Semiconductor inspection bench

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a semiconductor inspection bench which comprises a transparent protection box and an inspection assembly, the inspection assembly is located in the transparent protection box and comprises a microscope, an accent light and a rotating frame, the microscope and the accent light are respectively and rotatably connected to the rotating frame, and the rotating frame is connected to the transparent protection box. The transparent protection box is provided with an operation opening used for stretching in and operating the microscope and the accent light, and the positions of the microscope and the accent light correspond to the operation opening. The semiconductor inspection bench provided by the utility model avoids the risks of introducing impurities and forming an oxide layer on the surface of the wafer in the inspection process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor inspection table. Background Art

[0002] As an important second-generation semiconductor material, gallium arsenide products are widely used in the fields of integrated circuits such as high-frequency, high-speed, high-power, and high-temperature resistance. With the development of technology and market competition, the current requirements for gallium arsenide substrate product manufacturers are also getting higher and higher. Producing higher-quality wafer substrate products has become an irreversible trend. After gallium arsenide wafers go through processes such as grinding, polishing, and washing, they enter the inspection of the wafer surface quality. Before inspection, parameters such as dust, temperature, humidity, and cleanliness in the inspection workshop need to be monitored. During inspection, careful operation is required to avoid introducing new impurities during the inspection process, which may affect the yield and product quality.

[0003] After the gallium arsenide wafers are cleaned, the cassette containing the wafers to be inspected is placed in a designated hand basket. Generally, 5-9 wafers are placed in each cassette, and the basket is carried to the wafer inspection area.

[0004] The inspector conducts defect inspection on the surface of each wafer under a strong light, records the data, puts the qualified wafers into boxes, and puts the unqualified wafers into a rework cassette. The inspector needs to randomly select 1 qualified wafer from each group for observation under a microscope, and the wafer needs to be transferred to another table in the inspection area for microscope inspection. During this process, there is a risk of introducing impurities and an increase in the oxide layer on the wafer surface. Summary of the Utility Model

[0005] It aims to solve at least one of the technical problems existing in the prior art. The utility model provides a semiconductor inspection table to avoid the risk of introducing impurities and forming an oxide layer on the wafer surface during the inspection process.

[0006] To achieve the above object, the utility model provides a semiconductor inspection table, which includes a transparent protection box and an inspection component. The inspection component is located inside the transparent protection box. The inspection component includes a microscope, a strong light lamp, and a rotating frame. The microscope and the strong light lamp are respectively rotatably connected to the rotating frame. The rotating frame is connected to the transparent protection box. The transparent protection box is provided with an operation port for extending in to operate the microscope and the strong light lamp. The positions of the microscope and the strong light lamp are correspondingly arranged with the operation port.

[0007] As a preferred solution, the rotating frame includes a rotating shaft and a bearing plate. The microscope and the strong light lamp are respectively fixed to the bearing plate.

[0008] One end of the rotating shaft is fixed to the top end of the transparent protection box, and the bearing plate is rotatably connected to the other end of the rotating shaft.

[0009] Alternatively, the rotating shaft is rotatably connected to the top end of the transparent protective box, and the bearing plate is fixedly connected to the other end of the rotating shaft.

[0010] As a preferred solution, the rotating frame includes a driving motor and a control button. The driving motor is connected to the transparent protective box. The control button is electrically connected to the driving motor and is connected to the outer surface of the transparent protective box, or the control button is connected to the outer side surface of the rotating shaft.

[0011] When the rotating shaft is rotatably connected to the transparent protective box, the driving motor is in transmission connection with the rotating shaft.

[0012] When the bearing plate is rotatably connected to the rotating shaft, the driving motor is in transmission connection with the bearing plate.

[0013] As a preferred solution, the driving motor is set with a preset rotation angle. When the driving motor rotates by the preset rotation angle, the microscope faces the operation opening, or the strong light lamp faces the operation opening.

