FC (Fiber Channel) product sealing and measuring hot-pressing device

Abstract

The utility model relates to an FC product sealing and testing hot-pressing device, and belongs to the technical field of product sealing and testing. Comprising a collecting and discharging mechanism for collecting and discharging materials; the platform guide rail is arranged on the working table top and used for conveying and positioning the carrier tape; the hot pressing main frame comprises a lower heating platform which is driven by a lower lifting air cylinder to do lifting motion and comprises a base body, a heating part, a temperature thermocouple and a sliding block guide mechanism; the upper lifting mechanism comprises a servo motor, a speed reducer and an upper lifting lead screw; the upper hot-pressing heating pipe combination is driven by an upper lifting mechanism to lift and is integrated with a heating pipe with a built-in thermocouple, and the end part of the upper hot-pressing heating pipe combination forms a direct pressure applying surface and is provided with a spring pressure adjusting mechanism; after the equipment is put into use, 16 chips can be welded at the same time through one-time operation of a single person, the problem that the efficiency is too low due to the fact that only one chip can be welded at a time in the prior art is solved, and meanwhile the technical problems that manual labor cost is high, working steps are many and replacement is frequent are solved.

Description

Technical Field

[0001] The utility model relates to a hot pressing device for FC product packaging and testing, belonging to the technical field of product packaging and testing. Background Art

[0002] At present, in the field of semiconductor FC product packaging and testing, the packaging and soldering of chips and carrier tapes mainly rely on manual spot welding. Manual spot welding has problems such as insufficient pressure control accuracy (easily affected by human factors), low efficiency (only one chip can be soldered at a time), high labor cost, and frequent material change (need to stop the machine and wait), which seriously restricts production efficiency and product quality.

[0003] In the prior art, some hot pressing devices attempt to improve performance through automation improvement. Although the temperature is adjusted by a heating device and a controller, there are defects such as inconvenient material loading and unloading, low hot pressing efficiency (still unable to realize simultaneous welding of multiple chips), and inability to complete downward pressing and welding with one key. In addition, related technologies in the field of carrier tape sealing, such as a carrier tape sealing device based on hot pressing disclosed in CN205060155U, which uses a servo motor to drive a single-side sealing knife for hot sealing, can reduce noise and vibration and control temperature fluctuations, but is only applicable to the sealing scenario of carrier tape and cover tape, and cannot solve the core problems such as simultaneous welding of multiple chips, up-and-down coordinated hot pressing control, and continuous material change in chip soldering.

[0004] Therefore, there is an urgent need for a hot pressing device for FC product packaging and testing that can improve welding efficiency, accurately control pressure and temperature, and realize continuous non-stop operation. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a hot pressing device for FC product packaging and testing, which solves the problems of high labor cost, many working steps and frequent replacement in the prior art.

[0006] The hot pressing device for FC product packaging and testing described in the utility model includes:

[0007] A material loading and unloading mechanism for performing material loading and unloading operations;

[0008] A platform guide rail is arranged on the workbench surface for transporting and positioning the carrier tape to ensure that the positions of the carrier tape chips are aligned with the hot pressing center;

[0009] A hot pressing main frame, including:

[0010] A lower heating platform is driven by a lower lifting cylinder to perform lifting movement, and includes a base body, a heating component, a temperature measuring thermocouple, and a slider guiding mechanism;

[0011] An upper lifting mechanism includes a servo motor, a reducer, and an upper lifting lead screw, and realizes precise lifting by driving the reducer with the servo motor to drive the upper lifting lead screw;

[0012] The upper hot pressing heating tube assembly is driven by a lifting mechanism to move up and down. It integrates a heating tube with a built-in thermocouple, and its end forms a direct pressing surface. It is equipped with a spring pressure adjustment mechanism.

[0013] Among them, the lower heating platform and the upper hot pressing heating tube assembly form a cooperative hot pressing working surface, and the lifting of the lower lifting cylinder and the lifting of the servo motor form a linkage pressure system.

[0014] Preferably, the feeding and discharging mechanism includes a feeding device and a discharging device respectively located on the left and right sides of the main hot pressing frame. The feeding device and the discharging device perform feeding and discharging operations through silicon oil paper. The silicon oil paper isolates the pressing head from the colloid to avoid the colloid sticking and affecting the hot pressing effect. When the carrier tape or the silicon oil paper is exhausted, the equipment automatically prompts to replace the material tray, and the operator can complete the switching of 5 spare material trays in only 30 seconds, realizing continuous production without stopping.

[0015] Preferably, a number of positioning pins are provided on the platform guide rail for the conveying and positioning of the carrier tape to ensure that the chip position is at the center of the hot pressing point.

