Circuit board, temperature measurement system and atomization device

Abstract

The embodiment of the utility model relates to the technical field of temperature measurement, and discloses a circuit board, a temperature measurement system and an atomization device, the circuit board comprises a substrate, a temperature measurement circuit, a welding part and a temperature measurement chip, the surface of the substrate comprises a copper foil area and an empty foil area, and at least part of the copper foil area is paved with copper foil; the temperature measuring circuit is arranged in the copper foil area; the welding part is arranged in the empty foil area, the welding part is electrically connected with the temperature measuring circuit, the welding part is configured to be welded with an electrode of the thermocouple, the thermocouple is provided with a hot end and a cold end, and the hot end is used for being in contact with a to-be-measured object; the temperature measuring chip is electrically connected with the temperature measuring circuit, and the temperature measuring chip is configured to obtain the temperature of the cold end. Through the above mode, the embodiment of the utility model can reduce the influence of the heat generated by the circuit board on the thermocouple, thereby improving the accuracy of the temperature measured by the circuit board and the thermocouple.

Description

Technical Field

[0001] The embodiments of the present utility model relate to the technical field of temperature measurement, and particularly to a temperature measurement circuit board, a temperature measurement system and an atomization device. Background Art

[0002] In the prior art, a circuit board is generally formed by laying a layer of copper on one surface of a substrate and then etching part of the copper through a solution, so as to form the required traces on the substrate, and thus obtain the circuit board. For a circuit board that measures temperature through a thermocouple, since the copper on the circuit board can conduct heat to the thermocouple, the temperatures measured by the thermocouple and the circuit board are not accurate enough. Summary of the Utility Model

[0003] The main technical problem to be solved by the embodiments of the present utility model is to provide a circuit board, a temperature measurement system and an atomization device, which can reduce the influence of the heat generated by the circuit board on the thermocouple, thereby improving the accuracy of the temperatures measured by the circuit board and the thermocouple.

[0004] To solve the above technical problem, one technical solution adopted by the embodiments of the present utility model is: to provide a circuit board, including a substrate, a temperature measurement circuit, a welding part and a temperature measurement chip. The surface of the substrate includes a copper foil area and a non - copper foil area, and at least part of the copper foil area is provided with copper foil; the temperature measurement circuit is arranged in the copper foil area; the welding part is arranged in the non - copper foil area, the welding part is electrically connected to the temperature measurement circuit, and the welding part is configured to be welded to the electrodes of the thermocouple. The thermocouple has a hot end and a cold end, and the hot end is used to contact the object to be measured; the temperature measurement chip is electrically connected to the temperature measurement circuit, and the temperature measurement chip is configured to obtain the temperature of the cold end.

[0005] In some embodiments, the welding part includes a first welding pad and a second welding pad. The first welding pad and the second welding pad are both electrically connected to the temperature measurement circuit. One of the first welding pad and the second welding pad is used to be electrically connected to the positive electrode of the thermocouple, and the other is used to be electrically connected to the negative electrode of the thermocouple.

[0006] In some embodiments, the temperature measurement chip is arranged at intervals between the first welding pad and the second welding pad.

[0007] In some embodiments, there are intervals between the first welding pad and the second welding pad and the copper foil area.

[0008] In some embodiments, the minimum distance between the first welding pad and the second welding pad and the copper foil area is greater than or equal to 1 mm.

[0009] In some embodiments, the temperature measurement chip is arranged in the non - copper foil area.

[0010] In some embodiments, the temperature measurement chip is disposed at an interval from the copper foil area.

[0011] In some embodiments, the minimum distance between the temperature measurement chip and the copper foil area is greater than or equal to 1 mm.

[0012] To solve the above technical problem, another technical solution adopted in the embodiments of the present invention is: to provide a temperature measurement system, including a thermocouple and the above-mentioned circuit board, and the thermocouple is welded to the welding part to form an electrical connection.

[0013] To solve the above technical problem, yet another technical solution adopted in the embodiments of the present invention is: to provide an atomizing device, including a heating component for heating an aerosol generating substrate to generate smoke and the above-mentioned temperature measurement system, and one end of the thermocouple far from the welding part is connected to the heating component, so that the temperature measurement system can measure the temperature of the heating component.

