Processor support with liquid cooling heat dissipation structure

Abstract

The utility model relates to a processor support with a liquid cooling heat dissipation structure, which comprises a back plate and a cover plate, and the back plate and the cover plate are arranged in parallel to clamp a circuit board provided with a processor chip. The back plate and the cover plate are both heat-conducting metal plates, a first water path is arranged on the back plate and arranged on the side, close to the circuit board, of the back plate, a heat-conducting face is arranged on the side, close to the circuit board, of the cover plate and makes contact with the surface of the processor chip to absorb heat of the processor chip, and a second water path is arranged on the heat-conducting face and makes contact with the surface of the processor chip to absorb heat of the processor chip. The first water path and the second water path are both used for conveying liquid so as to absorb heat generated by the processor chip and the circuit board and transmitted to the cover plate and the back plate. The processor support with the liquid cooling heat dissipation structure integrates the functions of protecting the processor chip, facilitating installation of the processor chip and the circuit board and conducting liquid cooling heat dissipation on the processor chip and the circuit board, traditional air cooling type heat dissipation is replaced, and energy-saving transformation of a server is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of processor heat dissipation, and particularly relates to a processor bracket with a liquid cooling heat dissipation structure. Background Art

[0002] Servers in data centers and computing centers need to consume a lot of electricity for heat dissipation. Among them, the common heat dissipation methods are air cooling and liquid cooling. The heat dissipation efficiency of air cooling is low and it is not energy-saving. Liquid cooling uses water or other liquids for heat dissipation. Compared with traditional air cooling, the heat transfer effect of liquids is better than that of air, making the heat dissipation effect of liquid cooling better, energy-saving and environment-friendly, and it is especially suitable for large data centers, high-performance computing environments, and scenarios that need to process a large amount of data.

[0003] Liquid cooling is divided into immersion liquid cooling and plate liquid cooling. Immersion liquid cooling technology immerses electronic devices entirely in liquid, and its heat dissipation effect is the best. However, the assembly cost of the entire immersion liquid cooling system is relatively high, and the maintainability and compatibility of components are poor. Plate liquid cooling separates electronic devices from the cooling liquid and does not directly contact them. The two transfer heat through a heat-conducting metal. Compared with immersion liquid cooling, the technical maturity of plate liquid cooling is higher and it is more widely used.

[0004] Existing plate liquid cooling is mostly single-point heat dissipation. The processor chip in the server generates the most heat and is installed on one side of the processor chip through a liquid cold head to dissipate heat from the processor chip. The rest of the electronic components on the circuit board still dissipate heat through air cooling, and the heat dissipation effect needs to be improved. Content of the Utility Model

[0005] In order to solve the deficiencies of the prior art, the utility model provides a processor bracket with a liquid cooling heat dissipation structure.

[0006] The utility model provides a processor bracket with a liquid cooling heat dissipation structure, which includes a backplane and a cover plate. The backplane and the cover plate are arranged parallel to each other to clamp a circuit board provided with a processor chip. Both the backplane and the cover plate are heat-conducting metal plates. A first waterway is arranged on the backplane, and the first waterway is arranged on the side of the backplane close to the circuit board. The side of the cover plate close to the circuit board is set as a heat-conducting surface, and the heat-conducting surface is in contact with the surface of the processor chip to absorb the heat of the processor chip. A second waterway is arranged on the heat-conducting surface. Both the first waterway and the second waterway are used to convey liquid to absorb the heat generated by the processor chip and the circuit board and transferred to the cover plate and the backplane.

[0007] In some of these embodiments, a sunken groove is provided at the center of the backplane, and the sunken groove is located on the back of the processor chip. The first waterway includes a first branch, a second branch, and a third branch connected in series in sequence. The first branch and the third branch are arranged on the same plane and are located outside the sunken groove, and the second branch is located at the bottom of the sunken groove.

[0008] In some of these embodiments, the first branch and the third branch are arranged along the edge of the backplane.

[0009] In some of these embodiments, the second branch is arranged at the bottom of the sunken groove in the form of a U-shaped bend and a right-angle bend.

[0010] In some of these embodiments, a first wire groove is opened along the path of the first waterway on the backplane, and a metal pipe is buried in the first wire groove to form the first waterway.

