Semiconductor substrate grinding disc

Abstract

The utility model discloses a semiconductor substrate grinding disc, which relates to the technical field of semiconductor substrate grinding and comprises a circular disc body. A plurality of grinding blocks are evenly arranged on the lower side of the disc body, a skirt belt surrounds the circumferential side of the disc body, and the lower end of the skirt belt is not lower than the lower side faces of the grinding blocks. According to the grinding disc, the skirt belt surrounding the disc body is adopted, the skirt belt rotates and moves along with the grinding disc in the grinding process, the skirt belt can clean and remove chippings on the upper side of a substrate, and the chippings are prevented from entering the lower side of the grinding disc again; chippings generated on the lower side of the grinding disc are discharged through the notch under the rotating action of the grinding disc; chipping accumulation on the working surface is reduced, and the grinding quality is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor substrate grinding, in particular to a grinding disc for semiconductor substrates. Background Art

[0002] Semiconductor substrate grinding is an important step in the semiconductor manufacturing process. The main purposes of grinding are as follows: to improve the surface flatness, ensure the smoothness of the substrate surface to reduce problems in subsequent processing; to remove surface defects such as scratches and particles to improve the substrate quality; to reach a specific thickness to meet the requirements of device manufacturing. For example, the utility model patent with the publication number CN209850657U, a semi-consolidated grinding disc for semiconductor substrate grinding, and the utility model patent with the publication number CN214980196U, a diamond structure grinding disc for semiconductor substrate grinding; both can realize the grinding of semiconductor substrates, and groove structures are arranged on the grinding discs to play the roles of cooling, chip accommodation, and chip removal. However, the above-mentioned existing technologies have the following deficiencies: During the process of the grinding disc rotating and moving on the upper side of the semiconductor substrate, the existing debris on the semiconductor substrate cannot be isolated, resulting in debris accumulation, which interferes with further grinding work and grinding quality. Summary of the Utility Model

[0003] The purpose of the utility model is to solve the problems in the above-mentioned existing technologies and provide a grinding disc for semiconductor substrates.

[0004] To achieve the above purpose, the utility model provides the following technical solutions:

[0005] A grinding disc for semiconductor substrates includes a circular disc body; a number of grinding blocks are evenly arranged on the lower side of the disc body, a skirt is wound around the circumferential side of the disc body, the lower end of the skirt is not lower than the lower side of the grinding blocks, and a number of notches are evenly arranged on the lower part of the skirt.

[0006] Further, a number of skirts are provided, and the number of skirts surround the disc body with their heads and tails abutting against each other.

[0007] Further, a pressing piece is arranged on the outer side of the skirt, a number of bolts are evenly penetrated through the pressing piece, and the bolts pass through the skirt and are threadedly connected with the circumferential side of the disc body.

[0008] Further, the grinding blocks include a first grinding block and a second grinding block, both of which are disc-shaped. The outer diameter of the first grinding block is larger than that of the second grinding block; the first grinding block and the second grinding block are both arranged in a plum blossom shape evenly; the first grinding block and the second grinding block are arranged staggeredly.

[0009] Further, a number of liquid leakage holes are evenly arranged on the circumferential edge of the disc body, the upper and lower ends of the liquid leakage holes extend to the upper and lower sides of the disc body respectively, and the liquid leakage holes surround the grinding blocks.

[0010] Furthermore, a groove is provided on the upper side of the disk body, and the upper port of the leakage hole is located in the groove.

[0011] Furthermore, the annular edge at the upper end of the disk body extends horizontally toward the center to form a horizontal annular baffle, and the leakage hole is located below the annular baffle.

[0012] Furthermore, a central axis is provided on the upper side of the middle portion of the disk body, and a flange is connected to the upper end of the central axis.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] The utility model adopts a skirt belt surrounding the disc body, which rotates and moves with the grinding disc during the grinding process. The skirt belt can clean and remove the existing debris on the upper side of the substrate and prevent the existing debris from entering the lower side of the grinding disc again; the gap is used for the debris generated on the lower side of the grinding disc to be discharged under the rotation of the grinding disc; the accumulation of debris on the working surface is reduced, and the grinding quality is guaranteed;

[0015] The skirt belt of the utility model is detachable, so damaged skirt belts can be replaced easily; the grinding blocks adopt a disc-shaped structure, and the chip removal grooves formed between the grinding blocks have rounded corners, which is conducive to chip removal; and the disc body is provided with leakage holes, so that the sprayed grinding liquid can pass through the disc body and enter the grinding working surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model from the first viewing angle.

[0017] Figure 2 It is a schematic diagram of the three-dimensional structure of the utility model from a second viewing angle.

