Novel composite heat insulation plate

Abstract

The utility model relates to the technical field of refractory materials, in particular to a novel composite heat insulation plate. Comprising a composite heat insulation plate body, the composite heat insulation plate body comprises a heat insulation base plate, a heat insulation cavity is formed in the heat insulation base plate, a heat insulation plate is arranged in the heat insulation cavity, and the upper surface of the heat insulation base plate is coated with a light high-temperature-resistant bonding coating used for heat insulation and used for assisting in sealing the heat insulation plate. The heat insulation cavity is formed in the heat insulation base plate, the heat insulation plate is arranged in the heat insulation cavity, meanwhile, the surface of the heat insulation base plate is coated with the light high-temperature-resistant bonding coating, and the synergistic effect of the heat insulation base plate, the heat insulation cavity, the heat insulation plate and the light high-temperature-resistant bonding coating is achieved. According to the structure, the integral integrity is guaranteed, all parts can be better matched with one another, and the heat insulation property and the integral strength of the composite heat insulation plate are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of refractory materials, and particularly relates to a novel composite heat insulation board. Background Art

[0002] In the field of industrial kilns, as the core equipment, the operating efficiency and energy consumption of the kiln are directly related to the production cost and economic benefits of the enterprise. A large amount of high temperature is generated during the operation of the kiln. To reduce heat loss, lower energy consumption, and maintain a stable temperature environment inside the kiln, the application of heat insulation materials is crucial.

[0003] Currently, the commonly used heat insulation materials for kilns mainly include refractory fiber boards, nano heat insulation boards, light castables, and light heat insulation bricks, etc. These materials each have certain advantages, but they also all have relatively obvious defects. For example, the nano heat insulation board performs excellently in terms of thermal conductivity and theoretically can meet the basic requirements of various kilns for heat insulation performance. However, in actual applications, many problems are exposed. For example, the strength and bulk density of this material are relatively low, resulting in poor resistance to mechanical damage. In the complex operating environment of the kiln, it is easily damaged by external forces, affecting the integrity and heat insulation effect of the heat insulation layer.

[0004] The patent document with the authorization announcement number of CN221959272U in the prior art discloses a novel composite heat insulation board, which includes a high-strength heat insulation board. The high-strength heat insulation board is used to be arranged between the kiln lining and the kiln shell. The high-strength heat insulation board is of a double-layer structure and includes a substrate. Grooves are designed on the cold surface or the hot surface of the substrate, and heat insulation materials are arranged in the grooves to form a composite material heat insulation structure with the substrate. This design attempts to improve the heat insulation performance and strength through a composite structure to a certain extent, but there are still some deficiencies. Designing grooves on the cold surface or the hot surface of the substrate and arranging heat insulation materials makes the combination of the substrate and the heat insulation materials lack integrity cooperation, which affects the strength of the entire structure to a certain extent. In the complex operating environment of the kiln, it may not be able to withstand large external forces and thermal stresses, thus affecting its heat insulation performance and service life. Summary of the Utility Model

[0005] The utility model provides a novel composite heat insulation board to solve the technical problem that the overall structural strength is relatively poor when improving the heat insulation performance of high-temperature plates used in kilns in the prior art.

[0006] To solve the above problems, the novel composite heat insulation board provided by the utility model adopts the following technical solutions:

[0007] It includes a composite heat insulation board body, and the composite heat insulation board body includes a heat insulation base board. A heat insulation cavity is formed in the heat insulation base board, and heat insulation plates are arranged in the heat insulation cavity. A light high-temperature resistant bonding coating for heat insulation and for assisting in sealing the heat insulation plates is coated on the upper surface of the heat insulation base board.

[0008] Further, heat insulation grooves are provided on the heat insulation base board, and the heat insulation grooves and the light high-temperature resistant bonding coating at the upper ports of the heat insulation grooves 13 cooperate to form a closed heat insulation cavity.