[0011] In some of these embodiments, a second wire groove is provided on the heat-conducting surface of the cover plate, and a metal pipe is buried in the second wire groove to form a second waterway. The second waterway is arranged in the form of a plurality of U-shaped bends arranged side by side.

[0012] In some of these embodiments, a heat-conducting metal plate is provided on the heat-conducting surface of the cover plate. The cover plate is provided with a heat-dissipating water tank, and the cover plate is provided with a water inlet and a water outlet communicating with the heat-dissipating water tank. The heat-conducting metal plate is fixed at the opening of the heat-dissipating water tank to form the second waterway.

[0013] In some of these embodiments, a sealing groove is provided at the bottom of the heat-dissipating water tank, and a sealing ring is arranged in the sealing groove. The heat-conducting metal plate is provided with a ring of protrusions at a position corresponding to the sealing groove, and the sealing ring is clamped between the sealing groove and the end face of the protrusion to seal the heat-dissipating water tank.

[0014] In some of these embodiments, the heat-conducting metal plate protrudes into the heat-dissipating water tank with heat-dissipating fins.

[0015] In some of these embodiments, the heat-dissipating fins include partition heat-dissipating fins and diversion heat-dissipating fins. The partition heat-dissipating fins are vertically arranged between the water inlet and the water outlet to divide the heat-dissipating water tank into a water inlet side chamber and a water outlet side chamber. The water inlet side chamber and the water outlet side chamber are communicated into a U-shaped waterway through a notch between the partition heat-dissipating fins and the protrusion. A plurality of diversion heat-dissipating fins are arranged side by side in both the water inlet side chamber and the water outlet side chamber, and the diversion heat-dissipating fins are parallel to the partition heat-dissipating fins.

[0016] Compared with the prior art, the beneficial effects of the utility model are as follows: the circuit board and the processor chip are fixed by the cover plate and the back plate, and the cover plate and the back plate are provided with liquid cooling heat dissipation through the first waterway and the second waterway, so that the processor bracket integrates the functions of protecting the processor chip, facilitating the installation of the processor chip and the circuit board, and performing liquid cooling heat dissipation on the processor chip and the circuit board; the cover plate and the back plate are closely attached to the circuit board and the processor chip, so that the heat generated by the processor chip and the circuit board can be quickly transferred to the cover plate and the back plate, and liquid cooling heat dissipation is carried out through the first waterway and the second waterway, which is more energy-saving than the traditional air-cooled heat dissipation, so as to replace the traditional air-cooled heat dissipation and is beneficial to the energy-saving transformation of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. is a schematic assembly structure diagram of a processor bracket with a liquid cooling heat dissipation structure, a circuit board and a processor chip according to an embodiment of the present application.

[0018] Figure 2 FIG. is a three-dimensional structure diagram of a back plate according to an embodiment of the present application.

[0019] Figure 3 FIG. is a three-dimensional structure diagram of a cover plate according to an embodiment of the present application.

[0020] Figure 4 FIG. is a planar structure diagram of a cover plate according to one embodiment of the present application.

[0021] Figure 5 FIG. is a planar structure diagram of a cover plate according to another embodiment of the present application.

[0022] Figure 6 FIG. is an internal structure diagram of a cover plate according to another embodiment of the present application.

[0023] Figure 7 FIG. is a planar structure diagram of a heat-conducting metal plate according to an embodiment of the present application.

[0024] Figure 8 FIG. is a schematic structure diagram of a liquid cooling heat dissipation system composed of a plurality of processor brackets with liquid cooling heat dissipation structures according to an embodiment of the present application.

[0025] Reference numerals: 101, processor chip; 102, circuit board;

[0026] 1, back plate; 11, sinking groove; 12, shaped hole; 13, avoidance hole; 14, first wire groove; 15, positioning stud;

[0027] 2, cover plate; 21, heat-conducting surface; 22, second wire groove; 23, heat dissipation water groove; 24, water inlet; 25, water outlet; 26, sealing groove; 27, sealing ring;

[0028] 3. Heat-conducting metal plate; 31. Boss; 32. Partition heat dissipation fin; 33. Flow-guiding heat dissipation fin; 34. Water inlet side chamber; 35. Water outlet side chamber; 36. Notch;

[0029] 4. First waterway; 41. First branch; 42. Second branch; 43. Third branch;

[0030] 5. Second waterway;

[0031] 6. Metal pipe;

[0032] 71. Radiator; 72. Water pump; 73. Water tank. Detailed implementation manners

[0033] The detailed implementation manners of the present utility model will be introduced with reference to the accompanying drawings.

