Cutting assembly and wire cutting machine

Abstract

The utility model relates to the technical field of cutting equipment, in particular to a cutting assembly and a wire cutting machine. The wire cutting machine aims at solving the problem that when a collecting component of an existing wire cutting machine is taken down from a rail, cutting liquid dripping from the collecting component can pollute the working environment. Therefore, the cutting assembly comprises a cutting frame provided with a discharge port communicated with a cutting cavity; the collecting component is used for collecting the cut silicon wafers; the track extends into the cutting cavity, and the collecting component can move out of the cutting cavity along the track; and when the collecting component is taken down from the track, the flow guide component can receive the cutting fluid falling from the collecting component. The flow guide assembly is arranged to receive the cutting fluid falling from the collecting component, so that the cutting fluid can be prevented from polluting the working environment of the wire cutting machine, and waste of the cutting fluid can be avoided.

Description

Technical Field

[0001] This application relates to the technical field of cutting equipment, and particularly relates to a cutting assembly and a wire cutting machine. Background Art

[0002] Wire cutting is a processing method in which a cutting wire moves reciprocally at a high speed and relatively moves with a crystal bar (such as materials like photovoltaic silicon bars, semiconductors, silicon carbide, sapphire, or magnetic materials) to cut the crystal bar with the cutting wire.

[0003] Taking diamond wire cutting as an example, during the cutting process, the crystal bar is bonded to the crystal holder, the crystal holder is installed on the feeding device, the feeding device drives the crystal bar to make a feeding movement along the direction close to the cutting wire, the cutting wire cuts the crystal bar into multiple silicon wafers, the cut silicon wafers are received by the collecting member and transported outside the cutting chamber, and then the collecting member and the silicon wafers inside the collecting member are removed from the track together and transferred to a dedicated wafer taking station. However, when the collecting member is removed from the track, the cutting fluid attached to the collecting member will drip downward, polluting the working environment of the wire cutting machine.

[0004] Correspondingly, the art needs a new technical solution to solve the above problems. Utility Model Content

[0005] In order to solve at least one of the above problems in the prior art, that is, to solve the problem that when the collecting member of the existing wire cutting machine is removed from the track, the cutting fluid dripping from the collecting member will pollute the working environment.

[0006] In a first aspect, this application provides a cutting assembly, including:

[0007] A cutting frame, within which a cutting chamber is formed, and a discharge port communicating with the cutting chamber is provided on the cutting frame;

[0008] A collecting member, which is located within the cutting chamber and is used for collecting silicon wafers;

[0009] A track, a part of which passes through the discharge port and extends into the cutting chamber, and the collecting member can move along the track to the outside of the cutting chamber; and

[0010] A diversion assembly, when the collecting member is removed from the track, the diversion assembly can receive the cutting fluid falling from the collecting member.

[0011] By setting the diversion assembly to receive the cutting fluid falling from the collecting member, it can avoid the cutting fluid from polluting the working environment of the wire cutting machine and also avoid waste of the cutting fluid.

[0012] In the preferred technical solution of the above-mentioned cutting assembly, the diversion assembly includes a first diversion plate. There is a first collection port at the top of the first diversion plate, and the cutting fluid can pass through the first collection port and enter the first diversion plate.

[0013] In the preferred technical solution of the above-mentioned cutting assembly, a first diversion opening is provided on the first diversion plate, and the cutting fluid in the first diversion plate can flow out from the first diversion opening and drip onto the bottom of the track or the cutting chamber.

[0014] By providing a first diversion opening on the first diversion plate, the cutting fluid in the first diversion plate can directly flow onto the track and flow back into the cutting chamber along the track, eliminating the need to set up a drain pipe to connect the first diversion plate and the cutting chamber. The structure is more simplified and is conducive to cost reduction.

[0015] In the preferred technical solution of the above-mentioned cutting assembly, the first diversion plate includes a first bottom plate, two relatively arranged first side plates, and two relatively arranged first end plates. The first bottom plate, the two first side plates, and the two first end plates jointly enclose a water-containing space, and the first diversion opening is formed on the first end plate.

[0016] Through the above settings, the structure is more simplified, which is conducive to cost reduction and convenient for layout.

[0017] In the preferred technical solution of the above-mentioned cutting assembly, the cutting assembly further includes a moving trolley installed on the track. The collection member is placed on the moving trolley, and the moving trolley can move along the track. The first diversion plate is arranged on the moving trolley.

[0018] By providing a moving trolley on the track and installing the collection member on the moving trolley, it is convenient to remove the collection member and the silicon wafers in the collection member together through an automated device, and then replace the collection member with a new one, thereby further improving the processing efficiency.

[0019] In the preferred technical solution of the above-mentioned cutting assembly, the first bottom plate is fixedly connected or integrally provided with the moving trolley. The first side plate extends along the length direction of the moving trolley, and the bottom end of the first side plate is fixedly connected or integrally provided with the first bottom plate. The first end plate extends along the width direction of the moving trolley, and the bottom end of the first end plate is fixedly connected or integrally provided with the first bottom plate.

[0020] In the preferred technical solution of the above-mentioned cutting assembly, the diversion assembly further includes a diversion box arranged on the track. A second diversion opening is provided on the track. The diversion box is located below the track and is communicated with the second diversion opening. The diversion box is communicated with the cutting chamber through a drain pipe.

[0021] By arranging a diversion box at the bottom of the track and providing a second diversion opening communicating with the diversion box, it is beneficial to collect the cutting fluid located on the track and avoid the accumulation of the cutting fluid on the track.

[0022] In the preferred technical solution of the above cutting assembly, the diversion assembly includes a second diversion plate arranged on the side of the track. A second collection port is provided at the top of the second diversion plate, and the cutting fluid can pass through the second collection port and enter the second diversion plate.

[0023] By arranging a second diversion plate on the side of the track, during the process of removing the silicon wafer from the collection member, the cutting fluid dripping from the silicon wafer will fall onto the second diversion plate to prevent the cutting fluid from dripping onto other places.

[0024] In the preferred technical solution of the above cutting assembly, the second diversion plate includes a second bottom plate, second side plates, and two relatively arranged second end plates. One side of the second bottom plate is fixedly connected to the side wall of the track. The second side plates extend along the length direction of the track, and the bottom end of the second side plates is fixedly connected or integrally formed with the other side of the second bottom plate. The bottom ends of the second end plates are fixedly connected or integrally formed with the second bottom plate, and the left and right ends of the second end plates are respectively connected to the side wall of the track and the second side plates.

[0025] Through the above arrangement, the structure is simpler, which is beneficial to reducing costs and facilitating layout.

[0026] In the preferred technical solution of the above cutting assembly, the second side plates are inclined upward along the direction away from the track.

[0027] Through the above arrangement, it is convenient to make the second diversion box cover a larger receiving area, and the effect is better.

[0028] In the preferred technical solution of the above cutting assembly, the second diversion plate is communicated with the cutting chamber through a drain pipe.

[0029] By arranging a drain pipe to communicate the second diversion plate with the cutting chamber, there is no need to make the second diversion plate extend into the inside of the cutting chamber, which can reduce the space occupied by the second diversion plate, facilitate layout and reduce costs.

[0030] In the second aspect of the present application, a wire cutting machine is further provided. The wire cutting machine includes the cutting assembly described in the above technical solution.

[0031] The wire cutting machine further provided by the present application on the basis of the above technical solution includes the above cutting assembly, and thus has the technical effects possessed by the above cutting assembly. Compared with the wire cutting machine before improvement, the wire cutting machine of the present application has higher processing efficiency and can effectively avoid the waste of cutting fluid. Brief Description of the Drawings

[0032] The wire cutting machine of the present application will be described below with reference to the drawings. In the drawings:

[0033] Figure 1 is a schematic structural diagram of the wire cutting machine of the present application;

[0034] Figure 2 is a schematic structural diagram of the cutting assembly of the present application Figure 1 ;

[0035] Figure 3 is a schematic structural diagram of the cutting assembly of the present application Figure 2 ;

[0036] Figure 4 is a schematic structural diagram of the debris box device of the present application;

[0037] Figure 5 is a schematic structural diagram of the spray degumming device of the present application;

[0038] Figure 6 is a schematic structural diagram of the cutting assembly of the present application Figure 3 ;

[0039] Figure 7 is a schematic structural diagram of the cutting assembly of the present application Figure 4 ;

[0040] Figure 8 is a schematic structural diagram of the cutting assembly of the present application Figure 5 ;

[0041] Fig. 9 is a schematic structural diagram of the cutting assembly of the present application Figure 6 ;

[0042] Fig.10 is a schematic structural diagram of the track, moving trolley and chain of the cutting assembly of the present application;

[0043] Fig.11 is a schematic structural diagram of the chain of the second drive assembly of the present application;

[0044] Fig.12 is a schematic structural diagram of the water retaining device of the present application Figure 1 ;

[0045] Fig.13 is a schematic structural diagram of the water retaining device of the present application Figure 2 ;

[0046] Fig.14 is a cross-sectional view of the water retaining device of the present application;

[0047] Fig.15Top view of the guide plate of the water retaining device of the present application;

[0048] Fig.16 Top view of the water retaining block of the water retaining device of the present application.

[0049] Reference numerals list

[0050] 10. Cutting frame; 11. Discharge port; 13. Upper main roller; 14. Lower main roller; 15. Wire mesh; 16. Collection member; 17. Crystal bar;

[0051] 20. Feeding device;

[0052] 21. Flow deflector; 22. Debris box; 211. Long plate; 212. Short plate; 213. Hanging ear; 2111. Flanging structure; 221. Water retaining plate; 222. Box bottom plate; 223. Box side plate; 2211. First water retaining flange; 2212. Second water retaining flange; 2221. Connecting flange; 2222. Connecting column;

[0053] 3. Spray degumming device; 31. Spray pipe; 32. Nozzle; 33. Protection member; 331. First guard plate; 332. Second guard plate;

[0054] 41. Track; 42. Mobile trolley; 43. Sprocket; 44. Chain; 45. Second motor; 46. Driving pulley; 47. Driven pulley; 48. Timing belt; 49. Storage box; 411. Horizontal guide rail; 412. Strip-shaped groove; 4121. Straight section; 4122. Arc section; 441. Body; 442. Rotating shaft; 443. Roller;

[0055] 51. Lifting seat; 52. First motor; 53. Lift; 54. Guide post; 55. Linear bearing; 56. Fixed seat;

[0056] 6. Clamping assembly; 61. Airbag; 62. Clamping plate; 621. Elastic buffer pad;

[0057] 7. Water retaining device; 71. First water retaining member; 72. Second water retaining member; 73. Third water retaining member; 74. Guide plate; 75. Fixed frame; 711. First water retaining plate; 712. Second water retaining plate; 713. Connecting plate; 714. Third water retaining plate; 741. First guide groove; 742. Second guide groove; 743. Guide rib; 731. Third guide groove; 751. Water receiving groove;

[0058] 81. First flow deflector; 82. Second flow deflector; 83. Flow deflector box; 811. First bottom plate; 812. First side plate; 813. First end plate; 814. First flow deflector opening; 821. Second bottom plate; 822. Second side plate; 823. Second end plate. Detailed implementation manners

[0059] The preferred implementation manners of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these implementation manners are only used to explain the technical principle of the present application and are not intended to limit the protection scope of the present application.

