Cleaning device

Abstract

The utility model relates to a cleaning device which comprises a cleaning tank, a bearing mechanism and a plurality of waste discharge mechanisms. The bearing mechanism is detachably connected with the rotating end of the rotating driving piece, and each waste discharging mechanism comprises a waste discharging pipeline and a control switch. Different bearing mechanisms can bear to-be-cleaned workpieces of different sizes, such as wafers, so that the wafers of different sizes can be cleaned by replacing the bearing mechanisms. The multiple waste discharge mechanisms are mutually independent, and each waste discharge mechanism can discharge one type of cleaning waste liquid. According to different cleaning liquids, the corresponding waste discharge pipelines are opened through the control switches, and the other waste discharge pipelines are closed, so that classified recovery of different types of cleaning waste liquids can be realized. Therefore, the cleaning device is not only suitable for cleaning wafers with different sizes, but also suitable for cleaning wafers electroplated by adopting different types of plating solutions, so that the cleaning device is wide in application range.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a cleaning device. Background Art

[0002] After wafers go through processes such as electroplating, they generally need to be cleaned. Common cleaning devices include a cleaning chamber and a wafer limiting mechanism disposed in the cleaning chamber. First, the wafers to be cleaned are placed on the wafer limiting mechanism in the cleaning chamber, and then the wafers can be cleaned by spraying water or a specific liquid on the wafer surface. Since the limiting mechanism generally only adapts to wafers of one size, the cleaning device usually can only clean wafers of a single size. Moreover, for wafers electroplated with different types of plating solutions, different cleaning devices are required during cleaning to meet the requirement of classifying and recycling cleaning waste liquid. It can be seen that in order to successfully meet the cleaning requirements of wafers of different sizes and types, a relatively large number of cleaning devices generally need to be configured in the production workshop, resulting in more space occupation and inconvenient management. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a cleaning device with a wider applicable range for the above problems.

[0004] A cleaning device includes:

[0005] A cleaning tank, a cleaning chamber with an opening on one side is formed inside the cleaning tank, a rotary driving member is disposed at the bottom of the cleaning chamber, and a drain port communicating with the cleaning chamber is provided on the cleaning tank;

[0006] A carrying mechanism for carrying the workpiece to be cleaned, and the carrying mechanism is detachably connected to the rotating end of the rotary driving member; and

[0007] A plurality of waste discharging mechanisms, each waste discharging mechanism includes a waste discharging pipeline and a control switch, the waste discharging pipelines of the plurality of waste discharging mechanisms are all communicated with the drain port, and each control switch can control the corresponding waste discharging pipeline to be opened or closed.

[0008] In one embodiment, the carrying mechanism includes a plurality of support columns, a support surface is formed at the top end of each support column and a protruding portion protruding from the support surface, the plurality of protruding portions enclose an accommodating space for the workpiece to be cleaned, and the workpiece in the accommodating space is carried on the support surface.

[0009] In one embodiment, a sealing ring is disposed on the support surface.

[0010] In one embodiment, a guiding inclined surface inclined relative to the support surface is formed on the side surface of the protruding portion.

[0011] In one embodiment, the supporting mechanism is provided with an upper flange, and the rotating end of the rotating driving member is provided with a lower flange. One of the upper flange and the lower flange is provided with a fixing rod, and the other is provided with a plug hole and a locking member. The fixing rod is passed through the plug hole and is locked by the locking member to connect the upper flange and the lower flange.

[0012] In one embodiment, a liquid sensor is further included, which is communicatively connected to the control switches of the plurality of waste discharge mechanisms and is capable of sending a control signal to each of the control switches to turn the control switch on or off.

[0013] In one embodiment, each of the waste discharge mechanisms further includes a waste liquid pool connected to an end of the waste discharge pipe away from the drain port.

[0014] In one of the embodiments, a spraying mechanism is further included, wherein the spraying mechanism includes a first nozzle for spraying cleaning liquid into the cleaning chamber and a second nozzle for blowing air into the cleaning chamber.

[0015] In one of the embodiments, it further includes an annular baffle plate which is sleeved with the cleaning tank, and the annular baffle plate can be raised and lowered relative to the cleaning tank.

