Substrate processing equipment and substrate processing system

Abstract

The utility model discloses substrate processing equipment and a substrate processing system, and relates to the field of substrate processing equipment.The substrate processing equipment comprises a vibration processing module and a vibration workbench; the vibration machining module is used for driving a machining tool rotating at a high speed to vibrate in a first direction at a set first amplitude and a set first frequency in the machining process, so that periodic contact and separation are formed between the machining tool and a base plate fixed to the vibration workbench; and the vibration workbench is used for driving the substrate on the vibration workbench to vibrate in the first direction at a set second amplitude and a set second frequency in the machining process. In the embodiment of the invention, through the dual vibration mechanism, when the vibration processing module vibrates at a certain amplitude and frequency, the vibration workbench can vibrate in a superposed manner, so that the vibration range is expanded, and the flexibility and adaptability of the substrate processing equipment in processing substrates with different shapes, sizes and materials are improved.

Description

Technical Field

[0001] The utility model relates to the field of substrate processing equipment, in particular to a substrate processing equipment and a substrate processing system. Background Art

[0002] With the rapid development of the aerospace, medical, automotive and electronics industries, the number of layers of substrates (such as printed circuit boards) is increasing, the diameter of micro-holes is getting smaller, and the quality requirements for micro-holes are getting higher. In substrate processing, the materials involved in micro-hole processing are mostly difficult-to-process materials such as carbon fiber composites. These materials have poor machinability, and the aspect ratios of micro-holes are generally large, resulting in large drilling forces, high drilling temperatures, and short drill bit service lives during drilling, thereby reducing the processing accuracy of the substrate.

[0003] The existing substrate processing equipment mainly applies ultrasonic vibration to the spindle during the processing to improve the processing accuracy of the substrate. However, this method results in a limited axial amplitude range that can be provided by the ultrasonic vibration spindle, and it cannot adapt to substrates of different thicknesses, different materials, and different sizes, resulting in low flexibility and adaptability of the substrate processing equipment. Summary of the Invention

[0004] Based on this, the embodiments of the present utility model provide a substrate processing equipment and a substrate processing system to solve the technical problem of low flexibility and adaptability of the existing substrate processing equipment when processing different substrates.

[0005] To solve the above problems, the technical solutions adopted by the present utility model are as follows:

[0006] In a first aspect, a substrate processing equipment is provided, including a vibration processing module and a vibration workbench;

[0007] The vibration processing module is configured to drive a high-speed rotating processing tool to vibrate in a first direction at a set first amplitude and first frequency during processing, so as to form periodic contact and separation between the processing tool and a substrate fixed on the vibration workbench;

[0008] The vibration workbench is configured to drive the substrate thereon to vibrate along the first direction at a set second amplitude and second frequency during processing.

[0009] Optionally, the vibration processing module includes an ultrasonic vibration processing module, and the ultrasonic vibration processing module includes an ultrasonic vibration spindle.

[0010] Optionally, the ultrasonic vibration spindle includes an ultrasonic vibration module and a first spindle body;

[0011] One end of the ultrasonic vibration module is connected to one end of the first spindle body;

[0012] The other end of the first main spindle body is connected to one end of the machining tool.

[0013] Optionally, the ultrasonic vibration spindle further includes an ultrasonic tool holder;

[0014] The other end of the first main spindle body is connected to one end of the ultrasonic tool holder;

[0015] The other end of the ultrasonic tool holder is connected to one end of the machining tool.

[0016] Optionally, the ultrasonic vibration module includes a first transducer and a first horn;

[0017] The output end of the first transducer is connected to one end of the first horn;

[0018] The other end of the first horn is connected to one end of the first main spindle body.

[0019] Optionally, the ultrasonic vibration spindle includes a hydrostatic ultrasonic motor spindle.

[0020] Optionally, the hydrostatic ultrasonic motor spindle includes an aerostatic ultrasonic motor spindle, and the aerostatic ultrasonic motor spindle includes a second main spindle body, an air path structure, a thrust plate, and a rotating shaft core disposed inside the second main spindle body;

[0021] The thrust plate is disposed on the rotating shaft core;

[0022] The air path structure is disposed inside the second main spindle body and is used to guide high-pressure air to act on both sides of the thrust plate respectively, so as to drive the thrust plate to drive the rotating shaft core to vibrate along the first direction, and further drive the machining tool to vibrate synchronously along the first direction.