[0060] It should be noted that in the description of the present application, terms indicating directions or positional relationships such as "left" and "right" are based on the directions or positional relationships shown in the accompanying drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0061] In addition, it should also be noted that in the description of the present application, unless otherwise clearly specified and limited, the terms "installed", "set", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0062] Specifically, the present application provides a wire cutting machine. As Figure 1 shown, the wire cutting machine of the present application includes a cutting assembly, a feeding device 20, and a wire winding assembly (not shown in the figure).

[0063] Among them, the cutting assembly includes a plurality of main rollers and a main roller motor for driving the main rollers to rotate. The plurality of main rollers are generally arranged in parallel and are located in the cutting chamber of the wire cutting machine. The plurality of main roller motors are respectively drivingly connected to the corresponding main rollers, and the main roller motors can drive their respective main rollers to rotate. A cutting wire is arranged on the main rollers, and the cutting wire is spirally arranged on the plurality of main rollers at a certain distance to form a wire mesh 15. The multi-wire cutting work is realized by the grinding between the wire mesh 15 and the ingot 17.

[0064] It should be noted that the number of main rollers can be three, four, etc. Correspondingly, the number of main roller motors for driving the main rollers to rotate can also be three, four, etc. Such adjustments and changes to the specific number of main rollers do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0065] Among them, the winding assembly includes a wire pay-off and take-up mechanism and a tension mechanism. The wire pay-off and take-up mechanism is used for paying off and taking up the cutting wire. The number of wire pay-off and take-up mechanisms is two, which are respectively located on both sides of the cutting assembly. During the working process, one is used for paying off the cutting wire, and the other is used for taking up the cutting wire. The tension mechanism is used for controlling the tension of the cutting wire to ensure that the entire cutting wire is stretched and tightened by the tension during operation.

[0066] Among them, the wire pay-off and take-up mechanism includes a wire roller and a wire roller motor for driving the wire roller to rotate. The cutting wire is wound around the wire roller. When the wire roller motor drives the wire roller to rotate forward, the wire roller is in the wire pay-off state. When the wire roller motor drives the wire roller to rotate backward, the wire roller is in the wire take-up state.

[0067] Among them, the tension mechanism includes a tension swing rod, a tension guide wheel, and a swing rod motor for driving the tension swing rod to swing. The bottom end of the tension swing rod is fixedly connected to the output shaft of the swing rod motor, and the tension guide wheel is rotatably installed at the top end of the tension swing rod.

[0068] It should be noted that in addition to the wire pay-off and take-up mechanism and the tension mechanism introduced above, the winding assembly also includes a wire arranging mechanism and a turning wheel mechanism. Among them, the wire arranging mechanism is installed between the wire roller and the tension mechanism and is used for arranging the cutting wire on the wire roller with a certain pitch. The turning wheel mechanism is installed between the tension mechanism and the main roller and is used for changing the direction of the cutting wire so that the cutting wire can be smoothly wound on the main roller. The wire cutting machine of the present application can adopt wire arranging mechanisms and turning wheel mechanisms of any structural form in the prior art.

[0069] In order to solve the problem of low cutting efficiency existing in the existing wire cutting machines, the present application provides a brand-new cutting assembly. As shown in Figure 1 , Figure 2 , Figure 3 and Figure 7 , the cutting assembly of the present application includes a cutting frame 10, a blanking device, and a main roller assembly and a degumming device installed on the cutting frame 10.

[0070] Among them, a cutting chamber is formed inside the cutting frame 10. The cutting frame 10 is provided with a discharge port 11 communicating with the cutting chamber. The main roller assembly is located inside the cutting chamber. Each main roller in the main roller assembly is rotatably arranged between two opposite side walls of the cutting frame 10. The cutting wire is wound around the main roller assembly to form a wire mesh 15. A feed opening communicating with the cutting chamber is formed at the top of the cutting frame 10. The feed device 20 of the wire cutting machine is installed at the feed opening at the top and can perform a feed movement in the vertical direction.

[0071] It should be noted that the feed direction is not limited to the vertical direction. For example, it can also be fed horizontally or obliquely. The technical solution of the present application will be continued to be introduced below by taking the vertical feed as an example.

[0072] A crystal bar assembly can be mounted on the feeding device 20, such as Figure 3 shown. The crystal bar assembly includes multiple crystal bars 17 adhesively bonded together in the vertical direction. The feeding device 20 is used to feed the crystal bar assembly towards the wire mesh 15. The wire mesh 15 can cut the crystal bars into multiple silicon wafers. The debonding device can debond the cut silicon wafers, and the blanking device can receive the debonded silicon wafers and transport them outside the cutting chamber.

[0073] It should be noted that those skilled in the art can also mount only one crystal bar on the feeding device 20 in actual applications.

[0074] Preferably, as Figure 3 and Figure 7 shown, the blanking device includes a collecting member 16. The collecting member 16 is located inside the cutting chamber and corresponds to the discharge port 11. More specifically, the collecting member 16 is located in the space surrounded by the wire mesh 15. The collecting member 16 is used to collect the debonded silicon wafers, and moreover, the collecting member 16 can pass through the discharge port 11 to transport the collected silicon wafers outside the cutting chamber.

[0075] It should be noted that multiple crystal bars 17 (such as two, three, or four, etc.) are adhesively bonded together in the feeding direction to form a crystal bar assembly. Adjacent crystal bars 17 are adhesively bonded with glue to form an adhesive layer. The axes of all crystal bars 17 are arranged in the vertical direction. The feeding device 20 drives the crystal bar assembly to feed towards the wire mesh 15. During the feeding process, the multiple crystal bars 17 are successively cut into multiple silicon wafers by the wire mesh 15, improving the cutting efficiency.

[0076] Preferably, as Figure 2 and Figure 3 shown, the main roller assembly of the present application includes a first main roller 13 and a second main roller 14. The first main roller 13 and the second main roller 14 are spaced apart in the vertical direction (i.e., the feeding direction). The number of the first main rollers 13 is two and they are spaced apart in the horizontal direction. The number of the second main rollers 14 is two and they are spaced apart in the horizontal direction.

[0077] That is to say, the main roller assembly of the present application includes four main rollers arranged in parallel. Among them, two first main rollers are located above, and two second main rollers are located below. An upper wire mesh is formed between the two first main rollers 13, and a lower wire mesh is formed between the two second main rollers 14. The upper wire mesh is used to cut the crystal bars 17 and can also be called the cutting section. The collecting member 16 is located between the upper wire mesh and the lower wire mesh and is used to collect silicon wafers.

[0078] It should be noted that the number of the lower main rollers 14 is not limited to the above two. For example, only one lower main roller can also be provided.

[0079] In addition, it should be noted that the present application does not limit the specific structural form of the collection member 16. For example, those skilled in the art can set the collection member 16 as a housing structure ( Figure 7 the collection member 16 shown in Figure 8 is a housing structure), or the collection member 16 can also be set as a frame structure (

[0080] the collection member 16 shown in Figure 3 is a frame structure), or the collection member 16 can also be set as a flat plate structure, etc. Such adjustments and changes to the specific structural form of the collection member 16 do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0081] Preferably, as shown in

[0082] Figure 3 Figure 3 the wire mesh wrap angle of the upper main roller 13 and / or the wire mesh wrap angle of the lower main roller 14 is not less than 80°.

[0083] By limiting the wire mesh wrap angle of the main rollers (the upper main roller 13 and the lower main roller 14) to be not less than 80°, it is possible to ensure that there is sufficient friction between the main rollers and the wire mesh 15, avoid wire jumping and slipping, and ensure the normal operation of the main roller assembly. Figure 7 Preferably, as shown in

[0084] the collection member 16 of the present application is a housing that is closed at the bottom and around, and the top of the housing has an opening allowing the ingot 17 to pass through.

[0085] That is to say, the bottom and around of the housing are closed. By setting the collection member 16 as a closed housing, some cutting fluid can be injected into the housing. When the silicon wafer falls into the housing, the cutting fluid can play a buffering role to prevent the silicon wafer from being damaged.

[0086] Exemplarily, the collection member 16 is a rectangular housing, and a receiving cavity is formed inside the housing to accommodate the cut silicon wafers. The top of the receiving cavity is open, and after the cut silicon wafers are degummed, they can directly fall into the receiving cavity of the housing. Figure 3 Preferably, as shown in

[0087] the horizontal distance between the two lower main rollers 14 is greater than the horizontal distance between the two upper main rollers 13.By increasing the horizontal spacing between the two lower main rollers 14, the collecting member 16 has a larger installation space, which is convenient for arrangement, and is convenient for collecting silicon wafers and transporting the silicon wafers outside the cutting chamber.

[0088] Preferably, as Figures 2 to 4 shown, the cutting assembly of the present application further includes a debris box device, and the debris box device is installed in the cutting chamber.

[0089] Among them, the debris box device is fixedly connected to the cutting frame 10, the main body part of the debris box device is also located in the space surrounded by the wire mesh 15, and the collecting member 16 is located in the debris box device.

[0090] Preferably, as Figure 3 and Figure 4 shown, the debris box device of the present application includes a diversion cover 21 and a debris box 22 located below the diversion cover 21.

