Vapor chamber upper cover with radiating fins
By covering the temperature uniform plate with integrated molded fins and capillary structures to form an integrated condensation zone, the heat dissipation and temperature uniformity problems of high-power wafers are solved, and efficient heat exchange and heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202421999042.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-08-16
AI Technical Summary
The welding method of the existing heat dissipation fins of the temperature equalization plate cannot effectively cope with the heat dissipation needs of high-power wafers, resulting in excessive temperature and even burning.
A plurality of fins and porous capillary structures are integrally formed on the upper cover of the temperature uniform plate to form an integrated condensation zone. Combined with air-cooled or liquid-cooled heat dissipation methods, it is directly connected to the chip hotspots for heat exchange.
It improves heat dissipation efficiency and temperature uniformity, can effectively deal with the heat dissipation needs of high-power chips, and avoids the problem of excessive temperature.
Smart Images
Figure CN223156022U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to a component for manufacturing a heat pipe element, and particularly to a heat pipe condensation area upper cover with integrally formed fins on the upper cover. Background Art
[0002] The conventional heat pipe element is manufactured by hermetically sealing a flat metal upper cover and a metal lower plate to form a receiving space. A porous capillary structure and air channels are arranged in the receiving space, and a negative pressure state is formed. The working fluid undergoes phase change and two-phase flow circulation between the porous capillary structure and the air channels. Generally, the function of a heat pipe is to serve as an element for efficient heat conduction. If the heat dissipation function is to be achieved, a heat dissipation fin needs to be additionally welded to the condensation end of the flat upper cover of the heat pipe. After the heat energy at the heat absorption end is conducted to the condensation end, the heat is dissipated by the heat dissipation fin.
[0003] Please refer to Figure 1 , Figure 1 which shows a conventional heat pipe E. As Figure 1 shown, when the conventional heat pipe E is applied to the heat dissipation of a computing power chip, the condensation area 80 of the heat pipe E is usually located on the left and right sides (as shown by the wire frame in Figure 1 ). The heat dissipation fin is welded to the upper surface of the upper cover of the condensation area, and then the heat dissipation fin is blown by a fan for forced air cooling. However, as the thermal design power of the computing power chip increases steadily, the air cooling method of the conventional heat pipe E and the welded heat dissipation fin cannot quickly dissipate heat from the high-power chip, resulting in the overheating of the high-power chip and even burnout.
[0004] Therefore, combining the liquid cooling method of the heat pipe element will become a better choice. In order to solve the heat dissipation and heat removal challenges brought about by the gradual increase in the current chip power and power density, it is necessary to provide a more efficient solution that can simultaneously solve the heat dissipation and temperature uniformity problems of high-power chips. Summary of the Utility Model
[0005] In view of this, the purpose of the present utility model is to provide a heat pipe upper cover with heat dissipation fins, which has a simple structure, is convenient for operation and maintenance, and can effectively solve the heat dissipation and temperature uniformity problems of high-power chips.
[0006] To achieve the above purpose, the present utility model discloses a heat pipe upper cover with heat dissipation fins, which is applied to a heat pipe and is characterized by comprising:
[0007] An upper cover serving as a condensation area of the heat pipe, the upper cover having an upper cover upper surface and an upper cover lower surface;
[0008] A plurality of fins, spaced apart and arranged on the upper cover upper surface; and
[0009] A multi-porous capillary structure is continuously provided on the lower surface of the upper cover.
[0010] Wherein, the upper cover further has a convex tube body, the convex tube body has a tube cavity, is arranged on the upper surface of the upper cover, and these fins are arranged around the convex tube body.
[0011] Wherein, these fins are arranged at intervals on the upper surface of the upper cover and form a plurality of microchannels, and the channel width of these microchannels is less than or equal to 1 mm.
[0012] Wherein, the convex tube body and these fins are formed on the upper surface of the upper cover in an integrally formed manner.
[0013] Wherein, the upper cover further has an opening, and the convex tube body is arranged on the upper surface of the upper cover by welding and is located above the opening.
[0014] Wherein, the heat pipe plate includes a lower plate relative to the upper cover of the heat pipe plate, and when the upper cover of the heat pipe plate is coupled to the lower plate, a sealed air cavity is formed.
[0015] Wherein, the lower plate contacts a wafer, and the convex tube body corresponds to the hot spot position of the wafer contacted by the lower plate.