[0023] Optionally, the vibration workbench includes an ultrasonic vibration workbench, and the ultrasonic vibration workbench includes a machining workbench and an ultrasonic vibration device;

[0024] One end of the ultrasonic vibration device is connected to the machining workbench;

[0025] The ultrasonic vibration device is used to drive the substrate on the machining workbench to vibrate along the first direction with a set second amplitude and second frequency during the machining process.

[0026] Optionally, at least one of the ultrasonic vibration devices is included and is arranged on the machining workbench in a uniformly arranged manner; wherein, the ultrasonic vibration device includes a second transducer, a second horn, and a resonance body;

[0027] The output end of the second transducer is connected to one end of the second horn;

[0028] The other end of the second horn is connected to one end of the resonator;

[0029] The other end of the resonator is connected to the processing workbench.

[0030] Optionally, the ultrasonic vibration device includes an aerostatic ultrasonic vibration device, and the aerostatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, and a vibration rod;

[0031] The output end of the vibration rod is detachably connected to the processing workbench;

[0032] The bearing mounting cover is detachably connected to the bearing mounting base;

[0033] The vibration rod is disposed in the accommodation chamber formed by the bearing mounting cover and the bearing mounting base, and is used to drive the substrate on the processing workbench to vibrate in the first direction.

[0034] Optionally, the aerostatic ultrasonic vibration device further includes a first aerostatic bearing, a second aerostatic bearing, and an air floating vibration plate disposed on the vibration rod;

[0035] The first aerostatic bearing is fixedly installed on the bearing mounting cover;

[0036] The second aerostatic bearing is fixedly installed on the bearing mounting base;

[0037] The central axis of the vibration rod is perpendicular to the central axes of the first aerostatic bearing and the second aerostatic bearing respectively, and the air floating vibration plate is located between the first aerostatic bearing and the second aerostatic bearing;

[0038] An air inlet hole is provided on the bearing mounting base, a first air inlet passage is provided between the first aerostatic bearing and the bearing mounting cover, and a second air inlet passage is provided between the second aerostatic bearing and the bearing mounting base;

[0039] Both the first air inlet passage and the second air inlet passage are communicated with the air inlet hole, so that the high-pressure air introduced through the air inlet hole enters the first annular air groove on the first aerostatic bearing through the first air inlet passage, and then a first air film is formed between the first aerostatic bearing and the air floating vibration plate. After entering the second annular air groove on the second aerostatic bearing through the second air inlet passage, a second air film is formed between the second aerostatic bearing and the air floating vibration plate;

[0040] The first air film and the second air film generate different pressures on both sides of the air floating vibration plate, so that the air floating vibration plate drives the vibration rod to vibrate in the first direction.

[0041] Optionally, the aerostatic ultrasonic vibration device further includes a third aerostatic bearing;

[0042] The third aerostatic bearing is fixedly installed on the bearing mounting base;

[0043] A third air inlet channel is provided between the third aerostatic bearing and the bearing mounting base;

[0044] The third air inlet channel is communicated with the air inlet hole, so that the high-pressure air introduced through the air inlet hole enters the third annular air groove on the third aerostatic bearing through the third air inlet channel and then fills into the accommodating chamber, forming a third air film for supporting the suspension of the vibrating rod.

[0045] Optionally, the substrate processing device further includes a muffler;

[0046] The bearing mounting base is provided with an outlet communicated with the accommodating chamber, and the muffler is arranged at the outlet.

[0047] Optionally, the substrate processing device further includes a bed body, a gantry system and a moving platform;

[0048] A channel is formed between the gantry system and the bed body;

[0049] The gantry system and / or the moving platform are movably arranged on the bed body along a third direction, and the moving platform can drive the vibrating workbench to move into or out of the channel relative to the channel;

[0050] The vibration processing module is movably arranged on the gantry system along a second direction, and the vibration processing module can move along the first direction;

[0051] Wherein, the first direction, the second direction and the third direction are perpendicular to each other in pairs.

[0052] Optionally, the substrate processing device further includes a laser displacement sensor for detecting the actual amplitude and actual frequency of the processing workbench;

[0053] The laser displacement sensor is arranged on the processing workbench.

[0054] In a second aspect, a substrate processing system is provided. The processing types of the substrate include drilling, routing, milling or cutting, and / or, the substrate includes a substrate with a high aspect ratio, a multi-layer stacked substrate or a high-density interconnect substrate; the substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device as described in the first aspect above.