[0091] Among them, both the top and bottom of the diversion cover 21 are open, the diversion cover 21 is located between the two upper main rollers 13, the debris box 22 is located between the two lower main rollers 14, and the collecting member 16 is located in the debris box 22.

[0092] That is to say, the diversion cover 21 is vertically through, and such a setting can enable the ingot 17 to pass through the diversion cover 21. Both the diversion cover 21 and the debris box 22 extend along the axis direction of the upper main roller 13. The diversion cover 21 is located below the upper wire mesh and is mainly used for guiding the cutting fluid. The cutting fluid can drip along the inner wall of the diversion cover 21 into the debris box 22 to prevent the cutting fluid from flowing onto the upper main roller 13. The two ends of the debris box 22 in the length direction are preferably set to be open, so that the cutting fluid in the debris box 22 can flow back to the bottom of the cutting chamber and allows the collecting member 16 to pass through. The bottom of the debris box 22 is closed, which can prevent the cutting fluid from dripping onto the wire mesh located at the bottom of the lower main roller 14.

[0093] Preferably, as Figure 3 and Figure 4 shown, the debris box 22 of the present application is provided with water baffle plates 221 extending towards the outside of the debris box 22 on both sides along its width direction, and the water baffle plates 221 are located above the lower main roller 14.

[0094] By providing the water baffle plates 221 on the debris box 22 and making the water baffle plates 221 located above the lower main roller 14, it can prevent the cutting fluid from dripping onto the lower main roller 14.

[0095] Preferably, as Figure 3 and Figure 4 shown, the top opening of the diversion cover 21 is larger than the bottom opening of the diversion cover 21.

[0096] By increasing the size of the top opening of the deflector 21, more cutting fluid can enter the deflector 21. At the same time, it is also more conducive to enabling the ingot 17 to pass through the deflector 21 smoothly.

[0097] Exemplarily, as Figure 4 shown, the deflector 21 includes two relatively arranged long plates 211 and two relatively arranged short plates 212. Hanging ears 213 are provided on the short plates 212, and the hanging ears 213 are fixedly connected to the inner wall of the cutting chamber. The two long plates 211 and the two short plates 212 together enclose a box structure, and the cross-section of the box structure is rectangular. Flanging structures 2111 that extend obliquely outward are provided at the top ends of the two long plates 211, thereby increasing the size of the top opening of the deflector 21.

[0098] Preferably, as Figure 3 and Figure 4 shown, the water baffle 221 of the present application is inclined upward in a direction away from the debris box 22.

[0099] By arranging the water baffle 221 obliquely, the cutting fluid can flow smoothly into the debris box 22. In addition, the lateral space occupied by the debris box 22 can be reduced, making it more convenient to arrange.

[0100] Exemplarily, as Figure 3 shown, two water baffles 221 are provided at the top of the debris box 22. The water baffle 221 on the left side is inclined upward to the left, and the water baffle 221 on the right side is inclined upward to the right. The two water baffles 221 are arranged in an inverted "V" shape to converge the cutting fluid dripping from above into the debris box 22.

[0101] Preferably, as Figure 3 and Figure 4 shown, a water retaining structure that extends upward is provided at the edge of the water baffle 221 of the present application.

[0102] By providing a water retaining structure at the edge of the water baffle 221 and arranging the water retaining structure to extend upward, it can ensure that the cutting fluid on the water baffle 221 flows smoothly into the debris box 22.

[0103] It should be noted that the water retaining structure can be a flanging formed by bending the edge of the water baffle upward, or it can also be set as a protruding water retaining rib, etc. Such adjustments and changes to the specific structural form of the water retaining structure do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0104] Preferably, as Figure 3 and Figure 4 shown, the water retaining structure of the present application includes two first water retaining flangings 2211 that are spaced apart. The first water retaining flangings 2211 extend from the end of the water baffle 221 away from the debris box 22 to the top of the debris box 22.

[0105] That is, a first water retaining flange 2211 is provided at each of the two edges distributed along the length direction of the water retaining plate 221. The first water retaining flange 2211 extends along the width direction of the water retaining plate 221 and extends from the top end of the water retaining plate 221 to the top of the debris box 22.

[0106] Preferably, as Figure 3 and Figure 4 shown, the first water retaining flange 2211 of the present application is perpendicularly arranged to the water retaining plate 221.

[0107] By arranging the first water retaining flange 2211 perpendicularly to the water retaining plate 221, a better water retaining effect can be achieved.

[0108] Preferably, as Figure 3 and Figure 4 shown, the water retaining structure of the present application further includes a second water retaining flange 2212 located between the two first water retaining flanges 2211. The extending direction of the second water retaining flange 2212 is perpendicular to the extending direction of the first water retaining flange 2211.

[0109] That is, the second water retaining flange 2212 extends along the length direction of the water retaining plate 221. The two ends of the second water retaining flange 2212 are preferably connected to the two first water retaining flanges 2211 respectively. In this way, the water retaining plate 221 can be surrounded, and the water retaining effect is better.

[0110] Preferably, as Figure 3 and Figure 4 shown, the second water retaining flange 2212 of the present application is inclined towards the outside of the debris box 22.

[0111] By arranging the second water retaining flange 2212 to be inclined outwards, the water retaining plate 221 can receive more cutting fluid.

[0112] Wherein, the inclination angle (the included angle with the vertical direction) of the second water retaining flange 2212 is smaller than the inclination angle of the water retaining plate 221. Exemplarily, the inclination angle of the water retaining plate 221 is 45 degrees, and the inclination angle of the second water retaining flange 2212 is 10 degrees.

[0113] Preferably, as Figure 4 shown, the debris box 22 of the present application includes a box bottom plate 222 and two relatively arranged box side plates 223. The bottom of the box side plate 223 is fixedly connected or integrally formed with the box bottom plate 222. The water retaining plate 221 extends from the top of the box side plate 223 towards the outside of the debris box 22.

[0114] Exemplarily, as Figure 4As shown, the box bottom plate 222 is a rectangular plate and is horizontally arranged. The two box side plates 223 are also rectangular plates and are spaced along the width direction of the box bottom plate 222. The two box side plates 223 are vertically arranged and are respectively connected to both sides of the width direction of the box bottom plate 222. The collection member 16 is located between the two box side plates 223. A water baffle 221 extending outwardly and obliquely is provided at the top of each box side plate 223. The two ends of the debris box 22 along the length direction are open. Each end of the box bottom plate 222 is provided with a connecting flange 2221 bent downward. A connecting post 2222 extending horizontally is provided on the connecting flange 2221. The connecting post 2222 is fixedly connected to the cutting frame 10. The two ends of the second water baffle flange 2212 are also fixedly connected to the cutting frame 10, for example, by screw connection.

[0115] Preferably, as Figure 1 and Figure 3 shown, the degumming device of the present application is arranged between the upper main roller and the lower main roller, and is also located between the flow guide cover 21 and the debris box 22. When the ingot 17 is completely cut or nearly completely cut, the degumming device is started to perform a degumming operation on the ingot 17, so that the ingot 17 falls into the collection member 16 below.

[0116] In the technical solution of the present application, by arranging a degumming device and a collection member 16 on the cutting frame 10, the degumming and collection of the cut ingot 17 can be realized without stopping the machine during the cutting process, which is beneficial to greatly improving the cutting efficiency of the wire cutting machine and reducing the process flow.

[0117] It should be noted that the present application does not limit the specific type of the degumming device. For example, those skilled in the art can adopt a laser degumming device or a spray degumming device, etc.

[0118] In the first preferred embodiment, as Figure 5 and Figure 6 shown, the degumming device of the present application is set as a spray degumming device 3. The spray degumming device 3 is connected to the cutting frame 10 and is used to spray degumming liquid on the ingot 17 so that the cut ingot 17 is degummed. In the present application, the degumming liquid can be selected according to the specific type of the glue layer, and those skilled in the art can flexibly choose. For example, when the glue layer uses water-soluble glue, the degumming liquid can be selected as pure water, tap water or cutting fluid, etc.

[0119] Furthermore, as Figure 3 、 Figure 5 and Figure 6 shown, the spray degumming device 3 of the present application includes a spray assembly connected to the cutting frame 10. The spray assembly is communicated with the degumming liquid source, and the spray assembly is used to spray degumming liquid on the ingot 17.

[0120] Among them, the spraying assembly is located between the upper main roller 13 and the lower main roller 14. When the cutting of the ingot 17 is completed or nearly completed, the spraying debonding device 3 is started, and the spraying assembly sprays the cutting fluid towards the adhesive layer of the ingot 17.

[0121] It should be noted that the present application does not limit the structural form of the spraying assembly. For example, those skilled in the art can set the spraying assembly in the structural form of a spray pipe + nozzle, or in the structural form of spraying holes opened on the spray pipe, or in the structural form of a spray shower head, and so on.

[0122] Furthermore, as Figure 3 and Figure 5 shown, the spraying assembly of the present application includes a spray pipe 31 connected to the cutting frame 10 and a nozzle 32. The spray pipe 31 is communicated with the debonding liquid source, and one end of the nozzle 32 is communicated with the spray pipe 31.

[0123] Exemplarily, as Figure 3 and Figure 5 shown, the spray pipe 31 is located between the upper main roller 13 and the lower main roller 14, and is disposed closer to the upper main roller 13. The spray pipe 31 extends along the axial direction of the upper main roller 13. After the spraying debonding device 3 is started, the debonding liquid from the debonding liquid source enters the spray pipe 31, and then is ejected from the nozzle 32 and sprayed towards the adhesive layer of the ingot 17.

[0124] Among them, the water flow ejected from the nozzle 32 is a conical jet surface, and the taper of the conical jet surface is preferably 60°, which has a large coverage range and is beneficial to improving the processing efficiency.

[0125] Furthermore, as Figure 3 and Figure 5 shown, the nozzle 32 is disposed towards the cutting section of the wire mesh 15.

[0126] Among them, the cutting section of the wire mesh 15 refers to the wire mesh between the two first main rollers 13, and this section of the wire mesh is used for cutting. Viewed from Figure 3 above, the cutting section of the wire mesh 15 is located above the nozzle 32. Therefore, the nozzle 32 is disposed obliquely upward.