[0016] In one of the embodiments, the annular baffle is inserted into the cleaning chamber, and the outer wall of the cleaning tank is provided with a lifting drive member that is transmission-connected to the annular baffle, and the annular baffle can be lifted and lowered under the drive of the lifting drive member.

[0017] In the above-mentioned cleaning device, different carrying mechanisms can carry workpieces to be cleaned of different sizes, such as wafers, so by replacing the carrying mechanism, wafers of different sizes can be cleaned. The multiple waste discharge mechanisms are independent of each other, and each waste discharge mechanism can discharge one type of cleaning waste liquid. Depending on the cleaning liquid used, the corresponding waste discharge pipe is opened by controlling the switch and the remaining waste discharge pipes are closed, so that different types of cleaning waste liquids can be classified and recovered. It can be seen that the above-mentioned cleaning device is suitable for cleaning wafers of different sizes, and is also suitable for cleaning wafers electroplated with different types of plating solutions. Therefore, the above-mentioned cleaning device has a wide range of applications and can significantly reduce the number of cleaning devices in the production workshop. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 Structural schematic diagram of the cleaning device in a preferred embodiment of the present utility model;

[0020] Figure 2 is Figure 1 Partial structural schematic diagram of the cleaning device shown omitting the waste discharging mechanism;

[0021] Figure 3 is Figure 2 Partial structural schematic diagram of another usage state of the cleaning device shown;

[0022] Figure 4 is Figure 2 Enlarged schematic diagram of part A in the cleaning device shown;

[0023] Figure 5 is Figure 1 Structural schematic diagram of the support column in the cleaning device shown. Detailed implementation manners

[0024] To make the above objects, features and advantages of the present utility model more obvious and understandable, the following will give a detailed description of the detailed implementation manners of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0025] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

[0026] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0027] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0028] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on the top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "under the bottom of" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0030] Please refer to Figure 1 and Figure 2 , the present utility model provides a cleaning device 100. Among them, the cleaning device 100 includes a cleaning tank 110, a carrying mechanism 120 and a waste discharging mechanism 130.

[0031] The cleaning device 100 is used to clean the workpiece after electroplating. Specifically, in this embodiment, the workpiece to be cleaned is a wafer 200. Obviously, the cleaning device 100 can also be used to clean other electroplated workpieces. The cleaning tank 110 can be a barrel-shaped structure formed by a metal material, and a cleaning cavity 101 with an opening on one side is formed inside it. The opening of the cleaning cavity 101 faces upward, and the wafer 200 to be cleaned can be placed into the cleaning cavity 101 through the opening and complete the cleaning operation in the cleaning cavity 101.

[0032] Specifically, in this embodiment, the cleaning device 100 further includes a spraying mechanism 140, and the spraying mechanism 140 includes a first nozzle 141 and a second nozzle 142. The first nozzle 141 is used to spray a cleaning liquid, such as clean water or other types of solutions, into the cleaning chamber 101, so as to wash away the residual electroplating liquid on the surface of the wafer 200 in the cleaning chamber 101; the second nozzle 142 is used to blow air into the cleaning chamber 101 to dry the washed wafer 200.

[0033] A rotary driving member 111 is provided at the bottom of the cleaning chamber 101, and the carrying mechanism 120 is detachably connected to the rotating end of the rotary driving member 120. The rotary driving member 111 can be a driving element such as a motor or a rotary cylinder. The carrying mechanism 120 is used to carry the workpiece to be cleaned, that is, the wafer 200. During the cleaning process, the rotary driving member 111 drives the carrying mechanism 120 and the carried wafer 200 to rotate, so that the cleaning agent can be evenly sprayed onto the surface of the wafer 200, which helps to improve the cleaning effect.

[0034] In addition, a sensor 190 is further provided on the cleaning tank 110 to detect whether a wafer 200 is placed on the carrying mechanism 120 or whether the wafer 200 is damaged.

[0035] Different carrying mechanisms 120 can carry wafers 200 of different sizes. Since the carrying mechanism 120 is detachably connected to the rotating end of the rotary driving member 120, the carrying mechanism 120 on the rotary driving member 111 can be replaced as needed, and by replacing the corresponding carrying mechanism 120, wafers 200 of different sizes can be cleaned.

