Temperature control module and temperature control system of semiconductor equipment

Abstract

The utility model discloses a temperature control module of semiconductor equipment and a temperature control system comprising the temperature control module. The temperature control module comprises a power supply device, an electric switch module, a heat dissipation device, a wire connecting device and a temperature control device. The electric switch module and the heat dissipation device are arranged in the first installation space, the wire connecting device and the temperature control device are arranged in the second installation space, and the wire connecting device is electrically connected with the power supply device, the heat dissipation device, the electric switch module and the temperature control device. The power supply device realizes radioactive wiring to different electric equipment through the wire connecting device, avoids disordered wiring, and facilitates heat dissipation and subsequent maintenance. The electric switch module and the temperature control device are separately arranged in the first mounting space and the second mounting space, and the temperature control device is electrically connected with the single input end of the electric switch module, so that mutual interference between flat cables is avoided, the space utilization efficiency is improved, and subsequent maintenance is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a temperature control module and a temperature control system of semiconductor equipment. Background Art

[0002] In the gas pipelines of semiconductor equipment, such as Metal-Organic Chemical Vapor Deposition (MOCVD) equipment, Vapor Phase Chemical Vapor Deposition (VPCVD) equipment, Low Pressure Chemical Vapor Deposition (LPCVD) equipment, etc., for the intake pipeline, it is necessary to maintain a certain temperature of the reaction source during the transportation process of the reaction source to keep it in a gaseous state and meet the process requirements of semiconductor production; for the exhaust pipeline, chemical products generated during the process or emission are likely to deposit in the pipeline during the emission process. Therefore, it is particularly important to set corresponding temperature control devices in these gas pipelines to maintain an appropriate temperature and effectively measure and monitor temperature changes, which can reduce the number of machine maintenance and extend the service life of the machine.

[0003] The prior art usually sets heating devices in the temperature-controlled devices (such as the aforementioned intake pipeline and exhaust pipeline) of semiconductor equipment, and controls the heating elements by controlling the on-off of switches and heating power in the heating devices through temperature control devices. Since the temperature control system occupies a large space, and there are many devices that need to be temperature-controlled in semiconductor equipment and the pipelines are complex, it is easy to cause messy wiring, which is not conducive to heat dissipation and subsequent maintenance.

[0004] Therefore, it is necessary to provide a temperature control module for semiconductor equipment to solve the above problems existing in the prior art. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a temperature control module for semiconductor equipment and a temperature control system including the temperature control module, which is beneficial to reducing wiring and mutual interference between cables, improving space utilization rate and facilitating maintenance.

[0006] To achieve the above purpose, the technical solution of the utility model is as follows:

[0007] In the first aspect, the temperature control module of the semiconductor equipment pipeline includes:

[0008] A power supply device;

[0009] An electric switch module and a heat dissipation device disposed in a first installation space. The electric switch module includes a single input end, and the heat dissipation device is disposed towards one end of the electric switch module;

[0010] A wire connection device and a temperature control device disposed in a second installation space and electrically connected to each other. The first installation space is opposite to the second installation space;

[0011] The wire connection device is electrically connected to the power supply device, the heat dissipation device, the electric switch module, and the temperature control device, so that the power supply device supplies power to the heat dissipation device, the electric switch module, and the temperature control device through the wire connection device;

[0012] The temperature control device is electrically connected to the single input end to control the opening and closing states of the electric switch modules.

[0013] On the other hand, the temperature control system of the semiconductor device includes a main control device and the temperature control module of the semiconductor device described above. The main control device is communicatively connected to the temperature control module.

[0014] The beneficial effects of the temperature control module and the temperature control system of the pipeline of the semiconductor device provided by the present utility model are both:

[0015] The electric switch module and the heat dissipation device are arranged in the first installation space, the wire connection device and the temperature control device are arranged in the second installation space opposite to the first installation space, and the wire connection device is electrically connected to the power supply device, the heat dissipation device, the electric switch module, and the temperature control device, so that the power supply device realizes radial wiring to different electrical equipment through the wire connection device, avoiding messy wiring, being beneficial to heat dissipation and subsequent maintenance; further combined with the separate arrangement of the electric switch module and the temperature control device in the first installation space and the second installation space, forming two independent installation spaces, and the temperature control device is electrically connected to the single input end of the electric switch module to control the opening and closing states of the electric switch modules, avoiding mutual interference between the wiring rows, improving the utilization efficiency of the space and being beneficial to subsequent maintenance.