[0055] In one of the solutions provided by the embodiments of the present utility model, a substrate processing device includes a vibration processing module and a vibration workbench; the vibration processing module is configured to drive a processing tool rotating at a high speed to vibrate in a first direction with a set first amplitude and first frequency during the processing, so as to form periodic contact and separation between the processing tool and a substrate fixed on the vibration workbench; the vibration workbench is configured to drive the substrate thereon to vibrate along the first direction with a set second amplitude and second frequency during the processing. In this embodiment, by adopting a combination of the vibration processing module and the vibration workbench in the substrate processing device, when the vibration processing module drives the processing tool to vibrate in the first direction with the set first amplitude and first frequency, the vibration workbench can also drive the substrate to vibrate along the first direction with the set second amplitude and second frequency. Through this dual vibration mechanism, when the vibration processing module vibrates with a certain amplitude and frequency, the vibration workbench can superimpose vibrations, thereby expanding the vibration range and improving the flexibility and adaptability of the substrate processing device when processing substrates of different shapes, sizes, and materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the description of the embodiments of the present utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0057] Figure 1 is a schematic diagram of a substrate processing device in an embodiment of the present utility model;

[0058] Figure 2 is a processing schematic diagram of a substrate processing device in an embodiment of the present utility model;

[0059] Figure 3 is a schematic diagram of an ultrasonic vibration device in an embodiment of the present utility model;

[0060] Figure 4 is an installation schematic diagram of an aerostatic ultrasonic vibration device in an embodiment of the present utility model;

[0061] Figure 5 is a schematic diagram of an aerostatic ultrasonic vibration device in an embodiment of the present utility model.

[0062] Among them, the reference numerals are as follows:

[0063] 1. Vibration processing module;

[0064] 2. Vibration workbench; 21. Processing workbench;

[0065] 22. Ultrasonic vibration device; 221. Second transducer; 2211. Stud; 2212. Front end cover; 2213. Insulating sleeve; 2214. Electrode plate; 2215. Piezoelectric ceramic; 2216. Rear end cover; 2217. First screw; 222. Second horn; 223. Resonator;

[0066] 23. Aerostatic ultrasonic vibration device; 231. Bearing mounting cover; 232. Bearing mounting base; 233. Vibration rod; 234. First aerostatic bearing; 235. Second aerostatic bearing; 236. Third aerostatic bearing; 237. Aerostatic vibration plate; 238. First air inlet channel; 239. Second air inlet channel; 2310. Third air inlet channel; 2311. First annular air groove; 2312. Second annular air groove; 2313. Third annular air groove; 2314. Air inlet hole; 2315. Muffler;

[0067] 3. Moving platform;

[0068] 4. Crossbeam base; 41. First base; 42. Second base;

[0069] 5. Crossbeam; 6. Bed; 7. First motion component; 8. Second motion component; 9. Third motion component; 10. Ultrasonic generator; 11. Laser displacement sensor; 12. Control system; 13. Substrate; 14. Machining tool. Detailed implementation manners

[0070] In order to make the technical problems, technical solutions and beneficial effects solved by the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0071] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0072] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0073] To facilitate the understanding of the embodiments of the present utility model, the substrate related to the present utility model is explained here as follows: The substrate 13 related to the present utility model may include a substrate, a package substrate (IC carrier), and a glass substrate, which are not limited here. The embodiments provided by the present utility model will be explained as follows:

[0074] In a first aspect, a substrate processing device is provided. Please refer to Figure 1 and Figure 2 , the substrate processing device includes a vibration processing module 1 and a vibration workbench 2; the vibration processing module 1 is used to drive the processing tool 14 to vibrate in a first direction with a set first amplitude and first frequency during the processing, so as to form periodic contact and separation between the high-speed rotating processing tool 14 and the substrate 13 fixed on the vibration workbench 2; the vibration workbench 2 is used to drive the substrate 13 thereon to vibrate in the first direction with a set second amplitude and second frequency during the processing.

[0075] In an embodiment, the high-speed rotating processing tool 14 can be a processing tool 14 with a rotational speed between 50000 rpm and 300000 rpm. Preferably, the rotational speed of the processing tool 14 can be 100000 rpm, 150000 rpm, 200000 rpm, or 250000 rpm. Here, it is not limited. Of course, if the vibration processing module 1 uses other rotational speeds to drive the processing tool 14 to perform vibration processing on the substrate 13, it should also be within the protection scope of this application.

[0076] As an example, when drilling the substrate 13 through a substrate processing device, based on the vibration processing module 1 and the vibration workbench 2 arranged on the substrate processing device, the vibration processing module 1 can drive the processing tool 14 to vibrate in the first direction with a set first amplitude and first frequency. This vibration mode enables periodic contact and separation between the high-speed rotating processing tool 14 and the substrate 13, and the vibration workbench 2 can drive the substrate 13 thereon to vibrate along the first direction with a set second amplitude and second frequency. Through this dual vibration mechanism, when the vibration processing module 1 vibrates with a certain amplitude and frequency, the vibration workbench 2 can superimpose vibrations, thus expanding the vibration range and improving the flexibility and adaptability of the substrate processing device when processing substrates 13 of different shapes, sizes, and materials.