[0034] Reference Figure 1 , the figure is a schematic assembly structure diagram of a processor bracket with a liquid cooling structure, a circuit board 102 and a processor chip 101. The circuit board 102 is clamped by a backplane 1 and a cover plate 2. The cover plate 2 is closely attached to the processor chip 101. The backplane 1 and the cover plate 2 are cooled by a liquid cooling structure formed by a first waterway 4 and a second waterway 5 to absorb the heat generated by the circuit board 102 and the processor chip 101, maintain the working temperature of the circuit board 102 and the processor chip 101, and ensure the stable operation of the circuit board 102 and the processor chip 101.

[0035] Reference Figures 1 to 8 , a processor bracket with a liquid cooling structure includes a backplane 1 and a cover plate 2. The backplane 1 and the cover plate 2 are arranged in parallel to clamp the circuit board 102 provided with the processor chip 101. Both the backplane 1 and the cover plate 2 are heat-conducting metal plates 3. A first waterway 4 is arranged on the backplane 1, and the first waterway 4 is disposed on the side of the backplane 1 close to the circuit board 102. The side of the cover plate 2 close to the circuit board 102 is set as a heat-conducting surface 21, and the heat-conducting surface 21 is in contact with the surface of the processor chip 101 to absorb the heat of the processor chip 101. A second waterway 5 is arranged on the heat-conducting surface 21. Both the first waterway 4 and the second waterway 5 are used to convey liquid to absorb the heat generated by the processor chip 101 and the circuit board 102 and transferred to the cover plate 2 and the backplane 1.

[0036] The processor bracket with a liquid cooling structure of the present application fixes the circuit board 102 and the processor chip 101 through the cover plate 2 and the back plate 1. While protecting the processor chip 101, it can facilitate the installation of the processor chip 101 and the circuit board 102 in the corresponding server. The first waterway 4 and the second waterway 5 for transferring heat by liquid are arranged on the cover plate 2 and the back plate 1. The cover plate 2 and the back plate 1 are in close contact with the circuit board 102 and the processor chip 101, so that the heat generated by the processor chip 101 and the circuit board 102 can be quickly transferred to the cover plate 2 and the back plate 1, and liquid cooling heat dissipation is carried out through the first waterway 4 and the second waterway 5, ensuring that the processor chip 101 and the circuit board 102 are at an appropriate working temperature. The processor bracket adopts liquid cooling heat dissipation, which is more energy-saving than traditional air-cooled heat dissipation and reduces energy consumption.

[0037] It should be further noted that the processor chip 101 in this embodiment refers to a graphics processing unit (GPU), and can also be a central processing unit (CPU), a dedicated accelerator, a future technology processor, etc. The GPU is installed on the circuit board 102, and the circuit board 102 is clamped between the back plate 1 and the cover plate 2, and the circuit board 102 and the GUP are protected by the structural bracket formed by the back plate 1 and the cover plate 2.

[0038] In order to arrange the first waterway 4 on the back plate 1, in this embodiment, referring to Figure 2 , a sunken groove 11 is arranged at the center of the back plate 1. The sunken groove 11 is located at the back of the processor chip 101. The first waterway 4 includes a first branch 41, a second branch 42 and a third branch 43 connected in series in sequence. The first branch 41 and the third branch 43 are arranged on the same plane and are located outside the sunken groove 11, and the second branch 42 is located at the bottom of the sunken groove 11.

[0039] It can be understood that with such an arrangement, the sunken groove 11 is located at the back of the processor chip 101, and the heat generated when the processor chip 101 works will be transferred into the sunken groove 11, so that the heat at the sunken groove 11 will be higher than the heat at other places on the back plate 1. The second branch 42 arranged at the bottom of the sunken groove 11 absorbs the heat at the sunken groove 11, and the first branch 41 and the third branch 43 absorb the heat at other places on the back plate 1, so that the first waterway 4 can well dissipate heat and cool the back plate 1.

[0040] In order to make the first waterway 4 cover a larger range of the back plate 1, in this embodiment, referring to Figure 2 , the first branch 41 and the third branch 43 are arranged along the edge of the back plate 1.