[0016] Further, a partition device located between the first installation space and the second installation space is also included for load-bearing or installation use.

[0017] Further, the numbers of the electric switch module and the heat dissipation device are both at least 2, and they are respectively arranged along the transverse extension direction of the first installation space.

[0018] Further, at least one heat dissipation device electrically connected to the wire connection device is also arranged in the second installation space.

[0019] Further, a power supply indication part electrically connected to the wire connection device is arranged on the electric switch module, and / or a on-off indication part electrically connected to the single input end is arranged on each electric switch module.

[0020] Further, the electric switch module further includes a circuit board. At least one electric switch module is provided with a plug post and a plurality of pins for realizing electrical connection at the bottom. A plug post interface detachably adapted to the plug post is opened on the circuit board, and a pin interface detachably adapted to each pin is provided. The diameter of the plug post is larger than that of the pin.

[0021] Further, a heating device and a temperature measuring device electrically connected to each other are further included. The heating device is electrically connected to the electric connection module, and the temperature measuring device is electrically connected to the temperature control device.

[0022] Further, the electric switch module includes a plurality of solid-state relays connected in parallel. Each solid-state relay is internally provided with an insurance module. The wire connection device includes connection terminals electrically connecting the power supply device, the heat dissipation device, the electric switch module, and the temperature control device.

[0023] Further, the number of the temperature control modules is at least 2 and is configured to be arranged along the extension direction of the temperature-controlled device of the semiconductor device. Description of the Drawings

[0024] Figure 1 Partial structural schematic diagram of a temperature control module according to an embodiment of the present invention;

[0025] Figure 2 Partial structural schematic diagram of another temperature control module according to an embodiment of the present invention;

[0026] Figure 3 Structural block diagram of the temperature control module according to an embodiment of the present invention;

[0027] Figure 4 Structural schematic diagram of the electric switch module according to an embodiment of the present invention;

[0028] Figure 5 Structural schematic diagram of the electric switch module according to an embodiment of the present invention.

[0029] Reference numerals: 1, electrical switch module; 11, circuit board; 111, power supply indication section; 112, pin interface; 12, electrical switch module; 121, on / off indication section; 122, pin; 123, pin; 13, single input terminal; 14, output terminal; 2, wire connection device; 3, temperature control device; 4, installation housing; 5, partition device; 51, first installation space; 52, second installation space; 53, wire insertion hole; 6, heat dissipation device; 7, power supply device; 8, heating device; 9, temperature measurement device. Detailed implementation manners

[0030] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the field to which the present utility model belongs. The words such as "including" used herein mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects.

[0031] The following will further elaborate on the detailed implementation manners of the present utility model with reference to the drawings.

[0032] The temperature control module and the temperature control system provided by the present utility model are applicable to the temperature control of semiconductor devices, including but not limited to the temperature control of heating the intake pipeline, the temperature control of heating the exhaust pipeline, the temperature control of heating the cavity wall, etc. The semiconductor devices include but not limited to MOCVD devices, VPCVD devices, LPCVD devices, etc.

[0033] Please refer to Figure 1 the temperature control module of the semiconductor device shown in the figure, which includes an electrical switch module 1 and a heat dissipation device 6 located in the first installation space 51, a wire connection device 2, a temperature control device 3 and a power supply device located in the second installation space 52. Among them, the first installation space 51 and the second installation space 52 are arranged opposite to each other.

[0034] In some embodiments, referring to Figure 3 , the power supply device 7 can be a stored solid-state power supply, a super capacitor or an external power adapter, etc.

[0035] In some embodiments, the installation position of the power supply device 3 is set close to the electrical switch module 1, and no limitation is made here.

[0036] In some embodiments, the electric switch module 1 includes a single input terminal, and the heat dissipation device 6 is disposed towards one end of the electric switch module 1. For example, as shown in Figure 2 and is disposed in the first installation space 51 and located above the electric switch module 1.