[0127] By disposing the nozzle 32 towards the cutting section of the wire mesh 15, the debonding liquid ejected from the nozzle 32 can contact the adhesive layer on the ingot 17 as early as possible, which is beneficial to improving the processing efficiency.

[0128] It should be noted that the present application does not limit the angle between the nozzle 32 and the horizontal direction (i.e., the inclination angle of the nozzle 32). For example, those skilled in the art can set the angle between the nozzle 32 and the horizontal direction to 20°, 50° or 70°, etc.

[0129] Furthermore, as Figure 3As shown, the included angle between the nozzle 32 and the horizontal direction is 30° to 60°.

[0130] By limiting the included angle between the nozzle 32 and the horizontal direction to 30° to 60°, the nozzle 32 can cover a larger degumming range, thereby further improving the processing efficiency.

[0131] Wherein, the included angle between the nozzle 32 and the horizontal direction is the included angle between the axis direction of the nozzle 32 and the horizontal direction.

[0132] It should be noted that the present application does not limit the specific number of nozzles 32. For example, those skilled in the art can set multiple nozzles 32 in actual applications, or, alternatively, only one nozzle 32 can be set. In the case of setting one nozzle 32, it is preferably to set a sliding mechanism to drive the nozzle 32 to reciprocate along the length direction of the collecting member 16.

[0133] Furthermore, as Figure 5 shown, the number of nozzles 32 is multiple, and the multiple nozzles 32 are spaced apart along the length direction of the spray pipe 31.

[0134] Wherein, the spray pipe 31 extends along the length direction of the collecting member 16, and multiple nozzles 32 are spaced apart along the length direction of the spray pipe 31. The distance between two adjacent nozzles 32 can be determined according to the coverage range of the nozzle 32.

[0135] Furthermore, as Figure 3 shown, the number of spray pipes 31 is two and they are spaced apart along the horizontal direction.

[0136] Wherein, the two spray pipes 31 are respectively located on both sides of the collecting member 16 in the width direction, and the nozzles 32 on the two spray pipes 31 are arranged oppositely and all spray towards the side close to the collecting member 16. In this way, degumming can be realized simultaneously from two directions, thereby greatly improving the degumming efficiency.

[0137] It should be noted that in the present application, the length direction of the collecting member 16 is parallel to the axial direction of the upper main roller 13, and the width direction of the collecting member 16 is perpendicular to the axial direction of the upper main roller 13 and along the horizontal direction.

[0138] Furthermore, as Figure 3 and Figure 5 shown, the spray degumming device 3 of the present application further includes a protective member 33. The protective member 33 is located between the spray assembly and the main roller assembly, and the protective member 33 can block the degumming liquid sprayed from the spray assembly from spraying onto the main roller assembly.

[0139] By arranging the protective member 33 between the spray assembly and the main roller assembly, the cutting liquid can be blocked to prevent the cutting liquid from spraying onto the main roller assembly, effectively protecting the main roller assembly.

[0140] Specifically, as Figure 3 shown, the protection member 33 is located between the nozzle 32 and the upper main roller 13, and can effectively protect the upper main roller 13. In the case where two spray pipes 31 are provided, the number of protection members 33 is also two. The two protection members 33 are respectively located between the corresponding nozzles 32 and the upper main roller 13 to protect both upper main rollers 13.

[0141] Furthermore, the protection member 33 is connected to the spray pipe 31.

[0142] Exemplarily, as Figure 5 and Figure 6 shown, both ends of the spray pipe 31 are fixedly installed on the cutting frame 10 through connectors, and the protection member 33 is fixedly installed on the spray pipe 31.

[0143] It should be noted that those skilled in the art can, in actual application, connect the protection member 33 to the cutting frame 10 through a connector and fixedly install the spray pipe 31 on the protection member 33. Or, the protection member 33 and the spray pipe 31 can also be set as a split type, and the protection member 33 is directly connected to the cutting frame 10 through a connector, and so on.

[0144] Of course, in this application, it is preferably to connect the protection member 33 and the spray pipe 31 together and then install them on the cutting frame 10 together. In this way, it is beneficial to ensure a stable positional relationship between the protection member 33 and the nozzle 32, play a better protection role, and is also beneficial to improving the assembly efficiency.

[0145] Furthermore, as Figure 3 shown, the top of the protection member 33 extends to the flow guide cover 21.

[0146] By extending the top of the protection member 33 to the flow guide cover 21, there is no longer a gap between them in the vertical direction, and a better protection effect can be achieved.

[0147] It should be noted that in actual application, the top of the protection member 33 can be connected to the bottom of the flow guide cover 21, or the top of the protection member 33 can also be connected to the side of the flow guide cover 21, that is, there is a part of overlap between them in the vertical direction.

[0148] Furthermore, as Figure 3 and Figure 5 shown, the protection member 33 of this application includes a first guard plate 331. The first guard plate 331 is located above the spray pipe 31, and the extending direction of the cross-section of the first guard plate 331 is inclined towards the wire mesh between the two first main rollers 13. The first guard plate 331 is located between the nozzle 32 and the upper main roller 13.

[0149] Compared with setting the first guard plate 331 horizontally or vertically, by setting the first guard plate 331 to incline upward, it is possible to not only reduce the influence on the spraying range of the nozzle 32, but also reduce the vertical space occupied by the first guard plate 331, which is convenient for layout. Among them, it is preferable that the top of the first guard plate 331 extends to the flow guide cover 21. In addition, the first guard plate 331 extends along the length direction of the spray pipe 31, and the length of the first guard plate 331 is preferably greater than or equal to the length of the spray pipe 31.

[0150] Furthermore, the included angle between the first guard plate 331 and the horizontal direction is greater than the included angle between the nozzle 32 and the horizontal direction.

[0151] That is to say, the inclination direction of the first guard plate 331 is not parallel to the inclination direction of the nozzle 32, and the inclination angle of the first guard plate 331 is greater than the inclination angle of the nozzle 32. In this way, it is possible to further reduce or even eliminate the influence on the spraying range of the nozzle 32 and ensure that the nozzle 32 has the maximum spraying range.

[0152] Among them, the specific value of the included angle between the extending direction of the first guard plate 331 and the extending direction of the nozzle 32 can be determined through experiments.

[0153] Furthermore, as Figure 3 and Figure 5 shown, the protection member 33 of the present application further includes a second guard plate 332. The second guard plate 332 is located on the side of the spray pipe 31 away from the nozzle 32. The top of the second guard plate 332 is fixedly connected or integrally provided with the bottom of the first guard plate 331, and the extending direction of the second guard plate 332 intersects with the extending direction of the first guard plate 331.

[0154] That is to say, the second guard plate 332 extends downward from the bottom of the first guard plate 331. In this way, it is possible to prevent the cutting fluid reflected from the crystal bar 17 from splashing onto the wire mesh 15 between the upper main roller 13 and the lower main roller 14. In addition, it is also possible to guide the degumming fluid blocked by the first guard plate 331 to the bottom of the cutting chamber.

[0155] Furthermore, as Figure 3 and Figure 5 shown, the second guard plate 332 is arranged in the vertical direction.

[0156] By arranging the second guard plate 332 in the vertical direction, the second guard plate 332 can have the maximum protection range.

[0157] It should be noted that those skilled in the art can also set the second guard plate 332 to incline downward toward the side close to the nozzle 32 in actual application. From Figure 3Viewed from above, the second protective plate 332 on the left is inclined downward to the right, and the second protective plate 332 on the right is inclined downward to the left. In this way, it is more conducive to guiding the cutting fluid to the bottom of the cutting chamber and preventing the cutting fluid from dropping onto the lower main roller 14.

[0158] In addition, it should be noted that the protective member 33 includes a first protective plate 331 and a second protective plate 332. Only the first protective plate 331 or the second protective plate 332 can be connected to the spray pipe 31, or the first protective plate 331 and the second protective plate 332 can be connected to the spray pipe 31 at the same time.

[0159] In the second preferred embodiment, the debonding device of the present application is a laser generator. The number of laser generators is two and they are respectively located on both sides in the width direction of the collection member 16. A sliding mechanism is provided between the two side walls of the cutting frame 10 opposite to the length direction of the collection member 16. The sliding mechanism is selected as an electric cylinder, and the two laser generators are respectively fixed on the corresponding sliding mechanisms.

[0160] During the debonding process, the two electric cylinders drive the two laser generators to move along the length direction of the collection member 16. The two laser generators respectively emit laser from both sides of the ingot assembly to the same glue layer. The chemical bonds of the glue are destroyed by the cavitation erosion effect of the laser, causing cavitation inside the glue layer and generating tiny holes. The liquid can quickly enter the inside of the glue layer, causing the glue layer to fall off from the silicon wafer, and finally realizing the debonding of the silicon wafer.

[0161] Of course, the specific setting method of the above laser generator is not fixed. Those skilled in the art can adjust it so that the present application is applicable to more specific application scenarios. For example, the laser generator can also be fixedly arranged or rotatably arranged around a rotating shaft, etc., to replace the movable arrangement. When fixedly arranged, multiple laser generators need to be arranged, or the laser range generated by the laser generator is controlled to be sufficient to cause the entire glue layer to fall off. Again, the number of laser generators can be set to at least one, and of course, more can also be set. The setting positions of the laser generators, in addition to being distributed on both sides of the collection member 16, can also be located on the same side, or outside the two ends in the length direction of the collection member 16. Of course, being located on the same side or outside the two ends in the length direction of the collection member 16 is not conducive to realizing rapid debonding. Again, in addition to using an electric cylinder for the sliding mechanism, a cylinder or a hydraulic cylinder, etc., can also be used.

[0162] Preferably, as Figure 7 and Figure 8 shown, the blanking device of the present application further includes a first driving component, and the first driving component can drive the collection member 16 to move up and down in the vertical direction.

[0163] By setting the first driving component to drive the collecting component 16 to move up and down, it is convenient to adjust the vertical distance between the collecting component 16 and the ingot 17 according to specific situations, which is beneficial to safely collect the silicon wafers and prevent the silicon wafers from being damaged due to too large a distance from the collecting component 16.

[0164] It should be noted that the present application does not limit the specific structural form of the first driving component. For example, those skilled in the art can set the first driving component as a motor driving component, a hydraulic driving component or a pneumatic driving component, etc. Such adjustments and changes to the specific structural form of the first driving component do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0165] Preferably, as Figure 2 , Figures 7 to 11 shown, the blanking device of the present application further includes a second driving component, and the second driving component can drive the collecting component 16 to move from the discharge port 11 to the outside of the cutting chamber.

