, a placing plate and a pressing piece, the placing plate is connected to the top of the base in a front-back sliding mode, and the pressing piece is connected to the top of the base. The top of the placing plate is detachably connected with placing seats arranged in the length direction, and the placing plate is provided with pressing pieces in one-to-one correspondence with the placing seats arranged in the length direction. According to the utility model, the pedestal is arranged, the top of the pedestal is provided with the placing plate, the placing plate and the pedestal slide back and forth, the placing plate is provided with the placing seats distributed along the length direction, each placing seat is correspondingly provided with one pressing piece, and the placing seats are used for placing single optoelectronic components. And the to-be-cut optoelectronic component and the cut optoelectronic component can be quickly switched by controlling the placing plate to slide back and forth, so that the cutting efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic component cutting equipment, and specifically relates to a laser cutting device for optoelectronic components. Background Technique

[0002] During the processing of existing optoelectronic components, a cutting device is required for cutting. However, there are some deficiencies in the use of existing cutting devices, as follows: Firstly, the mechanical cutting method of existing cutting devices has relatively low precision during cutting, which affects the precision of the product. Secondly, there is a problem that the horizontal and vertical position adjustments cannot be quickly performed during cutting.

[0003] Therefore, the utility model with the publication number CN215919409U proposes a laser cutting device for optoelectronic components. Through the provided laser emission component, the laser emitter and the exhaust heat pipe in the laser emission component, the laser emitter emits laser, effectively achieving the effect of laser cutting on the components above the optoelectronic component placement table. The exhaust heat pipe discharges the heat generated during laser emission through the pipeline, solving the problem of mechanical cutting and low efficiency in the prior art. Through the provided longitudinal movement adjustment component, the longitudinal servo motor drives the front longitudinal motor lead screw to rotate. Through the provided transverse movement adjustment component, the transverse servo motor drives the transverse motor lead screw to rotate, and the lead screw nut will rotate left and right with the transverse motor lead screw to achieve the effect of transverse movement. Thus, the optoelectronic component placement table above is effectively driven to move horizontally through the lead screw nut.

[0004] However, the above-mentioned prior art still has the following deficiencies in use: This cutting device has the defect of low cutting efficiency when cutting and processing multiple optoelectronic components of the same type. Specifically, after one optoelectronic component is cut, it is necessary to change the material. During the material change operation, the cutting interval of the laser emitter will be delayed, which will affect the cutting efficiency.

[0005] Therefore, the utility model provides a laser cutting device for optoelectronic components. Content of the Utility Model

[0006] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide a laser cutting device for optoelectronic components to solve the problems raised in the above background technique. The utility model has the advantage of greatly improving the cutting efficiency when cutting optoelectronic components in batches.

[0007] To achieve the above object, the utility model is realized by the following technical solutions: A laser cutting device for optoelectronic components, including a cutting table, a moving positioning table located on the top of the cutting table, and a laser cutter located above the moving positioning table. The moving positioning table includes a base, a placing plate, and a pressing member. The placing plate is slidably connected to the top of the base in the front and rear directions, and a placing seat arranged along the length direction is detachably connected to its top. A pressing member corresponding to the placing seat arranged along the length direction is provided on the placing plate. A column is fixedly connected to the top of the cutting table on one side of the moving positioning table. A cantilever is fixedly connected to one side of the column. A driving slide is slidably arranged on the cantilever. The top of the driving slide is fixedly connected to the laser cutter through a lifting rod.

[0008] Further, a rack is fixedly arranged at the bottom of the placing plate, and a transmission gear meshing with the rack is arranged on the base.

[0009] Further, a guide rail is fixedly connected to the bottom of the placing plate, and a guide seat slidably matched with the guide rail is fixedly connected to the top of the base. A control motor is fixedly connected to the top of the base on one side of the guide seat, and the output shaft of the control motor is fixedly connected to the transmission gear.

[0010] Further, the pressing member includes a pressing cylinder and a pressing block. The pressing cylinder is fixedly arranged at the bottom of the placing plate, and its output shaft is fixedly connected to a pressing arm located above the placing seat. The pressing block is fixedly arranged at the bottom of the pressing arm.

[0011] Further, a protective rubber pad is bonded to the bottom of the pressing block.

[0012] Further, a guide sleeve sleeved outside the cantilever is penetrated and fixedly connected to one side of the driving slide. An adjusting lead screw is rotatably connected to the top of the cantilever, and the adjusting lead screw is threadedly engaged with the driving slide.

[0013] Further, a driving motor with an output shaft fixedly connected to one end of the adjusting lead screw is fixedly connected to the top of the cantilever.

[0014] The beneficial effects of the utility model are as follows:

[0015] 1. In the utility model, by setting the base, then setting the placing plate on the top of the base, the placing plate slides back and forth with the base. The placing plate is provided with placing seats distributed along the length direction, and each placing seat is correspondingly installed with a pressing member. The placing seats are used to place single optoelectronic components. Thus, by controlling the front and back sliding of the placing plate, the optoelectronic components to be cut and the cut ones can be quickly switched, greatly improving the cutting efficiency.

