Auxiliary device based on semiconductor chip packaging

Abstract

The utility model discloses an auxiliary device based on semiconductor chip packaging, which comprises a support table and a cooling assembly, a continuous conveying mechanism is arranged above the support table, a blanking plate matched with the continuous conveying mechanism is arranged below the support table, the continuous conveying mechanism comprises a conveying assembly used for continuously conveying chips, and the cooling assembly is used for cooling the chips; the output end of the stepping motor penetrates through the supporting table and extends to the position above the supporting table, the output end of the stepping motor is fixedly connected with a disc, six chip grooves are formed in the top of the disc at equal intervals, and a plurality of through holes are evenly formed in the bottoms of the inner walls of the chip grooves. According to the auxiliary device for packaging based on the semiconductor chip, continuous feeding is conducted in a rotating mode when the chip is fed, the occupied space of the conveying mechanism is obviously reduced, the clamping and discharging processes of the chip are automatically completed in the feeding process, and the practicability of the device in use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and specifically relates to an auxiliary device for semiconductor chip packaging. Background Technique

[0002] Chip packaging technology is a process technology that wraps memory chips to avoid contact between the chips and the outside world and prevent damage to the chips by the outside world. Impurities, bad gases, and even water vapor in the air will corrode the delicate circuits on the chips, thereby causing a decline in electrical performance. Different packaging technologies vary greatly in manufacturing processes and techniques, and also play a crucial role in the performance of memory chips themselves after packaging.

[0003] The reference patent publication number "CN220753382U" discloses an auxiliary device for semiconductor chip packaging, including a bottom plate. A bracket is fixedly installed at the top of the bottom plate. A working plate is arranged inside the bracket. A placement groove is opened at the top of the working plate, and a sliding groove is opened at the top of the working plate.

[0004] This patent realizes the control of the clamping force on the chip. When the existing auxiliary device for semiconductor chip packaging packages the chip, it is transported through a conveying mechanism. If a large number of chips need to be transported, the length of the conveying mechanism will also be long, which undoubtedly increases the area occupied by the equipment in the workshop and is not conducive to the rational layout of the workshop equipment. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides an auxiliary device for semiconductor chip packaging, which solves the problem that the existing auxiliary device for semiconductor chip packaging occupies a large space.

[0006] To achieve the above objectives, the utility model is realized through the following technical solutions: An auxiliary device for semiconductor chip packaging includes a support table and a cooling component. A continuous conveying mechanism is arranged above the support table, and a blanking plate matched with the continuous conveying mechanism is arranged below the support table. The continuous conveying mechanism includes:

[0007] A conveying component for continuously conveying chips. The conveying component includes a stepping motor. The output end of the stepping motor penetrates through the support table and extends above the support table. The output end of the stepping motor is fixedly connected with a disc. Six chip slots are equidistantly opened at the top of the disc, and a plurality of through holes are evenly opened at the bottom of the inner wall of the chip slot.

[0008] Six groups of clamping components are provided, and the six groups of clamping components are respectively located in the six chip slots.

[0009] The feeding component is arranged on the right side of the conveying component, and the feeding component is used for intermittently feeding into the conveying component.

[0010] Preferably, the clamping component includes a groove opened at the top of the chip slot. The bottom of the inner wall of the groove is slidably connected with an L-shaped rod. The L-shaped rod penetrates through the disc and is fixedly connected with a double-arc plate at one end extending below the disc. The other end of the L-shaped rod is fixedly connected with a push plate. A return spring is fixedly connected between the L-shaped rod and the inner wall of the groove.

[0011] Preferably, two left and right L-shaped clamping plates are slidably connected to the inner surface of the chip slot. The tops of the two L-shaped clamping plates are fixedly connected with first fixing rods. The surface of the left first fixing rod is rotatably connected with a first connecting rod. The surface of the right first fixing rod is rotatably connected with a second connecting rod.

[0012] Preferably, the top of the L-shaped rod is fixedly connected with a second fixing rod. The first connecting rod and the second connecting rod are both rotatably connected to the surface of the second fixing rod.

[0013] Preferably, a second stop rod is fixedly connected to the top of the support platform, and the second stop rod is located outside the circular contour formed by a plurality of double-arc plates. A first stop rod is fixedly connected to the top of the support platform, and the first stop rod is located inside the circular contour formed by a plurality of double-arc plates.

[0014] Preferably, the feeding component includes a chip box. The chip box is fixedly connected to the top of the support platform, and the bottom of the inner wall of the chip box is in the same plane as the bottom of the inner wall of the chip slot. A hydraulic cylinder is fixedly connected to the right side of the chip box, and the telescopic end of the hydraulic cylinder penetrates through the chip box and extends into the interior of the chip box. The output end of the hydraulic cylinder is fixedly connected with a bottom plate.

