Packaging device for semiconductor device

Abstract

The utility model relates to the technical field of production of semiconductor devices, in particular to a packaging device for semiconductor devices, which comprises a workbench and an adjusting assembly, a welding head is mounted on the adjusting assembly, a positioning frame is fixedly mounted at the top of the workbench, an inlet and an outlet are formed in one side of the positioning frame, and a side opening is formed in the other side of the workbench. A plurality of strip-shaped plates are inserted into the positioning frame, a plurality of transverse grooves are formed in one side of each strip-shaped plate, a top groove and a bottom groove are formed in the top and the bottom of each transverse groove in a penetrating mode respectively, a supporting plate is transversely inserted into each transverse groove, a clamping plate is fixedly installed at the top of each supporting plate and slidably installed in the corresponding top groove, and a bottom plate is fixedly installed at the bottom of each supporting plate and slidably installed in the corresponding bottom groove. And a first spring is fixedly mounted between one side of the bottom plate and one side of the bottom groove. And when the first spring resets, the bottom plate is far away from the strip-shaped plate, the strip-shaped plate is taken out, and limiting is relieved at the same time, so that convenience and rapidness are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device production, in particular to a packaging device for semiconductor devices. Background Art

[0002] A semiconductor device is an electronic device with conductivity between that of a good conductor and an insulator, which utilizes the special electrical properties of semiconductor materials to perform specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor material of a semiconductor device is silicon, germanium or gallium arsenide, and it can be used as devices such as rectifiers, oscillators, light emitters, amplifiers, and photometers.

[0003] During packaging, it is necessary to position and install the semiconductor device to be packaged. However, after packaging, it is necessary to release the limit and then take out the packaged component, which is rather troublesome. Therefore, those skilled in the art have provided a packaging device for semiconductor devices to solve the problems raised. Summary of the Utility Model

[0004] In order to solve the problem of low efficiency in the existing semiconductor packaging that requires separate release of the limit in the prior art, the utility model provides a packaging device for semiconductor devices with improved efficiency.

[0005] The technical solution adopted by the utility model to solve its technical problems is as follows:

[0006] A packaging device for semiconductor devices, including a workbench, an adjustment component is arranged on the workbench, and a welding head is installed on the adjustment component. It is characterized in that: a positioning frame is fixedly installed on the top of the workbench, an inlet and an outlet are opened on one side of the positioning frame, a side port is opened on the other side of the workbench, a plurality of strip plates are inserted into the positioning frame, a plurality of transverse grooves are opened on one side of the strip plate, a top groove and a bottom groove are respectively opened through the top and bottom of the transverse groove, a support plate is horizontally inserted into the transverse groove, a clamping plate is fixedly installed on the top of the support plate, the clamping plate is slidably installed in the top groove, a bottom plate is fixedly installed on the bottom of the support plate, the bottom plate is slidably installed in the bottom groove, and a first spring is fixedly installed between one side of the bottom plate and one side of the bottom groove. The provided inlet and outlet facilitate putting the strip plate with the unpackaged component into the positioning frame and taking it out. When the first spring resets, the bottom plate moves away from the strip plate, and when taking out the strip plate, the limit is released at the same time, which is convenient and fast.

[0007] Further, a handle is fixedly installed on one side of the strip plate, which is convenient to pull out the strip plate from the outlet through the handle.

[0008] Further, two cross cylinders are fixedly inserted on one side of the workbench, and inserting rods are inserted in both of the two cross cylinders. A second spring is sleeved on the inserting rod. The second spring is located inside the cross cylinder and presses the inserting rod inward. A connecting rod is fixedly installed between the two inserting rods, and a connecting frame is fixedly installed on the tops of the two inserting rods. The connecting frame is located inside the side opening and abuts against the strip plate closest to it. It can squeeze the strip plate to maintain stability and also ensure the existence of a position for placing the strip plate.

[0009] Further, a snap ring is provided at the end of the inserting rod located inside the cross cylinder, and the second spring is arranged between the snap ring and the cross cylinder.

[0010] Further, two guide plates are symmetrically and fixedly installed at the edge of the outlet, and the two guide plates are arranged in parallel. It is convenient for the strip plate to slide out smoothly and can conduct guiding.

[0011] Further, an extrusion plate and a cross plate are fixedly installed at the edge of the inlet. The extrusion plate and the cross plate are cooperating components to form an inlet channel. The extrusion plate is bent, and along the entering direction of the strip plate, the distance between the extrusion plate and the cross plate gradually decreases. It guides the sliding-in of the strip plate.

[0012] Further, the cross plate is arranged in an L-shaped structure and is used to abut against the strip plate and the supporting plate for extruding the strip plate. It can enable the supporting plate and the extrusion plate to be extruded into the transverse groove.