[0041] It should be further noted that two rectangular avoidance holes 13 are arranged on both sides of the sunken groove 11 of the back plate 1. The avoidance holes 13 avoid other electronic components on the circuit board 102, such as a cable socket, so that these electronic components can be exposed from the back plate 1.

[0042] It can be understood that with such a setting, except for the sunken groove 11, the backplane 1 has a relatively wide flat surface at the edge where the water channel can be set. The first branch 41 and the third branch 43 are arranged along the edge of the backplane 1, which can cover a large area of the backplane 1, ensuring that the first water channel 4 can be set with a longer path on the backplane 1 and guaranteeing the heat dissipation effect of the first water channel 4 on the backplane 1.

[0043] In order to enable the first water channel 4 to cover a larger range of the sunken groove 11, in this embodiment, referring to Figure 2 , the second branch 42 is arranged at the bottom of the sunken groove 11 in the form of a U-shaped bend and a right-angle bend.

[0044] It can be understood that with such a setting, the bottom of the sunken groove 11 is provided with a shaped hole 12 for exposing some electronic components of the circuit board 102. By arranging the second branch 42 through two right-angle bends and two U-shaped bends, the second branch 42 can bypass the shaped hole 12 while covering a large area of the sunken groove 11.

[0045] In order to ensure the sealing of the first water channel 4, in this embodiment, referring to Figure 2 , the backplane 1 is provided with a first wire groove 14 along the path of the first water channel 4, and the first wire groove 14 buries the metal pipe 6 to form the first water channel 4.

[0046] It can be understood that with such a setting, the metal pipe 6 can transport water or other liquids for heat dissipation. The material of the metal pipe 6 can be copper with good heat conduction performance. By burying the metal pipe 6 in a grooving manner, the outer wall of the metal pipe 6 is in precise contact with the inner wall of the first wire groove 14, ensuring good heat conduction between the backplane 1 and the metal pipe 6. The metal pipe 6 protruding above the first wire groove 14 is flattened, so that the position of the metal pipe 6 buried in the backplane 1 remains flat. The metal pipe 6 can ensure the sealing of the first water channel 4. The metal pipe 6 integrally buried in the first wire groove 14 has no interface in the backplane 1, ensuring that the first water channel 4 will not leak.

[0047] In order to set the second water channel 5 on the cover plate 2, in one of the embodiments, referring to Figure 3 and Figure 4 , the heat-conducting surface 21 of the cover plate 2 is provided with a second wire groove 22, and the second wire groove 22 buries the metal pipe 6 to form the second water channel 5. The second water channel 5 is arranged in the form of a plurality of U-shaped bends arranged side by side.

[0048] It can be understood that with such an arrangement, similar to the first waterway 4 of the backplane 1, the metal pipe 6 of the second waterway 5 is made of copper pipe with good heat conduction performance. The metal pipe 6 protruding above the second wire groove 22 is flattened to make the heat conduction surface 21 of the cover plate 2 flat. The metal pipe 6 integrally embedded in the second wire groove 22 has no interface inside the cover plate 2, ensuring that dew will not occur in the second waterway 5. The second waterway 5 arranged in a plurality of U-shaped bends can cover a large range of the cover plate 2, ensuring that the second waterway 5 can dissipate heat from the cover plate 2 well.

[0049] In another embodiment, referring to Figures 5 to 7 , a heat conduction metal plate 3 is arranged on the heat conduction surface 21 of the cover plate 2. The cover plate 2 is provided with a heat dissipation water tank 23, and the cover plate 2 is provided with a water inlet 24 and a water outlet 25 communicated with the heat dissipation water tank 23. The heat conduction metal plate 3 is fixed at the opening of the heat dissipation water tank 23 to form the second waterway 5.

[0050] It can be understood that with such an arrangement, compared with the scheme of embedding the metal pipe 6 on the cover plate 2 in the previous embodiment, the heat dissipation water tank 23 scheme is adopted in this embodiment. The heat dissipation liquid enters the heat dissipation water tank 23 through the water inlet 24 and flows out from the water outlet 25, so that a continuously flowing liquid can be formed in the heat dissipation water tank 23, and the inside of the cover plate 2 can be filled with the flowing liquid, making the contact area between the cover plate 2 and the liquid larger, and further improving the heat dissipation effect.