[0016] Wherein, the upper cover further has a plurality of convex tube bodies, and the lower plate contacts a plurality of wafers corresponding to these convex tube bodies respectively.
[0017] Wherein, the upper cover of the heat pipe plate further has an upper cover cavity, so that when the upper cover of the heat pipe plate is coupled to the lower plate, the tube cavity and the upper cover cavity form the sealed air cavity.
[0018] Wherein, the lower plate has a lower plate cavity, so that when the upper cover of the heat pipe plate is coupled to the lower plate, the tube cavity and the lower plate cavity form the sealed air cavity.
[0019] In summary, when the upper cover of the heat pipe plate with heat dissipation fins of the present utility model is applied to the production of heat pipe plate components, since the fins are formed on the upper cover, the heat pipe plate components can have their own heat dissipation function and thus increase the heat dissipation efficiency. Further, the present utility model provides other aspects, for example, the upper cover further includes a convex tube body, so that in actual application of the heat pipe plate, whether it is the air-cooling heat dissipation method using a fan or the liquid-cooling heat dissipation method using a coolant, the upper cover of the heat pipe plate with heat dissipation fins of the present utility model can effectively be used as a condensation area to quickly perform heat exchange and discharge the heat energy. In addition, since the position of the convex tube body is relatively perpendicular to the wafer, when the coolant flows in, it can directly dissipate heat from the place with the highest temperature, and let the coolant take away the heat energy from the radiator to meet the efficient wafer heat dissipation and heat equalization solutions required for the development of high-power wafers. Description of the Drawings
[0020] Figure 1 Shows a conventional heat pipe.
[0021] Figure 2 Shows a sectional view of a heat pipe upper cover with heat dissipation fins of a specific embodiment of the present invention applied to a heat pipe.
[0022] Figure 3 Shows a sectional view of a heat pipe upper cover with heat dissipation fins of another specific embodiment of the present invention applied to a heat pipe.
[0023] Figure 4 Shows a sectional view of a heat pipe upper cover with heat dissipation fins of another specific embodiment of the present invention applied to a heat pipe.
[0024] Figure 5 Shows according to Figure 4 a schematic diagram of the upper cover of a heat pipe upper cover with heat dissipation fins.
[0025] Figure 6 Shows a sectional view of a heat pipe upper cover with heat dissipation fins of another specific embodiment of the present invention applied to a heat pipe.
[0026] Figure 7 Shows a sectional view of a heat pipe upper cover with heat dissipation fins of another specific embodiment of the present invention applied to a heat pipe. Detailed Description of the Preferred Embodiments
[0027] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. Also, the elements in the drawings are only used to express their relative positions and are not drawn to their actual proportions. The step numbers of the present invention are only used to distinguish different steps and do not represent the order of the steps. This is stated first for clarification.
[0028] Please refer to Figure 2 , Figure 2 shows the fabrication of a heat pipe upper cover 1 with heat dissipation fins of a specific embodiment of the present invention applied to a heat pipe F element. As Figure 2As shown, the top cover 1 of the heat pipe with heat dissipation fins in this specific embodiment includes a top cover 10, a plurality of fins 11, and a porous capillary structure 12. Among them, the top cover 10 has an upper surface 101 of the top cover and a lower surface 102 of the top cover, and a plurality of fins 11 are sequentially arranged at intervals on the upper surface 101 of the top cover. The porous capillary structure 12 is continuously arranged on the lower surface 102 of the top cover. Among them, the top cover 10 serves as the condensation area 80 of the heat pipe F. The bottom plate 13 of the heat pipe serves as the heat absorption area. After the working fluid evaporates and undergoes a phase change on the surface of the porous capillary structure 12 on the upper surface 131 of the bottom plate of the bottom plate 13 of the heat pipe, it directly condenses on the surface of the porous capillary structure 12 on the lower surface of the top cover of the top cover 10. The plurality of fins 11 on the top cover 10 can efficiently exchange heat with cold air or coolant, and at the same time, also enhance the efficiency of the two-phase flow circulation in the heat pipe, improving the heat dissipation effect of the wafer 90 and the hot spot 901.