[0016] Preferably, the lower heating platform is made of stainless steel, and its surface is provided with a temperature measuring thermocouple. It is heated by 2 heating tubes of 8*75*200W. A lower lifting cylinder is arranged below the lower heating platform. The slider guiding mechanism includes a slider and a lower linear guide rail. The lower end of the lower lifting cylinder is fixed, and the upper end of the lower lifting cylinder cooperates with the slider guiding mechanism to realize the lifting movement of the lower heating platform.

[0017] Preferably, a heating tube jacket is provided outside the heating tube. The spring pressure adjustment mechanism is arranged between the heating tube and the heating tube jacket, and the spring pressure adjustment mechanism is a symmetrically arranged disc spring.

[0018] Preferably, a fixing frame is provided outside the heating tube jacket. The fixing frame is connected to the outside of the upper lifting lead screw. A reducer and a servo motor are connected above the upper lifting lead screw. An upper linear guide rail is also connected to the outside of the upper lifting lead screw, and the lifting direction and precision control can be fixed through the upper linear guide rail.

[0019] Preferably, it further includes a cabinet support, and the cabinet support is located below the main hot pressing frame.

[0020] Preferably, it further includes a control mounting plate, which is internally provided with a control module and externally provided with a touch display screen.

[0021] The FC product encapsulation and testing hot pressing device of the present utility model has the following beneficial effects:

[0022] 1. After the equipment is put into use, it can realize single-person single-operation to weld 16 chips at the same time, replacing the problem of too low efficiency of only welding one chip at a time before. The downward pressing precision is controlled within 0.1mm, and the temperature is controlled within plus or minus 1°C.

[0023] 2. Only need to replace 5 material trays in the material bin at one time. The entire set of equipment completes the automatic loading belt work. The belt connection and material replacement processes are uninterrupted. There is no need to stop the dispensing machine for material replacement, and continuous non-stop operation can be achieved. At the same time, the number of operators can be changed from one operator per dispensing machine to one operator for multiple dispensing machines, effectively saving labor costs;

[0024] 3. The qualified rate is significantly improved: The pressure control of the ball screw driven by the servo motor and the independent temperature control module are adopted, and the welding qualified rate is improved;

[0025] 4. Material cost savings: Abandon the gold wire welding process, and directly fix the chip and the carrier tape by thermocompression bonding, effectively saving the material cost of the gold wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 : The overall structure diagram of the present utility model;

[0027] Figure 2 : The structure diagram of the thermocompression main frame in the present utility model;

[0028] Figure 3 : The structure diagram of the platform guide rail in the present utility model;

[0029] Figure 4 : The structure diagram of the lower heating platform in the present utility model;

[0030] Figure 5 : The structure diagram of the upper thermocompression heating tube combination in the present utility model;

[0031] Figure 6 : The structure diagram of the upper lifting mechanism in the present utility model;

[0032] In the figure: 1. Control mounting plate; 2. Thermocompression main frame; 21. Upper lifting lead screw; 22. Upper thermocompression heating tube combination; 221. Heating tube; 222. Spring; 223. Fixed frame; 224. Heating tube outer sleeve; 23. Lower heating platform; 24. Lower lifting cylinder; 25. Lower linear guide rail; 26. Servo motor; 27. Reducer; 28. Upper linear guide rail; 3. Material receiving device; 4. Platform guide rail; 41. Positioning pin; 5. Cabinet support; 6. Material feeding device. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0034] Embodiment 1:

[0035] As shown Figures 1-6 in the figure, the FC product sealing and testing hot pressing device of the present utility model includes:

[0036] A material loading and unloading mechanism for performing material loading and unloading operations;

[0037] The platform guide rail 4 is arranged on the workbench surface for conveying and positioning the carrier tape to ensure that the position of the carrier tape chip is aligned with the hot pressing center;

[0038] The hot pressing main frame 2 includes:

[0039] The lower heating platform 23 is driven by the lower lifting cylinder 24 to perform lifting movement, and includes a base body, a heating component, a temperature measuring thermocouple, and a slider guiding mechanism;

[0040] The upper lifting mechanism includes a servo motor 26, a speed reducer 27, and an upper lifting lead screw 21, and the upper lifting lead screw 21 is accurately lifted by driving the speed reducer 27 through the servo motor 26;

[0041] The upper hot pressing heating tube assembly 22 is driven by the upper lifting mechanism to perform lifting, and is integrated with a heating tube 221 with an internal thermocouple. The end part thereof forms a direct pressing surface, and is configured with a spring pressure regulating mechanism;

[0042] Among them, the lower heating platform 23 and the upper hot pressing heating tube assembly form a cooperative hot pressing working surface, and the lifting of the lower lifting cylinder 24 and the lifting of the servo motor 26 form a linkage pressure system.