[0009] Further, the cross-sectional shape of the heat insulation plates is the same as the cross-sectional shape of the heat insulation cavity, and the upper surface of the heat insulation plates is flush with the upper surface of the heat insulation base board.

[0010] Further, the gap between the side surface of the heat insulation plates and the side wall of the heat insulation grooves is L1, where 0.1 mm ≤ L1 ≤ 5 mm.

[0011] Further, the number of the heat insulation cavities arranged at intervals is n, where n ≥ 2.

[0012] Further, the depth of the heat insulation cavity is L2, and the thickness of the heat insulation base board is L3, where L2∶L3 = 1∶(1.5 - 8).

[0013] Further, the thickness L3 of the heat insulation base board is 20 - 180 mm.

[0014] Further, the thickness L3 of the heat insulation base board is 30 mm, and the depth L2 of the heat insulation cavity is 12 mm.

[0015] Further, the thickness of the light high-temperature resistant bonding coating is 1 - 5 mm.

[0016] Further, the heat insulation plates are multiple layers stacked, and the thermal conductivity of the heat insulation plates gradually increases from top to bottom.

[0017] The beneficial effects of a novel composite heat insulation board provided by the present utility model are as follows:

[0018] 1. By arranging a heat insulation cavity in the heat insulation base board, arranging heat insulation plates in the heat insulation cavity, and coating a light high-temperature resistant bonding coating on the surface of the heat insulation base board, the present utility model realizes the synergistic effect of the heat insulation base board, the heat insulation cavity, the heat insulation plates, and the light high-temperature resistant bonding coating. This structure ensures the integrity of the whole, enables each part to cooperate better with each other, and improves the heat insulation performance and overall strength of the composite heat insulation board.

[0019] 2. In the present utility model, the heat insulation groove and the lightweight high-temperature resistant bonding coating cooperate to form a closed heat insulation cavity, which can effectively prevent the convective and radiative transfer of heat, and further enhance the heat insulation effect. The heat insulation plate is made of a nano-insulating material, and its thermal conductivity is lower than that of the heat insulation substrate. Moreover, the gap between its side surface and the side wall of the heat insulation groove is filled with a high-temperature resistant binder, which reduces the influence of thermal stress on the structure and helps to improve the reliability and stability of the entire heat insulation system.

[0020] 3. There is a gap between the side surface of the heat insulation plate and the side wall of the heat insulation groove in the present utility model, which provides space for thermal expansion and contraction and avoids damage caused by thermal stress concentration. At the same time, the lightweight high-temperature resistant bonding coating not only plays a heat insulation role but also assists in fixing the heat insulation plate, ensuring the overall stability and reliability of the composite heat insulation plate body and enabling it to better adapt to the complex operating environment of the kiln furnace. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By referring to the accompanying drawings and reading the following detailed description, the above and other objects, features, and advantages of the exemplary embodiments of the present utility model will become readily understood. In the drawings, several embodiments of the present utility model are shown in an exemplary rather than restrictive manner, and the same or corresponding reference numerals represent the same or corresponding parts, where:

[0022] Figure 1 is a schematic cross-sectional structure view of the novel composite heat insulation plate in Embodiment 1 of the present utility model;

[0023] Figure 2 is a schematic structure view of the cooperation between the heat insulation substrate and the heat insulation plate in Embodiment 1 of the present utility model;

[0024] Figure 3 is a schematic structure view of the heat insulation substrate in Embodiment 1 of the present utility model;

[0025] Figure 4 is a schematic front view of the cross-section of the novel composite heat insulation plate in Embodiment 1 of the present utility model;

[0026] Figure 5 is a schematic structure view of the heat insulation substrate in Embodiment 2 of the present utility model;

[0027] Figure 6 is Figure 5 a cross-sectional view of the structure in

[0028] DESCRIPTION OF THE REFERENCE NUMERALS:

[0029] 1. Heat insulation substrate; 11. Heat insulation cavity; 12. Heat insulation plate; 13. Heat insulation groove; 2. Composite heat insulation plate body; 3. Lightweight high-temperature resistant bonding coating. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Those skilled in the art should know that the embodiments described below are a part of the present disclosure, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present utility model.