[0051] In order to ensure the sealing performance between the cover plate 2 and the heat conduction metal plate 3, in this embodiment, referring to Figures 5 to 7 , a sealing groove 26 is arranged at the bottom of the heat dissipation water tank 23, a sealing ring 27 is arranged in the sealing groove 26, and a ring of convex platform 31 is arranged at the position of the heat conduction metal plate 3 corresponding to the sealing groove 26. The sealing ring 27 is clamped between the sealing groove 26 and the end face of the convex platform 31 to seal the heat dissipation water tank 23.

[0052] It can be understood that with such an arrangement, the heat dissipation water tank 23 of the cover plate 2 and the heat conduction metal plate 3 are processed separately. The convex platform 31 matches the shape of the heat dissipation water tank 23. The edge of the cover plate 2 extending outward in the circumferential direction of the convex platform 31 is located outside the heat dissipation water tank 23 and is fixed to the cover plate 2 by four screws. The convex platform 31 extends into the heat dissipation water tank 23, and the end face of the convex platform 31 contacts the sealing ring 27. The sealing ring 27 is used to seal the connection between the heat dissipation water tank 23 and the heat conduction metal plate 3, and the sealing groove 26 positions the sealing ring 27 to prevent the sealing ring 27 from shifting.

[0053] In order to increase the contact area between the heat conduction metal plate 3 and the heat dissipation liquid, in this embodiment, referring to Figure 7 , the heat conduction metal plate 3 protrudes into the heat dissipation water tank 23 with heat dissipation fins.

[0054] It can be understood that with such an arrangement, the heat-conducting metal plate 3 is made of a copper plate with good heat-conducting performance. The heat-conducting metal plate 3 absorbs the heat of the processor chip 101 and then transfers it to one side of the heat-dissipating water tank 23 and the heat-dissipating fins. The heat-dissipating fins extend into the liquid flowing in the heat-dissipating water tank 23, which can increase the contact area between the heat-conducting metal plate 3 and the liquid, thereby accelerating the heat exchange speed between the two, and thus improving the heat dissipation effect of the liquid on the heat-conducting metal plate 3.

[0055] In order to guide the flow of the liquid in the heat-dissipating water tank 23, in this embodiment, referring to Figure 7 , the heat-dissipating fins include a partition heat-dissipating fin 32 and a flow-guiding heat-dissipating fin 33. The partition heat-dissipating fin 32 is vertically arranged between the water inlet 24 and the water outlet 25 to divide the heat-dissipating water tank 23 into an inlet-side chamber 34 and an outlet-side chamber 35. The inlet-side chamber 34 and the outlet-side chamber 35 are connected into a U-shaped water path through a notch 36 between the partition heat-dissipating fin 32 and the boss 31. A plurality of flow-guiding heat-dissipating fins 33 are arranged side by side in both the inlet-side chamber 34 and the outlet-side chamber 35, and the flow-guiding heat-dissipating fins 33 are parallel to the partition heat-dissipating fin 32.

[0056] It can be understood that with such an arrangement, the height of the partition heat-dissipating fin 32 is slightly lower than the height of the convex block, the height of the flow-guiding heat-dissipating fin 33 is lower than the height of the partition heat-dissipating fin 32, and the gap between the partition heat-dissipating fin 32 and the bottom of the heat-dissipating water tank 23 is small, so that the partition heat-dissipating fin 32 can well divide the heat-dissipating water tank 23 into the inlet-side chamber 34 and the outlet-side chamber 35, making the water path in the heat-dissipating water tank 23 U-shaped, enabling the liquid to continuously flow at each position in the heat-dissipating water tank 23, ensuring the heat exchange efficiency of the entire heat-dissipating water tank 23, and the flow-guiding heat-dissipating fin 33 can guide the flow of the liquid, making the liquid flow stably in the U-shaped water path and ensuring the stability of the liquid flow rate.

[0057] It should be further noted that referring to Figure 8 , for multiple processor chips 101 in the server, the heat generated is transferred to the radiator 71 through the liquid in the first water path 4 and the second water path 5 on the respective backplane 1 and cover plate 2. The liquid cooled in the radiator 71 is pumped into the water tank 73 for storage by the water pump 72. The liquid in the water tank 73 is pumped by the water pump 72 to the backplane 1 and cover plate 2 of each processor bracket again to complete the liquid circulation.