[0014] The beneficial effects of the embodiments of the present invention are as follows: Different from the prior art, in the embodiments of the present invention, by providing a copper foil area and an empty foil area on the surface of the substrate, the temperature measurement circuit is arranged in the copper foil area, the welding part is arranged in the empty foil area, the welding part is electrically connected to the temperature measurement circuit, the welding part is configured to be welded to the electrode of the thermocouple, and the thermocouple has a hot end and a cold end, and the hot end is used to contact the object to be measured. Since the welding part is arranged in the empty foil area, the heat of the circuit board itself can be reduced from being transmitted to the welding part through the copper foil on the surface of the circuit board, thereby reducing the influence of the heat of the circuit board itself on the temperature of the object to be measured measured by the thermocouple, which is beneficial to improving the measurement accuracy. Description of the Drawings

[0015] To more clearly illustrate the technical solutions in the specific embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally denoted by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to actual scale.

[0016] Figure 1 is a schematic structural diagram of the temperature measurement system provided in the embodiments of the present invention;

[0017] Figure 2 is a schematic structural diagram of the substrate provided in the embodiments of the present invention;

[0018] Figure 3 is a schematic structural diagram of the circuit board provided in the embodiments of the present invention.

[0019] Reference Numerals in the Drawings

[0020] Detailed Embodiments

[0021] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "vertical", "horizontal", etc. used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0023] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] In the prior art, a layer of copper is coated on one surface of a substrate, and then part of the copper is etched away according to the routing design of the circuit board, and various electronic components are soldered on the substrate so that the required electrical connection relationship is established between the electronic components, thereby forming a circuit board with specific functions.

[0025] For a circuit board that uses a thermocouple to measure the temperature of an object to be measured, the two electrodes of the thermocouple need to be welded to the circuit board. However, since the circuit board tends to generate a large amount of heat during operation, the heat is easily transferred to the thermocouple through the copper layer on the substrate, causing the thermocouple to absorb a large amount of heat that does not belong to the object to be measured, thereby causing the temperature measured by the circuit board and the thermocouple to be inaccurate.

[0026] To solve the above problems, the present application provides a circuit board, a temperature measurement system, and an atomization device. By arranging the welding part for welding with the thermocouple in the empty foil area, the heat around the thermocouple is reduced from being conducted to the thermocouple through the copper foil of the circuit board, thereby improving the accuracy of the temperature of the circuit board and the object to be measured by the thermocouple. The structure and function of the present application will be described in detail below.

[0027] The principle of the thermocouple for measuring temperature is as follows: A thermocouple generally has a hot end and a cold end. The hot end is used to contact the object to be measured, so as to absorb the heat of the object to be measured or transfer its own heat to the object to be measured, so that the temperature of the hot end is the same as that of the object to be measured. The cold end is also called the reference end, and its temperature is generally 0° or a certain constant temperature value. When there is a temperature difference between the hot end and the cold end, a thermoelectric potential will be generated, and the greater the temperature difference, the greater the thermoelectric potential. Therefore, the temperature difference between the hot end and the cold end can be determined by measuring the thermoelectric potential, so as to obtain the temperature of the hot end, and thus the temperature of the object to be measured can be obtained.