[0016] 2. In the present utility model, pressing members corresponding to the placement seats one by one are provided on the placement plate. When the placement plate moves, it will drive the pressing members to move synchronously, which is convenient for driving the cut optoelectronic components to a position far from the laser cutter. This kind of setting makes the blanking of the cut optoelectronic components more convenient, and the loading operation can be carried out simultaneously during blanking, greatly improving the convenience of the loading and unloading operations of the optoelectronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of a laser cutting device for optoelectronic components of the present utility model;

[0018] Figure 2 is Figure 1 the front view of;

[0019] Figure 3 is a schematic diagram of the connection between the pressing cylinder and the placement plate of a laser cutting device for optoelectronic components of the present utility model.

[0020] In the figure: 1, cutting table; 2, moving positioning table; 21, base; 211, transmission gear; 212, guide seat; 22, placement plate; 221, placement seat; 222, guide rail; 224, rack; 23, pressing member; 231, pressing cylinder; 2311, pressing arm; 232, pressing block; 2321, protective rubber pad; 3, laser cutter; 4, column; 5, cantilever; 6, driving slide; 61, guide sleeve; 7, lifting rod; 8, control motor; 9, adjusting lead screw; 101, driving motor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Please refer to Figures 1 to 3 , the present utility model provides a technical solution: a laser cutting device for optoelectronic components, including a cutting table 1, a moving positioning table 2 located on the top of the cutting table 1, and a laser cutter 3 located above the moving positioning table 2. The function of the moving positioning table 2 is to position and transfer optoelectronic components, and the function of the laser cutter 3 is to cut the optoelectronic components on the moving positioning table 2. Among them, when the moving positioning table 2 moves, it can drive multiple optoelectronic components placed thereon to the cutting station in sequence, and the function is to improve the cutting switching efficiency of a large number of optoelectronic components.

[0023] Specifically, the mobile positioning table 2 includes a base 21, a placement plate 22, and a pressing member 23. The base 21 is fixedly connected to the cutting table 1. The placement plate 22 is slidably connected to the top of the base 21 in the front-back direction, and a placement seat 221 arranged along the length direction is detachably connected to its top. The placement seat 221 is used to place optoelectronic components. The placement seat 221 is connected to the placement plate 22 by bolts. The structure of the placement seat 221 is determined according to the structure of the optoelectronic component, that is to say, the specific structure of the placement seat 221 is determined according to the structure of the optoelectronic component to be cut. When other optoelectronic components need to be cut, only the different placement seat 221 needs to be replaced. When the placement plate 22 moves, each optoelectronic component can be sequentially driven to the cutting station.

[0024] Furthermore, pressing members 23 corresponding one by one to the placement seats 221 arranged in the length direction are provided on the placement plate 22. The function of the pressing members 23 is to clamp and fix the optoelectronic components on the placement seats 221, avoiding the problem that the optoelectronic components shake during cutting, which affects the cutting accuracy.

[0025] A column 4 located on one side of the mobile positioning table 2 is fixedly connected to the top of the cutting table 1. A cantilever 5 is fixedly connected to one side of the column 4. A driving slide 6 that slides left and right is provided on the cantilever 5. The top of the driving slide 6 is fixedly connected to a laser cutter 3 through a lifting rod 7. The space below the laser cutter 3 is the cutting station. The left-right movement function of the laser cutter 3, combined with the front-back movement function of the mobile positioning table 2, enables the cutting device to easily cut the optoelectronic components comprehensively. Among them, the lifting rod 7 can be an electric push rod or a control cylinder, and its function is to adjust the height of the laser cutter 3.

[0026] In this embodiment, a rack 224 is fixedly provided at the bottom of the placement plate 22. A transmission gear 211 meshing with the rack 224 is provided on the base 21. When the transmission gear 211 rotates, it drives the rack 224 to move by the meshing action, thereby driving the placement plate 22 to move.

[0027] Furthermore, a guide rail 222 is fixedly connected to the bottom of the placement plate 22. A guide seat 212 that slidably cooperates with the guide rail 222 is fixedly connected to the top of the base 21. A control motor 8 located on one side of the guide seat 212 is fixedly connected to the top of the base 21. The output shaft of the control motor 8 is fixedly connected to the transmission gear 211. The control motor 8 is a servo motor, and the control motor 8 provides driving force for the rotation of the transmission gear 211.

[0028] In this embodiment, the pressing member 23 includes a pressing cylinder 231 and a pressing block 232. The pressing cylinder 231 is fixedly arranged at the bottom of the placing plate 22, and its output shaft is fixedly connected with a pressing arm 2311 located above the placing seat 221. The pressing block 232 is fixedly arranged at the bottom of the pressing arm 2311. When the pressing cylinder 231 operates, it can drive the pressing block 232 to press the optoelectronic components on the adjacent placing seat 221. The pressing block 232 and the pressing arm 2311 can be connected by bolts, which is convenient for replacing the pressing block 232.