[0018] Figure 3 It is a schematic diagram of the structure of the utility model when viewed from above.

[0019] Figure 4 It is an explosion diagram of the utility model.

[0020] Figure 5 It is a schematic diagram of the cutaway state of the annular baffle of the utility model.

[0021] Figure 6 It is a schematic diagram of the grinding state of the utility model.

[0022] In the figure: 1, disc body; 2, grinding block; 3, skirt; 4, notch; 5, pressing plate; 6, bolt; 7, threaded hole; 8, leakage hole; 9, groove; 10, annular baffle; 11, central axis; 12, flange; 13, semiconductor substrate to be ground; 21, first grinding block; 22, second grinding block. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model, that is, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] It should be noted that relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0025] In the description of the present utility model, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" that may appear should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood through specific situations.

[0026] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the term "provided with" that may appear should be understood in a broad sense. For example, the object of "provided with" may be a part of the body, or may be separately arranged from the body and connected to the body, and this connection may be a detachable connection or a non-detachable connection. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood through specific situations.

[0027] The present utility model will be further described in detail below with reference to the embodiments.

[0028] Specific embodiments of the semiconductor substrate grinding disc provided by the present utility model:

[0029] Please refer to Figure 1-6, a semiconductor substrate grinding disc, including a circular disc body 1; a plurality of grinding blocks 2 are evenly arranged on the lower side of the middle of the disc body 1. In this embodiment, the grinding blocks 2 include a first grinding block 21 and a second grinding block 22, both of which are disc-shaped. The outer diameter of the first grinding block 21 is larger than that of the second grinding block 22; the first grinding block 21 and the second grinding block 22 are both arranged in a plum blossom shape evenly; the first grinding block 21 and the second grinding block 22 are evenly staggered and interspersed. The lower side of the grinding block is evenly inlaid with abrasive grains, and the abrasive grains are preferably diamond abrasive grains.

[0030] The second grinding block 22 with a small outer diameter fills the gap between the first grinding blocks 21 with a large outer diameter, ensuring that the grinding disc has a large enough grinding surface; there is a gap between adjacent grinding blocks, forming a chip discharge groove, which plays a role in cooling, chip accommodation, and chip discharge. The corners of the disc-shaped grinding block are rounded. Compared with the utility model patents with publication numbers CN209850657U, a semi-consolidated grinding disc for semiconductor substrate grinding, and CN214980196U, a diamond structure grinding disc for semiconductor substrate grinding, in the prior art, it is more conducive to chip discharge, without excessive corners, reducing chip storage dead zones, and ensuring grinding quality.

[0031] A skirt 3 is wound around the circumferential side of the disc body 1, and a plurality of skirts 3 are provided. The plurality of skirts 3 are abutted end to end and wound around the disc body 1. In this embodiment, two skirts 3 are provided, and the material is a rubber band. Both of the two skirts 3 are semi-circular and can be wound around the disc body 1 to form a ring.

[0032] The lower end of the skirt 3 is not lower than the lower side of the grinding block 2. Specifically, the lower end of the skirt 3 can be flush with the lower side of the grinding block 2 and fit on the upper side of the semiconductor substrate 13 to be ground during work; or the lower end of the skirt 3 is slightly higher than the lower side of the grinding block 2 and there is a small gap between the upper side of the skirt 3 and the semiconductor substrate 13 to be ground during work. As Figure 1 、 Figure 2 and Figure 4 shown, a plurality of notches 4 are evenly arranged at the lower part of the skirt 3.

[0033] In order to facilitate the replacement of the skirt 3, a pressing piece 5 made of metal is provided on the outer side of the skirt 3. A plurality of bolts 6 are evenly penetrated through the pressing piece 5. The bolts 6 pass through the skirt 3 and are threadedly connected with the circumferential side of the disc body 1; in this embodiment, an internal thread hole 7 matched with the bolt 6 is provided on the circumferential side of the disc body 1.

[0034] When grinding, the disk body 1 rotates and moves laterally on the upper side of the semiconductor substrate 13 to be ground. The skirt 3 rotates and moves accordingly. The rotating skirt 3 forms an annular barrier to prevent the debris ground on the upper side of the semiconductor substrate 13 to be ground from entering the inner side of the skirt 3, thereby preventing the existing debris from affecting the grinding work. When the disk body 1 and the skirt 3 move, the skirt 3 pushes the external debris and can push the debris off the surface of the semiconductor substrate 13 to be ground. Under the rotating action of the disk body 1 and the skirt 3, some of the debris centrifugally thrown out by the grinding block 2 can directly pass through the notch 4 and be discharged to the outside of the skirt 3, and some of the debris not corresponding to the notch 4 is blocked by the skirt 3, and the rotating action of the skirt 3 causes some of this part of the debris to be discharged from the notch 4.