[0013] Beneficial effects:

[0014] (1) The provided inlet and outlet facilitate the insertion of the strip plate with unencapsulated components into the positioning frame and the removal thereof. When the first spring resets, the bottom plate moves away from the strip plate, and the limit is released when the strip plate is taken out, which is convenient and fast;

[0015] (2) By pulling out the strip plate through the handle, it is convenient to take out the encapsulated parts. Under the action of the second spring, multiple strip plates can be pushed and squeezed. The strip plate is inserted between the extrusion plate and the cross plate, and the supporting plate contacts the extrusion plate and shrinks into the transverse groove. The clamping plate can fix the parts to be encapsulated, and the connecting frame can push the strip plate to reserve a position for the strip plate to be added. After the new strip plate with encapsulated parts contacts the connecting frame, the connecting rod can be manually pulled, and the strip plate can be inserted into the positioning frame to be flush with the previous multiple strip plates. After releasing the connecting rod, the connecting frame keeps multiple strip plates stable, facilitating the welding operation;

[0016] (3) The extrusion plate and the cross plate are used for guiding the sliding-in of the strip plate on the one hand and extruding the supporting plate of the strip plate on the other hand, so that the supporting plate and the extrusion plate can be extruded into the transverse groove. Description of the drawings

[0017] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of a packaging device for semiconductor devices in an embodiment of the present utility model;

[0019] Figure 2 It is a schematic diagram of the mounting structure of the connecting frame of a packaging device for semiconductor devices in an embodiment of the present utility model;

[0020] Figure 3 It is a schematic diagram of the side view sectional structure of the strip board of a packaging device for semiconductor devices in an embodiment of the present utility model.

[0021] Explanation of reference numerals: 1, workbench; 2, positioning frame; 3, strip board; 4, horizontal cylinder; 11, adjusting assembly; 21, inlet; 22, outlet; 23, side port; 24, guide plate; 25, extrusion plate; 26, cross plate; 31, support plate; 32, clamping plate; 33, bottom plate; 34, horizontal groove; 35, top groove; 36, bottom groove; 37, first spring; 38, handle; 41, insertion rod; 42, second spring; 43, connecting rod; 44, connecting frame. Detailed implementation manners

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. The description of at least one exemplary embodiment is actually only illustrative and in no way limits the present utility model and its application or use. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0023] It should be noted that the terms used here are only for describing the specific implementation manners and are not intended to limit the exemplary implementation manners according to the present application. As used here, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "include" and / or "comprise" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0024] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that for the sake of convenience in description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the description. In all the examples shown and discussed here, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof in subsequent drawings is not necessary.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. are generally based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description. Without contrary statements, these orientation terms do not indicate and imply that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the protection scope of the present invention; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0026] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above-mentioned", etc. can be used here to describe the spatial positional relationships of one device or feature to other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0027] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without otherwise stating, the above terms have no special meanings. Therefore, they should not be construed as limiting the protection scope of the present invention.

[0028] Such asFigures 1 to 3 , the present utility model provides a packaging device for semiconductor devices, including a workbench 1, on which an adjustment component 11 is provided, a welding head is installed on the adjustment component 11, a positioning frame 2 is fixedly installed on the top of the workbench 1, an inlet 21 and an outlet 22 are opened on one side of the positioning frame 2, a side port 23 is opened on the other side of the workbench 1, a plurality of strip plates 3 are inserted into the positioning frame 2, a plurality of transverse grooves 34 are opened on one side of the strip plate 3, a top groove 35 and a bottom groove 36 are respectively opened through the top and bottom of the transverse groove 34, a support plate 31 is transversely inserted into the transverse groove 34, a clamping plate 32 is fixedly installed on the top of the support plate 31, the clamping plate 32 is slidably installed in the top groove 35, a bottom plate 33 is fixedly installed on the bottom of the support plate 31, the bottom plate 33 is slidably installed in the bottom groove 36, and a first spring 37 is fixedly installed between one side of the bottom plate 33 and one side of the bottom groove 36.

[0029] As Figure 1 , a handle 38 is fixedly installed on one side of the strip plate 3, which is convenient to pull out the strip plate 3 from the outlet 22 through the handle 38. Two guiding plates 24 are symmetrically and fixedly installed at the edge of the outlet 22, and the two guiding plates 24 are arranged in parallel.

[0030] An extrusion plate 25 and a transverse plate 26 are fixedly installed at the edge of the inlet 21. The extrusion plate 25 and the transverse plate 26 are cooperating components to form an inlet channel. The extrusion plate 25 is bent, and along the entering direction of the strip plate 3, the distance between the extrusion plate 25 and the transverse plate 26 gradually decreases.

[0031] The transverse plate 26 is arranged in an L-shaped structure for abutting against the strip plate 3 and extruding the support plate 31 of the strip plate 3.

[0032] As Figure 1 and Figure 2 shown, two transverse cylinders 4 are fixedly inserted on one side of the workbench 1, and a plug rod 41 is inserted into each of the two transverse cylinders 4. A second spring 42 is sleeved on the plug rod 41. The second spring 42 is located in the transverse cylinder 4 and presses the plug rod 41 inward. A connecting rod 43 is fixedly installed between the two plug rods 41. A connecting frame 44 is fixedly installed at the top of the two plug rods 41. The connecting frame 44 is located in the side port 23 and abuts against the strip plate 3 closest to it.

