Sealing ball valve for semiconductor oxygen supply system

Abstract

The utility model discloses a sealing ball valve for a semiconductor oxygen supply system, and belongs to the technical field of semiconductor production equipment. The sealing ball valve for the semiconductor oxygen supply system comprises a valve body, a valve rod rotationally connected to the inner side of the valve body, valve covers symmetrically arranged at the two ends of the valve body, and a valve ball fixedly connected to the lower end of the valve rod and rotationally connected with the inner wall of the valve body. A dustproof sealing structure is arranged between the valve body and the valve cover, and a packing sealing structure is arranged between the valve rod and the valve body. According to the sealing ball valve for the semiconductor oxygen supply system, the dustproof sealing structure is arranged, the first dustproof ring and the second dustproof ring are arranged on the end face of the valve deck and the middle of the valve deck respectively, the sealing ring is arranged between the valve deck and the valve ball, and the triple sealing structure is adopted, so that external dust is prevented from entering the sealing ball valve, and oxygen is prevented from leaking in the conveying process; by arranging the filler sealing structure, the elastic compensation element can carry out dynamic loading when the filler is abraded, and dynamic compensation is achieved when the filler is abraded.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production equipment, in particular to a sealed ball valve for a semiconductor oxygen supply system. Background Art

[0002] A ball valve is a valve in which the closing member (ball) is driven by a valve stem and rotates around the ball valve stem line. It can also be used for the regulation and control of fluids. Among them, the hard-sealed V-type ball valve has a strong shearing force between its V-type ball core and the metal valve seat with surfacing hard alloy, and is especially suitable for media containing fibers, tiny solid particles, etc. The multi-way ball valve can not only flexibly control the confluence, diversion, and flow direction switching of the medium on the pipeline, but also close any channel to connect the other two channels. This type of valve should generally be installed horizontally in the pipeline. The ball valve is divided into pneumatic ball valve, electric ball valve, and manual ball valve according to the driving method.

[0003] During the semiconductor production process, the sealing performance of the oxygen supply system is crucial. The existing ball valves have leakage problems during the transportation of high-purity oxygen, which affects the safety and efficiency of semiconductor production. Summary of the Utility Model

[0004] The utility model provides a sealed ball valve for a semiconductor oxygen supply system, aiming to solve the problems that the existing ball valves have leakage problems during the transportation of high-purity oxygen, which affects the safety and efficiency of semiconductor production and other problems mentioned in the background art.

[0005] To achieve the above object, the utility model provides the following technical solution: A sealed ball valve for a semiconductor oxygen supply system, the sealed ball valve for a semiconductor oxygen supply system includes a valve body, a valve stem rotatably connected to the inner side of the valve body, valve covers symmetrically arranged at both ends of the valve body, and a valve ball fixedly connected to the lower end of the valve stem and rotatably connected to the inner wall of the valve body; a dust-proof sealing structure is arranged between the valve body and the valve cover, and the dust-proof sealing structure includes two sealing rings symmetrically arranged between the valve cover and the valve ball, a first dust-proof ring respectively embedded in the end face of the valve cover far away from the valve ball, and a second dust-proof ring sleeved on the middle part of the outer side of the valve cover; a packing sealing structure is arranged between the valve stem and the valve body, and the packing sealing structure includes a packing sleeved on the outer side of the valve stem, a packing gland arranged at the upper end of the packing, a locking ring threadedly connected to the upper end of the valve stem, a sealing gasket sleeved on the lower end of the valve stem, and an elastic compensation element arranged between the packing gland and the locking ring and sleeved on the outer side of the valve stem.

[0006] By setting a dust-proof sealing structure, a first dust-proof ring and a second dust-proof ring are respectively arranged on the end face and the middle part of the valve cover, and a sealing ring is arranged between the valve cover and the valve ball. With the above triple-sealing structure, external dust can be prevented from entering and oxygen leakage during transportation can be prevented. By setting a packing sealing structure, the elastic compensation element can perform dynamic loading when the packing wears, achieving dynamic compensation for the wear of the packing.

[0007] Preferably, the cross-section of the valve stem is square, and the surface is designed with surfacing hard-facing. The lower end of the valve stem is integrally connected with a connecting block, and a pin hole is opened on one side of the connecting block. Surfacing hard-facing is used to increase the surface hardness of the valve stem, and square connection and surfacing hard-facing are used to improve the wear resistance and extrusion resistance.