[0015] Beneficial effects

[0016] The utility model provides an auxiliary device for semiconductor chip packaging. Compared with the prior art, the following beneficial effects are achieved:

[0017] 1. For the auxiliary device for semiconductor chip packaging, since the conveying component includes a stepping motor, the output end of the stepping motor penetrates through the support platform and extends above the support platform, and the output end of the stepping motor is fixedly connected with a disc, continuous feeding is carried out by rotation when feeding the chip, significantly reducing the occupied space of the conveying mechanism, and automatically completing the clamping and blanking processes of the chip during the feeding process, improving the practicability of the device during use.

[0018] 2. The auxiliary device for semiconductor chip packaging includes a chip box through a loading assembly. The chip box is fixedly connected to the top of the support table, and the bottom of the inner wall of the chip box and the bottom of the inner wall of the chip slot are in the same plane. A hydraulic cylinder is fixedly connected to the right side of the chip box. The loading assembly is designed to cooperate with the conveying assembly, thereby ensuring the continuity of the conveying mechanism during operation and further improving the convenience of the device when used. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the appearance of the utility model;

[0020] Figure 2 It is a schematic diagram of the feeding assembly and conveying mechanism of the utility model;

[0021] Figure 3 It is a schematic diagram of the conveying assembly and the clamping assembly of the utility model;

[0022] Figure 4 It is a partial schematic diagram of the utility model;

[0023] Figure 5 It is an enlarged view of point A of the present utility model.

[0024] In the figure: 1. support table; 2. cooling component; 3. conveying component; 31. stepping motor; 32. disc; 33. chip slot; 34. through hole; 4. clamping component; 41. groove; 42. L-shaped rod; 43. push plate; 44. return spring; 45. L-shaped clamping plate; 46. first fixed rod; 47. second fixed rod; 48. first connecting rod; 49. second connecting rod; 410. first stop rod; 411. second stop rod; 412. double arc plate; 5. loading component; 51. chip box; 52. hydraulic cylinder; 53. bottom plate; 6. unloading plate. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figures 1 - 5 , the auxiliary device based on semiconductor chip packaging provides two technical solutions:

[0027] The first embodiment includes a support platform 1 and a cooling assembly 2. A continuous conveying mechanism is disposed above the support platform 1, and a blanking plate 6 cooperating with the continuous conveying mechanism is disposed below the support platform 1. The continuous conveying mechanism includes:

[0028] A conveying assembly 3 for continuously conveying chips. The conveying assembly 3 includes a stepping motor 31. The output end of the stepping motor 31 penetrates through the support platform 1 and extends above the support platform 1. A disc 32 is fixedly connected to the output end of the stepping motor 31. Six chip slots 33 are equidistantly arranged at the top of the disc 32. A plurality of through holes 34 are evenly arranged at the bottom of the inner wall of the chip slot 33.

[0029] There are six groups of clamping assemblies 4, and the six groups of clamping assemblies 4 are respectively located in the six chip slots 33. The clamping assembly 4 includes a groove 41 opened at the top of the chip slot 33. A L-shaped rod 42 is slidably connected to the bottom of the inner wall of the groove 41. One end of the L-shaped rod 42 that penetrates through the disc 32 and extends below the disc 32 is fixedly connected to a double-arc plate 412. The other end of the L-shaped rod 42 is fixedly connected to a push plate 43. A return spring 44 is fixedly connected between the L-shaped rod 42 and the inner wall of the groove 41. Two left and right L-shaped clamping plates 45 are slidably connected to the inner surface of the chip slot 33. The tops of the two L-shaped clamping plates 45 are both fixedly connected to a first fixing rod 46. A first connecting rod 48 is rotatably connected to the surface of the left first fixing rod 46. A second connecting rod 49 is rotatably connected to the surface of the right first fixing rod 46. A second fixing rod 47 is fixedly connected to the top of the L-shaped rod 42. Both the first connecting rod 48 and the second connecting rod 49 are rotatably connected to the surface of the second fixing rod 47. A second stop rod 411 is fixedly connected to the top of the support platform 1, and the second stop rod 411 is located outside the circular contour formed by the plurality of double-arc plates 412. The second stop rod 411 is directly below the cooling assembly 2. A first stop rod 410 is fixedly connected to the top of the support platform 1. The position of the first stop rod 410 corresponds to the position of the blanking plate 6, and the first stop rod 410 is located inside the circular contour formed by the plurality of double-arc plates 412.

[0030] When loading the chips, continuous loading is carried out by rotation, which significantly reduces the occupied space of the conveying mechanism, and automatically completes the clamping and blanking processes of the chips during the loading process, improving the practicability of the device during use.

[0031] The second implementation mode is mainly different from the first implementation mode in that: a loading assembly 5 is arranged on the right side of the conveying assembly 3, and the loading assembly 5 is used for intermittently loading into the conveying assembly 3. The loading assembly 5 includes a chip box 51. The chip box 51 is fixedly connected to the top of the support platform 1, and the bottom of the inner wall of the chip box 51 is on the same plane as the bottom of the inner wall of the chip slot 33. A hydraulic cylinder 52 is fixedly connected to the right side of the chip box 51, and the telescopic end of the hydraulic cylinder 52 penetrates through the chip box 51 and extends into the interior of the chip box 51. The output end of the hydraulic cylinder 52 is fixedly connected to a bottom plate 53.