[0077] In an actual application scenario, the preset amplitude range of the vibration processing module 1 can be 1 µm to 20 µm, the preset frequency range can be 100 Hz to 80 KHz, the preset amplitude range of the vibration workbench 2 can be 1 µm to 20 µm, and the preset frequency range can be 100 Hz to 80 KHz. For example, the first amplitude of the vibration processing module 1 can be set to 20 µm, the first frequency can be set to 2 KHz and vibrate upward along the first direction, and the second amplitude of the vibration workbench 2 can be set to 20 µm, and the second frequency can be set to 2 KHz to drive the substrate 13 to vibrate downward along the first direction. Since the vibration directions are opposite and the phases are opposite, a vibration with a maximum amplitude of 40 µm is formed, enabling the substrate processing device to provide a larger amplitude range and higher processing accuracy when processing substrates 13 of different shapes, sizes, and materials.

[0078] It should be understood that the first amplitude, the first frequency, the second amplitude, and the second frequency in the above embodiments can be set according to specific processing requirements. For example, when drilling the substrate 13, during the drilling-in stage, the first amplitude of the vibration processing module 1 can be set to 20 µm, the first frequency can be set to 5 KHz, and it vibrates upward along the first direction. The second amplitude of the vibration workbench 2 is set to 20 µm, and the second frequency is set to 5 KHz to synchronously drive the substrate 13 to vibrate downward along the first direction. Since the vibration directions are opposite and the phases are opposite, a vibration with a maximum amplitude of 40 µm is formed, so that during the drilling-in process, the offset of the drill bit is reduced, ensuring that the transverse edge of the drill bit can accurately contact the surface of the substrate 13, improving the precise positioning ability of the processing, maintaining stable processing conditions, effectively improving the processing accuracy and efficiency, and reducing the error caused by uneven thickness. During the middle-drilling stage, the amplitude and frequency can be appropriately increased to improve the processing accuracy and efficiency. During the drilling-out stage, the amplitude and frequency can be reduced to reduce the exit burrs, improving the processing quality of the substrate 13, further solving the problems existing in the prior art at different stages, and improving the processing accuracy and efficiency. Here, no further examples will be given one by one. It should be noted that the above examples do not constitute a limitation to this application.

[0079] In one embodiment, the vibration processing module 1 includes an ultrasonic vibration processing module, and the ultrasonic vibration processing module includes an ultrasonic vibration main shaft; the frequency range of the ultrasonic vibration main shaft is above 20 KHz. Further, the frequency range of the ultrasonic vibration main shaft can be configured within the range of 20 KHz to 60 KHz. Preferably, it can be configured as 20 KHz, 30 KHz, or 40 KHz, etc.; the ultrasonic vibration main shaft includes an ultrasonic vibration module and a first main shaft body; one end of the ultrasonic vibration module is connected to one end of the first main shaft body; the other end of the first main shaft body is connected to one end of the processing tool 14.

[0080] It can be understood that the ultrasonic vibration main shaft protected by this application also includes a method of adding an ultrasonic vibration module to an existing mechanical main shaft or electric main shaft, enabling the mechanical main shaft or electric main shaft to have ultrasonic vibration processing performance. In this way, adding the corresponding ultrasonic vibration module to an old machine can also achieve the corresponding performance, which is naturally within the scope protected by this application. Among them, the frequency range of the ultrasonic vibration main shaft is 20 KHz to 60 KHz, which is only used as an example here and does not constitute a limitation.

[0081] In some embodiments, one end of the ultrasonic vibration module can be connected to one end of the first main spindle through a fastening device, such as a thread, a fixture, or a special connector, etc. The other end of the first main spindle can be connected to the machining tool 14 through a tool holding system, such as a special connector or a flange, etc., to ensure that the machining tool 14 forms a periodic contact with the substrate 13 under the drive of the first main spindle, so as to complete machining tasks such as cutting, drilling, or milling.

[0082] Furthermore, the ultrasonic vibration spindle further includes an ultrasonic tool shank; the other end of the first main spindle is connected to one end of the ultrasonic tool shank; the other end of the ultrasonic tool shank is connected to one end of the machining tool 14.

