Modularized memory test mainboard

Abstract

The utility model discloses a modularized memory test mainboard, which comprises a power supply, a power supply adapter board, a power supply control board, a current control board and a test board, the power supply is detachably connected with the power supply control board through the power supply adapter board, the power supply control board is detachably connected with the current control board, and the test board is detachably connected with the current control board; according to the utility model, the existing memory test mainboard is improved and is divided into a plurality of modular board cards, the modular board cards are convenient to disassemble, when memory chips of different specifications and models need to be replaced for testing, only the test board in the modular board cards needs to be replaced, other modular board cards do not need to be replaced, the model replacement is convenient, and the cost is low. The same tester can be compatible with test requirements of different specifications; the functions of the board card modules are separated, parallel testing is facilitated, meanwhile, when equipment breaks down, fault board cards can be rapidly positioned, overhaul and maintenance are facilitated, and the overhaul and maintenance cost is also saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of memory testing, and specifically belongs to a modular memory testing main board. Background Art

[0002] When testing memory chips in the prior art, the test is usually carried out on the test main board used, such as a computer main board or a server main board. By loading various specifications of slots on the main board to meet the test requirements of various specifications of products, for small-batch tests in the industry, this low-cost hardware configuration is selected for testing. Due to its limitation by the hardware and the supporting test operators, mass production automation has not been achieved. For the existing methods of testing mass-produced memory chips, usually, the test operator is equipped with a tester to achieve mass production. In order to facilitate loading of the chips, the test main board usually needs to be modified, and the test positions are arranged flat on the plane of the test main board.

[0003] In the existing test main board, each functional module is integrated together, and the layout area is relatively large. When the test main board fails, it is impossible to quickly find the fault point, and the number of test positions that a single main board can carry is limited. Usually, the number of test positions in the DDR5 system is less than 20, and even in the X16 system, there are only 8. To set more test positions, more test main boards need to be arranged flat. After being arranged flat, it will occupy a large working area, with higher costs, and the travel of the handling mechanism also increases, directly reducing the production capacity of the equipment. Moreover, different memory chips need to be equipped with different test main boards for testing. Each test main board is adapted to a specific specification of memory chip. However, the existing test main boards have a single function and are only suitable for single-chip testing, with poor applicability and compatibility. Summary of the Utility Model

[0004] In view of this, the purpose of the present utility model is to overcome the deficiencies in the prior art and provide a modular memory testing main board. The present application provides the following technical solutions:

[0005] A modular memory testing main board includes several modular boards, and the several modular boards are detachably connected.

[0006] In a possible embodiment, the several modular boards are connected by a connector.

[0007] In a possible embodiment, the modular board includes a power supply, a power supply adapter board, a power control board, a current control board, and a test board;

[0008] The power supply is detachably connected to the power control board through the power supply adapter board, the power control board is detachably connected to the current control board, and the test board is detachably connected to the current control board.

[0009] In a possible embodiment, the number of the test boards is not less than one, and test positions are arranged on each of the test boards.

[0010] In a possible embodiment, the modular board further includes a peripheral function board. The power control board is detachably connected to the peripheral function board, and a BMC, a USB, a UART, and an RJ45 are arranged on the peripheral function board.

[0011] In summary, due to the adoption of the above technical solutions, the beneficial effects of the present utility model are as follows:

[0012] The present utility model improves the existing memory test main board and disassembles it into multiple modular boards. It is convenient to disassemble between the modular boards. When it is necessary to test by replacing memory chips of different specifications and models, only the test board in the modular board needs to be replaced, and other modular boards do not need to be replaced, which is convenient for model change and low in cost. The same tester can be compatible with different test requirements; and the functions of the board modules are separated, which is convenient for parallel testing. At the same time, when a failure occurs in the device, the faulty board can be quickly located, which is convenient for maintenance and repair, and also saves the maintenance and repair costs; at the same time, disassembling the test main board into multiple modular boards enables more test positions to be carried on the plane space of the test platform. In this way, the supporting automation equipment has a smaller space, the traveling mechanism has a smaller stroke, and the running speed is faster, which improves the production capacity of the equipment, saves the working site, improves the space utilization rate, and is beneficial to the supporting automated mass production test.

[0013] To make the above objects, features, and advantages of the present application more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, makes the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0015] Figure 1 is a schematic structural diagram of the present utility model.