[0166] After all the silicon wafers with the glue removed have fallen into the collecting component 16, the second driving component drives the collecting component 16 to pass through the discharge port 11 and move to the outside of the cutting chamber.

[0167] It should be noted that the present application does not limit the specific structural form of the second driving component. For example, those skilled in the art can set the second driving component as a motor driving component, a hydraulic driving component or a pneumatic driving component, etc. Such adjustments and changes to the specific structural form of the second driving component do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0168] Preferably, as Figures 7 to 10 shown, the blanking device of the present application further includes a track 41 and a moving trolley 42. Among them, the collecting component 16 is placed on the moving trolley 42, the moving trolley 42 is located on the track 41, a part of the track 41 passes through the discharge port 11 and extends into the cutting chamber, the second driving component is connected to the moving trolley 42 and can drive the moving trolley 42 to move along the track 41.

[0169] Exemplarily, as Figure 3 , Figures 7 to 10As shown, the second driving assembly is installed on the track 41. A horizontal guide rail 411 is provided on the track 41. The second driving assembly can drive the moving trolley 42 to move along the horizontal guide rail 411. A debris box 22 is installed between the two lower main rollers 14. The discharge port 11 on the cutting frame 10 is arranged opposite to the debris box 22. The track 41 is horizontally arranged, and a part of the track 41 passes through the discharge port 11 and extends into the debris box 22. The first driving assembly is located outside the cutting chamber and is supported under the other part of the track 41. Driven by the first driving assembly, the track 41, the moving trolley 42, the second driving assembly and the collecting member 16 move up and down together. The discharge port 11 is rectangular and extends in the vertical direction, allowing the track 41 to move up and down. Wheels are installed on both sides of the bottom of the moving trolley 42, enabling the moving trolley 42 to move smoothly on the horizontal guide rail 411.

[0170] After the silicon wafer falls into the collecting member 16, the first driving assembly drives the track 41 and the second driving assembly, the moving trolley 42 and the collecting member 16 on the track 41 to move downward. After moving to the set initial position, the first driving assembly stops running, and the second driving assembly is started to pull the moving trolley 42 and the collecting member 16 on the moving trolley 42 to move along the track 41 and pass through the discharge port 11 to the outside of the cutting chamber. Then, the collecting member 16 and the silicon wafer on the collecting member 16 are taken off the moving trolley 42 together. Then, an empty collecting member 16 is placed on the moving trolley 42. The collecting member 16 taken off the moving trolley 42 is transferred to a special wafer-taking station, and then the silicon wafer is taken out of the collecting member 16.

[0171] It should be noted that those skilled in the art can cancel the setting of the moving trolley 42 in actual applications. In this case, the second driving assembly can be directly connected to the collecting member 16.

[0172] Preferably, as Figure 7 and Figure 8 shown, the blanking device of the present application further includes a lifting seat 51 and a guiding mechanism. The track 41 is installed on the lifting seat 51. The first driving assembly is connected to the lifting seat 51 and can drive the lifting seat 51 to move up and down in the vertical direction. The guiding mechanism is used to guide the lifting seat 51.

[0173] Exemplarily, as Figure 7 and Figure 8As shown, the blanking device of the present application further includes a fixed seat 56. The fixed seat 56 is fixedly connected to the cutting frame 10. The lifting seat 51 is fixedly installed at the bottom of the track 41. The guiding mechanism includes a plurality of vertically arranged guiding columns 54 and linear bearings 55 sleeved on each guiding column 54. The top end of the guiding column 54 is fixedly connected to the lifting seat 51. The linear bearings 55 and the first driving assembly are fixedly installed on the fixed seat 56. During the process of the first driving assembly driving the lifting seat 51 to move up and down, the guiding column 54 slides up and down within the linear bearing 55 to guide the lifting seat 51.

[0174] It should be noted that the guiding mechanism is not limited to the combination form of the guiding column 54 and the linear bearing 55 introduced above. For example, the linear bearing 55 can be replaced with a guiding cylinder, or the guiding mechanism can be set as a structural form in which a guiding groove formed on the cutting frame 10 cooperates with a guiding block provided on the lifting seat 51, etc. Such adjustments and changes to the specific structural form of the guiding mechanism do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0175] In addition, it should also be noted that the fixed seat can be cancelled. In this case, the first driving assembly and the guiding mechanism can be installed on the base of the wire cutting machine.

[0176] In addition, it should also be noted that the present application does not limit the structural form of the first driving assembly. For example, those skilled in the art can set the first driving assembly as a motor driving assembly, a hydraulic driving assembly, or a pneumatic driving assembly, etc. Such adjustments and changes to the specific structural form of the first driving assembly do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0177] Preferably, as Figure 7 and Figure 8 shown, the first driving assembly of the present application includes a first motor 52 and a lifter 53 connected to the lifting seat 51. The first motor 52 is drivingly connected to the lifter 53.

[0178] Exemplarily, the lifter 53 is a ball screw lifter. The first motor 52 drives the lifting seat 51 to move up and down through the ball screw lifter.

[0179] It should be noted that the lifter 53 is not limited to the above-mentioned ball screw lifter. For example, a worm screw lifter can also be used, etc.

[0180] Preferably, as Figures 7 to 11 shown, the second driving assembly of the present application includes a second driving mechanism, a sprocket 43, and a chain 44 meshing with the sprocket 43. The chain 44 is connected to the moving trolley 42. The second driving mechanism is connected to the sprocket 43 and can drive the sprocket 43 to rotate.

[0181] When the collecting member 16 needs to be moved outside the cutting chamber, the second driving mechanism drives the sprocket 43 to rotate, and the sprocket 43 moves with the chain 44, and the chain 44 pulls the moving trolley 42 and the collecting member 16 on the moving trolley 42 to move together.

[0182] For example, Figure 7 and Figure 8 As shown, the sprocket 43 is pivotally mounted on the track 41 and is located at the outer end of the track 41 (from Figure 7 The second drive mechanism is also mounted on the track 41, and the right end of the chain 44 is connected to the outer end of the moving trolley 42 (from the left end). Figure 7 The left end (as viewed from above) is fixedly connected.

[0183] It should be noted that the present application does not limit the structural form of the second drive mechanism. For example, a person skilled in the art may set the second drive mechanism to be in the structural form of a motor + gear transmission group, or to be in the structural form of a motor + synchronous belt transmission group, etc. Such adjustments and changes to the specific structural form of the second drive mechanism do not deviate from the principle and scope of the present application, and should be limited within the protection scope of the present application.

[0184] Preferably, if Figure 7 and Figure 8 As shown, the second driving mechanism of the present application includes a second motor 45, a driving pulley 46, a driven pulley 47 and a synchronous belt 48 for connecting the driving pulley 46 and the driven pulley 47. The driving shaft of the second motor 45 is connected to the driving pulley 46, and the driven pulley 47 is installed on the sprocket 43.

[0185] For example, Figure 7 and Figure 8 As shown, the second motor 45 is fixedly mounted at the bottom of the track 41, the driving shaft of the second motor 45 is horizontally arranged, specifically extending along the width direction of the track 41, the driving pulley 46 is fixedly mounted on the driving shaft, the driven pulley 47 is fixedly mounted on the side of the sprocket 43, and the driving pulley 46 and the driven pulley 47 are connected by a synchronous belt 48. The second motor 45 drives the driving pulley 46 to rotate, and the driving pulley 46 drives the driven pulley 47 and the sprocket 43 to rotate synchronously through the synchronous belt 48.

[0186] Preferably, if Figures 9 to 11As shown, the chain 44 of the present application includes a plurality of pivotally connected chain monomers. Each chain monomer includes a body 441, a rotating shaft 442 horizontally installed within the body 441, and rollers 443 installed at both ends of the rotating shaft 442. A chain guide is further provided on the track 41. The chain guide includes two strip-shaped grooves 412 spaced apart along the width direction of the track 41. One side of the two strip-shaped grooves 412 close to each other is open. The rollers 443 are located within the strip-shaped grooves 412. The dimension of the strip-shaped groove 412 in the vertical direction matches the dimension of the roller 443 in the vertical direction to limit the roller 443 within the strip-shaped groove 412.

[0187] Exemplarily, as Figures 9 to 11 shown, the chain monomers extend along the length direction of the track 41. Two adjacent chain monomers are pivotally connected. An installation hole is provided at the middle position of each chain monomer. The installation hole extends along the width direction of the track 41. The rotating shaft 442 is installed within this installation hole and can rotate. Two strip-shaped grooves 412 are provided on the track 41. The two strip-shaped grooves 412 are spaced apart along the width direction of the track 41. The chain 44 is located between the two strip-shaped grooves 412. One side of the two strip-shaped grooves 412 close to each other is open, that is, the cross-section of the strip-shaped groove 412 is approximately C-shaped, so that the roller 443 can extend into the corresponding strip-shaped groove 412. The dimension of the strip-shaped groove 412 in the vertical direction, that is, the distance between the top wall and the bottom wall of the strip-shaped groove 412, matches the height of the roller 443. In this way, the chain 44 also has the function of pushing the moving trolley 42. After taking out the silicon wafer on the collecting member 16, under the drive of the second drive mechanism, the moving trolley 42 and the collecting member 16 on the moving trolley 42 can also be pushed back into the cutting chamber by the chain 44.

[0188] Preferably, as Figure 7 shown, the strip-shaped groove 412 on the track 41 includes a straight segment 4121 and an arc segment 4122. One end of the straight segment 4121 is connected to the top end of the arc segment 4122. The arc segment 4122 is arranged corresponding to the sprocket 43.

[0189] Exemplarily, as Figure 7 shown, the arc segment 4122 is located at the outer end of the track 41. The sprocket 43 is located between the two arc segments 4122. The other end of the chain 44 extends out from the bottom end of the arc segment 4122.

[0190] Preferably, as Figure 7 and Figure 8 shown, the second drive assembly of the present application further includes a storage box 49 for storing the chain 44. The storage box 49 is located below the sprocket 43. The top of the storage box 49 has an opening allowing the chain 44 to pass through.