[0029] In this specific embodiment, the heat pipe F includes a bottom plate 13 opposite to the top cover 10 of the heat pipe. The porous capillary structure 12 is arranged on the lower surface 102 of the top cover 10 and the upper surface 131 of the bottom plate of the bottom plate 13, and the outer surface of the support column 14 will also have a porous capillary structure. The support column is arranged between the top cover 10 and the bottom plate 13. When the top cover 10 is coupled with the bottom plate 13, the support column 14 with a porous capillary structure will be located between the top cover 10 and the bottom plate 13, and further, the support column 14 with a porous capillary structure will form a continuous capillary structure with the porous capillary structure 12 on the lower surface 102 of the top cover 10 and the upper surface 131 of the bottom plate of the bottom plate 13. Then, the working fluid is injected into the cavity between the top cover 10 and the bottom plate and evacuated. After evacuation, a sealed air cavity 15 is formed. In practice, the porous capillary structure can be formed by sintering copper powder or formed by a slurry through drying, cracking, and sintering processes; the working fluid can be water or a two-phase coolant, such as R134a. In another embodiment, the top cover further has a cavity in the top cover. When the top cover is coupled to the bottom plate, the cavity in the top cover forms a sealed air cavity; in another embodiment, the top cover further includes a tube body, and the tube body has a cavity in the tube body. When the top cover is coupled to the bottom plate, the cavity in the top cover, the cavity in the tube body, and form a sealed air cavity; in yet another embodiment, the top cover has both a cavity in the tube body and a cavity in the top cover, and the bottom plate has a cavity in the bottom plate. When the top cover is coupled to the bottom plate, the cavity in the tube body, the cavity in the top cover, and the cavity in the bottom plate form a sealed air cavity.
[0030] In practical applications, the lower plate of the heat pipe F is used to contact the wafer 90. The lower plate 13, as the heat absorption area, preferentially absorbs the thermal energy of the wafer 90. At this time, the working fluid in the sealed air cavity 15 of the heat pipe F absorbs the thermal energy, undergoes a phase change from the liquid working fluid to the gaseous working fluid, and flows into the condensation area 80. Since the upper cover 10 is provided with fins 11, the fins 11 can take away the thermal energy by an external fan or the coolant of liquid cooling. Due to the temperature reduction, the cooled working fluid will undergo a phase change again and turn back into the liquid working fluid, and finally flow back to the heat absorption area of the lower plate along the porous capillary structure 12 and the support column 14, thus repeating the two-phase flow cycle inside the heat pipe F.
[0031] The present utility model provides other embodiments of the upper cover of the heat pipe with heat dissipation fins. Please refer to Figure 3 , Figure 3 which shows a sectional view of the upper cover 2 of the heat pipe with heat dissipation fins of another specific embodiment of the present utility model applied to the heat pipe F. As Figure 3 shown, the difference between the upper cover 2 of the heat pipe with heat dissipation fins of this specific embodiment and the above embodiment is that the upper cover 10 of the upper cover 2 of the heat pipe with heat dissipation fins of this specific embodiment is a flat plate structure. The other devices of this specific embodiment are substantially the same as the corresponding devices of the previous specific embodiment, so they will not be described in detail here.
[0032] Furthermore, the present utility model provides other embodiments of the upper cover of the heat pipe with heat dissipation fins. Please refer to Figure 4 and Figure 5 , Figure 4 which shows a sectional view of the upper cover 3 of the heat pipe with heat dissipation fins of another specific embodiment of the present utility model applied to the heat pipe F, Figure 5 and Figure 4 shows a schematic diagram of the upper cover 10 of the upper cover 3 of the heat pipe with heat dissipation fins according to Figure 4 and Figure 5 shown. As and
[0033] shown, the upper cover 10 of the upper cover 3 of the heat pipe with heat dissipation fins of this specific embodiment further has a raised tube body 103 disposed on the upper surface 101 of the upper cover, and a plurality of fins 11 are arranged around the raised tube body 103, wherein the raised tube body 103 has a tube cavity 1031. The heat pipe F includes a lower plate 13 opposite to the upper cover of the heat pipe. When the upper cover 3 of the heat pipe with heat dissipation fins is coupled to the lower plate 13, a sealed air cavity 15 is formed.
[0033] In practice, the raised tube body 103 and the fins 11 of the upper cover 3 of the heat pipe with heat dissipation fins in this specific embodiment can use CNC machining and the straddle milling process to mill out straddle fins, so that the raised tube body 103 and the fins 11 are formed on the upper surface 101 of the upper cover 10 in an integrally formed manner. Due to the integrally formed relationship, the thermal resistance between the fins and the upper cover can be reduced, thereby improving the heat dissipation efficiency. In another embodiment, the straddle fins can be milled out by the straddle milling process, and then the fins are coupled to the upper cover with the raised tube body as a whole through welding. In another embodiment, the upper cover has an opening, and the size of the opening is sufficient to accommodate the raised tube body, and the raised tube body is arranged on the upper surface of the upper cover by welding and is located on the opening.