[0008] Preferably, a connecting groove adapted to the connecting block is opened at the top of the valve ball, and a pin adapted to the pin hole is fixedly connected to the inner wall of one side of the connecting groove.

[0009] Preferably, the valve body is made of polytetrafluoroethylene material, which has the advantages of good elasticity and corrosion resistance, so as to improve the service life of the valve body.

[0010] Preferably, the elastic compensation element adopts a disc spring or a bellows. The disc spring or the bellows is used for dynamic loading to achieve dynamic compensation for the wear of the packing.

[0011] Preferably, the packing adopts high-purity graphite packing or a high-efficiency sealing ring, which has the advantage of strong durability.

[0012] The sealed ball valve for a semiconductor oxygen supply system has a simple structure and is easy to use. By setting a dust-proof sealing structure, a first dust-proof ring and a second dust-proof ring are respectively arranged on the end face and the outer middle part of the valve cover, and a sealing ring is arranged between the valve cover and the valve ball. With the above triple-sealing structure, external dust can be prevented from entering and oxygen leakage during transportation can be prevented. By setting a packing sealing structure, the elastic compensation element can perform dynamic loading when the packing wears, achieving dynamic compensation for the wear of the packing. Brief Description of the Drawings

[0013] Figure 1 is an exploded view of a sealed ball valve for a semiconductor oxygen supply system;

[0014] Figure 2 is a side view of a sealed ball valve for a semiconductor oxygen supply system;

[0015] Figure 3 is a schematic cross-sectional view of a sealed ball for a semiconductor oxygen supply system in the Figure 2 sectional view taken along the line B-B;

[0016] Figure 4Schematic structural diagram of a sealed ball valve for a semiconductor oxygen supply system;

[0017] Figure 5 Explosion structure diagram of the dust-proof sealing structure in a sealed ball valve for a semiconductor oxygen supply system.

[0018] In the figure:

[0019] 1. Valve body;

[0020] 2. Valve stem; 21. Connecting block;

[0021] 3. Valve cover;

[0022] 4. Valve ball; 41. Connecting groove;

[0023] 5. Dust-proof sealing structure; 51. Sealing ring; 52. First dust-proof ring; 53. Second dust-proof ring;

[0024] 6. Packing sealing structure; 61. Packing; 62. Packing gland; 63. Locking ring; 64. Locking ring; 65. Elastic compensation element. Detailed implementation mode

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0026] This embodiment provides a sealed ball valve for a semiconductor oxygen supply system. As Figures 1 to 5 shown, the sealed ball valve for a semiconductor oxygen supply system includes a valve body 1, a valve stem 2 rotatably connected to the inner side of the valve body 1, valve covers 3 symmetrically arranged at both ends of the valve body 1, and a valve ball 4 fixedly connected to the lower end of the valve stem 2 and rotatably connected to the inner wall of the valve body 1; a dust-proof sealing structure 5 is arranged between the valve body 1 and the valve cover 3. The dust-proof sealing structure 5 includes two sealing rings 51 symmetrically arranged between the valve cover 3 and the valve ball 4, a first dust-proof ring 52 respectively embedded in the end face of the valve cover 3 away from the valve ball 4, and a second dust-proof ring 53 sleeved on the middle part of the outside of the valve cover 3; a packing sealing structure 6 is arranged between the valve stem 2 and the valve body 1. The packing sealing structure 6 includes a packing 61 sleeved on the outside of the valve stem 2, a packing gland 62 arranged at the upper end of the packing 61, a locking ring 63 threadedly connected to the upper end of the valve stem 2, a sealing gasket 64 sleeved on the lower end of the valve stem 2, and an elastic compensation element 65 arranged between the packing gland 62 and the locking ring 63 and sleeved on the outside of the valve stem 2.

[0027] By providing a dust-proof sealing structure 5, a first dust-proof ring 52 and a second dust-proof ring 53 are respectively provided on the end face and the middle part of the outer side of the valve cover 3, and a sealing ring 51 is provided between the valve cover 3 and the valve ball 4. With the above triple-sealing structure, external dust is prevented from entering and oxygen leakage during transportation is prevented; by providing a packing sealing structure 6, the elastic compensation element 65 can perform dynamic loading when the packing 61 wears, realizing dynamic compensation for the wear of the packing 61.

