Chip heat dissipation structure

Abstract

The utility model relates to the technical field of computer parts, in particular to a chip radiating structure which comprises a pair of positioning strips and a radiator, the top of each positioning strip is provided with an insertion hole and a square groove, a positioning plate, a sliding block, a pull rod and a spring are arranged in each square groove, an insertion block is further fixed on the inner side of each sliding block, and the inner end face of each insertion block is an inclined opening. And the bottom of the radiator is provided with a bolt opposite to each jack. In the structure, the radiator can be installed by directly pressing the radiator; the pull rod is reversely pulled back and then rotated by 90 degrees, the baffle clamps the long-strip-shaped hole, and then the radiator can be directly taken down; the whole disassembly and assembly process does not need auxiliary tools and is convenient to operate and high in efficiency. In addition, a radiator structure is further designed, a front-back horizontal one-way air channel can be formed, heat can be discharged out of the main machine more easily, heat in the center of the radiator can be taken away more easily, and the radiating effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of computer components, in particular to a chip heat dissipation structure. Background Art

[0002] Computer radiators are a key hardware component used to transfer the heat generated inside the computer to maintain the normal operation of electronic devices and extend their service life. There are various types of computer radiators, which can be divided into two types: active heat dissipation and passive heat dissipation according to different heat dissipation methods. The common form of active heat dissipation is an air-cooled radiator, which takes away heat by forcing air flow through a fan; while passive heat dissipation mostly refers to the use of heat sinks to disperse heat through heat conduction. On the basis of these two, it can be further subdivided into different types of radiators such as air-cooled, heat pipe, liquid-cooled, semiconductor refrigeration, and compression refrigeration.

[0003] For air-cooled radiators, they are applied to graphics cards and motherboards. The conventional structure is that the radiator is attached to the surface of the chip, and then a fan is installed on the top of the radiator. The radiator is generally locked by screws, and there are also larger radiators that use a snap-on method. The screw locking method requires controlling the torque. Excessive torque is likely to damage the motherboard screw holes, and too little torque results in unstable installation. Moreover, a screwdriver needs to be used, which is time-consuming and laborious. If the screws are rusted, it is not convenient to disassemble. The snap-on method requires a series of steel structure materials, with a high cost, and is not suitable for small and medium-sized radiators, especially graphics cards, which have strict requirements on the volume and thickness of the radiator. Summary of the Utility Model

[0004] In view of the above problems, the purpose of the present utility model is to provide a chip heat dissipation structure, aiming to solve the above technical problems.

[0005] To achieve the above purpose, the present utility model adopts the following technical solutions:

[0006] A chip heat dissipation structure includes a pair of positioning strips located outside the chip and a radiator installed on the positioning strips. The top of the positioning strip is provided with a jack and a square groove outside the jack. A positioning plate is fixedly arranged in the square groove and a slider is slidably arranged. An insertion block is fixed on one side of the slider, and the inner end surface of the insertion block is an inclined opening. A long slot is opened on the positioning plate, and a pull rod passes through the long slot until the end of the pull rod is rotatably connected to the slider. There is also a stop strip outside the positioning plate on the pull rod, and a spring is sleeved on the pull rod at the position between the slider and the positioning plate. An insertion block is also fixed on the inner side of the slider. A plug pin is arranged at the bottom of the radiator opposite to each jack position, and a connecting groove is transversely opened on the plug pin.

[0007] Furthermore, the radiator includes a base plate and a frame mounted on the base plate, fins are formed on the base plate, and air guide grooves are formed between adjacent fins. A motor is installed on the top of the frame, and fan blades are fixedly connected to the output end of the motor. The fan blades are located in the circular area between the fins.

[0008] Furthermore, a partition between the insertion hole and the square groove is provided with a sliding hole for circumventing the insertion block, and the insertion block passes through the sliding hole.

[0009] Furthermore, the left and right side walls of the sliding block are formed with limit strips, the inner wall of the square groove is provided with two limit slots matching the limit strips, and the limit strips are slidably disposed in the limit slots on the corresponding sides.

[0010] Furthermore, a pull plate is provided at the outer end of the pull rod.

[0011] Furthermore, the bottom of the heat sink is a boss, and a heat-conducting material is filled between the boss and the chip.

[0012] The utility model has the following technical effects:

[0013] In this structure, after the thermal conductive material is applied to the chip surface, the pin at the bottom of the radiator is directly aligned with the socket on the positioning strip, and the radiator is pressed downward. The pin squeezes the oblique mouth of the plug block, causing the plug block to retract and the spring to compress. After the radiator is pressed to the lowest position, the plug block bounces into the connecting groove of the socket, thereby completing the limitation; the pull rod is pulled back in the opposite direction and rotated 90° to disengage the plug block from the connecting groove, and the blocking bar and the long strip hole are limited at 90°, so that the radiator can be directly removed; the entire disassembly and assembly process does not require auxiliary tools, and the operation is convenient and efficient.