[0191] By providing a storage box 49 below the sprocket 43, the chain 44 extending from the bottom end of the arc segment 4122 enters the storage box 49, preventing the chain 44 from swinging randomly.

[0192] Preferably, as Fig. 9 shown, the blanking device of the present application further includes a clamping mechanism installed on the collection member 16, and the clamping mechanism is used to clamp the ingot 17 located on the collection member 16.

[0193] Clamping the silicon wafer by the clamping mechanism can prevent the silicon wafer from tipping over, avoiding damage to the silicon wafer.

[0194] It should be noted that the present application does not limit the structural form of the clamping mechanism. For example, those skilled in the art can set the clamping mechanism as a motor clamping mechanism, a hydraulic clamping mechanism, or a pneumatic clamping mechanism, etc. Such adjustments and changes to the specific structural form of the clamping mechanism do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0195] Preferably, as Fig. 9 shown, the clamping mechanism of the present application includes two relatively arranged clamping components 6, and relative movement can occur between the two clamping components 6 in a direction close to / away from each other to clamp / loosen the silicon wafer.

[0196] Exemplarily, the two clamping components 6 are relatively arranged along the width direction of the collection member 16. When the silicon wafer falls into the collection member 16, the two clamping components 6 move relatively in a direction close to each other, thereby clamping the silicon wafer in the collection member 16. When the second driving component moves the collection member 16 outside the cutting chamber and transfers the collection member 16 and the silicon wafer to a dedicated wafer taking station, the two clamping components 6 move in a direction away from each other, thereby loosening the silicon wafer, and then the silicon wafer in the collection member 16 is taken out.

[0197] It should be noted that the two clamping components 6 can also be relatively arranged along the length direction of the collection member 16. Of course, it is preferably to arrange the two clamping components 6 relatively along the width direction of the collection member 16, so that it is not easy to damage the silicon wafer.

[0198] Preferably, as Fig. 9 shown, the clamping component 6 of the present application includes an airbag 61, an air pump (not shown in the figure) communicated with the airbag 61, and a clamping plate 62, and one side of the clamping plate 62 is connected to the airbag 61.

[0199] Exemplarily, the airbag 61 is fixedly installed on the inner sidewalls of the collecting member 16 distributed in the width direction. The airbag 61 is communicated with an air pump through an air pipe. The clamping plate 62 is fixedly connected to the inner side surface of the airbag 61. The clamping plate 62 is located between the silicon wafer and the airbag 61 and can provide rigid support for the silicon wafer. For example, it is set as a rectangular steel plate, etc. The clamping plate 62 extends along the length direction of the collecting member 16, and the length of the clamping plate 62 is slightly greater than the length of the ingot 17. When it is necessary to clamp the silicon wafer in the collecting member 16, the air pumps of the two clamping assemblies 6 respectively inflate their respective airbags 61, so that the two clamping plates 62 move towards the silicon wafer simultaneously to clamp the silicon wafer. When it is necessary to take out the silicon wafer, the exhaust valve on the airbag 61 can be opened to discharge the gas in the airbag 61, thereby loosening the silicon wafer.

[0200] It should be noted that the airbag 61 can realize the functions of clamping and loosening through the switching of two modes of positive pressure and negative pressure. Or, a spring can also be installed inside the airbag 61 or between the airbag 61 and the collecting member 16. The airbag 61 is inflated by positive pressure to clamp the silicon wafer, and the spring compresses the airbag 61 to loosen the silicon wafer after the air supply stops, etc. Such flexible adjustments and changes do not deviate from the principle and scope of this application and should all be limited within the protection scope of this application.

[0201] Preferably, as Fig. 9 shown, an elastic buffer structure is provided on the other side (i.e., the inner side surface) of the clamping plate 62 of this application.

[0202] By providing an elastic buffer structure on the inner side surface (the side close to the silicon wafer) of the clamping plate 62, the silicon wafer can be better protected and damage to the silicon wafer can be prevented.

[0203] It should be noted that this application does not limit the specific structural form of the elastic buffer structure. For example, the elastic buffer structure can be set as a plurality of elastic dot-shaped protrusions, or set as an elastic buffer pad, etc.

[0204] Preferably, as Fig. 9 shown, the elastic buffer structure of this application is an elastic buffer pad 621.

[0205] Exemplarily, the elastic buffer pad 621 is made of polyurethane material.

[0206] Preferably, as Figure 2 and Figure 7 shown, the cutting assembly of this application further includes a water blocking device 7. The water blocking device 7 is installed at the discharge port 11 to prevent the cutting fluid in the cutting chamber from overflowing from the discharge port 11.

[0207] Among them, the water retaining device 7 is arranged around the track 41 of the blanking device to prevent the cutting fluid in the cutting chamber from overflowing through the gap between the discharge port 11 and the track 41, and the water retaining device 7 can move up and down along the vertical direction with the track 41.

[0208] It should be noted that those skilled in the art can set the water retaining device 7 as an integral annular structure surrounding the track 41 in practical applications. Alternatively, the water retaining device 7 can also be set to include a plurality of split water retaining structures, which are respectively arranged above, below and on the side of the track 41, etc. Such flexible adjustments and changes do not deviate from the principle and scope of this application and should be limited within the protection scope of this application.

[0209] Preferably, as Figure 7 , Figure 12 to Figure 14 shown, the water retaining device 7 of this application includes a first water retaining member 71. The first water retaining member 71 is located above the track 41, and the bottom of the first water retaining member 71 abuts against the top surface of the track 41. The first water retaining member 71 can move up and down along the vertical direction together with the track 41.

[0210] With such a setting, when it is necessary to open the discharge port 11, only the first water retaining member 71 needs to be lifted, without other operations, which improves work efficiency.

[0211] Under the action of its own gravity, the first water retaining member 71 abuts against the top surface of the track 41. When the track 41 rises, the track 41 supports the first water retaining member 71 to rise together. When the track 41 descends, the first water retaining member 71 descends together with the track 41 under the action of its own gravity.

[0212] Preferably, as Figure 7 , Figure 12 to Figure 14 shown, the water retaining device 7 of this application further includes a second water retaining member 72. The second water retaining member 72 is located below the track 41, and the top of the second water retaining member 72 is connected to the bottom surface of the track 41. The second water retaining member 72 can expand and contract with the lifting of the track 41.

[0213] Among them, the bottom of the second water retaining member 72 is fixed. When the track 41 rises, the second water retaining member 72 extends and becomes longer with the rise of the track 41, closing the part of the discharge port 11 below the track 41. When the track 41 descends, the second water retaining member 72 is compressed and shortened.

[0214] Preferably, as Figure 7 , Figure 12 to Figure 14As shown, the water retaining device 7 of the present application further includes a third water retaining member 73. The third water retaining member 73 is located on the side of the track 41 and is connected to the side surface of the track 41. The third water retaining member 73 can move up and down in the vertical direction together with the track 41.

[0215] Among them, the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 are three independent members, which are respectively used to retain water on the upper, lower, and side surfaces of the track 41. When the first driving assembly drives the track 41 to move up and down, the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 can all move up and down together with the track 41. In this way, during the cutting process, the discharge port 11 is always in a closed state, and the water retaining effect is better.

[0216] Preferably, as Figure 12 to Figure 14 shown, the water retaining device 7 of the present application further includes a guiding member, and the guiding member is used to guide the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 during the up and down movement.

[0217] By providing the guiding member to guide the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73, the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 will not deviate during the up and down movement, thus playing a more stable water retaining role.

[0218] It should be noted that the present application does not limit the specific structural forms of the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73. For example, they can be set as water retaining plates, water retaining blocks, or water retaining covers, etc., as long as they can achieve the water retaining function.

[0219] In addition, it should also be noted that those skilled in the art can, in actual applications, install the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 inside the cutting chamber, or install the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 between the track 41 and the inner wall of the discharge port 11, or install the first water retaining member 71, the second water retaining member 72, and the third water retaining member 73 outside the cutting chamber, etc. Such flexible adjustments and changes do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0220] Preferably, as Figures 12 to 15 shown, the guiding member of the present application is provided with a first guiding groove 741 on the side facing the track 41. The first guiding groove 741 extends in the vertical direction, and the edge of the first water retaining member 71 is located in the first guiding groove 741.

[0221] Exemplarily, as Figures 12 to 15 As shown, both the guiding member and the first water blocking member 71 are located outside the cutting chamber. The guiding member includes two vertically arranged guiding plates 74. The two guiding plates 74 are respectively located on both sides of the track 41. On the side of the guiding plate 74 facing the track 41, there is a vertically extending first guiding groove 741. The left and right edges of the first water blocking member 71 are respectively located in the corresponding first guiding grooves 741. The width of the first guiding groove 741 matches the thickness of the edge of the first water blocking member 71. By guiding the first water blocking member 71 with the first guiding groove 741, it is beneficial to prevent the cutting fluid inside the first water blocking member 71 from flowing to the outside of the first water blocking member 71 along the edge of the first water blocking member 71, and the waterproof effect is better.

[0222] Preferably, as Figures 12 to 15 shown, on the side of the guiding member of the present application facing the track 41, there is a second guiding groove 742. The second guiding groove 742 extends in the vertical direction, and the edge of the second water blocking member 72 is located in the second guiding groove 742.

[0223] Exemplarily, as Figures 12 to 15 shown, the second water blocking member 72 is also located outside the cutting chamber. On the side of the guiding plate 74 facing the track 41, there is also a vertically extending second guiding groove 742. The left and right edges of the second water blocking member 72 are respectively located in the corresponding second guiding grooves 742. Among them, the first guiding groove 741 and the second guiding groove 742 can be located in the same vertical plane, and the bottom end of the first guiding groove 741 is communicated with the top end of the second guiding groove 742, or, as Fig.15 shown, the first guiding groove 741 and the second guiding groove 742 can be arranged in a horizontal offset manner.

[0224] Preferably, as Figures 12 to 16 shown, on the side of the guiding member of the present application facing the track 41, there is a guiding rib 743. The guiding rib 743 extends in the vertical direction. The third water blocking member 73 is provided with a third guiding groove 731 at a position corresponding to the guiding rib 743, and the guiding rib 743 is adapted to the third guiding groove 731.