[0028] In one embodiment, the cross-section of the valve stem 2 is square, and the surface is designed with hard surfacing by surfacing. The lower end of the valve stem 2 is integrally connected with a connecting block 21. A pin hole is provided on one side of the connecting block 21. Hard surfacing is used to increase the surface hardness of the valve stem 2, and square connection and hard surfacing are used to improve the wear resistance and extrusion resistance.

[0029] In this embodiment, referring to Figure 1 , the valve ball 4 and the valve stem 2 are connected in a square shape, and hard surfacing is used to improve the wear resistance and extrusion resistance.

[0030] In one embodiment, a connecting groove 41 adapted to the connecting block 21 is provided at the top of the valve ball 4, and a pin adapted to the pin hole is fixedly connected to an inner wall of one side of the connecting groove 41.

[0031] In this embodiment, referring to Figure 1 and Figure 3 , the valve stem 2 and the valve ball 4 are fixed together by adapting the connecting groove 41 to the connecting block 21 and inserting and mating the pin hole with the pin.

[0032] In one embodiment, the valve body 1 is made of polytetrafluoroethylene material.

[0033] In this embodiment, referring to Figure 1 , it has the advantages of good elasticity and corrosion resistance, so as to improve the service life of the valve body 1.

[0034] In one embodiment, the elastic compensation element 65 is a disc spring or a bellows.

[0035] In this embodiment, referring to Figure 1 and Figure 3 , dynamic loading is performed by using a disc spring or a bellows to realize dynamic compensation for the wear of the packing 61.

[0036] In one embodiment, the packing 61 is a high-purity graphite packing or a high-efficiency sealing ring.

[0037] In this embodiment, referring to Figure 1 and Figure 3, by adopting the packing 61 with high-purity graphite packing or high-efficiency sealing rings, it has the advantage of strong durability.

[0038] As mentioned above, only the preferred specific implementation manners of the present utility model are described. However, the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. A sealed ball valve for a semiconductor oxygen supply system, comprising a valve body (1), a valve stem (2) rotatably connected to the inner side of the valve body (1), valve covers (3) symmetrically arranged at both ends of the valve body (1), and a valve ball (4) fixedly connected to the lower end of the valve stem (2) and rotatably connected to the inner wall of the valve body (1); It is characterized in that: A dust-proof sealing structure (5) is arranged between the valve body (1) and the valve cover (3). The dust-proof sealing structure (5) includes two sealing rings (51) symmetrically arranged between the valve cover (3) and the valve ball (4), a first dust-proof ring (52) respectively embedded in the end face of the valve cover (3) away from the valve ball (4), and a second dust-proof ring (53) sleeved on the middle part of the outer side of the valve cover (3); A packing sealing structure (6) is arranged between the valve stem (2) and the valve body (1). The packing sealing structure (6) includes a packing (61) sleeved on the outer side of the valve stem (2), a packing gland (62) arranged at the upper end of the packing (61), a locking ring (63) threadedly connected to the upper end of the valve stem (2), a sealing gasket (64) sleeved on the lower end of the valve stem (2), and an elastic compensation element (65) arranged between the packing gland (62) and the locking ring (63) and sleeved on the outer side of the valve stem (2).

2. The sealed ball valve for a semiconductor oxygen supply system according to claim 1, wherein: The cross-section of the valve stem (2) is square, and the surface is designed with surfacing hardfacing. A connecting block (21) is integrally connected to the lower end of the valve stem (2), and a pin hole is formed on one side of the connecting block (21).

3. The sealed ball valve for a semiconductor oxygen supply system according to claim 2, characterized in that: A connecting groove (41) adapted to the connecting block (21) is formed at the top of the valve ball (4), and a pin adapted to the pin hole is fixedly connected to the inner wall of one side of the connecting groove (41).

4. The sealed ball valve for a semiconductor oxygen supply system according to claim 1, wherein: The valve body (1) is made of polytetrafluoroethylene material.

5. The sealed ball valve for a semiconductor oxygen supply system according to claim 1, characterized in that: The elastic compensation element (65) is a disc spring or a bellows.

6. The sealed ball valve for a semiconductor oxygen supply system according to claim 1, characterized in that: The packing (61) is made of high-purity graphite packing or a high-efficiency sealing ring.

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