[0037] In some embodiments, referring to Figure 3 , the wire connection device 2 is electrically connected to the power supply device 7, the heat dissipation device 6, the electric switch module 1, and the temperature control device 3 respectively, so that the power supply device supplies power to the heat dissipation device 6, the electric switch module 1, and the temperature control device 3 through the wire connection device 2.

[0038] In some embodiments, referring to Figure 3 and Figure 4 , the temperature control device 3 is electrically connected to the single input terminal 13 to control the opening and closing states of the respective electric switch modules 12.

[0039] Referring to Figure 2 , the electric switch module 1 and the heat dissipation device 6 are arranged close to each other and disposed in the first installation space 51, the wire connection device 2 and the temperature control device 3 are disposed in the second installation space 52 opposite to the first installation space 51, and the wire connection device 2 is electrically connected to the power supply device, the heat dissipation device 6, the electric switch module 1, and the temperature control device 3 respectively, so that the power supply device realizes the radial wiring to different electrical equipment through the wire connection device 2, avoiding messy wiring, facilitating heat dissipation and subsequent maintenance; further combined with the separate arrangement of the electric switch module 1 and the temperature controller in the first installation space 51 and the second installation space 52 to form two independent installation spaces, and the temperature control device 3 is electrically connected to the single input terminal of the electric switch module 1 to control the opening and closing states of the respective electric switch modules 12, avoiding mutual interference between the wiring rows, improving the utilization efficiency of the space and facilitating subsequent maintenance.

[0040] Please refer to Figure 1 shown. In this embodiment, specifically, there is one electric switch module 1, and one electric switch module 1 and one temperature control device 3 are longitudinally disposed in the first installation space 51 and the second installation space 52 respectively. The electric switch module 1 can be a solid state relay module including multiple solid state relays. The solid state relay realizes the switching action through electronic components, has no mechanical moving parts, usually has a higher switching speed and a longer service life, and is suitable for high-frequency switching operations. The field effect transistor switch has the advantages of fast switching speed, low power consumption and can handle high current.

[0041] Please refer to Figure 2 and Figure 3As shown, in other embodiments, the number of the electric switch modules 1 and the heat dissipation devices 6 is at least two, and they are arranged along the lateral extension direction of the first installation space 51 respectively. The multiple electric switch modules 1 are arranged side by side in the first installation space 51 along the extension direction of the partition device 5. The second installation space 52 is also provided with at least one heat dissipation device 6 electrically connected to the wire connection device 2, and the power supply device 7 supplies power to at least one heat dissipation device 6 arranged in the second installation space 52 through the wire connection device 2, which is beneficial to heat dissipation.

[0042] Referring to Figure 2 and Figure 4 , by connecting multiple electric switch modules 12 in parallel to form the electric switch module 1, and arranging multiple electric switch modules 1 in the same installation space (such as Figure 2 the first installation space 51 shown), and realizing electrical connection through the temperature control device 3 in the second installation space 52 to the single input end 13 of each electric switch module 1 respectively, it is possible to avoid messy wiring and improve space utilization.

[0043] Please refer to Figure 3 and Figure 4 As shown, in this embodiment, the temperature control module further includes a heating device 8 and a temperature measuring device 9 that are electrically connected to each other. The heating device 8 is electrically connected to the electric connection module 1, and the temperature measuring device 9 is electrically connected to the temperature control device 3.

[0044] For the temperature-controlled device of the semiconductor device, such as the intake pipe or exhaust pipe that needs temperature control, multiple heating devices 8 are respectively sleeved on the outer wall of the pipe and arranged along the extension direction of the pipe. One temperature control device 3 controls multiple electric switch modules 12, and the control of multiple electric switch modules 12 by the temperature control device 3 enables the electric switch modules 12 to control multiple heating devices 8 electrically connected thereto through circuit on / off control, thereby being able to regulate the temperature of the pipe.

[0045] In some specific embodiments, the heating device 8 uses a heating sleeve with a resistance wire inside or a conductor heater that generates heat through the thermoelectric effect.