[0225] Exemplarily, as Figures 12 to 16As shown, the first guiding groove 741 and the second guiding groove 742 on the guiding plate 74 are distributed at intervals in the horizontal direction. The part between the first guiding groove 741 and the second guiding groove 742 forms a guiding rib 743. A part of the third water-blocking member 73 is located between the side of the track 41 and the side wall of the discharge port 11, and is in contact with the side wall of the discharge port 11. Another part of the third water-blocking member 73 is located outside the cutting chamber and between the track 41 and the guiding plate 74. A vertically extending third guiding groove 731 is provided at this part. The guiding rib 743 is located in the third guiding groove 731, which can play a guiding role and also a waterproof role while guiding.

[0226] Preferably, the first water-blocking member 71 of the present application is located outside the cutting chamber.

[0227] By arranging the first water-blocking member 71 outside the cutting chamber, when it is necessary to move the collecting member 16 outside the cutting chamber, it is convenient to lift the first water-blocking member 71, thereby opening the discharge port 11. That is to say, the first water-blocking member 71 is equivalent to a door, closing the part of the discharge port 11 above the track 41. Among them, when it is necessary to open the discharge port 11, the first water-blocking member 71 can be lifted manually, automatically or semi-automatically.

[0228] Preferably, as Figure 12 to Figure 14 shown, the first water-blocking member 71 of the present application includes a vertically arranged first water-blocking plate 711, a vertically arranged second water-blocking plate 712, and a connecting plate 713 for connecting the first water-blocking plate 711 and the second water-blocking plate 712. The first water-blocking plate 711 and the second water-blocking plate 712 are distributed at intervals along the length direction of the track 41. The first water-blocking plate 711 is located between the second water-blocking plate 712 and the cutting frame 10.

[0229] By arranging the first water-blocking plate 711 and the second water-blocking plate 712 distributed at intervals along the length direction of the track 41, double protection can be formed, and the water-blocking effect is better.

[0230] Exemplarily, as Figure 12 to Figure 14 shown, the tops of the first water-blocking plate 711 and the second water-blocking plate 712 are connected by a horizontally arranged connecting plate 713. The two sides of the first water-blocking plate 711 and the second water-blocking plate 712 are respectively connected by a vertically arranged connecting plate 713. The width of the second water-blocking plate 712 is greater than the width of the first water-blocking plate 711. The edge of the second water-blocking plate 712 is located in the first guiding groove 741.

[0231] Preferably, as Fig.10 and Fig.12As shown, the horizontal guide rail 411 on the rail 41 is an orbital groove formed on the top surface of the rail 41. The first water blocking member 71 further includes a third water baffle 714. The third water baffle 714 is installed on the second water baffle 712, and the third water baffle 714 can move up and down relative to the second water baffle 712 so that the bottom of the third water baffle 714 can abut against the bottom wall of the orbital groove.

[0232] Under normal working conditions, there is less cutting fluid on the rail 41, and the bottom of the third water baffle 714 is flush with or slightly higher than the bottom of the second water baffle 712. When there is more cutting fluid on the rail 41, the third water baffle 714 can be moved down so that the bottom of the third water baffle 714 crosses the bottom of the second water baffle 712 and abuts against the bottom wall of the orbital groove on the rail 41 to block the cutting fluid and prevent the cutting fluid from flowing outwards, achieving a better water blocking effect.

[0233] Exemplarily, as Fig.10 shown, two orbital grooves are formed on the top surface of the rail 41, and the two orbital grooves are spaced apart along the width direction of the rail 41. As Fig.12 shown, the third water baffle 714 is arranged in an inverted U shape and can just be inserted into the two orbital grooves.

[0234] Preferably, as Figure 12 to Figure 14 shown, the second water blocking member 72 of the present application is a bellows shield, and the top of the bellows shield is fixedly connected to the bottom surface of the rail 41.

[0235] Among them, the bellows shield can stretch / compress in the vertical direction, and the bottom end of the bellows shield is fixed. When the rail 41 rises, the bellows shield stretches and becomes longer as the rail 41 rises, closing the part of the discharge port 11 located below the rail 41. When the rail 41 descends, the bellows shield is compressed and becomes shorter.

[0236] It should be noted that those skilled in the art can install the bellows shield inside the cutting chamber in actual applications, or, alternatively, can also install the bellows shield between the rail 41 and the bottom wall of the discharge port 11, or, further, can also install the bellows shield outside the cutting chamber. Such adjustments and changes to the specific installation position of the bellows shield do not deviate from the principle and scope of the present application and should all be limited within the protection scope of the present application.

[0237] Preferably, the bellows shield of the present application is located outside the cutting chamber.

[0238] Preferably, as Figure 12 to Figure 14As shown, the water retaining device 7 of the present application further includes a fixing frame 75 fixedly connected to the cutting frame 10. The guiding member and the second water retaining member 72 are installed on the fixing frame 75. A water receiving groove 751 is provided at the bottom of the fixing frame 75. The bottom of the guiding member and the bottom of the second water retaining member 72 are both communicated with the water receiving groove 751.

[0239] Exemplarily, as Figure 12 to Figure 14 shown, the fixing frame 75 is located outside the cutting chamber. A flange is provided on one side of the fixing frame 75 close to the cutting frame 10. The flange is fixedly connected to the cutting frame 10 by bolts. The bottom end of the bellows shield is fixedly connected to the inner bottom wall of the water receiving groove 751. The cutting fluid blocked by the bellows shield can flow along the bellows shield into the water receiving groove 751, effectively preventing the cutting fluid from flowing out. Further, two guiding plates 74 are fixedly installed on the fixing frame 75. The first guiding groove 741 and the second guiding groove 742 provided on the guiding plate 74 are both communicated with the water receiving groove 751 on the fixing frame 75. If cutting fluid enters the first guiding groove 741 and the second guiding groove 742, it will also flow into the water receiving groove 751, effectively preventing the cutting fluid from flowing out.

[0240] Preferably, as Figures 12 to 16 shown, the third water retaining member 73 of the present application includes two water retaining blocks, and the two water retaining blocks are respectively located on both sides of the track 41.

[0241] That is to say, one water retaining block is installed on each of the left side and the right side of the track 41. For example, the water retaining block can be fixed to the side of the track 41 by screws. Among them, a part of the water retaining block is located between the track 41 and the side wall of the discharge port 11, and another part of the water retaining block is located outside the cutting chamber. A third guiding groove 731 adapted to the guiding rib 743 on the guiding plate 74 is provided on the side of this part facing away from the track 41.

[0242] Preferably, as Figure 8 and Fig. 9 shown, the cutting assembly of the present application further includes a diversion assembly for receiving part of the cutting fluid during the cutting process and / or the blanking process.

[0243] The cutting process refers to the process of cutting the ingot, and the blanking process refers to the process of removing the collecting member 16 and the silicon wafers in the collecting member 16 from the moving trolley 42. When removing the collecting member 16 and the silicon wafers in the collecting member 16 from the moving trolley 42, the cutting fluid on the outer surface of the collecting member 16 will drip, and the dripping cutting fluid can be received by the diversion assembly.

[0244] Among them, the diversion assembly can be installed on the track 41 of the blanking device and / or the moving trolley 42. Further, the diversion assembly can also be communicated with the cutting chamber so as to divert the received cutting fluid back to the cutting chamber.

[0245] By providing a diversion component, during the cutting process, it can receive the cutting fluid dripping from above, serving as a buffer for the cutting fluid, preventing the cutting fluid from splashing everywhere. During the process of removing the collection component 16 from the mobile trolley 42, it can collect the cutting fluid dripping from the collection component 16 and divert the cutting fluid back into the cutting chamber, avoiding waste caused by the outflow of the cutting fluid. In addition, in the case where a first driving component is provided, it can also prevent the cutting fluid from falling onto the first driving component located below the track 41, providing effective protection for the first driving component. Moreover, it can also avoid polluting the working environment.

[0246] Preferably, as Figure 8 and Fig. 9 shown, the diversion component of the present application includes a first diversion plate 81 installed on the blanking device. A first collection port is provided at the top of the first diversion plate 81, and the cutting fluid can enter the first diversion plate 81 through the first collection port.

[0247] Exemplarily, the first diversion plate 81 is installed on the mobile trolley 42 of the blanking device. During the process of removing the collection component 16 from the mobile trolley 42, it can collect the cutting fluid dripping from the collection component 16 to prevent the cutting fluid from dripping onto other places. In addition, in the case where a first driving component is provided, when the collection component 16 is inside the cutting chamber, the first diversion plate 81 can also rise along with the track 41 to receive the cutting fluid dripping from above, serving as a buffer for the cutting fluid.

[0248] Exemplarily, as Fig. 9 and Fig.10 shown, the mobile trolley 42 is a flatbed cart, and the first diversion plate 81 is installed on the top surface of the mobile trolley 42.

[0249] Preferably, as Figure 8 and Fig. 9 shown, the lower part of the collection component 16 is located inside the first diversion plate 81, and the width of the first diversion plate 81 is greater than the width of the collection component 16.

[0250] In this way, a space for storing the cutting fluid can be formed between the side wall of the first diversion plate 81 and the collection component 16.

[0251] Preferably, as Figure 8 and Fig. 9 shown, a first diversion opening 814 is provided on the first diversion plate 81, and the cutting fluid inside the first diversion plate 81 can flow out from the first diversion opening 814 and drip onto the bottom of the track 41 or the cutting chamber.

[0252] Among them, when the first diversion plate 81 is inside the cutting chamber, the cutting fluid flowing out from the first diversion opening 814 can directly drip to the bottom of the cutting chamber. When the first diversion plate 81 is outside the cutting chamber, the cutting fluid flowing out from the first diversion opening 814 can directly drip onto the track 41.

[0253] Exemplarily, the first diversion opening 814 is provided at the inner end of the first diversion plate 81 (the right end when viewed from Figure 8 above), and the inner end of the track 41 (the right end when viewed from Figure 8 above) is set to be open. After the cutting fluid flows onto the track 41, it flows out from the opening at the inner end of the track 41 and falls to the bottom of the cutting chamber. Alternatively, an opening can also be provided at the middle position of the track 41, and this opening is communicated with the cutting chamber through a drain pipe.