[0034] Please continue to refer to Figure 4 and Figure 5 , in practical applications, the lower plate 13 is used to contact the chip 90, and it is worth noting that the position where the raised tube body 103 is arranged corresponds to the hot spot 901 position of the chip 90 contacted by the lower plate 13, that is to say, the raised tube body 103 is arranged corresponding to the place where the chip temperature is the highest. When the heat pipe F dissipates heat, the lower plate 13 serves as the heat absorption area and preferentially absorbs the heat energy of the chip 90. At this time, the working fluid in the sealed air cavity 15 of the heat pipe F absorbs the heat energy, undergoes a phase change from the liquid working fluid to the gaseous working fluid and flows to the condensation area 80. At this time, since the upper cover 10 further includes the raised tube body 103, both the fins 11 and the raised tube body 103 can be used as the condensation area 80 for heat dissipation. Due to the temperature drop, the cooled working fluid will undergo a phase change back to the liquid working fluid, and finally flow back to the heat absorption area of the lower plate along the porous capillary structure 12 and the support column 14, thereby repeating the two-phase flow cycle inside the heat pipe F.
[0035] The embodiments of the utility model can also be applied to liquid cooling. After the lower plate 13 absorbs the heat energy of the chip 90, the working fluid in the closed air cavity 15 absorbs the heat energy and changes phase from the liquid working fluid to the gaseous working fluid. At this time, since the coolant can flow directly through the protruding tube body 103, the coolant can quickly take away the heat energy on the protruding tube body through heat exchange. Furthermore, the gap between each fin 11 forms a microchannel 111, which can also allow the coolant to flow more evenly, and the coolant can further exchange heat with each fin 11 during the flow process to take away the heat energy again. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants, but is not limited to this. The coolant can also be other fluids that absorb heat and take away heat energy. Please note that considering the heat exchange area of the microchannel and the flow rate of the coolant, the channel width d of the microchannel 111 is less than or equal to 1 mm. In practice, the channel width of the microchannel, the thickness of the fins, the size of the microchannel and the number of outlets are not limited thereto and can be adjusted according to the design. Other devices of this embodiment are substantially the same as those of the above embodiments, so they are not described here in detail.
[0036] Furthermore, in view of the increasingly high power chip specifications, in addition to the single chip specifications, there will also be a design for multiple chips at the same time. In another embodiment, the upper cover has a plurality of protruding tubes, and each protruding tube is correspondingly arranged on each chip, and the lower plate is used to contact the multiple chips corresponding to the protruding tubes. In another embodiment, the height of the protruding tube can correspond to chips of different powers. Please refer to Figure 6 , Figure 6 The cross-sectional view of another specific embodiment of the utility model showing a temperature averaging plate upper cover 4 with heat dissipation fins applied to a temperature averaging plate F. Figure 6 As shown, the number of raised tubes on the upper cover 4 of the temperature equalizing plate with heat dissipation fins of this specific embodiment is 3, and they are raised tubes 104, 105 and 106 respectively. In practice, the height of the raised tube can correspond to the power of the chip. For example, the number of chips in this specific embodiment is 3, and the power sizes are respectively: heat source 91 is greater than heat source 92 is greater than heat source 93. Among them, the raised tube 104 is correspondingly arranged at a position relative to the heat source 91; the raised tube 105 is correspondingly arranged at a position relative to the heat source 92; and the raised tube 106 is correspondingly arranged at a position relative to the heat source 93. Therefore, the tube height of the raised tube 104 will be greater than the tube height of the raised tube 105 and greater than the tube height of the raised tube 106, so as to dissipate heat for heat sources of different powers. The other devices of this specific embodiment are substantially the same as the corresponding devices of the aforementioned specific embodiments, so they will not be repeated here. In practice, the number and location of the protruding tubes are not limited thereto and can be designed according to the actual size, quantity and specifications of the chip.