[0083] In some embodiments, in the ultrasonic vibration spindle, although the first main spindle serves as the main transmission channel of vibration energy, the direct connection between it and the machining tool 14 often cannot meet the machining requirements of high precision and high efficiency. By further connecting an ultrasonic tool shank to the first main spindle, the loss of vibration energy during transmission can be minimized to ensure that the machining tool 14 obtains stable and efficient ultrasonic vibration. Compared with the direct connection of the first main spindle to the machining tool 14, the ultrasonic tool shank can more effectively focus and transmit the vibration energy to the machining tool 14. In addition, the design of the ultrasonic tool shank has a certain universality and can adapt to different types of machining tools 14. This enables the same substrate processing equipment to conveniently replace different types of machining tools 14 to meet the requirements of different machining tasks.

[0084] Furthermore, the ultrasonic vibration module includes a first transducer and a first horn; the output end of the first transducer is connected to one end of the first horn; the other end of the first horn is connected to one end of the first main spindle.

[0085] In some embodiments, the first transducer is used to convert the electrical signal sent by the ultrasonic generator 10 into ultrasonic vibration. After being amplified by the first horn, it is transmitted to the first main spindle, and the first main spindle then transmits the vibration to the machining tool 14, enabling the machining tool 14 to perform tiny vibrations at an extremely high frequency during the machining process of the substrate 13. These tiny vibrations make the contact time between the machining tool 14 and the substrate 13 extremely short during the machining of the substrate 13, thereby reducing the heat generated during the machining process, extending the service life of the machining tool 14, and reducing the material deformation or delamination phenomenon of the substrate 13 due to overheating during the traditional machining process.

[0086] It should be noted that the first horn in this embodiment can be a single-stage horn or a multi-stage horn. For example, a horn composed of a first-stage horn and a second-stage horn connected in series. Specifically, it can be selected according to the machining requirements and is not limited here.

[0087] In another embodiment, the ultrasonic vibration spindle includes a static pressure ultrasonic electric spindle. As an example, the static pressure ultrasonic electric spindle can be an electric spindle that combines ultrasonic vibration and static pressure technology. The static pressure ultrasonic electric spindle can not only use ultrasonic vibration to achieve fine processing and efficient processing of the surface of the substrate 13, but also use static pressure technology to ensure the stability and low wear of the electric spindle during high-speed rotation, providing higher processing accuracy and efficiency for precision manufacturing, medical equipment, aerospace and other fields.

[0088] Furthermore, the static pressure ultrasonic electric spindle includes an air static pressure ultrasonic electric spindle, which includes a second spindle body, an air path structure, a thrust plate and a rotating shaft core arranged inside the second spindle body; one end of the processing tool 14 is detachably connected to the output end of the rotating shaft core; a thrust plate is arranged on the rotating shaft core; the air path structure is arranged inside the second spindle body, and is used to guide high-pressure air to act on both sides of the thrust plate respectively, thereby driving the thrust plate to drive the rotating shaft core to vibrate along the first direction, and then driving the processing tool 14 to vibrate synchronously along the first direction.

[0089] In some embodiments, a rotating shaft core is installed inside the second spindle body of the air-static pressure ultrasonic electric spindle, and the rotating shaft core is detachably connected to one end of the processing tool 14 through its output end, so that it can transmit ultrasonic vibration while rotating, so that the processing tool 14 is synchronously vibrated along a preset first direction. Among them, the thrust plate is fixedly connected to the rotating shaft core, and its main function is to drive the rotating shaft core to achieve ultrasonic vibration. Specifically, the air flow can be guided to both sides of the thrust plate by an air path structure arranged at the front end or inside the second spindle body, so that an air film is formed on both sides of the thrust plate, thereby generating a pressure difference, and the thrust plate is pushed to vibrate along the first direction by the pressure difference, and then the vibration of the thrust plate is transmitted to the processing tool 14 through the rotating shaft core, so that the processing tool 14 forms a periodic contact force on the surface of the substrate 13.

[0090] Furthermore, the hydrostatic ultrasonic electric spindle also includes a liquid hydrostatic ultrasonic electric spindle, which includes a liquid bearing, an ultrasonic liquid vibration module and a third spindle body; one end of the third spindle body is connected to one end of the processing tool 14; the liquid bearing is used to provide liquid hydrostatic pressure to support the levitation of the third spindle body; one end of the ultrasonic liquid vibration module is connected to the other end of the third spindle body, and is used to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate along the first direction, and drive the processing tool 14 to vibrate synchronously along the first direction.