[0014] As a preferred solution, a finished product storage box and a defective product storage box are provided on one side of the transparent protective box. The defective product storage box is located below the finished product storage box. The finished product storage box is provided with a finished product inlet for putting in finished products, and the defective product storage box is provided with a defective product inlet for putting in defective products. A baffle is hinged to each of the finished product inlet and the defective product inlet.

[0015] As a preferred solution, a handle is connected to the top surface of the finished product storage box and the top surface of the defective product storage box respectively.

[0016] As a preferred solution, the finished product storage box is provided with a nitrogen connection port for connecting to nitrogen.

[0017] As a preferred solution, the transparent protective box is provided with a filtration port for connecting to a filtration fan. An inspection chamber is provided inside the transparent protective box, and the inspection assembly is located in the inspection chamber. The filtration port and the operation port are respectively communicated with the filtration port.

[0018] As a preferred solution, a particle size detector, a hygrometer and a thermometer are installed inside the transparent protective box. The particle size detector is used to obtain the particle size data inside the transparent protective box, the thermometer is used to obtain the temperature information inside the transparent protective box, and the hygrometer is used to obtain the humidity information inside the transparent protective box.

[0019] As a preferred solution, the display surfaces of the particle size detector, the thermometer and the thermometer respectively face the operation opening.

[0020] Compared with the prior art, the semiconductor inspection table of the embodiment of the present utility model has the following beneficial effects: The transparent protection box is provided with an operation opening, and the inspection component is located inside the transparent protection box. The inspector can reach into the transparent protection box through the operation opening to operate the inspection component. The inspection component includes a microscope and a strong light lamp. The microscope and the strong light lamp are respectively rotatably connected to the rotating frame. When it is necessary to perform microscope or strong light lamp inspection, only the required inspection equipment needs to be rotated towards the operation opening. Inside the transparent protection box, strong light detection and microscope spot checks can be carried out on the wafer without transferring the wafer, avoiding the risk of introducing impurities and forming an oxide layer on the wafer surface during the inspection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the overall structure of the embodiment of the present utility model.

[0022] Figure 2 is a schematic diagram of the structure of the rotating frame of the embodiment of the present utility model.

[0023] In the figure:

[0024] 10. Transparent protection box; 11. Operation opening; 12. Filtering opening; 13. Particle size detector; 14. Hygrometer; 15. Thermometer; 16. Inspection chamber;

[0025] 20. Inspection component; 21. Microscope; 22. Strong light lamp; 23. Rotating frame; 24. Rotating shaft; 25. Bearing plate; 26. Control button

[0026] 30. Finished product storage box; 31. Nitrogen connection port; 32. Defective product storage box; 33. Handle. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will further describe in detail the specific embodiments of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model but are not intended to limit the scope of the present utility model.

[0028] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. in the present utility model is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

[0029] In the description of the present utility model, it should be understood that the terms "connected", "connected", "fixed", etc. used in the present utility model should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, or a welded connection; it can be directly connected, or indirectly connected through an intermediate medium. It can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] As Figures 1 to 2 shown, a semiconductor inspection table according to a preferred embodiment of the present utility model includes a transparent protection box 10 and an inspection component 20. The inspection component 20 is located inside the transparent protection box 10. The inspection component 20 includes a microscope 21, a strong light lamp 22, and a rotating frame 23. The microscope 21 and the strong light lamp 22 are respectively rotatably connected to the rotating frame 23. The rotating frame is connected to the transparent protection box 10. The transparent protection box 10 is provided with an operation port 11 for extending into and operating the microscope 21 and the strong light lamp 22. The positions of the microscope 21 and the strong light lamp 22 are correspondingly arranged with the operation port 11.

