Novel LED lamp heat dissipation structure
By introducing a combination of thermal chassis, heat dissipation fins and high thermal coatings into LED lamps, the problem of unsatisfactory heat dissipation in existing LED lamps is solved, efficient heat dissipation is achieved, and the service life of the lamps is extended.
Patent Information
- Application Number
- CN202422378462.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The heat dissipation effect of existing LED lamps is not ideal, especially high-power LED lamps, which require additional cooling fans, which increases power consumption and affects service life.
A heat dissipation device containing a thermal chassis and radial radial fins is adopted. The contact surface of the aluminum substrate and the thermal chassis are coated with high thermal coating. The aluminum substrate and the heat dissipation fins are connected by screws, combining a high-thermal radiant coating and a thermal outer ring to improve heat dissipation efficiency.
It improves heat dissipation efficiency, reduces thermal resistance, avoids excessive temperature of lamps, extends service life, and meets the needs of high-power lamps.
Smart Images
Figure CN223153525U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED lamps, in particular to a novel heat dissipation structure for LED lamps. Background Art
[0002] The heat dissipation effect of LED lamps has a great influence on the service life of LED lamps. The existing LED lamps basically rely only on the aluminum substrate of the lamps for heat dissipation. This method has an unsatisfactory heat dissipation effect. For some high-power LED lamps, it is necessary to add a heat dissipation fan for heat dissipation, which increases the power consumption of the lamps. Summary of the Invention
[0003] The problem to be solved by the utility model is to provide a novel heat dissipation structure for LED lamps, improve the heat dissipation efficiency of the lamps, and meet the use requirements of high-power lamps.
[0004] To solve the above technical problems, a novel heat dissipation structure for LED lamps provided by the utility model includes an LED lamp board and a heat dissipation device. The heat dissipation device includes a heat conduction chassis and heat dissipation fins evenly distributed in a radial pattern at the bottom of the heat conduction chassis. The LED lamp board includes an aluminum substrate and a number of LED lamp beads distributed on the top surface of the aluminum substrate. A high heat radiation coating is sprayed on the surface of the aluminum substrate. A number of first through holes are penetrated through the aluminum substrate. First mounting posts are provided on the heat dissipation fins. First internal threaded holes extending into the interior of the first mounting posts are penetrated through the aluminum substrate. A first screw is connected between the first through hole and the first internal threaded hole. A high thermal conductivity coating is applied to the contact surface between the aluminum substrate and the heat conduction chassis. The heat conduction chassis and the heat dissipation fins are both made of high thermal conductivity materials.
[0005] Preferably, it further includes a lamp cover covering the top of the LED lamp board. A number of second through holes are penetrated through the lamp cover. Second mounting posts are provided on the heat dissipation fins. Second internal threaded holes extending into the interior of the second mounting posts are penetrated through the heat conduction chassis. A second screw is connected between the second through hole and the second internal threaded hole.
[0006] Preferably, the heat dissipation device further includes a heat conduction outer ring, and one end of the heat dissipation fin extends to the inner wall of the heat conduction outer ring.
[0007] Preferably, the heat conduction chassis, the heat dissipation fins and the heat conduction outer ring are of an integral die-casting structure.
[0008] Preferably, the high thermal conductivity coating is thermal grease.
[0009] The beneficial effects of the present utility model are as follows: The present utility model provides a novel heat dissipation structure for an LED lamp. By coating a high thermal conductivity coating on the contact surface between the aluminum substrate and the heat conducting chassis, the heat on the aluminum substrate can be quickly conducted to the heat conducting chassis. By providing heat dissipation fins on the heat conducting chassis, the heat on the heat conducting chassis can be conducted to the heat dissipation fins, which can increase the heat dissipation area and improve the heat dissipation efficiency. By spraying a high heat radiation coating on the surface of the aluminum substrate, the aluminum substrate can accelerate the dissipation of heat into the air. By arranging the first mounting post on the heat dissipation fins and using the first screw to connect the first through hole and the first internal thread hole, the heat on the aluminum substrate can be conducted to the heat dissipation fins through the first screw, reducing the thermal resistance of the aluminum substrate, accelerating the heat dissipation of the aluminum substrate, avoiding the lamp from overheating, meeting the use requirements of high-power lamps, and extending the service life of the lamp. Description of the Drawings
[0010] Figure 1 Illustrates the external structure schematic diagram of the present utility model.
[0011] Figure 2 Illustrates the structure schematic diagram of the heat dissipation device of the present utility model.
[0012] Figure 3 Illustrates the cross-sectional structure schematic diagram of the present utility model.
[0013] Figure 4 Illustrates the present utility model Figure 3 The partial enlarged structure schematic diagram of part A in.
[0014] Figure 5 Illustrates the exploded structure schematic diagram of the present utility model.
[0015] Explanation of the reference numerals in the drawings: LED lamp board 1, aluminum substrate 10, LED lamp beads 11, first through hole 12, first internal thread hole 13, first screw 14, heat dissipation device 2, heat conducting chassis 20, second internal thread hole 200, second screw 201, heat dissipation fins 21, first mounting post 210, second mounting post 211, heat conducting outer ring 22, lamp cover 3, second through hole 30. Detailed Embodiments
[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some, but not all, of the embodiments of the present disclosure.
[0017] Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present disclosure.