[0091] In some embodiments, the hydrostatic ultrasonic electric spindle includes an electric spindle that supports the high-speed rotation of the third spindle body through hydrostatic pressure. As an example, the hydrostatic ultrasonic electric spindle may include a liquid bearing, an ultrasonic liquid vibration module, a third spindle body, and a liquid supply system. Among them, the liquid supply system is used to supply high-pressure liquid to the liquid bearing to form a uniform liquid film. As the third spindle body rotates, this film will generate sufficient hydrostatic pressure to make the hydrostatic third spindle body float and maintain extremely high rotational accuracy and stability without mechanical contact. The ultrasonic liquid vibration module is connected to the other end of the third spindle body and is used to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate in the first direction and drive the processing tool 14 to vibrate synchronously in the first direction, thereby achieving precision machining of the substrate 13.

[0092] In one embodiment, the vibration workbench 2 includes an ultrasonic vibration workbench, and the ultrasonic vibration workbench includes a processing workbench 21 and an ultrasonic vibration device 22; one end of the ultrasonic vibration device 22 is connected to the processing workbench 21; the ultrasonic vibration device 22 is used to drive the substrate 13 on the processing workbench 21 to vibrate in the first direction with a set second amplitude and second frequency during the processing.

[0093] In some embodiments, the ultrasonic vibration device 22 can apply vibration to the processing workbench 21 with a set amplitude and frequency during the processing, thereby driving the substrate 13 to perform small periodic displacements in the first direction. Among them, the amplitude and frequency can be adjusted according to the specific requirements of the processing to adapt to different types of processing tasks, which are not limited here.

[0094] In one embodiment, as Figure 2 and Figure 3 shown, the ultrasonic vibration device 22 includes a second transducer 221, a second amplitude transformer 222, and a resonator 223; the output end of the second transducer 221 is connected to one end of the second amplitude transformer 222; the other end of the second amplitude transformer 222 is connected to one end of the resonator 223; the other end of the resonator 223 is connected to the processing workbench 21.

[0095] In some embodiments, the frequency range of the ultrasonic vibration device 22 can be set to 20KHz - 60KHz. Preferably, it can be set to 20KHz, 30KHz, or 40KHz, etc., so that during the processing, the processing tool 14 contacts and separates from the substrate 13 in a very short time, reducing the instability during the cutting process.

[0096] As an example, one end of the second transducer 221 can be connected to one end of the second horn 222 by threads or other means, and the other end of the second horn 222 is connected to one end of the resonator 223 by a similar connection method. The other end of the resonator 223 is firmly connected to the processing workbench 21 by threads or welding to ensure that it will not be displaced during the processing. During operation, the second transducer 221 converts electrical energy into ultrasonic vibrations. After being amplified by the second horn 222, these vibrations are transmitted to the resonator 223, so that the resonator 223 drives the processing workbench 21 to vibrate and further acts on the substrate 13.

[0097] Furthermore, as Figure 3 shown, the second transducer 221 includes a stud 2211, a front end cover 2212, a rear end cover 2216, an insulating sleeve 2213, an electrode plate 2214, a piezoelectric ceramic 2215, and a first screw 2217. As an example, the front end cover 2212 and the rear end cover 2216 can be detachably connected together by threads or snap devices to form an accommodating chamber, and the first screw 2217 is arranged in the accommodating chamber. One end of the stud 2211 is fixed on the front end cover 2212, and the other end of the stud 2211 passes through the front end cover 2212 and is connected to one end of the second horn 222 by threads or plug-in devices. The piezoelectric ceramic 2215 and the electrode plate 2214 are sequentially sleeved on the first screw 2217 and are located in the accommodating chamber. To prevent direct contact between the first screw 2217 and the piezoelectric ceramic 2215 and the electrode plate 2214, the insulating sleeve 2213 is sleeved between the first screw 2217 and the piezoelectric ceramic 2215 and the electrode plate 2214 to reduce the electrical interference and short circuit between the first screw 2217 and these components, thereby maintaining the stability and efficiency of the second transducer 221. During operation, the high-frequency electrical signal sent by the ultrasonic generator 10 applies an alternating voltage to the piezoelectric ceramic 2215 through the electrode plate 2214. The piezoelectric ceramic 2215 generates a piezoelectric effect under the action of the electric field, that is, the internal crystal structure undergoes mechanical deformation to generate high-frequency mechanical vibrations. These vibrations are transmitted to the second horn 222 through the other end of the stud 2211. The second horn 222 further amplifies these high-frequency vibrations and transmits them to the resonator 223, so that the resonator 223 drives the processing workbench 21 to vibrate.