[0031] For the semiconductor inspection table of the present utility model, the transparent protection box 10 is provided with an operation port 11, and the inspection component 20 is located inside the transparent protection box 10. The inspection personnel can extend into the transparent protection box 10 through the operation port 11 to operate the inspection component 20. The inspection component 20 includes a microscope 21 and a strong light lamp 22. The microscope 21 and the strong light lamp 22 are respectively rotatably connected to the rotating frame 23. When it is necessary to perform inspections on the microscope 21 or the strong light lamp 22, only the required inspection equipment needs to be rotated towards the operation port 11. Inside the transparent protection box 10, strong light detection and microscope 21 spot checks can be performed on the wafer without transferring the wafer, avoiding the risk of introducing impurities and forming an oxide layer on the surface of the wafer during the inspection process.

[0032] Further, as Figures 1 to 2 shown, the rotating frame 23 includes a rotating shaft 24 and a bearing plate 25. The microscope 21 and the strong light lamp 22 are respectively fixed to the bearing plate 25. The bearing plate 25 is used to carry and fix the microscope 21 and the strong light lamp 22.

[0033] One end of the rotating shaft 24 is fixed to the top end of the transparent protection box 10, and the bearing plate 25 is rotatably connected to the other end of the rotating shaft 24; or, the rotating shaft 24 is rotatably connected to the top end of the transparent protection box 10, and the bearing plate 25 is fixedly connected to the other end of the rotating shaft 24. By rotatably connecting the rotating shaft 24 to the transparent protection box 10 or rotatably connecting the bearing plate 25 to the rotating shaft 24, the position switching of the microscope 21 or the strong light lamp 22 towards the operation port 11 is realized, facilitating the inspection operation of the microscope 21 or the strong light lamp 22.

[0034] Of course, the switching between the microscope 21 and the strong light 22 can be manually switched, but the operation convenience is not high, and it takes a certain amount of time to adjust the relative position between the switching position and the operation port 11.

[0035] Furthermore, as Figure 2 shown, the rotating frame 23 includes a driving motor and a control button 26. The driving motor is connected to the transparent protective box 10. The control button 26 is electrically connected to the driving motor, and the control button 26 is connected to the outer surface of the transparent protective box 10;

[0036] When the rotating shaft 24 is rotatably connected to the transparent protective box 10, the driving motor is in transmission connection with the rotating shaft 24;

[0037] When the carrier plate 25 is rotatably connected to the rotating shaft 24, the driving motor is in transmission connection with the carrier plate 25.

[0038] The driving motor is in transmission connection with the rotating shaft 24, or the driving motor is in transmission connection with the carrier plate 25, so that the microscope 21 and the strong light 22 can be rotated and switched. The control button 26 is electrically connected to the driving motor. The control button 26 is connected to the outer surface of the transparent protective box 10 or the control button 26 is connected to the outer side surface of the rotating shaft 24. When the inspector needs to switch the inspection equipment, the inspection equipment is switched by operating the control button 26. The operation is simple and the inspection efficiency is improved.

[0039] Furthermore, as Figures 1 to 2 shown, the driving motor sets a preset rotation angle. When the driving motor rotates by the preset rotation angle, the microscope 21 faces the operation port 11, or the strong light 22 faces the operation port 11. When the microscope 21 faces the operation port 11, the driving motor is rotated by the preset rotation angle through the control button 26, so that the strong light 22 faces the operation port 11, so as to realize the accurate switching of the operation positions of the strong light 22 and the microscope 21. The operation is simple and the inspection efficiency is improved.