[0029] Furthermore, a protective rubber pad 2321 is bonded to the bottom of the pressing block 232. The function of the protective rubber pad 2321 is to avoid damaging the optoelectronic components.

[0030] In this embodiment, one side of the driving slide 6 penetrates and is fixedly connected with a guiding sleeve 61 sleeved outside the cantilever 5. The top of the cantilever 5 is rotatably connected with an adjusting lead screw 9. The adjusting lead screw 9 and the driving slide 6 are threadedly engaged. When the adjusting lead screw 9 rotates, it can drive the driving slide 6 to slide on the cantilever 5 by means of the screwing action, so as to control the left and right movement of the laser cutter 3. A driving motor 101 with an output shaft fixedly connected to one end of the adjusting lead screw 9 is fixedly connected to the top of the cantilever 5. The driving motor 101 provides driving force for the rotation of the adjusting lead screw 9.

[0031] Working principle: During use, when a large number of optoelectronic components need to be cut, start the control motor 8. The placing plate 22 moves in one direction to the limit position, and then control the pressing cylinder 231 to drive the pressing block 232 to move upward. Then, place each optoelectronic component corresponding on each placing seat 221, and then control all the pressing cylinders 231 to reset. At this time, all the optoelectronic components are individually pressed. When cutting is required, control the placing plate 22 to move, driving one optoelectronic component to the cutting station. Then, control the laser cutter 3 to descend and cut through the adjusting lead screw 9 and the lifting rod 7. After the current optoelectronic component is cut, control the placing seat 221 to move, so that the cut optoelectronic component is moved out of the cutting station, and the adjacent uncut optoelectronic component enters the cutting station. Then, continue to control the laser cutter 3 to cut. At the same time, control the pressing cylinder 231 corresponding to the cut optoelectronic component to drive the pressing block 232 to rise, and then replace the cut optoelectronic component with the uncut optoelectronic component to realize the loading and unloading operation.

[0032] In addition, it should be understood that although this specification is described according to the embodiments, not each embodiment only includes an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A laser cutting device for optoelectronic components, comprising a cutting table (1), a moving positioning table (2) located at the top of the cutting table (1), and a laser cutter (3) located above the moving positioning table (2), characterized in that, The mobile positioning table (2) includes a base (21), a placement plate (22) and a pressing member (23). The placement plate (22) is slidably connected to the top of the base (21) in the front-back direction, and placement seats (221) arranged along the length direction are detachably connected to its top. Pressing members (23) corresponding one-to-one to the placement seats (221) arranged along the length direction are provided on the placement plate (22). A column (4) located on one side of the mobile positioning table (2) is fixedly connected to the top of the cutting table (1). A cantilever (5) is fixedly connected to one side of the column (4). A driving slide seat (6) that slides left and right is provided on the cantilever (5). The top of the driving slide seat (6) is fixedly connected to a laser cutter (3) through a lifting rod (7).

2. The laser cutting device for optoelectronic components according to claim 1, wherein: A rack (224) is fixedly provided at the bottom of the placement plate (22). A transmission gear (211) meshing with the rack (224) is provided on the base (21).

3. The laser cutting device for optoelectronic components according to claim 2, characterized in that: A guide rail (222) is fixedly connected to the bottom of the placement plate (22). A guide seat (212) slidably matched with the guide rail (222) is fixedly connected to the top of the base (21). A control motor (8) located on one side of the guide seat (212) is fixedly connected to the top of the base (21). The output shaft of the control motor (8) is fixedly connected to the transmission gear (211).

4. The laser cutting device for optoelectronic components according to claim 1, wherein: The pressing member (23) includes a pressing cylinder (231) and a pressing block (232). The pressing cylinder (231) is fixedly provided at the bottom of the placement plate (22), and its output shaft is fixedly connected to a pressing arm (2311) located above the placement seat (221). The pressing block (232) is fixedly provided at the bottom of the pressing arm (2311).

5. The laser cutting device for optoelectronic components according to claim 4, wherein: A protective rubber pad (2321) is adhesively bonded to the bottom of the pressing block (232).

6. The laser cutting device for optoelectronic components according to claim 1, characterized in that: One side of the driving slide seat (6) penetrates and is fixedly connected to a guide sleeve (61) sleeved outside the cantilever (5). An adjusting lead screw (9) is rotatably connected to the top of the cantilever (5). The adjusting lead screw (9) is threadedly connected to the driving slide seat (6) through penetration.

7. A laser cutting device for optoelectronic components according to claim 6, characterized in that: A driving motor (101) with an output shaft fixedly connected to one end of the adjusting lead screw (9) is fixedly connected to the top of the cantilever (5).

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