[0031] The quantity of any element in the accompanying drawings is for illustration rather than limitation, and any naming is only for distinction without any limiting meaning.

[0032] Next, with reference to several representative embodiments of the present utility model, the principles and spirit of the present utility model will be elaborated in detail.

[0033] Embodiment 1 of a novel composite heat insulation board provided by the present utility model:

[0034] As Figures 1 to 4 shown,

[0035] It includes a composite heat insulation board body 2, and the composite heat insulation board body 2 includes a heat insulation substrate 1. A heat insulation cavity 11 is formed in the heat insulation substrate 1, and heat insulation plates 12 are arranged in the heat insulation cavity 11. The upper surface of the heat insulation substrate 1 is coated with a lightweight high-temperature resistant bonding coating 3 for heat insulation.

[0036] It should be noted that the material of the lightweight high-temperature resistant bonding coating 3 in this embodiment is but not limited to a high-temperature resistant binder disclosed in the invention patent with the application number CN201710183845.2.

[0037] The thickness of the lightweight high-temperature resistant bonding coating 3 is 1.3 mm.

[0038] Among them, the lightweight high-temperature resistant bonding coating 3 is evenly coated on the upper surface of the heat insulation substrate 1. On the one hand, it improves the overall flexural strength of the heat insulation substrate 1. Among them, the lightweight high-temperature resistant bonding coating 3 will form an integrated protective layer on the upper surface of the heat insulation substrate 1, which can prevent the generation and expansion of microcracks on the upper surface to a certain extent.

[0039] On the other hand, the lightweight high-temperature resistant bonding coating 3 is high-temperature resistant and forms a heat insulation layer, which helps to reduce the temperature of the cold surface.

[0040] The heat insulation plates 12 are stacked in multiple layers, and the thermal conductivity of the heat insulation plates 12 gradually increases from top to bottom.

[0041] In this embodiment, the heat insulation plates 12 are of a two-layer stacked structure, and the top layer of the heat insulation plates 12, that is, the heat insulation plates 12 close to the lightweight high-temperature resistant bonding coating 3, specifically adopt 950-type nano heat insulation boards.

[0042] Enhance the effect of gradient heat insulation through multiple heat insulation plates 12 with different thermal conductivities.

[0043] Overall, through the synergistic effect of the heat insulation substrate 1, the heat insulation cavity 11, the heat insulation plates 12, and the lightweight high-temperature resistant bonding coating 3, the composite heat insulation plate body 2 achieves high efficiency in heat insulation while maintaining high strength. In addition, through the synergistic effect of the heat insulation substrate 1, the heat insulation cavity 11 filled with the heat insulation plates 12, and the lightweight high-temperature resistant bonding coating 3, a gradient heat insulation effect is achieved.

[0044] In this embodiment, a heat insulation groove 13 is provided on the heat insulation substrate 1, and the heat insulation groove 13 and the lightweight high-temperature resistant bonding coating 3 at the upper port of the heat insulation groove 13 cooperate to form a closed heat insulation cavity 11.

[0045] Among them, the heat insulation groove 13 and the lightweight high-temperature resistant bonding coating 3 at its upper port cooperate to form a closed heat insulation cavity 11. This closed cavity structure, in combination with the heat insulation plates 12 inside it, can effectively prevent the convective and radiative transfer of heat, further enhancing the heat insulation effect.

[0046] Among them, the cross-sectional shape of the heat insulation plate 12 is the same as that of the heat insulation cavity 11, and the upper surface of the heat insulation plate 12 is flush with the upper surface of the heat insulation substrate 1. And the lightweight high-temperature resistant bonding coating 3 on one of its surfaces is also used to assist in fixing the heat insulation plate 12.