[0037] In practice, the lower plate of the heat pipe can also be designed according to requirements. For example, when there are other electronic components with a height higher than that of the chip near the chip, the lower plate can further include a boss structure to avoid the position of the electronic components with a higher height. Please refer to Figure 7 , Figure 7 shows a cross-sectional view of the upper cover 5 of the heat pipe with heat dissipation fins of another specific embodiment of the present invention applied to the heat pipe F. As Figure 4 shown, since there are electronic components with a height higher than that of the chip 90 near the chip 90, at this time, the lower plate 13 of this specific embodiment can further include a boss structure to avoid the position of the electronic components with a higher height. The other devices of this specific embodiment are substantially the same as the corresponding devices in the foregoing specific embodiment, so they will not be described in detail here.
[0038] In summary, when the upper cover of the heat pipe with heat dissipation fins of the present invention is applied to the production of heat pipe components, since the fins are formed on the upper cover, the heat pipe components themselves can have a heat dissipation function and thus increase the heat dissipation efficiency. Further, the present invention provides other aspects, for example, the upper cover further includes a raised tube body, so that in actual application of the heat pipe, whether it is the air-cooling heat dissipation method using a fan or the liquid-cooling heat dissipation method using a coolant, the upper cover of the heat pipe with heat dissipation fins of the present invention can effectively be used as a condensation area to quickly perform heat exchange and discharge the heat energy. In addition, since the position where the raised tube body is provided is relatively perpendicular to the chip, when the coolant flows in, it can directly dissipate heat from the place with the highest temperature, and let the coolant take the heat energy away from the radiator to meet the efficient chip heat dissipation and heat equalization solutions required for the development of high-power chips.
[0039] From the detailed description of the above preferred specific embodiments, it is hoped that the features and spirit of the present invention can be more clearly described, rather than limiting the scope of the present invention by the above-disclosed preferred specific embodiments. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent application of the present invention. Therefore, the scope of the patent application of the present invention should be interpreted as widely as possible according to the above description, so as to cover all possible changes and equivalent arrangements.
Claims
1. A top cover of a heat pipe with heat dissipation fins, applied to a heat pipe, characterized in that Comprising: An upper cover serving as a condensation area of the heat pipe, the upper cover having an upper cover upper surface and an upper cover lower surface; A plurality of fins, spaced apart and disposed on the upper cover upper surface; And A porous capillary structure, continuously disposed on the upper cover lower surface.
2. The top cover of the heat pipe with heat dissipation fins as described in claim 1, characterized in that The upper cover further has a raised tube body, the raised tube body having a tube body cavity, disposed on the upper cover upper surface, and the fins are disposed around the raised tube body.
3. The top cover of the heat pipe with heat dissipation fins according to claim 1, characterized in that, The fins are spaced apart and disposed on the upper cover upper surface to form a plurality of microchannels, and the flow channel width of the microchannels is less than or equal to 1 mm.
4. The upper cover of the heat pipe with heat dissipation fins according to claim 2, characterized in that, The raised tube body and the fins are formed on the upper cover upper surface in an integrally formed manner.
5. The upper cover of the heat pipe with heat dissipation fins according to claim 2, characterized in that, The upper cover further has an opening, and the raised tube body is disposed on the upper cover upper surface by welding and is located above the opening.
6. The upper cover of the heat pipe with heat dissipation fins according to claim 2, characterized in that The heat pipe comprises a lower plate relative to the upper cover of the heat pipe, and when the upper cover of the heat pipe is coupled to the lower plate, a sealed air cavity is formed.
7. The upper cover of the heat pipe with heat dissipation fins according to claim 6, characterized in that, The lower plate contacts a wafer, and the raised tube body corresponds to the hot spot position of the wafer contacted by the lower plate.
8. The top cover of the heat pipe with heat dissipation fins as described in claim 7, characterized in that, The upper cover further has a plurality of raised tube bodies, and the lower plate contacts a plurality of wafers respectively corresponding to the raised tube bodies.
9. The upper cover of the heat pipe with heat dissipation fins according to claim 6, characterized in that, The upper cover of the heat pipe further has an upper cover cavity, so that when the upper cover of the heat pipe is coupled to the lower plate, the tube body cavity and the upper cover cavity form the sealed air cavity.
10. The top cover of the heat pipe with heat dissipation fins as described in claim 6, characterized in that, The lower plate has a lower plate cavity, so that when the upper cover of the heat pipe is coupled to the lower plate, the tube body cavity and the lower plate cavity form the sealed air cavity.