[0036] Please refer to Figure 5 , in this embodiment, the carrying mechanism 120 includes a plurality of support columns 121. A support surface 1211 and a protruding portion 1212 protruding from the support surface 1211 are formed at the top of each support column 121. The plurality of protruding portions 1212 enclose an accommodation space for accommodating the wafer 200 to be cleaned, and the wafer 200 in the accommodation space is carried on the support surface 1211.

[0037] The support columns 121 are preferably provided in three and are distributed in a triangular shape. After the wafer 200 to be cleaned is placed in the accommodation space, the support surfaces 1211 of the plurality of support columns 121 are all in contact with the bottom surface of the wafer 200, so as to support the wafer 200; while the side of the wafer 200 abuts against the protruding portion 1212, so as to prevent the wafer 200 from being thrown out when the rotary driving member 111 drives the wafer 200 to rotate. When the wafer 200 is limited by the plurality of support columns 121, there is no need to clamp or adsorb the wafer 200, so it is not easy to damage the wafer 200.

[0038] Specifically, the carrier mechanism 120 further includes a support ring 122, which is concentric with the rotating shaft of the rotation driving member 111. A plurality of support columns 121 are fixedly installed on the support ring 122 and are spaced apart along the circumferential direction of the support ring 122.

[0039] It should be noted that in other embodiments, the carrier mechanism 120 can also limit the wafer 200 by means of jaw clamping, suction cup adsorption, etc.

[0040] Further, in this embodiment, a sealing ring 1213 is provided on the support surface 1211. Specifically, the protruding portion 1212 is formed as a cylinder concentric with the support surface 1211, and the sealing ring 1213 is sleeved on the protruding portion 1212 for limiting. A part of the bottom surface of the wafer 200 placed in the accommodation space contacts the sealing ring 1213, which can increase the friction between the wafer 200 and the support column 121, thereby preventing the wafer 200 from sliding randomly. At the same time, the sealing ring 1213 can also play a buffering role when placing the wafer 200 to prevent the wafer 200 from being damaged.

[0041] Further, in this embodiment, a guiding inclined surface (not shown in the figure) inclined relative to the support surface 1211 is formed on the side surface of the protruding portion 1212. The guiding inclined surface can play a guiding role when placing the wafer 200, so that the wafer 200 can smoothly fall into the accommodation space and be carried on the support surface 1211. Specifically, the protruding portion 1212 can be formed in a shape similar to a frustum of a cone, and its side surface constitutes the guiding inclined surface. The protruding portion 1212 can also be formed in a cylindrical shape, and the guiding inclined surface is obtained by obliquely cutting the side of the protruding portion 1212 facing the accommodation space.

[0042] In addition, please also refer to Figure 4 , in this embodiment, the carrier mechanism 120 is provided with an upper flange 150, and the rotating end of the rotation driving member 120 is provided with a lower flange 160. One of the upper flange 150 and the lower flange 160 is provided with a fixing rod (not shown in the figure), and the other is provided with a plugging hole (not shown in the figure) and a locking member 151. The fixing rod passes through the plugging hole and is locked by the locking member 151 to connect the upper flange 150 and the lower flange 160.

[0043] That is to say, the bearing mechanism 120 and the rotating end of the rotary driving member 120 are detachably installed through the cooperation of the upper flange 150 and the lower flange 160. Specifically, the upper flange 150 in this embodiment is provided with a plug hole and a locking member 151, and the lower flange 160 is provided with a fixing rod. The fixing rod can be set as a rivet, and the locking member 151 can be set as a locking bolt. When the bearing mechanism 120 needs to be replaced, first loosen the locking member 151, and then pull out the fixing rod from the plug hole to remove the original bearing mechanism 120; then, insert the fixing rod of the lower flange 160 into the plug hole of the upper flange 150 of the new bearing mechanism 120 and tighten the locking member 151, and the new bearing mechanism 120 can be assembled to the rotating end of the rotary driving member 120. It can be seen that the cooperation of the upper flange 150 and the lower flange 160 can realize the rapid disassembly and replacement of the bearing mechanism 120. Please refer to again Figure 1 A drain port (not shown in the figure) communicating with the cleaning chamber 101 is provided on the cleaning tank 110, and the cleaning waste liquid generated by cleaning the wafer 200 first gathers in the cleaning chamber 101 and is discharged outwards through the drain port. Further, a plurality of waste discharging mechanisms 130 are provided, and each waste discharging mechanism 130 includes a waste discharging pipe 131 and a control switch 132. Moreover, the waste discharging pipes 131 of the plurality of waste discharging mechanisms 130 are all communicated with the drain port, and each control switch 132 can control the corresponding waste discharging pipe 131 to be opened or closed.