[0098] Furthermore, the vibrating workbench 2 includes at least one ultrasonic vibration device 22, and the ultrasonic vibration devices 22 are arranged on the processing workbench 21 in a uniformly arranged manner.

[0099] As an example, if there are multiple ultrasonic vibration devices 22, they can be arranged evenly below, inside, and / or on the sides of the processing workbench 21. The specific number and positions of the arrangements can be set according to requirements, and the present utility model does not limit them here. Preferably, four identical ultrasonic vibration devices 22 can be symmetrically arranged below the processing workbench 21, for example, at the four corners of the processing workbench 21, so as to achieve a uniform vibration distribution of the processing workbench 21 and ensure that the substrate 13 can obtain uniform ultrasonic vibration during the processing.

[0100] It should be noted that if a single ultrasonic vibration device 22 is sufficient to meet the processing requirements, a single ultrasonic vibration device 22 can also be arranged directly below the processing workbench 21. It should be understood that in this case, a guide post structure needs to be added to enhance stability and avoid displacement or uneven vibration of the processing workbench 21 caused by vibration.

[0101] In another embodiment, as Figure 4 shown, the ultrasonic vibration device 22 includes a gas static pressure ultrasonic vibration device 23. As an example, the gas static pressure ultrasonic vibration device 23 can be an ultrasonic vibration device 22 that combines the principles of aerodynamics and ultrasonic technology. Specifically, a vibration rod 233 can be arranged inside the ultrasonic vibration device 22, and under the drive of ultrasonic waves, the vibration rod 233 vibrates at a high frequency in the first direction. By introducing high-pressure air into the ultrasonic vibration device 22, the introduced high-pressure air forms a static pressure air film around the vibration rod 233, thereby isolating the direct contact between the vibration rod 233 and the inner wall of the ultrasonic vibration device 22. Then, under the action of the air cyclone buoyancy, the vibration rod 233 can achieve both vibration and rotation.

[0102] Furthermore, as Figure 5 shown, the gas static pressure ultrasonic vibration device 23 includes a bearing mounting cover 231, a bearing mounting base 232, and a vibration rod 233; the output end of the vibration rod 233 is detachably connected to the processing workbench 21; the bearing mounting cover 231 is detachably connected to the bearing mounting base 232; the vibration rod 233 is arranged in the accommodation chamber formed by the bearing mounting cover 231 and the bearing mounting base 232, and is used to drive the substrate 13 on the processing workbench 21 to vibrate in the first direction.

[0103] In some embodiments, the aerostatic ultrasonic vibration device 23 may include a bearing mounting cover 231, a bearing mounting base 232, and a vibration rod 233. The output end of the vibration rod 233 is fixedly connected to the processing workbench 21 through a detachable connection device. For example, it is fixedly connected by screws passing through the preset through holes on the processing workbench 21 and the preset threaded holes on the vibration rod 233, ensuring that the vibration rod 233 can stably transmit vibration during operation. The other end of the vibration rod 233 is located in the accommodation chamber formed by the bearing mounting cover 231 and the bearing mounting base 232. As an example, the bearing mounting cover 231 and the bearing mounting base 232 can be detachably connected by bolts or other fasteners to form a closed accommodation chamber for supporting and fixing the vibration rod 233. During operation, high-pressure air is introduced into the accommodation chamber formed by the bearing mounting cover 231 and the bearing mounting base 232, so that a static pressure air film is formed around the vibration rod 233, thereby isolating the direct contact between the vibration rod 233 and the inner wall of the accommodation chamber. Then, under the action of the air cyclone buoyancy, the vibration rod 233 vibrates periodically in the first direction with a set amplitude and frequency. Further, the processing workbench 21 drives the substrate 13 to have a small periodic displacement in the first direction under the drive of the vibration rod 233.