[0028] Please refer to Figure 1 and Figure 2 , Figure 1 shows the structure of the temperature measurement system, Figure 2 shows the structure of the substrate, Figure 2The dashed line in [it] indicates the demarcation line between the copper foil area and the empty foil area. The circuit board 1 includes a substrate 11, a welding part 12, a temperature measurement circuit 13, and a temperature measurement chip 14. The surface 111 of the substrate 11 includes a copper foil area 1111 and an empty foil area 1112. At least part of the copper foil area 1111 is covered with a copper foil 15. The temperature measurement circuit 13 is arranged in the copper foil area 1111, and the welding part 12 is arranged in the empty foil area 1112. Moreover, the welding part 12 and the copper foil area 1111 are spaced apart from each other to reduce the heat conduction from the temperature measurement circuit 13 to the welding part 12. The welding part 12 is electrically connected to the temperature measurement circuit 13 and is configured to be welded to the electrode of the thermocouple 2. The thermocouple 2 has a hot end 21 and a cold end 22. The hot end 21 is used to contact the object to be measured, and the cold end 22 is the end where the thermocouple 2 is connected to the welding part 12. The temperature measurement circuit 13 can measure the thermoelectric potential between the hot end 21 and the cold end 22, so as to obtain the temperature of the hot end 21 and further obtain the temperature of the object to be measured. The temperature measurement chip 14 is electrically connected to the temperature measurement circuit 13 and is configured to obtain the temperature of the cold end 22, so that when the temperature of the cold end 22 is unstable, a temperature compensation module (not shown in the figure) in the circuit board 1 compensates the temperature of the cold end 22, thereby improving the measurement stability. In this embodiment, by arranging the welding part 12 in the empty foil area 1112 and the temperature measurement circuit 13 in the copper foil area 1111, when the temperature measurement circuit 13 or other electronic components on the circuit board 1 generate heat during operation, the heat transfer from the copper foil 15 on the substrate 11 to the welding part 12 can be reduced, and further the influence of the heat generated by the circuit board 1 itself on the temperature of the cold end 22 of the thermocouple 2 can be reduced, thereby improving the stability of the temperature of the cold end 22 of the thermocouple 2, which is beneficial to improving the accuracy of the temperature of the object to be measured measured by the circuit board 1 and the thermocouple 2.

[0029] In some embodiments, as Figure 1 shown, the empty foil area 1112 means that no copper foil is provided around and at the bottom of the welding part 12, and only a very small amount of copper foil is retained to keep the welding part 12 and the temperature measurement circuit 13 in the copper foil area 111 electrically connected. Or, in some other embodiments, no copper foil is provided in the empty foil area 1112, and the welding part 12 and the temperature measurement circuit 13 in the copper foil area 111 are kept electrically connected by other means such as additional wires.

[0030] In some embodiments, the welding part 12 includes a first welding pad 121 and a second welding pad 122. Both the first welding pad 121 and the second welding pad 122 are electrically connected to the temperature measurement circuit 13. One of the first welding pad 121 and the second welding pad 122 is electrically connected to the positive electrode of the thermocouple 2, and the other is electrically connected to the negative electrode of the thermocouple 2, so as to realize the electrical connection between the temperature measurement circuit 13 and the thermocouple 2 and enable the thermocouple 2 to work properly.

[0031] In some embodiments, the temperature measurement chip 14 is disposed at intervals between the first welding pad 121 and the second welding pad 122. Since both the first welding pad 121 and the second welding pad 122 are connected to the cold end of the thermocouple 2, that is, the temperatures at the first welding pad 121 and the second welding pad 122 are the same as the temperature of the cold end 22 of the thermocouple 2. Therefore, in this embodiment, by disposing the temperature measurement chip 14 at intervals between the first welding pad 121 and the second welding pad 122, it is convenient for the temperature measurement chip 14 to detect the temperatures at the first welding pad 121 and the second welding pad 122 simultaneously, thereby facilitating the detection of the temperature of the cold end 22, and further contributing to improving the accuracy of the temperature measured by the thermocouple 2.

[0032] In some embodiments, please refer to Figure 3 , there are intervals between both the first welding pad 121 and the second welding pad 122 and the copper foil area 1111. In this embodiment, since the temperature measurement circuit 13 is disposed in the copper foil area 1111, the heat of the temperature measurement circuit 13 is easily transferred through the copper foil 15 laid on the copper foil area 1111. By making there be intervals between both the first welding pad 121 and the second welding pad 122 and the copper foil area 1111, the heat in the temperature measurement circuit 13 transferred to the first welding pad 121 and the second welding pad 122 through the copper foil 15 can be reduced, thereby reducing the influence on the temperature of the cold end 22, and further improving the accuracy of the temperature measured by the circuit board 1 and the thermocouple 2 for the object to be measured.