[0047] The upper surface of the heat insulation plate 12 is flush with the upper surface of the heat insulation substrate 1, which is convenient for subsequent processing and use. The lightweight high-temperature resistant bonding coating 3 on the upper surface of the heat insulation substrate 1, on the one hand, further reduces the heat transfer through its own heat insulation performance; on the other hand, as a bonding material, it plays a role in fixing the heat insulation plate 12, ensuring the overall stability and reliability of the composite heat insulation plate body 2.

[0048] In this embodiment, the gap between the side surface of the heat insulation plate 12 and the side wall of the heat insulation groove 13 is 1 mm.

[0049] During actual use, the heat insulation plate 12 and the heat insulation groove 13 may undergo different degrees of thermal expansion and contraction due to temperature changes. Leaving a gap can provide a certain space for this thermal expansion and contraction, preventing the side walls of the heat insulation plate 12 and the heat insulation groove 13 from generating excessive thermal stress when the temperature changes due to direct close contact, thereby preventing damage to the heat insulation plate 12 or the heat insulation groove 13 due to thermal stress concentration, such as cracking and deformation, and contributing to improving the stability and reliability of the entire structure.

[0050] Among them, the gap between the side surface of the heat insulation plate 12 and the side wall of the heat insulation groove 13 is filled with a high-temperature resistant binder.

[0051] In this embodiment, the high-temperature resistant binder is filled near the upper end face of the gap.

[0052] By adopting the method of locally filling the high-temperature resistant binder near the upper port, on the one hand, the process difficulty is reduced, and on the other hand, a certain space is provided for the thermal expansion and contraction of the heat insulation plate 12 and the heat insulation groove 13, reducing the influence of thermal stress on the structure and helping to improve the reliability and stability of the entire heat insulation system. If the entire gap is filled with the binder, since the heat insulation plate 12 and the heat insulation groove 13 will undergo thermal expansion and contraction when the temperature changes, the binder may limit this thermal deformation, thus generating relatively large thermal stress inside.

[0053] It should be noted that the material of the high-temperature resistant binder is the same as that of the lightweight high-temperature resistant bonding coating 3.

[0054] In this embodiment, there are 4 heat insulation cavities 11 arranged at intervals.

[0055] In this embodiment, the thickness L3 of the heat insulation substrate 1 is 30 mm, and the depth L2 of the heat insulation cavity 11 is 12 mm.

[0056] Among them, L2∶L3 = 2∶5.

[0057] In this embodiment, the design with the ratio of the depth L2 of the heat insulation cavity 11 to the thickness L3 of the heat insulation substrate 1 being 2∶5 can maximize the heat insulation effect of the heat insulation cavity 11 on the premise of ensuring the structural strength of the heat insulation substrate 1. If the depth of the heat insulation cavity 11 is too small, the heat blocking effect is limited; if the depth of the heat insulation cavity 11 is too large, the structural strength of the heat insulation substrate 1 may be weakened. This ratio enables the depth of the heat insulation cavity 11 and the thickness of the heat insulation substrate 1 to reach an ideal balance, achieving good coordination between structural strength and heat insulation performance.

[0058] When the novel composite heat insulation plate of this embodiment is specifically used, its upper surface serves as the cold surface, and through the synergistic effect of the heat insulation substrate 1, the heat insulation cavity 11 filled with the heat insulation plate 12, and the lightweight high-temperature resistant bonding coating 3, a gradient heat insulation effect is achieved and the heat transfer is weakened.

[0059] For the heat insulation performance test of the novel composite heat insulation plate of this embodiment, that is, heating its hot surface to different temperatures and testing the temperature of its cold surface.

[0060] Specifically, the temperature of the heat source is set at different temperature gradients of 500℃, 800℃, and 1000℃, and each temperature gradient is maintained for 30 min, and then the temperature of its cold surface is detected. The specific detection results are shown in the following table.