[0035] In this embodiment, during the grinding work, the grinding liquid is sprayed from above. A number of liquid leakage holes 8 are uniformly arranged on the circumferential edge of the disk body 1. The upper and lower ends of the liquid leakage holes 8 respectively extend to the upper and lower sides of the disk body 1, and the liquid leakage holes 8 surround the grinding block 2. The grinding liquid is sprayed on the upper side of the disk body 1 from above, and can leak through the liquid leakage holes 8 and fall on the upper side of the semiconductor substrate 13 to be ground and enter the grinding working surface. The grinding liquid entering the grinding working surface cools the grinding work and is centrifugally thrown out from the grinding working surface, which can wash away the debris on the inner side of the skirt 3 without the notch 4 and prevent the accumulation of debris.

[0036] In this embodiment, a groove 9 is provided on the upper side of the disk body 1, and the upper port of the liquid leakage hole 8 is located in the groove 9; the upper annular edge of the disk body 1, that is, the upper end of the outer annular groove wall of the groove 9 extends horizontally towards the center to form a horizontal annular baffle 10, and the liquid leakage hole 8 is located below the annular baffle 10.

[0037] Due to the rotating action of the disk body 1, during the actual grinding work, if there is no groove 9, most of the grinding liquid is scattered and directly discharged by the rotating disk body 1, and only a small amount of grinding liquid can enter the liquid leakage hole 8. By providing the groove 9 and the annular baffle 10, the grinding liquid falling into the groove 9 is scattered and enters between the lower side of the annular baffle 10 and the groove 9 and the liquid leakage hole 8, so that most of the grinding liquid can enter the liquid leakage hole 8, and then supply enough grinding liquid to the grinding working surface.

[0038] A central shaft 11 is provided on the upper side of the middle of the disk body 1. The upper end of the central shaft 11 is connected with a flange 12, and is connected to an external driving device through the flange 12. The external driving device drives the disk body 1 to rotate and move to grind the semiconductor substrate 13 to be ground.

[0039] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications to the technical solutions recorded in the foregoing embodiments without creative efforts, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A semiconductor substrate grinding disc, comprising a circular disc body (1); characterized in that: A number of grinding blocks (2) are evenly arranged on the lower side of the disk body (1). A skirt (3) is wound around the circumferential side of the disk body (1). The lower end of the skirt (3) is not lower than the lower side surface of the grinding blocks (2). A number of notches (4) are evenly arranged on the lower part of the skirt (3).

2. The semiconductor substrate polishing pad according to claim 1, wherein: A number of skirts (3) are provided. The number of skirts (3) are wound around the disk body (1) with their heads and tails butting against each other.

3. The semiconductor substrate polishing pad according to claim 1 or 2, characterized in that: A pressing piece (5) is arranged on the outer side of the skirt (3). A number of bolts (6) are evenly inserted through the pressing piece (5). The bolts (6) pass through the skirt (3) and are threadedly connected to the circumferential side of the disk body (1).

4. The semiconductor substrate polishing pad according to claim 1, wherein: The grinding block (2) includes a first grinding block (21) and a second grinding block (22) both in a disk shape. The outer diameter of the first grinding block (21) is larger than the outer diameter of the second grinding block (22). The first grinding block (21) and the second grinding block (22) are both evenly arranged in a plum blossom shape. The first grinding block (21) and the second grinding block (22) are arranged staggeredly.

5. The semiconductor substrate polishing pad according to claim 1, wherein: A number of liquid leakage holes (8) are evenly arranged on the circumferential edge of the disk body (1). The upper and lower ends of the liquid leakage holes (8) respectively extend to the upper and lower side surfaces of the disk body (1). The liquid leakage holes (8) surround the grinding blocks (2).

6. The semiconductor substrate polishing pad according to claim 5, wherein: A groove (9) is arranged on the upper side surface of the disk body (1). The upper ports of the liquid leakage holes (8) are located in the groove (9).

7. The semiconductor substrate polishing pad according to claim 6, wherein: The upper annular edge of the disk body (1) extends horizontally towards the center to form a horizontal annular baffle (10). The liquid leakage holes (8) are located below the annular baffle (10).

8. The semiconductor substrate polishing pad according to claim 1, wherein: A central shaft (11) is arranged on the upper side of the middle part of the disk body (1). A flange (12) is connected to the upper end of the central shaft (11).

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