[0032] The feeding component 5 is designed to cooperate with the conveying component 3, thus ensuring the continuity of the conveying mechanism during operation and further improving the convenience of the device during use.

[0033] During use, stack the chips to be encapsulated inside the chip box 51, start the hydraulic cylinder 52 and move the hydraulic cylinder 52, and then push the lowermost chip into the corresponding chip slot 33 through the bottom plate 53. When pushing the lowermost chip to move, the penultimate chip is above the bottom plate 53 and falls to the bottom of the chip box 51 after the bottom plate resets. Start the stepping motor 31 to make the disc 32 rotate intermittently, and the rotation time interval of the disc 32 is the same as the intermittent start time interval of the hydraulic cylinder 52. After the chip enters the chip slot 33, it rotates following the stepping motor 31. When the chip enters directly below the cooling component 2, the double arc plate 412 contacts the second stop rod 411, and then pushes the double arc plate 412 to move. The double arc plate 412 moves and pulls the first connecting rod 48 and the second connecting rod 49 through the L-shaped rod 42. At this time, the two L-shaped clamping plates 45 approach each other and clamp the chip. At this time, the encapsulation operation can be carried out. After the encapsulation is completed, the stepping motor 31 continues to rotate. When the double arc plate 412 contacts the first stop rod 410, at this time, push the push plate 43 into the chip slot 33, so as to push out the chip, and the chip slides out from the blanking plate 6.

[0034] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0035] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An auxiliary device for semiconductor chip packaging, comprising a support table (1) and a cooling component (2), characterized in that: Above the support table (1), a continuous conveying mechanism is provided. Below the support table (1), a blanking plate (6) is provided which cooperates with the continuous conveying mechanism. The continuous conveying mechanism includes: A conveying component (3) for continuously conveying chips. The conveying component (3) includes a stepping motor (31). The output end of the stepping motor (31) penetrates the support table (1) and extends above the support table (1). The output end of the stepping motor (31) is fixedly connected to a disc (32). Six chip slots (33) are equidistantly arranged at the top of the disc (32). A plurality of through holes (34) are evenly arranged at the bottom of the inner wall of the chip slot (33). Six clamping components (4) are provided, and the six clamping components (4) are respectively located in the six chip slots (33). A loading component (5) is provided on the right side of the conveying component (3), and the loading component (5) is used for intermittently loading into the conveying component (3).

2. The auxiliary device for semiconductor chip packaging according to claim 1, wherein: The clamping component (4) includes a groove (41) opened at the top of the chip slot (33). A sliding connection is provided between the bottom of the inner wall of the groove (41) and an L-shaped rod (42). The L-shaped rod (42) penetrates the disc (32) and a double-arc plate (412) is fixedly connected to the end extending below the disc (32). The other end of the L-shaped rod (42) is fixedly connected to a push plate (43). A return spring (44) is fixedly connected between the L-shaped rod (42) and the inner wall of the groove (41).

3. The auxiliary device for semiconductor chip packaging according to claim 2, characterized in that: Two left and right L-shaped clamping plates (45) are slidably connected to the inner surface of the chip slot (33). A first fixing rod (46) is fixedly connected to the top of each of the two L-shaped clamping plates (45). A first connecting rod (48) is rotatably connected to the surface of the left first fixing rod (46). A second connecting rod (49) is rotatably connected to the surface of the right first fixing rod (46).

4. An auxiliary device for semiconductor chip packaging according to claim 3, characterized in that: A second fixing rod (47) is fixedly connected to the top of the L-shaped rod (42). The first connecting rod (48) and the second connecting rod (49) are both rotatably connected to the surface of the second fixing rod (47).

5. The auxiliary device for semiconductor chip packaging according to claim 2, wherein: A second stop rod (411) is fixedly connected to the top of the support table (1), and the second stop rod (411) is located outside the circular contour formed by a plurality of double-arc plates (412). A first stop rod (410) is fixedly connected to the top of the support table (1), and the first stop rod (410) is located inside the circular contour formed by a plurality of double-arc plates (412).

6. The auxiliary device for semiconductor chip packaging according to claim 1, characterized in that: The loading component (5) includes a chip box (51). The chip box (51) is fixedly connected to the top of the support table (1), and the bottom of the inner wall of the chip box (51) is in the same plane as the bottom of the inner wall of the chip slot (33). A hydraulic cylinder (52) is fixedly connected to the right side of the chip box (51). The telescopic end of the hydraulic cylinder (52) penetrates the chip box (51) and extends into the interior of the chip box (51). The output end of the hydraulic cylinder (52) is fixedly connected to a bottom plate (53).

Images