[0014] In addition, in the preferred structure, the utility model also improves the structure of the radiator to form a front-to-rear horizontal unidirectional air duct; the existing radiator has air intake on both sides and air outlet on the top of the fan; on the one hand, since the host generally has heat dissipation holes on the back, the horizontal air duct can more easily discharge heat out of the host; on the other hand, this structure can more easily take away the heat from the center of the radiator, while the existing radiator has air intake on both sides, the wind force at the center of the fan is small, and the heat dissipation is uneven. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the expanded structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure of the positioning strip of the utility model;

[0018] Figure 4 For the utility model Figure 3Schematic diagram of the enlarged structure at A in the [device];

[0019] Figure 5 Schematic cross-sectional structure diagram of the radiator of the present utility model.

[0020] Legend: 1. Motherboard; 2. Mounting plate; 3. Chip; 4. Positioning strip; 5. Square groove; 6. Jack; 7. Slide block; 8. Limiting strip; 9. Spring; 10. Positioning plate; 11. Pull rod; 12. Pulling plate; 13. Insert block; 14. Bevel; 15. Plug pin; 16. Connection groove; 17. Frame; 18. Motor; 19. Fan blade; 20. Air guide groove; 21. Baffle strip; 22. Bottom plate; 23. Boss; 24. Finned strip; 25. Long strip hole. Detailed implementation manners

[0021] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0022] In order to illustrate the technical solutions described in the present utility model, the following will be described through specific embodiments.

[0023] Refer to Figures 1 - 4 As shown, the present utility model provides a chip heat dissipation structure, including a pair of positioning strips 4 located outside the chip 3 and a radiator installed on the positioning strips 4. The top of the positioning strip 4 is provided with a jack 6 and a square groove 5 located outside the jack 6. A positioning plate 10 is fixedly arranged in the square groove 5 and a slide block 7 is slidably arranged. One side of the slide block 7 is fixed with an insert block 13. The inner end face of the insert block 13 is a bevel 14. A long strip hole 25 is opened on the positioning plate 10, and a pull rod 11 is inserted into the long strip hole 25 until the end of the pull rod is rotatably connected to the slide block 7. There is also a baffle strip 21 outside the positioning plate 10 on the pull rod 11. A spring 9 is sleeved on the pull rod 11 at a position between the slide block and the positioning plate. Another insert block 13 is also fixed on the inner side of the slide block 7. Plug pins 15 are arranged at positions on the bottom of the radiator corresponding to each jack. A connection groove 16 is transversely opened on the plug pin 15. Under normal circumstances, the baffle strip 21 is located in the long strip hole 25.

[0024] In this embodiment, a graphics card is taken as an example. Of course, it can also be applied to other products.

[0025] The graphics card includes a mainboard 1 and a mounting plate 2, and the mainboard 1 is mounted on one side of the mounting plate 2. There is a chip 3 on the mainboard, and positioning bars 4 are located on both sides of the chip. There is a fan on the radiator, and the fan includes fan blades and a motor. The design feature of this structure is that a pair of positioning bars are designed, and there are sockets and locking structures on the positioning bars. There is a latch at the bottom of the radiator, and a connecting groove is horizontally opened on the latch. When in use, the latch at the bottom of the radiator is inserted into the corresponding positioning bar socket and locked with the locking structure. In this embodiment, as shown in the figure, the locking structure includes a square groove opened on the positioning bar and located on the outside of the socket. The square groove serves as a sliding groove, and there are sliders, positioning plates, pull rods, springs, etc. inside. An insert block is fixed on the inner side of the slider, and the inner end face of the insert block is an oblique mouth.

[0026] The insertion hole 6 on the positioning bar is arranged adjacent to the square groove 5, with a partition plate in between. The partition plate has a sliding hole for avoiding the insertion block 13, and the insertion block 13 passes through the sliding hole. In order to ensure the sliding stability of the slider, the left and right side walls of the slider 7 are formed with limit bars 8, and the inner wall of the square groove 5 is provided with two limit grooves matching the limit bars. The limit bars 8 are slidably arranged in the limit grooves on the corresponding sides, and the limit bars and limit grooves play a sliding guide role to ensure the movement stability.