[0043] The material loading and unloading mechanism includes a material receiving device 3 and a material discharging device 6 respectively located on the left and right sides of the hot pressing main frame 2. The material receiving device 3 and the material discharging device 6 perform material loading and unloading operations on the silicon oil paper, and the silicon oil paper isolates the pressing head from the colloid.

[0044] The material loading and unloading mechanism is mainly used for the loading and unloading of the silicon oil paper. The silicon oil paper isolates the pressing head from the glue to prevent the glue from sticking to the pressing head and affecting the next hot pressing effect;

[0045] A plurality of positioning pins 41 are provided on the platform guide rail 4 for the conveying and positioning of the carrier tape to ensure that the position of the chip is at the center of the hot pressing point.

[0046] The hot pressing main frame 2 is the core component of the device and the main component for realizing the hot pressing function.

[0047] The lower heating platform 23 is made of stainless steel, and a temperature-measuring thermocouple is provided on its surface. It is heated by 2 heating tubes of 8*75*200W. A lower lifting cylinder 24 is arranged below the lower heating platform 23. The slider guiding mechanism includes a slider and a lower linear guide rail 25. The lower end of the lower lifting cylinder 24 is fixed, and the upper end of the lower lifting cylinder 24 is matched with the slider guiding mechanism to realize the lifting movement of the lower heating platform 23. The cylinder lifting and slider guiding are adopted to ensure the lifting and returning accuracy. When it is necessary to move the carrier tape during downward pressing, the cylinder needs to be lowered, and the heating platform will fall together. When it is necessary to perform hot pressing after the carrier tape is moved in place, the cylinder needs to be raised, and the heating platform will move upward.

[0048] The heating tube 221 is an internally thermocouple-type heating tube. The end of the heating tube is directly pressed on the chip. The applied pressure of the heating tube 221 is controlled by controlling the compression amount of the control spring 222. The appropriate pressure value is found through experiments, and the magnitude of the pressure can be controlled by setting the stroke of the upper lifting lead screw 21.

[0049] An outer jacket 224 of the heating tube is provided outside the heating tube 221. The spring pressure regulating mechanism is arranged between the heating tube 221 and the outer jacket 224 of the heating tube. The spring pressure regulating mechanism is a symmetrically arranged disc spring 222.

[0050] A fixing bracket 223 is provided outside the outer jacket 224 of the heating tube. The fixing bracket 223 is connected to the outside of the upper lifting lead screw 21. A speed reducer 27 and a servo motor 26 are connected above the upper lifting lead screw 21. An upper linear guide rail 28 is also connected to the outside of the upper lifting lead screw 21. The lifting direction and precision control can be fixed through the upper linear guide rail 28.

[0051] It further includes a cabinet support 5, and the cabinet support 5 is located below the hot pressing main frame 2.

[0052] It further includes a control mounting plate 1, which is provided with a control module inside and a touch display screen outside.

[0053] During operation, the carrier tape is automatically conveyed to the hot pressing station through the platform guide rail 4. The positioning sensor detects the position of the carrier tape to ensure that the chip is accurately located in the central area of the lower heating platform 23. After the carrier tape is moved in place, the lower lifting cylinder 24 drives the lower heating platform 23 to rise to a preset height and is in close contact with the carrier tape.

[0054] Silicone oil paper isolation and winding: The winding and unwinding mechanism synchronously releases the silicone oil paper, which covers the surface of the carrier tape to isolate the hot pressing head from the colloid and prevent the colloid from sticking. After hot pressing is completed, the silicone oil paper is automatically recycled, and new silicone oil paper is continuously supplied by the unwinding disc to achieve uninterrupted operation.

[0055] Hot pressing and welding process:

[0056] Heating stage:

[0057] The lower heating platform 23 is heated to the set temperature (adjustable from 20 - 200 °C) by two 200W heating tubes. The thermocouple monitors the surface temperature in real-time and feeds it back to the PLC control system to ensure that the temperature control error ≤ ±1 °C.

[0058] The upper hot pressing heating tube assembly 22 is heated synchronously to the same temperature, and independent temperature control of each indenter is achieved through the built-in thermocouple.

[0059] The PLC triggers the servo motor 26 to drive the upper lifting lead screw 21, driving the upper hot pressing head to press vertically downward. The pressure is adjusted by the spring compression amount (adjustable from 0.5 - 10 N), and the pressure accuracy is controlled to 0.1 mm.

[0060] After the indenter contacts the chip, the set pressure and time (adjustable from 0.5 - 10 seconds) are maintained to melt the solder paste and complete the bonding of the chip and the carrier tape.

[0061] Separation and reset:

[0062] After hot pressing is completed, the servo motor 26 drives the upper indenter to retract to the initial position, and the lower lifting cylinder 24 of the lower heating platform 23 descends synchronously. The carrier tape is conveyed by the platform guide rail to the next station.