[0033] A clamping ring is provided at the end of the plug rod 41 located inside the transverse cylinder 4, and the second spring 42 is arranged between the clamping ring and the transverse cylinder 4.

[0034] The standard parts used in the present utility model can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding in the existing technology. The machines, parts, and equipment all adopt conventional models in the existing technology. In addition, the circuit connection adopts the conventional connection method in the existing technology, which will not be elaborated here.

[0035] The implementation principle of a packaging device for semiconductor devices of the present utility model is as follows: Place the component to be packaged into the top groove 35. Push the strip plate 3 into the positioning frame 2 from the inlet, that is, the strip plate 3 is inserted between the extrusion plate 25 and the cross plate 26. The support plate 31 contacts the extrusion plate 25 and retracts into the transverse groove 34. The clamping plate 32 can fix the component to be packaged. The bottom plate 33 can further compress the first spring 37. A plurality of strip plates 3 located in the positioning frame 2 are pushed and squeezed by the second spring 42. The connecting frame 44 can push the strip plate 3 to reserve the position for the strip plate 3 to be added. After the new strip plate 3 with the component to be packaged contacts the connecting frame 44, the connecting rod 43 can be manually pulled, and the other hand can also replace the connecting rod 42 to hold the strip plates 3 in the positioning frame 2 to prevent the first spring 37 in these strip plates 3 from rebounding; the strip plate 3 can be inserted into the positioning frame 2 to be flush with the previous plurality of strip plates 3. After releasing the connecting rod 43, the connecting frame 44 keeps the plurality of strip plates 3 stable, which is convenient for stable placement and facilitates the welding process. By adjusting the horizontal and vertical movement of the welding head on the adjusting component 11, the component to be packaged on the strip plate 3 located between the two guide plates 24 can be packaged. After the packaging is completed, the strip plate 3 is pulled out through the handle 38, and the packaged component is taken out.

[0036] The above is only the preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. A packaging device for semiconductor devices, comprising a workbench (1), an adjustment assembly (11) is arranged on the workbench (1), and a soldering head is installed on the adjustment assembly (11), characterized in that: A positioning frame (2) is fixedly installed on the top of the workbench (1). An inlet (21) and an outlet (22) are formed on one side of the positioning frame (2), and a side opening (23) is formed on the other side of the workbench (1). A plurality of strip plates (3) are inserted into the positioning frame (2). A plurality of transverse grooves (34) are formed on one side of the strip plate (3). Top grooves (35) and bottom grooves (36) are respectively formed through the top and bottom of the transverse groove (34). A support plate (31) is horizontally inserted into the transverse groove (34). A clamping plate (32) is fixedly installed on the top of the support plate (31). The clamping plate (32) is slidably installed in the top groove (35). A bottom plate (33) is fixedly installed on the bottom of the support plate (31). The bottom plate (33) is slidably installed in the bottom groove (36). A first spring (37) is fixedly installed between one side of the bottom plate (33) and one side of the bottom groove (36).

2. The packaging device for a semiconductor device according to claim 1, characterized in that: A handle (38) is fixedly installed on one side of the strip plate (3).

3. The encapsulation device for a semiconductor device according to claim 1, characterized in that: Two transverse cylinders (4) are fixedly inserted on one side of the workbench (1). A plug rod (41) is inserted into each of the two transverse cylinders (4). A second spring (42) is sleeved on the plug rod (41). The second spring (42) is located inside the transverse cylinder (4) and presses the plug rod (41) inward. A connecting rod (43) is fixedly installed between the two plug rods (41). A connecting frame (44) is fixedly installed on the tops of the two plug rods (41). The connecting frame (44) is located inside the side opening (23) and abuts against the strip plate (3) closest to it.

4. A packaging device for semiconductor devices according to claim 3, characterized in that: A clamping ring is provided at the end of the plug rod (41) inside the transverse cylinder (4). The second spring (42) is arranged between the clamping ring and the transverse cylinder (4).

5. A packaging device for a semiconductor device according to claim 1, characterized in that: Two guide plates (24) are symmetrically and fixedly installed at the edge of the outlet (22), and the two guide plates (24) are arranged in parallel.

6. The encapsulation device for a semiconductor device according to claim 1, characterized in that: An extrusion plate (25) and a transverse plate (26) are fixedly installed at the edge of the inlet (21). The extrusion plate (25) and the transverse plate (26) are cooperating components to form an inlet channel. The extrusion plate (25) is bent, and the distance between the extrusion plate (25) and the transverse plate (26) gradually decreases along the entering direction of the strip plate (3).

7. The encapsulation device for a semiconductor device according to claim 6, characterized in that: The transverse plate (26) is arranged in an L-shaped structure for abutting against the strip plate (3) and extruding the support plate (31) of the strip plate (3).

Images