[0061] Heating source temperature (°C) Average cold surface temperature (°C) 500 80 800 120 1000 150

[0062] It can be seen from the test results that as the temperature of the heating source increases, the temperature of the cold surface also rises, but the rising amplitude is relatively small. This indicates that the new composite heat insulation board has good heat insulation performance in a high-temperature environment and can effectively prevent heat from transferring from the hot surface to the cold surface.

[0063] Embodiment 2 of a new composite heat insulation board provided by the present utility model:

[0064] As Figure 5 、 Figure 6 shown,

[0065] The difference from Embodiment 1 is that in this embodiment, there are 3 heat insulation grooves 13 arranged at intervals. Among them, the cross-section of the heat insulation groove 13 is trapezoidal and the width of the bottom edge of the trapezoid is smaller than the width of the top edge.

[0066] According to the above description of this specification, those skilled in the art can also understand the following terms used, such as terms indicating orientation or positional relationship, such as "upper", "lower", "front", "rear", "left", "right", "width", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings of this specification. It is only for the purpose of facilitating the description of the solution of the present utility model and simplifying the description, rather than explicitly or implicitly indicating that the device or element involved must have the specific orientation, be constructed and operate in the specific orientation. Therefore, the above terms of orientation or positional relationship cannot be understood or interpreted as a limitation to the solution of the present utility model.

[0067] In addition, in the description of this specification, the meaning of "a plurality" is at least two, such as two, three or more, etc., unless otherwise specifically defined.

Claims

1. A novel composite heat insulation board, comprising a composite heat insulation board body (2), and the composite heat insulation board body (2) comprises a heat insulation base board (1), characterized in that, A heat-insulating cavity (11) is formed in the heat-insulating substrate (1). A heat-insulating plate (12) is arranged in the heat-insulating cavity (11). A light high-temperature resistant bonding coating (3) for heat insulation and for assisting in sealing and fixing the heat-insulating plate (12) is coated on the upper surface of the heat-insulating substrate (1).

2. The novel composite heat insulation board according to claim 1, characterized in that, A heat-insulating groove (13) is arranged on the heat-insulating substrate (1). The heat-insulating groove (13) and the light high-temperature resistant bonding coating (3) at the upper port of the heat-insulating groove (13) cooperate to form a closed heat-insulating cavity (11).

3. The novel composite heat insulation board according to claim 2, characterized in that The cross-sectional shape of the heat-insulating plate (12) is the same as the cross-sectional shape of the heat-insulating cavity (11). The upper surface of the heat-insulating plate (12) is flush with the upper surface of the heat-insulating substrate (1).

4. The novel composite heat insulation board according to claim 3, characterized in that, The gap between the side surface of the heat-insulating plate (12) and the side wall of the heat-insulating groove (13) is L1, where 0.1 mm ≤ L1 ≤ 5 mm.

5. The novel composite heat insulation board according to claim 1, characterized in that, The heat-insulating cavities (11) are arranged in n intervals, where n ≥ 2.

6. The novel composite heat insulation board according to claim 5, characterized in that, The depth of the heat-insulating cavity (11) is L2, and the thickness of the heat-insulating substrate (1) is L3, where L2∶L3 = 1∶(1.5 - 8).

7. The novel composite heat insulation board according to claim 6, characterized in that, The thickness L3 of the heat-insulating substrate (1) is 20 - 180 mm.

8. The novel composite heat insulation board according to claim 7, characterized in that, The thickness L3 of the heat-insulating substrate (1) is 30 mm, and the depth L2 of the heat-insulating cavity (11) is 12 mm.

9. The novel composite heat insulation board according to claim 1, wherein, The thickness of the light high-temperature resistant bonding coating (3) is 1 - 5 mm.

10. The novel composite heat insulation board according to claim 1, characterized in that, The heat-insulating plates (12) are stacked in multiple layers, and the thermal conductivity of the heat-insulating plates (12) gradually increases from top to bottom.

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