[0046] In some embodiments, Figure 1 or Figure 2 as shown, the number of the temperature control modules is at least 2, such as more than 20, and they are arranged along the extension direction of the intake or exhaust pipe. More specifically, multiple temperature control modules are arranged along the extension direction of the intake or exhaust pipe and correspond to the areas controlled by the pipe for convenient maintenance and troubleshooting.

[0047] In some specific embodiments, the temperature measuring device 9 uses a thermocouple or an infrared temperature sensor.

[0048] Please refer to Figure 1 andFigure 2 As shown in the figure, in some other embodiments of the present utility model, it further includes an installation housing 4 and a partition device 5. The installation housing 4 has an installation chamber, and the partition device 5 is arranged in the installation chamber. The partition device 5 divides the installation chamber into a first installation space 51 above and a second installation space 52 below. A plurality of wire insertion holes 53 are formed on the partition device 5. The installation housing 4 can be box-shaped or cylindrical, and the external structure of the installation housing 4 is not limited herein. By providing the partition device 5, it is convenient to place maintenance tools and parts to be disassembled and assembled during subsequent maintenance, facilitating repair.

[0049] In one embodiment, the electric switch module can be arranged on the partition device 5 for load-bearing.

[0050] In one embodiment, when the electric switch module 1 is suspended in the first installation space 51 and falls due to insecure fixation, the partition device 5 can play a role of support and buffering to prevent it from damaging the temperature control device below.

[0051] In one embodiment, a plurality of wire insertion holes 53 are provided on the partition device 5, facilitating the connection cables between the output end 14 and the wire connection device 2 to pass through, avoiding entanglement between the cables, and facilitating inspection and maintenance.

[0052] In some embodiments, the partition device 5 is a plate-like structure that divides the installation chamber into two parts.

[0053] Please refer to Figure 2 、 Figure 4 and Figure 5 As shown in the figure, in other embodiments, the electric switch module 1 further includes a circuit board 11 and a plurality of electric switch modules 12 arranged side by side. A plurality of electric switch modules 12 and a single input end 13 are both installed on the circuit board 11. An output end 14 with a plurality of ports is also provided on the circuit board 11. Each port of the output end 14 is correspondingly electrically connected to an electric switch module 12 as its output end. A plug post 122 and a plurality of pins 123 for realizing electrical connection are provided at the bottom of the electric switch module 12. The wire connection device 2 is electrically connected through an interface of the output end 14 on the circuit board 11 to realize the on-off of power supply to the heating device 8. An interface of the output end 14 is connected to a corresponding circuit loop with functions inside the circuit board 11, and the specific implementation method is a conventional technical means in the art).

[0054] By arranging a plurality of electric switch modules 12 arranged side by side and a single input end on a circuit board 11, the overall occupied space of the device is reduced, meeting the requirements of narrow spaces.

[0055] The wire connection device 2 is a terminal for electrically connecting the power supply device, the heat dissipation device 6, the electric switch module 1 and the temperature control device 3. The wire connection device 2 can electrically connect multiple electric switch modules 12 through a single input terminal, thereby reducing the amount of wiring from the power supply device to the multiple electric switch modules 12. In addition, the electric switch module 1 is separately arranged in the first installation space 51 and the second installation space 52 from the wire connection device 2 and the temperature control device 3 to form two independent installation spaces, thereby avoiding interference between the wiring of multiple electric switch modules 12 and multiple thermostats, and improving space utilization efficiency.

[0056] Please refer to Figure 1 and Figure 2 As shown, in some other embodiments of the utility model, the heat sink 6 is arranged near the electric switch module 1, and is located on the side of the electric switch module 1 away from the temperature control device 3. The heat sink 6 can be a fan or a water cooling device, and the heat dissipation end of the heat sink 6, such as the air outlet end of the fan, is close to the electric switch module 1, which is convenient for dissipating the heat of the solid-state module relay. In other more preferred embodiments, a fan is also provided at the bottom of the wire connection device 2 and the temperature control device 3, and the fan blades at the bottom and the fan at the top rotate in opposite directions, thereby forming an air duct, which is more convenient for discharging the heat accumulated inside. The plug hole 53 provided on the mounting plate can also pass through this air duct to avoid airflow blockage. In addition, the heat sink 6 is electrically connected to the wire connection device 2, and the power supply device 7 supplies power to the heat sink 6 via the wire connection device 2.