[0027] Through the above structure, when installing the heat sink, first stick or apply thermal conductive material (such as thermal conductive silicone, thermal conductive grease, etc.) on the surface of the chip, align the pin at the bottom of the heat sink with the socket on the positioning strip, press the heat sink downward, the pin contacts the plug block, so that the pin squeezes the bevel of the plug block, and during the pressing process of the heat sink, the plug block retreats and the spring is compressed until the heat sink is pressed to the lowest position, and the bottom of the heat sink is in close contact with the thermal conductive material (because the height of the positioning strip is higher than the chip under normal circumstances, in order to ensure the fit, the bottom of the heat sink is a sunken boss 23, and the bottom surface of the boss 23 is tightly pressed and attached to the thermal conductive material), and the plug block automatically pops into the connection groove of the socket under the action of the spring, thereby completing the limitation. Therefore, the way to install the heat sink is very simple, and you only need to insert the pin to press the heat sink downward. During this process, the blocking bar is always located in the long hole.

[0028] When the radiator needs to be disassembled, the pull rod is pulled back in the opposite direction to disengage the plug from the connection slot and the blocking bar falls off the long hole. Then the pull rod is rotated, and the blocking bar rotates 90° to form a limit with the long hole. When all pull rod operations are completed, the radiator can be directly removed. Therefore, the entire disassembly and assembly process does not require auxiliary tools, and the operation is convenient and efficient. In addition, for the convenience of operation, a pull plate 12 is provided at the outer end of the pull rod 11, and the pull plate is operated to pull and rotate the pull rod.

[0029] Another design feature of the chip heat dissipation structure is the structural design of the heat sink. Figure 5As shown in the figure, the radiator includes a bottom plate 22 and a frame 17 mounted on the bottom plate 22. Fins are formed on the bottom plate 22, and the fins and the bottom plate are integrally formed. A circular area is left in the middle of the front and rear fins, and an air guiding groove 20 is provided between adjacent fins. The top of the frame 17 is closed and is equipped with a motor 18. The output end of the motor 18 is fixedly connected with a fan blade 19, and the fan blade is located in the circular area between the fins. The top of the frame 17 is closed, and the front and rear sides are notches corresponding to the air guiding grooves. The rotation of the fan blade forms a horizontal one-way air duct in the front and rear directions.

[0030] In the existing radiator, the fan is directly installed on the top of the radiator fins. When the fan rotates, it draws air from both sides of the radiator and discharges air from the top of the fan. The wind force at the center position of the fan is small, resulting in uneven heat dissipation. In this structure, however, the radiator forms a horizontal one-way air duct. Since the host computer generally has heat dissipation holes on the back, the horizontal air duct is more likely to discharge the heat outside the host computer. At the same time, the wind speed of this structure is fast, and it is also easier to take away the heat at the center position of the radiator, ensuring the heat dissipation effect.

[0031] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific situations.

Claims

1. A chip heat dissipation structure, characterized in that: It includes a pair of positioning bars (4) located outside the chip and a radiator mounted on the positioning bars (4). A jack (6) and a square groove (5) located outside the jack (6) are formed at the top of the positioning bar (4). A positioning plate (10) is fixedly arranged in the square groove (5), and a slider (7) is slidably arranged. A plug block (13) is fixed on one side of the slider (7). The inner end face of the plug block (13) is an inclined opening (14). A long hole (25) is formed in the positioning plate (10), and a pull rod (11) passes through the long hole (25) until the end of the pull rod is rotatably connected to the slider (7). A stop bar (21) is arranged outside the positioning plate (10) on the pull rod (11). A spring (9) is sleeved on the pull rod (11) at a position between the slider (7) and the positioning plate (10). A plug pin (15) is arranged at the bottom of the radiator corresponding to each jack. A connecting groove (16) is transversely formed in the plug pin (15).

2. The chip heat dissipation structure according to claim 1, wherein: The radiator includes a bottom plate (22) and a frame (17) mounted on the bottom plate (22). Fins (24) are formed on the bottom plate, and an air guiding groove (20) is formed between adjacent fins. A motor (18) is assembled at the top of the frame (17). The output end of the motor (18) is fixedly connected with a fan blade (19). The fan blade (19) is located in the circular area between the fins.

3. The chip heat dissipation structure according to claim 2, wherein: There is a sliding hole for avoiding the plug block (13) on the partition between the jack (6) and the square groove (5), and the plug block (13) passes through the sliding hole.

4. The chip heat dissipation structure according to claim 3, wherein: Limit bars (8) are formed on the left and right side walls of the slider (7). Two limit grooves matching the limit bars are formed on the inner wall of the square groove (5), and the limit bars (8) are slidably arranged in the corresponding limit grooves.

5. The chip heat dissipation structure according to claim 4, wherein: A pull plate (12) is arranged at the outer end of the pull rod (11).

6. The chip heat dissipation structure according to claim 5, wherein: The bottom of the radiator is a boss (23), and a heat conductive material is filled between the boss and the chip.

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