[0033] In some embodiments, the minimum distance between the first welding pad 121 and the second welding pad 122 and the copper foil area 1111 is D, and D≥1mm is satisfied. If the minimum distance D between the first welding pad 121 and the second welding pad 122 and the copper foil area 1111 is too small, the heat in the temperature measurement circuit 13 is easily transferred to the first welding pad 121 or the second welding pad 122, affecting the temperature of the cold end 22 of the thermocouple 2. Therefore, by making D≥1mm, the influence of the heat in the temperature measurement circuit 13 on the temperatures at the first welding pad 121 and the second welding pad 122 can be reduced.

[0034] Furthermore, the minimum distance D between the first welding pad 121 and the second welding pad 122 and the copper foil area 1111 satisfies: 1mm≤D≤3mm. If the minimum distance D between the first welding pad 121 and the second welding pad 122 and the copper foil area 1111 is too small, the heat in the temperature measurement circuit 13 is easily transferred to the first welding pad 121 or the second welding pad 122, affecting the temperature of the cold end 22 of the thermocouple 2; if D is too large, it will cause an increase in the area of the circuit board 1. Therefore, by selecting D to satisfy: 1mm≤D≤3mm, the size of the circuit board 1 and the influence of the temperature measurement circuit 13 on the cold end 22 can be taken into account.

[0035] The location of the temperature measurement chip 14 also affects the accuracy of the temperature of the cold end 22 obtained thereby. If the temperature at the location where the temperature measurement chip 14 is located is relatively high, it will cause the temperature of the temperature measurement chip 14 itself to be relatively high, affecting the temperature value measured by the temperature measurement chip 14. In some embodiments, the temperature measurement chip 14 is disposed in the empty foil area 1112. By disposing the temperature measurement chip 14 in the empty foil area 1112, heat transfer in the temperature measurement circuit 13 to the temperature measurement chip 14 can be reduced, such that the temperature change at the location where the temperature measurement chip 14 is located is relatively small, which is conducive to improving the accuracy of the temperature of the cold end 22 measured by the temperature measurement chip 14.

[0036] In some embodiments, referring to Figure 3 , the temperature measurement chip 14 and the copper foil area 1111 are spaced apart from each other, thereby reducing heat in the temperature measurement circuit 13 from being transferred to the temperature measurement chip 14 through the copper foil 15 on the copper foil area 1111.

[0037] In some embodiments, the minimum distance between the temperature measurement chip 14 and the copper foil area 1111 is H, and H≥1 mm is satisfied. If the minimum distance H between the temperature measurement chip 14 and the copper foil area 1111 is too small, heat in the temperature measurement circuit 13 is likely to be transferred to the temperature measurement chip 14, affecting the measurement of the temperature of the cold end 22 by the temperature measurement chip 14. Therefore, by making H≥1 mm, the influence of heat in the temperature measurement circuit 13 on the temperature measurement of the cold end 22 by the temperature measurement chip 14 can be reduced.

[0038] Further, the minimum distance H between the temperature measurement chip 14 and the copper foil area 1111 satisfies: 1 mm≤H≤3 mm. If the minimum distance H between the temperature measurement chip 14 and the copper foil area 1111 is too small, heat in the temperature measurement circuit 13 is likely to be transferred to the temperature measurement chip 14; if H is too large, it will cause an increase in the area of the circuit board 1. Therefore, by selecting the minimum distance H between the temperature measurement chip 14 and the copper foil area 1111 to satisfy: 1 mm≤H≤3 mm, the size of the circuit board 1 and the influence of the temperature measurement circuit 13 on the temperature measurement chip 14 can be taken into account.

[0039] In some embodiments, referring to Figure 3 , both the first bonding pad 121 and the second bonding pad 122 are located on the side of the temperature measurement chip 14 facing away from the copper foil area 1111, so as to reduce heat in the temperature measurement circuit 13 or other electronic components from being transferred to the first bonding pad 121 and the second bonding pad 122 through the copper foil 15, which is conducive to improving the accuracy of the measurement of the thermocouple 2.