[0057] In some embodiments, the rated voltage of the heat dissipation device 6 and the heating device 8 is the same, so they can be powered by the same power supply device 7 via the wire connection device 2, which reduces related equipment and simplifies the installation space.

[0058] Please refer to Figure 4 As shown, the distance between adjacent electrical switch modules 12 is 5 mm. In some embodiments, the distance may be 3 mm to 6 mm. By reasonably ensuring the distance between adjacent electrical switch modules 12, the heat dissipation efficiency of the modules can be improved, because the distance can ensure air circulation, better remove the generated heat, and simplify the installation space.

[0059] Please refer to Figure 4As shown, in some other embodiments of the present utility model, the electrical switch module 1 is provided with a power supply indication part 111 electrically connected to the wire connection device 2. In some other embodiments of the present utility model, an on-off indication part 121 electrically connected to a single input end is provided on the electrical switch module 12. Specifically, a power supply indication part 111 is provided on the circuit board 11, and the power supply indication part 111 uses a power supply indicator light, and the circuit board 11 is electrically connected to the power supply indicator light. The power supply indicator light provides an intuitive feedback on the power supply status, helping users quickly confirm whether the device is powered on normally. Secondly, it can be used as an indication tool during the troubleshooting process to help identify power problems or connection problems, thereby improving the maintenance efficiency.

[0060] Please refer to Figure 4 As shown, in some other embodiments of the present utility model, an on-off indication part 121 is provided on the upper part of the electrical switch module 12 (the specific setting method is a conventional technical means in the art). The on-off indication part 121 uses an on-off indicator light, and the on-off indicator light is electrically connected to the electrical switch module 12. The on-off indicator light can intuitively display the working state of the electrical switch module 12. When the electrical switch module 12 is in the powered-on state, the on-off indicator light will light up; when the electrical switch module 12 is powered off, the on-off indicator light will go out. The setting of the on-off indicator light simplifies the fault diagnosis process. If the electrical switch module 12 fails, it can help identify the problem, such as the electrical switch module 12 failing to correctly switch states. By observing the on-off indicator light, users can more quickly determine whether they need to check the power supply, control signal, or the electrical switch module 12 itself, facilitating engineers to quickly verify the response of the electrical switch module 12 and the state of the circuit.

[0061] In some other embodiments of the present utility model, the electrical switch module 12 is detachably connected to the circuit board 11. Specifically, refer to Figure 4 and Figure 5 , a plug post 122 is provided at one end of the electrical switch module 12 away from the on-off indicator light for detachably adapting to a plug post interface (not marked in the figure) provided on the circuit board 11 and docked with the plug post 122.

[0062] In some specific embodiments, the specific adaptation method between the electrical switch module 12 and the circuit board 11 can be detachably connected by a bolt-nut connection method or a threaded connection method. Specifically, a threaded hole is opened on the circuit board 11, and a threaded structure adapted to the outer side wall of the plug post 122 is provided, and the plug post 122 passes through the threaded hole to achieve threaded connection. Or for further strengthening the detachable fixing relationship, it is fixed by tightening bolts.

[0063] In some embodiments, the diameter of the stud 122 is greater than that of the pin 123. When the diameter of the pin 123 is too thin, during the installation of the pin 123, if the alignment of the pin 123 is not accurate, the pin is likely to be deformed, and at this time, the operator's blind spot of vision may mistakenly think that it has been installed. Therefore, the aforementioned stud 122 is provided and the diameter of the stud 122 is controlled to be greater than that of the pin 123. The positioning of the stud 122 is easier to align than that of the pin 123, and the auxiliary positioning of the pin 123 can be achieved through the positioning of the stud 122. Further, the extension length of the stud 122 can be controlled to be longer than that of the pin 123, so that during the alignment process, the stud 122 can be aligned and inserted into the corresponding interface first.