[0044] The types of electroplating solutions used for different coating types are different, the cleaning solutions used for cleaning are also different, and the cleaning waste liquids generated after cleaning are also different. For each cleaning solution that may be used, a corresponding waste discharging mechanism 130 is provided. For example, five waste discharging mechanisms 130 are provided in this embodiment, and the cleaning device 100 can use five different cleaning solutions to clean the wafer 200. According to the type of the cleaning solution used, the corresponding waste discharging pipe 131 is opened through the control switch 132 and the remaining waste discharging pipes 131 are closed, so that various cleaning waste liquids can be discharged separately through a plurality of different waste discharging pipes 131, thereby realizing the classified recovery of different types of cleaning waste liquids.

[0045] Specifically, in this embodiment, the cleaning device 100 further includes a liquid sensor (not shown in the figure), and the liquid sensor is communicatively connected to the control switches 132 of the plurality of waste discharging mechanisms 130 and can send a control signal for opening or closing the control switches 132 to each control switch 132.

[0046] The liquid sensor can detect the type of the cleaning waste liquid in the cleaning chamber 101. The control switch 132 can be a pneumatic valve switch, an electromagnetic switch, etc., and can receive a control signal. After the liquid sensor detects the type of the cleaning waste liquid, it can send a control signal to open the control switch 131 of the corresponding waste discharge mechanism 130 and close the control switches 131 of other waste discharge mechanisms 130, so that multiple cleaning waste liquids can be discharged separately from separate waste discharge mechanisms 130.

[0047] Obviously, in other embodiments, the control switches 131 of each waste discharge mechanism 130 may also be manually operated to realize the control of the on / off state of each control switch 131 .

[0048] Furthermore, in this embodiment, each waste discharge mechanism 130 further includes a waste liquid pool 133 connected to one end of the waste discharge pipe 131 away from the drain port. The waste liquid pool 133 can collect the cleaning waste liquid discharged from the waste discharge pipe 131, so as to facilitate the recycling of the cleaning waste liquid. The waste liquid pool 133 can be connected to the waste discharge pipe 131 through a detachable joint, and when the current waste liquid pool 133 is full, it can be directly removed and transported away, and an empty waste liquid pool 133 can be installed.

[0049] Also, see Figure 2 and Figure 3 In this embodiment, the cleaning device 100 further includes an annular baffle 170 which is sleeved with the cleaning tank 110 , and the annular baffle 170 can be raised and lowered relative to the cleaning tank 110 .

[0050] The annular baffle 170 and the cleaning tank 110 may be connected via a slide rail, so that the annular baffle 170 can be raised and lowered relative to the cleaning tank 110. Figure 3 As shown, when cleaning the wafer 200, the annular baffle 170 can be operated to rise, thereby effectively preventing the cleaning liquid from splashing out of the cleaning chamber 101 and causing contamination of other equipment. In addition, the cleaning liquid splashed onto the annular baffle 170 can also flow back into the cleaning chamber 101 along the inner wall to achieve the recovery of the cleaning liquid.

[0051] After cleaning is completed, the annular baffle 170 can be operated to descend and return to the initial position (such as Figure 2 As shown in FIG. 1 ). In the initial position, the upper edge of the annular baffle 170 may be lower than or flush with the opening edge of the cleaning chamber 101. At this time, the supporting mechanism 120 may be better exposed, thereby facilitating the loading of the wafer 200 to be cleaned.

[0052] Furthermore, in this embodiment, the annular baffle 170 is inserted into the cleaning chamber 101 , and the outer wall of the cleaning tank 110 is provided with a lifting drive member 180 which is transmission-connected to the annular baffle 170 , and the annular baffle 170 can be lifted and lowered under the drive of the lifting drive member 180 .