[0040] In the embodiment of the present utility model, by providing a copper foil area 1111 and an empty foil area 1112 on the first surface 111 of the substrate 11, arranging the temperature measurement circuit 13 in the copper foil area 1111, and arranging the welding part 12 in the empty foil area 1112, the welding part 12 is electrically connected to the temperature measurement circuit 13. The welding part 12 is configured to be welded to the electrode of the thermocouple 2. The thermocouple 2 has a hot end 21 and a cold end 22, and the hot end 21 is used to contact the object to be measured. Since the welding part 12 is arranged in the empty foil area 1112, the heat of the circuit board 1 itself can be reduced from being transferred to the welding part 12 through the copper foil 15 on the surface of the circuit board 1, thereby reducing the influence of the heat of the circuit board 1 itself on the temperature of the object to be measured measured by the thermocouple 2, which is beneficial to improving the measurement accuracy.

[0041] The embodiment of the temperature measurement system 100 of the present utility model is further provided. Please refer to Figure 1 , the temperature measurement system 100 includes a thermocouple 2 and the above-mentioned circuit board 1. One of the positive electrode and the negative electrode of the thermocouple 2 is welded and fixed to the first welding pad 121 of the welding part 12, and the other is welded and fixed to the second welding pad 122 of the welding part 12. Wherein, the end of the thermocouple 2 far from the welding part 12 is the hot end 21, which is used to contact the object to be measured, and the end of the thermocouple 2 welded to the welding part 12 is the cold end 22.

[0042] The embodiment of the atomizing device is further provided by the present utility model, which is not shown in the figure. The atomizing device includes a heating component and the above-mentioned temperature measurement system 100. The heating component is used to heat the aerosol generating matrix in the atomizing device to atomize it into smoke. The aerosol generating matrix can be a liquid matrix or a solid matrix. The end of the thermocouple 2 far from the welding part 12 is connected to the heating component, so that the temperature measurement system 100 can measure the temperature of the heating component, thereby facilitating the control module in the atomizing device to control the temperature of the heating component.

[0043] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied to other related technical fields, shall be equally included in the patent protection scope of the present utility model.

Claims

1. A circuit board, characterized in that, Comprising: A substrate, the surface of the substrate comprising a copper foil region and a non - copper - foil region, at least a part of the copper foil region being provided with copper foil; A temperature - measuring circuit, disposed in the copper foil region; A welding part, disposed in the non - copper - foil region, the welding part being electrically connected to the temperature - measuring circuit, the welding part being configured to be welded to an electrode of a thermocouple, the thermocouple having a hot end and a cold end, the hot end being used to contact an object to be measured; And A temperature - measuring chip, the temperature - measuring chip being electrically connected to the temperature - measuring circuit, the temperature - measuring chip being configured to obtain the temperature of the cold end.

2. The circuit board according to claim 1, wherein The welding part comprises a first welding pad and a second welding pad, both the first welding pad and the second welding pad being electrically connected to the temperature - measuring circuit, one of the first welding pad and the second welding pad being used for electrically connecting to the positive electrode of the thermocouple, and the other being used for electrically connecting to the negative electrode of the thermocouple.

3. The circuit board according to claim 2, wherein The temperature - measuring chip is spaced between the first welding pad and the second welding pad.

4. The circuit board according to claim 2, wherein Both the first welding pad and the second welding pad are spaced from the copper foil region.

5. The circuit board according to claim 4, wherein The minimum distance between the first welding pad and the second welding pad and the copper foil region is greater than or equal to 1 mm.

6. The circuit board according to claim 1, wherein The temperature - measuring chip is disposed in the non - copper - foil region.

7. The circuit board according to claim 6, wherein The temperature - measuring chip is spaced from the copper foil region.

8. The circuit board according to claim 7, wherein The minimum distance between the temperature - measuring chip and the copper foil region is greater than or equal to 1 mm.

9. A temperature measurement system, characterized in that, Comprising a thermocouple and the circuit board according to any one of claims 1 - 8, the thermocouple being welded to the welding part to form an electrical connection.

10. An atomization device, characterized in that, Comprising a heating component for heating an aerosol - generating substrate to generate smoke, and the temperature - measuring system according to claim 9, one end of the thermocouple away from the welding part being connected to the heating component so that the temperature - measuring system can measure the temperature of the heating component.

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