[0064] In some embodiments, the electrical switch module 12 incorporates an insurance module. For example, in some specific embodiments, the electrical switch module 12 is a solid-state relay with built-in insurance, and the specific setting method of the insurance module is a conventional technical means in the art. By setting a fuse inside the electrical switch module 12, compared with the prior art, the additional setting of an insurance circuit is avoided, the integration degree of the overall device is improved, the circuit is simplified, and the space utilization rate of the wiring of the electrical switch module 1 is further improved.

[0065] In a second aspect, an embodiment of the present invention further provides a temperature control system for a semiconductor device, including a main control device and the above-mentioned temperature control module of the semiconductor device, and the main control device is communicatively connected to the temperature control module. In some embodiments, PID control is performed among the main control device, the temperature control module, and the heating device 8 to regulate the temperature of the temperature-controlled device (such as the intake pipeline or exhaust pipeline of the semiconductor device), so as to avoid the problem that the intake pipeline does not meet the process requirements for the source gas due to too low or too high pipeline temperature, or to avoid the problem that chemical products generated during the process or emission in the exhaust pipeline are likely to deposit in the pipeline during the emission process due to the temperature problem of the exhaust pipeline, thereby reducing the service life of the machine.

[0066] In other embodiments, there are at least two temperature control modules, which are arranged along the extension direction of the temperature-controlled device of the semiconductor device, so as to improve the space occupancy rate of the temperature control device of the semiconductor device.

[0067] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A temperature control module for a semiconductor device, characterized in that, Comprising: A power supply device; An electric switch module and a heat dissipation device disposed in a first installation space, the electric switch module including a single input end and a plurality of electric switch modules, and the heat dissipation device being disposed towards one end of the electric switch module; A wire connection device and a temperature control device disposed in a second installation space and electrically connected to each other, the first installation space being opposite to the second installation space; The wire connection device electrically connects the power supply device, the heat dissipation device, the electric switch module and the temperature control device, so that the power supply device supplies power to the heat dissipation device, the electric switch module and the temperature control device through the wire connection device; The temperature control device is electrically connected to the single input end to control the opening and closing states of the electric switch modules.

2. The temperature control module of the semiconductor device according to claim 1, wherein It further includes a partition device located between the first installation space and the second installation space for load bearing or installation use.

3. The temperature control module of the semiconductor device according to claim 1, wherein The number of the electric switch modules and the heat dissipation devices is at least 2, and they are respectively arranged along the transverse extension direction of the first installation space.

4. The temperature control module of the semiconductor device according to claim 1, characterized in that, At least one heat dissipation device electrically connected to the wire connection device is further provided in the second installation space.

5. The temperature control module of the semiconductor device according to claim 1, wherein The electric switch module is provided with a power supply indication part electrically connected to the wire connection device, and / or each of the electric switch modules is provided with a on / off indication part.

6. The temperature control module of the semiconductor device according to claim 1, characterized in that, The electric switch module further includes a circuit board. At least one of the electric switch modules is provided with insertion posts at the bottom and a plurality of pins for realizing electrical connection. The circuit board is provided with insertion post interfaces detachably adapted to the insertion posts, and pin interfaces detachably adapted to the pins. The diameter of the insertion posts is larger than the diameter of the pins.

7. The temperature control module of the semiconductor device according to claim 1, wherein It further includes a heating device and a temperature measuring device electrically connected to each other. The heating device is electrically connected to the electric switch module, and the temperature measuring device is electrically connected to the temperature control device.

8. The temperature control module of the semiconductor device according to claim 1, characterized in that, The electric switch module includes a plurality of solid state relays connected in parallel, and each of the solid state relays is internally provided with a fuse module. The wire connection device includes connection terminals electrically connecting the power supply device, the heat dissipation device, the electric switch module and the temperature control device.

9. A temperature control system for a semiconductor device, characterized in that, Comprising a main control device and a temperature control module of the semiconductor device according to any one of claims 1-8, the main control device being communicatively connected to the temperature control module.

10. The temperature control system of the semiconductor device according to claim 9, characterized in that, The number of the temperature control modules is at least 2, and they are configured to be arranged along the extension direction of the temperature-controlled device of the semiconductor device.

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