[0018] Reference Figures 1-5 。
[0019] The utility model provides a novel heat dissipation structure for an LED lamp, which comprises an LED lamp board 1 and a heat dissipation device 2. The heat dissipation device 2 comprises a heat-conducting chassis 20 and heat dissipation fins 21 evenly distributed in a radial pattern at the bottom of the heat-conducting chassis 20. The LED lamp board 1 comprises an aluminum substrate 10 and a number of LED lamp beads 11 distributed on the top surface of the aluminum substrate 10. A high heat radiation coating is sprayed on the surface of the aluminum substrate 10. A number of first through holes 12 are penetrated through the aluminum substrate 10. First mounting posts 210 are arranged on the heat dissipation fins 21. First internal threaded holes 13 extending into the interiors of the first mounting posts 210 are penetrated through the aluminum substrate 10. A first screw 14 is connected between the first through holes 12 and the first internal threaded holes 13. A high heat-conducting coating is applied to the contact surface between the aluminum substrate 10 and the heat-conducting chassis 20. Both the heat-conducting chassis 20 and the heat dissipation fins 21 are made of high heat-conducting materials.
[0020] The working principle thereof is that, by applying a high heat-conducting coating to the contact surface between the aluminum substrate 10 and the heat-conducting chassis 20, the heat on the aluminum substrate 10 can be quickly conducted to the heat-conducting chassis 20. By arranging the heat dissipation fins 21 on the heat-conducting chassis 20, the heat on the heat-conducting chassis 20 can be conducted to the heat dissipation fins 21, the heat dissipation area can be increased, and the heat dissipation efficiency can be improved. By spraying a high heat radiation coating on the surface of the aluminum substrate 10, the aluminum substrate 10 can accelerate the dissipation of heat to the air. By arranging the first mounting posts 210 on the heat dissipation fins 21 and using the first screw 14 to connect the first through holes 12 and the first internal threaded holes 13, the heat on the aluminum substrate 10 can be conducted to the heat dissipation fins 21 through the first screw 14, the thermal resistance of the aluminum substrate 10 can be reduced, the heat dissipation of the aluminum substrate 10 can be accelerated, the temperature of the lamp can be prevented from being too high, the use requirements of high-power lamps can be met, and the service life of the lamp can be prolonged.
[0021] Based on the above embodiment, it further comprises a lamp cover 3 covering the top of the LED lamp board 1. A number of second through holes 30 are penetrated through the lamp cover 3. Second mounting posts 211 are arranged on the heat dissipation fins 21. Second internal threaded holes 200 extending into the interiors of the second mounting posts 211 are penetrated through the heat-conducting chassis 20. A second screw 201 is connected between the second through holes 30 and the second internal threaded holes 200. The lamp cover 3 can play a role in protecting and dust-proofing the LED lamp beads 11. The heat of the lamp cover 3 can be conducted to the heat dissipation fins 21 through the second screw 201, the heat dissipation of the lamp cover 3 can be accelerated, and the service life of the lamp can be improved.
[0022] Based on the above embodiment, the heat dissipation device 2 further comprises a heat-conducting outer ring 22. One end of the heat dissipation fins 21 extends to the inner wall of the heat-conducting outer ring 22, the heat dissipation area can be increased, the heat dissipation of the heat dissipation device 2 can be accelerated, the thermal resistance can be reduced, and it is ensured that the lamp can work stably for a long time.
[0023] Based on the above embodiments, the heat-conducting chassis 20, the heat-dissipating fins 21, and the heat-conducting outer ring 22 are of an integrally die-cast structure, which has better structural strength, is not easily deformed, and has better heat-conducting effect.
[0024] Based on the above embodiments, the high heat-conducting coating is heat-conducting silicone grease. The heat-conducting silicone grease has good heat-conducting effect and certain fluidity, which can enhance the heat-conducting efficiency between the heat-conducting chassis 20 and the aluminum substrate 10.
[0025] The above embodiments are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.
Claims
1. A novel heat dissipation structure for an LED lamp, characterized in that, It includes an LED lamp board and a heat dissipation device. The heat dissipation device includes a heat-conducting chassis and heat dissipation fins evenly distributed radially at the bottom of the heat-conducting chassis. The LED lamp board includes an aluminum substrate and a number of LED lamp beads distributed on the top surface of the aluminum substrate. A high-heat radiation coating is sprayed on the surface of the aluminum substrate. A number of first through holes are penetrated through the aluminum substrate. First mounting posts are provided on the heat dissipation fins. First internal threaded holes extending into the interior of the first mounting posts are penetrated through the aluminum substrate. A first screw is connected between the first through hole and the first internal threaded hole. A high-heat conductive coating is applied to the contact surface between the aluminum substrate and the heat-conducting chassis. The heat-conducting chassis and the heat dissipation fins are both made of high-heat conductive materials.
2. A novel heat dissipation structure for an LED lamp according to claim 1, characterized in that It further includes a lamp cover covering the top of the LED lamp board. A number of second through holes are penetrated through the lamp cover. Second mounting posts are provided on the heat dissipation fins. Second internal threaded holes extending into the interior of the second mounting posts are penetrated through the heat-conducting chassis. A second screw is connected between the second through hole and the second internal threaded hole.
3. A novel heat dissipation structure of an LED lamp according to claim 2, characterized in that, The heat dissipation device further includes a heat-conducting outer ring. One end of the heat dissipation fin extends to the inner wall of the heat-conducting outer ring.
4. A novel heat dissipation structure for an LED lamp according to claim 3, characterized in that, The heat-conducting chassis, the heat dissipation fins, and the heat-conducting outer ring are of an integrally die-cast structure.
5. A novel heat dissipation structure for an LED lamp according to claim 1, characterized in that, The high-heat conductive coating is heat-conducting silicone grease.