[0063] The silicone oil paper is automatically peeled off and recycled, and a new silicone oil paper covers the surface of the carrier tape to prepare for the next hot pressing cycle.

[0064] Continuous operation and material replacement:

[0065] When the carrier tape or silicone oil paper is exhausted, the equipment automatically pauses and prompts to replace the material tray. The operator starts the material replacement program through the touch screen. Five spare material trays can be quickly switched, and the material replacement time ≤ 30 seconds to ensure continuous production without stopping the machine.

[0066] One-key operation: Preset parameters (temperature, pressure, time) through the touch screen. After startup, the PLC automatically coordinates the actions of each module to achieve the "one-key completion" hot pressing process.

[0067] Precision control: The closed-loop control of the servo motor 26 and the ball screw ensures the lifting precision (0.1 mm). Combined with real-time temperature control by the thermocouple, it guarantees the consistency of welding quality.

[0068] Pollution-free design: The silicone oil paper isolation technology avoids colloid residue, reduces the equipment cleaning frequency, and improves the product qualification rate and equipment stability. The main technical parameters are shown in Table 1 below.

[0069] Table 1 Main technical parameter table

[0070]

[0071] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, making equivalent substitutions or changes, shall be covered by the protection scope of the present utility model.

Claims

1. A hot pressing device for FC product packaging and testing, characterized in that, Comprising: A material loading and unloading mechanism for performing material loading and unloading operations; A platform guide rail (4) provided on the workbench surface for conveying and positioning the carrier tape to ensure that the positions of the chips on the carrier tape are aligned with the hot pressing center; A hot pressing main frame (2), including: A lower heating platform (23) driven by a lower lifting cylinder (24) to perform lifting motion, including a base body, a heating component, a temperature measuring thermocouple, and a slider guiding mechanism; An upper lifting mechanism, including a servo motor (26), a speed reducer (27), and an upper lifting lead screw (21), and achieving precise lifting by driving the speed reducer (27) with the servo motor (26) to drive the upper lifting lead screw (21); An upper hot pressing heating tube assembly (22) driven by the upper lifting mechanism to perform lifting, integrated with heating tubes (221) with built-in thermocouples, the ends of which form a direct pressing surface, and configured with a spring pressure regulating mechanism; Wherein, the lower heating platform (23) and the upper hot pressing heating tube assembly form a cooperative hot pressing working surface, and the lifting of the lower lifting cylinder (24) and the lifting of the servo motor (26) form a linkage pressure system.

2. The FC product encapsulation and testing hot pressing device according to claim 1, wherein The material loading and unloading mechanism includes a material receiving device (3) and a material feeding device (6) respectively located on both sides of the hot pressing main frame (2), and the material receiving device (3) and the material feeding device (6) perform material loading and unloading operations through silicon oil paper.

3. The FC product encapsulation and testing hot pressing device according to claim 1, characterized in that, A number of positioning pins (41) are provided on the platform guide rail (4) for conveying and positioning the carrier tape to ensure that the chip positions are at the center of the hot pressing points.

4. The FC product encapsulation and testing hot pressing device according to claim 1, characterized in that, The lower heating platform (23) is made of stainless steel, with a temperature measuring thermocouple provided on its surface, heated by 2 heating tubes of 8*75*200W, a lower lifting cylinder (24) is arranged below the lower heating platform (23), and the slider guiding mechanism includes a slider and a lower linear guide rail (25), the lower end of the lower lifting cylinder (24) is fixed, and the upper end of the lower lifting cylinder (24) cooperates with the slider guiding mechanism to realize the lifting motion of the lower heating platform (23).

5. The FC product packaging and testing hot pressing device according to claim 1, characterized in that, A heating tube jacket (224) is provided outside the heating tube (221), and the spring pressure regulating mechanism is arranged between the heating tube (221) and the heating tube jacket (224), and the spring pressure regulating mechanism is a symmetrically arranged disc-shaped spring (222).

6. The FC product encapsulation and testing hot pressing device according to claim 5, characterized in that, A fixing frame (223) is provided outside the heating tube jacket (224), the fixing frame (223) is connected to the outside of the upper lifting lead screw (21), the upper part of the upper lifting lead screw (21) is connected to the speed reducer (27) and the servo motor (26), and an upper linear guide rail (28) is also connected to the outside of the upper lifting lead screw (21).

7. The FC product encapsulation and testing hot pressing device according to claim 1, characterized in that, It further includes a cabinet support (5), and the cabinet support (5) is located below the hot pressing main frame (2).

8. The FC product encapsulation and testing hot pressing device according to claim 1, wherein It further includes a control mounting plate (1), with a control module inside and a touch display screen outside.

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