[0058] The cover plate 2 and the back plate 1 of the embodiment of the present application are fixed together by means of positioning studs 15, screws, etc. to clamp and fix the circuit board 102 and the processor chip 101. The cover plate 2 and the back plate 1 are provided with liquid cooling heat dissipation through the first water channel 4 and the second water channel 5, so that the processor bracket integrates the functions of protecting the processor chip 101, facilitating the installation of the processor chip 101 and the circuit board 102, and performing liquid cooling heat dissipation on the processor chip 101 and the circuit board 102, so as to replace the traditional air-cooled heat dissipation, reduce the energy consumption of the traditional air-cooled heat dissipation server, and is beneficial to the energy-saving transformation of the server.

[0059] The above does not impose any limitation on the technical scope of the present invention. Any modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A processor bracket with a liquid cooling structure, characterized in that It includes a back plate and a cover plate. The back plate and the cover plate are arranged parallel to each other to clamp a circuit board provided with a processor chip. Both the back plate and the cover plate are heat-conducting metal plates. A first waterway is provided on the back plate, and the first waterway is arranged on the side of the back plate close to the circuit board. The side of the cover plate close to the circuit board is set as a heat-conducting surface, and the heat-conducting surface is in contact with the surface of the processor chip to absorb the heat of the processor chip. A second waterway is provided on the heat-conducting surface, and both the first waterway and the second waterway are used to convey liquid to absorb the heat generated by the processor chip and the circuit board and transferred to the cover plate and the back plate.

2. The processor bracket with a liquid cooling heat dissipation structure according to claim 1, characterized in that, A sunken groove is provided in the center of the back plate, and the sunken groove is located at the back of the processor chip. The first waterway includes a first branch, a second branch and a third branch connected in series in sequence. The first branch and the third branch are arranged in the same plane and are located outside the sunken groove, and the second branch is located at the bottom of the sunken groove.

3. The processor bracket with a liquid cooling structure according to claim 2, wherein, The first branch and the third branch are arranged along the edge of the back plate.

4. The processor bracket with a liquid cooling structure according to claim 3, characterized in that, The second branch is arranged at the bottom of the sunken groove in the form of a U-shaped bend and a right-angle bend.

5. The processor bracket with a liquid cooling structure according to claim 4, characterized in that, A first wire groove is opened along the path of the first waterway on the back plate, and a metal pipe is buried in the first wire groove to form the first waterway.

6. The processor bracket with a liquid cooling structure according to claim 1, characterized in that, A second wire groove is provided on the heat-conducting surface of the cover plate, and a metal pipe is buried in the second wire groove to form the second waterway. The second waterway is arranged in the form of a plurality of U-shaped bends arranged side by side.

7. The processor bracket with a liquid cooling structure according to claim 1, characterized in that, A heat-conducting metal plate is provided on the heat-conducting surface of the cover plate. The cover plate is provided with a heat-dissipating water groove. The cover plate is provided with a water inlet and a water outlet communicated with the heat-dissipating water groove. The heat-conducting metal plate is fixed at the opening of the heat-dissipating water groove to form the second waterway.

8. The processor bracket with a liquid cooling structure according to claim 7, characterized in that, A sealing groove is provided at the bottom of the heat-dissipating water groove, and a sealing ring is arranged in the sealing groove. The heat-conducting metal plate is provided with a ring of protrusions at the position corresponding to the sealing groove, and the sealing ring is clamped between the sealing groove and the end face of the protrusion to seal the heat-dissipating water groove.

9. The processor bracket with a liquid cooling heat dissipation structure according to claim 8, characterized in that, The heat-conducting metal plate protrudes into the heat-dissipating water groove with heat-dissipating fins.

10. The processor bracket with a liquid cooling structure according to claim 9, characterized in that, The heat-dissipating fins include partition heat-dissipating fins and guiding heat-dissipating fins. The partition heat-dissipating fins are vertically arranged between the water inlet and the water outlet to divide the heat-dissipating water groove into an inlet side chamber and an outlet side chamber. The inlet side chamber and the outlet side chamber are communicated into a U-shaped waterway through a notch between the partition heat-dissipating fins and the protrusion. A plurality of guiding heat-dissipating fins are arranged side by side in both the inlet side chamber and the outlet side chamber, and the guiding heat-dissipating fins are parallel to the partition heat-dissipating fins.

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