[0040] Furthermore, as Figure 1As shown, a finished product storage box 30 and a defective product storage box 32 are provided on one side of the transparent protective box 10. The defective product storage box 32 is located below the finished product storage box 30. The finished product storage box 30 is provided with a finished product inlet for placing finished products, and the defective product storage box 32 is provided with a defective product inlet for placing defective products. The finished product inlet and the defective product inlet are respectively hinged with a cover. The finished product storage box 30 is used to place qualified wafers to be packaged. The defective product storage box 32 is used to store unqualified defective products to be reworked. The finished product storage box 30 is located above the defective product storage box 32, that is, stacked in the height direction, optimizing the placement position of the finished product storage box 30 and the defective product storage box 32, and reducing the placement space of the finished product storage box 30 and the defective product storage box 32, wherein the finished product inlet and the defective product inlet are facing one side of the operation port 11, so as to facilitate the classification and placement of qualified and defective wafers after the inspection operation. The original technology placed qualified wafers and unqualified wafers in different boxes, but the two boxes were placed on the same work surface, which may cause cross contamination. The existing technology placed finished products and defective products in different storage boxes to avoid cross contamination between finished products and defective products. At the same time, the original technology required the wafers to be packaged to be placed in a completely open hand basket and then transported to the packaging workshop. If the workshop environment is abnormal, the transportation process may affect the surface quality of the wafers; the qualified wafers are placed in a non-open finished product storage box to avoid contact with the air and ensure that they are not contaminated.

[0041] Further, such as Figure 1 As shown, the top surface of the finished product storage box 30 and the top surface of the defective product storage box 32 are respectively connected with handles 33. The arrangement of the handles 33 facilitates the finished product storage box 30 and the defective product storage box 32 to take out the classified wafers and send them to the packaging workshop, so that the products are almost not in contact with the air during transportation, reducing the risk of introducing impurities and increasing the oxide layer on the surface of the wafers.

[0042] Further, such as Figure 1 As shown, the finished product storage box 30 is provided with a nitrogen connection port 31 for connecting with nitrogen. The finished product storage box 30 is used to store the wafers to be packaged that have passed the inspection. The finished product storage box 30 is connected with nitrogen through the nitrogen connection port 31, so that the finished product storage box 30 is equivalent to a small nitrogen cabinet to ensure the storage environment. The finished product storage box 30 for placing qualified wafers is filled with nitrogen, which can ensure the quality requirements of qualified products. At the same time, the residual nitrogen in the finished product storage box during transportation can ensure that the wafers are not exposed to the outside air as much as possible during transportation to ensure that they are not contaminated.

[0043] As one embodiment, the nitrogen connection port 31 is connected to a connection pipe, and the connection pipe is connected to a valve. When nitrogen is not introduced, the valve is closed to prevent air from entering the finished product storage box 30, thereby ensuring that the finished product wafers are not contaminated.

[0044] Further, such as Figure 1As shown, the transparent protection box 10 is provided with a filter port 12 for connecting a filter fan. An inspection chamber 16 is provided inside the transparent protection box 10. The inspection assembly 20 is located inside the inspection chamber 16. The filter port 12 and the operation port 11 are respectively communicated with the filter port 12. The original inspection table ensures the environment of the entire inspection workshop, and only a simple filter device is installed on the inspection tabletop; the filter fan is internally provided with a high-efficiency filter and a filter net, and the fan is in an always-on state, which can ensure that the inspection environment fully meets the environmental requirements for wafer inspection and effectively avoid secondary pollution during the inspection process.

[0045] Among them, the filter fan is a prior art, and the specific structure of the filter fan will not be elaborated here.

[0046] Furthermore, as Figure 1 shown, a particle size detector 13, a hygrometer 14 and a thermometer 15 are installed inside the transparent protection box 10. The particle size detector 13 is used to obtain the particle size data inside the transparent protection box 10, the thermometer 15 is used to obtain the temperature information inside the transparent protection box 10, and the hygrometer 14 is used to obtain the humidity information inside the transparent protection box 10. Installing the particle size detector 13, the thermometer 15 and the hygrometer 14 inside the inspection table can monitor in real time whether the environment meets the requirements during the inspection process, improving the wafer quality.

[0047] Furthermore, as Figure 1 shown, the display surfaces of the particle size detector 13, the thermometer 15 and the thermometer 15 are respectively oriented towards the operation port 11, so that the inspector can obtain the environment-related information at any time and facilitate observation.