[0053] Specifically, the lifting driving member 180 can be a cylinder. Driven by the lifting driving member 180, the annular baffle 170 can be automatically lifted and lowered, thereby reducing the labor intensity of the operator. Moreover, since the annular baffle 170 is inserted into the cleaning chamber 101, the cleaning liquid flowing back along the inner wall of the annular baffle 170 will not leak out from the gap between the annular baffle 170 and the cleaning tank 110.

[0054] In the above-mentioned cleaning device 100, different loading mechanisms 120 can load workpieces to be cleaned with different sizes, such as the wafer 200. Therefore, by replacing the loading mechanism 120, the cleaning of wafers 200 with different sizes can be realized. The multiple waste discharging mechanisms 130 are independent of each other, and each waste discharging mechanism 130 can discharge a type of cleaning waste liquid. According to the different cleaning liquids used, by controlling the switch 132 to open the corresponding waste discharging pipeline 131 and closing the remaining waste discharging pipelines 131, the classified recovery of different types of cleaning waste liquid can be realized. It can be seen that the above-mentioned cleaning device 100 is suitable for cleaning wafers with different sizes and is also suitable for cleaning wafers 200 electroplated with different types of plating solutions. Therefore, the applicable range of the above-mentioned cleaning device 100 is relatively wide, and the number of cleaning devices 100 in the production workshop can be significantly reduced.

[0055] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0056] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A cleaning device, characterized in that, include: A cleaning tank, wherein a cleaning cavity with an opening on one side is formed inside the cleaning tank, a rotating driving member is provided at the bottom of the cleaning cavity, and a drainage port communicating with the cleaning cavity is provided on the cleaning tank; A carrying mechanism, used for carrying the workpiece to be cleaned, and the carrying mechanism is detachably connected to the rotating end of the rotary drive member; and Multiple waste discharge mechanisms, each of which includes a waste discharge pipe and a control switch, the waste discharge pipes of the multiple waste discharge mechanisms are connected to the drain port, and each of the control switches can control the corresponding waste discharge pipe to open or close.

2. The cleaning device according to claim 1, characterized in that, The supporting mechanism includes a plurality of supporting columns, each of which has a supporting surface and a protruding portion protruding from the supporting surface at the top end, and the plurality of protruding portions are arranged to form a receiving space for receiving the workpiece to be cleaned, and the workpiece in the receiving space is supported on the supporting surface.

3. The cleaning device according to claim 2, wherein, A sealing ring is arranged on the supporting surface.

4. The cleaning device according to claim 2, characterized in that, A guide slope that is inclined relative to the supporting surface is formed on the side surface of the protruding portion.

5. The cleaning device according to claim 1, characterized in that, The bearing mechanism is provided with an upper flange, and the rotating end of the rotating driving member is provided with a lower flange. One of the upper flange and the lower flange is provided with a fixing rod, and the other is provided with a plug hole and a locking member. The fixing rod is passed through the plug hole and is locked by the locking member to connect the upper flange and the lower flange.

6. The cleaning device according to claim 1, wherein, It also includes a liquid sensor, which is communicatively connected to the control switches of the plurality of waste discharge mechanisms and can send a control signal to each of the control switches to turn the control switch on or off.

7. The cleaning device according to claim 1, characterized in that Each of the waste discharge mechanisms also includes a waste liquid pool connected to one end of the waste discharge pipe away from the drain port.

8. The cleaning device according to claim 1, characterized in that It also includes a spraying mechanism, which includes a first nozzle for spraying cleaning liquid into the cleaning chamber and a second nozzle for blowing air into the cleaning chamber.

9. The cleaning device according to claim 1, wherein It also includes an annular baffle plate which is sleeved with the cleaning tank, and the annular baffle plate can be lifted and lowered relative to the cleaning tank.

10. The cleaning device according to claim 9, characterized in that, The annular baffle is inserted in the cleaning chamber, and the outer wall of the cleaning tank is provided with a lifting driving member which is transmission-connected with the annular baffle, and the annular baffle can be lifted and lowered under the driving of the lifting driving member.

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