[0016] Reference numerals: 1 - power supply; 2 - power supply adapter board; 3 - power control board; 4 - current control board; 5 - test board; 6 - peripheral function board. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0018] In the present application, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0019] In the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0020] Please refer to Figure 1 As shown, a modular memory test main board provided in this embodiment includes several modular boards, and the several modular boards are detachably connected; the several modular boards are connected through connectors; the modular board includes a power supply 1, a power supply adapter board 2, a power control board 3, a current control board 4, and a test board 5; the power supply 1 is detachably connected to the power control board 3 through the power supply adapter board 2, the power control board 3 is detachably connected to the current control board 4, and the test board 5 is detachably connected to the current control board 4; the number of the test boards 5 is not less than one, and test positions are provided on each of the test boards 5; the modular board includes a peripheral function board 6, the power control board 3 is detachably connected to the peripheral function board 6, and BMC, USB, UART, and RJ45 are provided on the peripheral function board 6.

[0021] In the above embodiment, as Figure 1The following is a structural schematic diagram of the present utility model. The present utility model improves the existing memory test mainboard. According to the functions of the test mainboard, it is split into multiple modular boards. The various modular boards are detachably connected structurally through connectors. The connectors can be male and female sockets to increase the applicability and compatibility of the tester. In this embodiment, the modular boards include a power supply 1, a power supply adapter board 2, a power supply control board 3, a peripheral function board 6, a current control board 4, and a test board 5. One end of the power supply adapter board 2 is connected to the power supply 1, and the other end is connected to the power supply control board 3 for supplying power to the entire device. The power supply control board 3 is also connected to the peripheral function board 6 and the current control board 4. The power supply control board 3 outputs different numbers of power supply 1 according to the number of boards connected. In this embodiment, the power supply 1 is respectively supplied to the peripheral function board 6 and the current control board 4. The peripheral function board 6 realizes communication interaction and management with external devices, and can be provided with BMC, USB, UART, RJ45, etc. among which BMC is a baseboard management controller, UART is a universal asynchronous receiver / transmitter, and RJ45 is a standard eight-bit modular interface. The current control board 4 is connected to the test board 5. By setting different currents with the test board 5, different overclocking or aging test results can be obtained during memory chip testing. The test board 5 is installed on the current test board 5 through a connector, and test positions are provided thereon. The test positions have chips to be tested. In this embodiment, the size specification of the test board 5 is relatively small, less than one-fourth of the size of a common mainboard. In this way, more test boards 5 can be carried per unit area, and the number of its test positions is also correspondingly more. The space occupied by a certain number of test positions is smaller than that of the test positions in the prior art, and the corresponding supporting facilities are also correspondingly reduced, improving the utilization rate of the site and also improving the production capacity of the device.

[0022] It should be noted that in this embodiment and the accompanying drawings, eight groups of test boards 5, eight groups of current control boards 4, eight groups of power control boards 3, eight groups of peripheral function boards 6, one group of power transfer boards 2, and one group of power supplies 1 are installed for testing the main board. According to the solution of the present application, different numbers of modular boards can be freely installed according to test requirements. Therefore, the present utility model improves the existing memory test main board, disassembles it into multiple modular boards, and it is convenient to disassemble between the modular boards. When it is necessary to test by replacing memory chips of different specifications and models, only the test board in the modular board needs to be replaced, and the other modular boards do not need to be replaced, which is convenient for model change and low cost. The same tester can be compatible with different test requirements; and the functions of the board modules are separated, which is convenient for parallel testing. At the same time, when a fault occurs in the device, the faulty board can be quickly located, which is convenient for repair and maintenance, and also saves the repair and maintenance cost; at the same time, disassembling the test main board into multiple modular boards enables more test positions to be installed in the plane space of the test platform, so that the supporting automation equipment has a smaller space, the travel of the handling mechanism is also smaller, the running speed is faster, the production capacity of the equipment is improved, the working site is saved, and the space utilization rate is improved, which is beneficial to supporting automated mass production testing.

[0023] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A modular memory test motherboard, characterized in that: It includes several modular boards, and the several modular boards are detachably connected; The modular board includes a power supply, a power transfer board, a power control board, a current control board, and a test board; the power supply is detachably connected to the power control board through the power transfer board, the power control board is detachably connected to the current control board, and the test board is detachably connected to the current control board.

2. The modular memory test motherboard according to claim 1, wherein: The several modular boards are connected through connectors.

3. The modular memory test main board according to claim 1, characterized in that: The number of the test boards is not less than one, and test positions are arranged on each test board.

4. The modular memory test main board according to claim 1, wherein: The modular board further includes a peripheral function board, the power control board is detachably connected to the peripheral function board, and BMC, USB, UART, and RJ45 are arranged on the peripheral function board.

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