[0254] Preferably, as Figure 8 and Fig. 9 shown, the first diversion plate 81 includes a first bottom plate 811, two relatively arranged first side plates 812 and two relatively arranged first end plates 813. The first bottom plate 811, the two first side plates 812 and the two first end plates 813 jointly enclose a water-containing space. The first bottom plate 811 is fixedly connected to the moving trolley 42. The first side plates 812 extend along the length direction of the moving trolley 42. The bottom end of the first side plate 812 is fixedly connected to or integrally formed with the first bottom plate 811. The first end plates 813 extend along the width direction of the moving trolley 42. The bottom end of the first end plate 813 is fixedly connected to or integrally formed with the first bottom plate 811. The first diversion opening 814 is formed on the inner first end plate 813.

[0255] It should be noted that those skilled in the art can also cancel the inner first end plate 813 in actual application. That is to say, the inner end of the first diversion plate 81 is open, and an opening is formed between the two first side plates 812 to form the first diversion opening 814.

[0256] Preferably, as Figure 8 and Fig. 9 shown, the diversion assembly of the present application further includes a diversion box 83 installed on the track 41. The track 41 is provided with a second diversion opening (not shown in the figure). The diversion box 83 is located below the track 41 and is communicated with the second diversion opening. The diversion box 83 is communicated with the cutting chamber through a drain pipe.

[0257] Exemplarily, the second diversion opening is preferably arranged at the middle position in the length direction of the track 41. The diversion box 83 is fixedly installed at the bottom of the track 41. The top of the diversion box 83 is open, so as to communicate with the second diversion opening on the track 41. The bottom of the diversion box 83 has a drain opening communicating with the drain pipe. The cutting fluid on the track 41 enters the diversion box 83 through the second diversion opening, and then flows back to the cutting chamber along the drain pipe.

[0258] Preferably, as Figure 8 and Fig. 9 shown, the diversion assembly of the present application further includes a second diversion disk 82 installed on the track 41. The top of the second diversion disk 82 is provided with a second collection opening. The cutting fluid dripping from the collection member 16 can pass through the second collection opening and enter the second diversion disk 82. The second diversion disk 82 is located on the side of the track 41.

[0259] Exemplarily, as Figure 8 and Fig. 9 shown, a second diversion disk 82 is installed on each of the left and right sides of the track 41. The length of the second diversion disk 82 is less than the length of the track 41 and is located outside the cutting chamber. During the process of removing the silicon wafer from the collection member 16, the cutting fluid dripping from the silicon wafer will fall onto the second diversion disk 82. Of course, in actual application, those skilled in the art can also set the second diversion disk 82 only on one side of the track 41.

[0260] It should be noted that, in actual application, those skilled in the art can extend the second diversion disk 82 into the cutting chamber and set the inner end of the second diversion disk 82 to be open, so that the cutting fluid in the second diversion disk 82 directly flows back into the cutting chamber, or the second diversion disk 82 can also be communicated with the cutting chamber through a drain pipe.

[0261] Preferably, as Figure 8 and Fig. 9 shown, the second diversion disk 82 of the present application is communicated with the cutting chamber through a drain pipe.

[0262] Exemplarily, as Figure 8 and Fig. 9 shown, a drain opening is arranged at the middle position of the bottom of the second diversion disk 82. The drain opening is communicated with the drain pipe. The cutting fluid in the second diversion disk 82 enters the drain pipe through the drain opening and flows back to the cutting chamber along the drain pipe.

[0263] Preferably, as Figure 8 and Fig. 9As shown in the figure, the second flow guiding disc 82 of the present application includes a second bottom plate 821, second side plates 822, and two oppositely arranged second end plates 823. One side of the second bottom plate 821 is fixedly connected to the side wall of the track 41. The second side plates 822 extend along the length direction of the track 41. The bottom end of the second side plates 822 is fixedly connected to or integrally provided with the other side of the second bottom plate 821. The bottom end of the second end plates 823 is fixedly connected to or integrally provided with the second bottom plate 821. The left and right ends of the second end plates 823 are respectively connected to the side wall of the track 41 and the second side plates 822.

[0264] That is to say, both the front and rear ends of the second flow guiding disc 82 are blocked. All the cutting fluid in the second flow guiding disc 82 flows back to the cutting chamber through the drain pipe. Exemplarily, a drain port communicating with the drain pipe is provided at the middle position of the second bottom plate 821.

[0265] Preferably, as Figure 8 and Fig. 9 shown in the figure, the second side plates 822 of the second flow guiding disc 82 of the present application are inclined in a direction away from the track 41.

[0266] By arranging the second side plates 822 of the second flow guiding disc 82 to be inclined, the receiving area of the second flow guiding disc 82 is larger, so that more cutting fluid can be received.

[0267] Finally, the working process of the wire cutting machine of the present application is introduced. Before cutting starts, the ingot assembly needs to be installed at the bottom of the feeding device 20. After cutting starts, the main roller motor of the main roller assembly is started to drive the upper main roller 13 and the lower main roller 14 to rotate at a high speed. The ingot assembly is driven by the feeding device 20 to feed downward, that is, to move towards the wire mesh on the main roller assembly. The first driving assembly is started to drive the lifting seat 51, the track 41 on the lifting seat 51, the second driving assembly on the track 41, the moving trolley 42, and the collecting member 16 on the moving trolley 42 to move upward. When the distance between the collecting member 16 and the ingot 17 at the bottom reaches the set safety distance, the collecting member 16 is stopped from rising, and the first driving assembly drives the collecting member 16 to move downward with the feeding of the feeding device 20, so that the distance between the collecting member 16 and the ingot 17 at the bottom always remains at the safety distance.

[0268] When the bottommost ingot is cut, start the spray degumming device 3 to spray degumming liquid onto the glue layer on the ingot, so that the cut silicon wafers are separated from the upper ingot. After the silicon wafers are degummed, they just fall into the collection member 16 below. Start the clamping mechanism to clamp the silicon wafers in the collection member 16, and make the first drive assembly drive the lifting seat 51, the track 41 on the lifting seat 51, the second drive assembly on the track 41, the moving trolley 42 and the collection member 16 on the moving trolley 42 to move quickly downward. After moving to the set initial position, turn off the first drive assembly and start the second drive assembly, pulling the moving trolley 42, the collection member 16 on the moving trolley 42 and the silicon wafers in the collection member 16 through the discharge port 11 and moving them outside the cutting chamber.

[0269] Then remove the collection member 16 and the silicon wafers together from the moving trolley 42, and then place an empty collection member 16 on the moving trolley. Start the second drive assembly to push the moving trolley 42 and the collection member 16 on the moving trolley 42 back into the cutting chamber. Turn off the second drive assembly and start the first drive assembly to drive the lifting seat 51, the track 41 on the lifting seat 51, the second drive assembly on the track 41, the moving trolley 42 and the collection member 16 on the moving trolley 42 to move upward. Then repeat the above steps. During the discharging process, the feeding device 20 does not stop and continues to feed.

[0270] In addition, those skilled in the art can understand that although some of the embodiments described herein include certain features included in other embodiments rather than other features, the combination of the features of different embodiments means that it is within the scope of the present application and forms different embodiments. For example, in the claims of the present application, any one of the claimed embodiments can be used in any combination.

[0271] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principle of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A cutting assembly, characterized in that, Comprising: A cutting frame, within which a cutting chamber is formed, and a discharge port communicating with the cutting chamber is provided on the cutting frame; A collection member, which is located within the cutting chamber and is used for collecting silicon wafers; A track, a part of which passes through the discharge port and extends into the cutting chamber, and the collection member can move along the track to the outside of the cutting chamber; And A flow guiding assembly, when the collection member is removed from the track, the flow guiding assembly can receive the cutting fluid falling from the collection member.

2. The cutting assembly according to claim 1, wherein The flow guiding assembly includes a first flow guiding disc, and a first collection port is provided at the top of the first flow guiding disc, and the cutting fluid can pass through the first collection port and enter into the first flow guiding disc.

3. The cutting assembly according to claim 2, wherein A first flow guiding opening is provided on the first flow guiding disc, and the cutting fluid within the first flow guiding disc can flow out from the first flow guiding opening and drip onto the track or the bottom of the cutting chamber; and / or The flow guiding assembly further includes a flow guiding box provided on the track, a second flow guiding opening is provided on the track, the flow guiding box is located below the track and communicates with the second flow guiding opening, and the flow guiding box communicates with the cutting chamber through a drain pipe.

4. The cutting assembly according to claim 3, wherein The first flow guiding disc includes a first bottom plate, two relatively arranged first side plates and two relatively arranged first end plates, the first bottom plate, the two first side plates and the two first end plates jointly enclose a water containing space, and the first flow guiding opening is formed on the first end plate.

5. The cutting assembly according to claim 4, wherein The cutting assembly further includes a moving trolley installed on the track, the collection member is placed on the moving trolley, the moving trolley can move along the track, and the first flow guiding disc is arranged on the moving trolley.

6. The cutting assembly according to claim 5, wherein The first bottom plate is fixedly connected or integrally provided with the moving trolley, the first side plate extends along the length direction of the moving trolley, the bottom end of the first side plate is fixedly connected or integrally provided with the first bottom plate, the first end plate extends along the width direction of the moving trolley, and the bottom end of the first end plate is fixedly connected or integrally provided with the first bottom plate.

7. The cutting assembly according to any one of claims 1 to 6, characterized in that, The flow guiding assembly includes a second flow guiding disc provided on the side of the track, and a second collection port is provided at the top of the second flow guiding disc, and the cutting fluid can pass through the second collection port and enter into the second flow guiding disc.

8. The cutting assembly according to claim 7, wherein, The second flow guiding disc includes a second bottom plate, a second side plate and two relatively arranged second end plates, one side of the second bottom plate is fixedly connected with the side wall of the track, the second side plate extends along the length direction of the track, the bottom end of the second side plate is fixedly connected or integrally provided with the other side of the second bottom plate, the bottom ends of the second end plates are fixedly connected or integrally provided with the second bottom plate, and the left and right ends of the second end plates are respectively connected with the side wall of the track and the second side plate; and / or The second flow guiding disc communicates with the cutting chamber through a drain pipe.

9. The cutting assembly according to claim 8, wherein, The second side plate is inclined upward in a direction away from the track.

10. A wire cutting machine, characterized in that, The wire cutting machine includes the cutting assembly according to any one of claims 1 to 9.

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