[0048] In summary, the embodiment of the present utility model provides a semiconductor inspection table. The transparent protection box 10 is provided with an operation port 11. The inspection assembly 20 is located inside the transparent protection box 10. The inspector can extend into the transparent protection box 10 through the operation port 11 to operate the inspection assembly 20. The inspection assembly 20 includes a microscope 21 and a strong light lamp 22. The microscope 21 and the strong light lamp 22 are respectively rotatably connected to the rotating frame 23. When it is necessary to perform inspections on the microscope 21 or the strong light lamp 22, only the required inspection equipment needs to be rotated towards the operation port 11. Inside the transparent protection box 10, strong light detection and microscope 21 spot checks can be performed on the wafer without transferring the wafer, avoiding the risk of introducing impurities and forming an oxide layer on the wafer surface during the inspection process.

[0049] The above is only the preferred embodiment of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and replacements can still be made, and these improvements and replacements should also be regarded as the protection scope of the present utility model.

Claims

1. A semiconductor inspection stage, characterized in that: It includes a transparent protective box and an inspection component. The inspection component is located inside the transparent protective box. The inspection component includes a microscope, a strong light lamp, and a rotating frame. The microscope and the strong light lamp are respectively rotatably connected to the rotating frame. The rotating frame is connected to the transparent protective box. The transparent protective box is provided with an operation port for extending in to operate the microscope and the strong light lamp. The positions of the microscope and the strong light lamp are correspondingly arranged with the operation port.

2. The semiconductor inspection stage according to claim 1, wherein: The rotating frame includes a rotating shaft and a bearing plate. The microscope and the strong light lamp are respectively fixed to the bearing plate. One end of the rotating shaft is fixed to the top end of the transparent protective box, and the bearing plate is rotatably connected to the other end of the rotating shaft. Or, the rotating shaft is rotatably connected to the top end of the transparent protective box, and the bearing plate is fixedly connected to the other end of the rotating shaft.

3. The semiconductor inspection stage according to claim 2, wherein: The rotating frame includes a driving motor and a control button. The driving motor is connected to the transparent protective box. The control button is electrically connected to the driving motor. The control button is connected to the outer surface of the transparent protective box, or the control button is connected to the outer side surface of the rotating shaft. When the rotating shaft is rotatably connected to the transparent protective box, the driving motor is in transmission connection with the rotating shaft. When the bearing plate is rotatably connected to the rotating shaft, the driving motor is in transmission connection with the bearing plate.

4. The semiconductor inspection stage according to claim 3, wherein: The driving motor sets a preset rotation angle. When the driving motor rotates by the preset rotation angle, the microscope faces the operation port, or the strong light lamp faces the operation port.

5. The semiconductor inspection stage according to claim 2, wherein: One side of the transparent protective box is provided with a finished product storage box and a defective product storage box. The defective product storage box is located below the finished product storage box. The finished product storage box is provided with a finished product inlet for putting in finished products. The defective product storage box is provided with a defective product inlet for putting in defective products. The finished product inlet and the defective product inlet are respectively hinged with a cover.

6. The semiconductor inspection stage according to claim 5, characterized in that: A handle is respectively connected to the top surface of the finished product storage box and the top surface of the defective product storage box.

7. The semiconductor inspection stage according to claim 5, wherein: The finished product storage box is provided with a nitrogen connection port for connecting with nitrogen.

8. The semiconductor inspection stage according to claim 1, characterized in that: The transparent protective box is provided with a filter port for connecting with a filter fan. An inspection cavity is arranged inside the transparent protective box. The inspection component is located inside the inspection cavity. The filter port and the operation port are respectively communicated with the filter port.

9. The semiconductor inspection stage according to claim 1, characterized in that: A particle size detector, a hygrometer, and a thermometer are installed inside the transparent protective box. The particle size detector is used to obtain the particle size data inside the transparent protective box. The thermometer is used to obtain the temperature information inside the transparent protective box. The hygrometer is used to obtain the humidity information inside the transparent protective box.

10. The semiconductor inspection stage according to claim 9, wherein: The display surfaces of the particle size detector, the thermometer, and the thermometer respectively face the operation port.

Images