[0104] Further, as Figure 5 shown, the aerostatic ultrasonic vibration device 23 further includes a first aerostatic bearing 234, a second aerostatic bearing 235, and an air-floating vibration plate 237 provided on the vibration rod 233; the first aerostatic bearing 234 is fixedly installed on the bearing mounting cover 231; the second aerostatic bearing 235 is fixedly installed on the bearing mounting base 232; the central axis of the vibration rod 233 is perpendicular to the central axes of the first aerostatic bearing 234 and the second aerostatic bearing 235 respectively, and the air-floating vibration plate 237 is located between the first aerostatic bearing 234 and the second aerostatic bearing 235; an air inlet hole 2314 is provided on the bearing mounting base 232, a first air inlet channel 238 is provided between the first aerostatic bearing 234 and the bearing mounting cover 231, and a second air inlet channel 239 is provided between the second aerostatic bearing 235 and the bearing mounting base 232; both the first air inlet channel 238 and the second air inlet channel 239 are communicated with the air inlet hole 2314, so that the high-pressure air introduced through the air inlet hole 2314 enters the first annular air groove 2311 on the first aerostatic bearing 234 through the first air inlet channel 238, and then a first air film is formed between the first aerostatic bearing 234 and the air-floating vibration plate 237, and enters the second annular air groove 2312 on the second aerostatic bearing 235 through the second air inlet channel 239, and then a second air film is formed between the second aerostatic bearing 235 and the air-floating vibration plate 237; different pressures are generated on both sides of the air-floating vibration plate 237 by the first air film and the second air film, so that the air-floating vibration plate 237 drives the vibration rod 233 to vibrate in the first direction.

[0105] In some embodiments, threaded holes may be provided on the first aerostatic bearing 234, and through holes matching the threaded holes on the first aerostatic bearing 234 may be preset on the bearing mounting cover 231. During the connection process, the first aerostatic bearing 234 can be fixedly connected by screwing a screw through the through hole and into the threaded hole provided on the first aerostatic bearing 234. Alternatively, the first aerostatic bearing 234 can be adhered to the inside of the bearing mounting cover 231 by an adhesive member. The specific fixing method is not limited in the present utility model. Similarly, the second aerostatic bearing 235 is fixed to the bearing mounting base 232 in the above manner, which will not be elaborated here. The air-bearing vibration plate 237 is fixedly connected to the vibration rod 233, and the air inlet hole 2314 is connected to the first air inlet passage 238 and the second air inlet passage 239 through a pipe. For example, the connecting pipe of the air inlet hole 2314 can be docked to the first air inlet passage 238 and the second air inlet passage 239 to ensure the sealing of each connection part and ensure that high-pressure air can smoothly enter the air grooves of the aerostatic bearing.

[0106] During operation, high-pressure air enters from the air inlet hole 2314, enters the first annular air groove 2311 on the first aerostatic bearing 234 through the first air inlet passage 238, and forms a first air film between the first aerostatic bearing 234 and the air-bearing vibration plate 237. Similarly, high-pressure air enters the second annular air groove 2312 on the second aerostatic bearing 235 through the second air inlet passage 239, and forms a second air film between the second aerostatic bearing 235 and the air-bearing vibration plate 237. These two air films form different pressures on both sides of the air-bearing vibration plate 237, pushing the air-bearing vibration plate 237 to vibrate back and forth in the first direction. Since the vibration rod 233 is connected to the air-bearing vibration plate 237, with the vibration of the air-bearing vibration plate 237, it is then transmitted to the processing workbench 21 through the vibration rod 233, thereby driving the substrate 13 on the processing workbench 21 to vibrate in the first direction. This periodic vibration causes intermittent contact between the processing tool 14 and the substrate 13, thereby achieving the purpose of precision machining of the substrate 13. The frictionless vibration transmission is realized through the pressure difference of the air film, ensuring the stability and precision during the vibration process, effectively reducing the mechanical wear between the vibration rod 233 and the aerostatic bearing, and improving the reliability and service life of the aerostatic ultrasonic vibration device 23.

[0107] Further, as Figure 5As shown in the figure, the aerostatic ultrasonic vibration device 23 further includes a third aerostatic bearing 236; the third aerostatic bearing 236 is fixedly installed on the bearing mounting base 232; a third air inlet passage 2310 is provided between the third aerostatic bearing 236 and the bearing mounting base 232; the third air inlet passage 2310 communicates with the air inlet hole 2314, so that the high-pressure air introduced through the air inlet hole 2314 enters the third annular air groove 2313 on the third aerostatic bearing 236 and then fills the accommodating chamber, forming a third air film for supporting the suspension of the vibrating rod 233.

[0108] In some embodiments, the third aerostatic bearing 236 can be fixedly installed on the bearing mounting base 232 in the same way as the above-mentioned fixed second aerostatic bearing 235, and details will not be elaborated here. The third air inlet passage 2310 is also provided on the bearing mounting base 232 and is connected to the air inlet hole 2314, and its function is to guide the high-pressure air to the third aerostatic bearing 236. During operation, when the high-pressure air enters the third annular air groove 2313 through the third air inlet passage 2310, it forms a uniform air film, and this air film provides a supporting force in the accommodating chamber formed by the bearing mounting cover 231 and the bearing mounting base 232, enabling the vibrating rod 233 to be suspended on the air film, not only supporting the weight of the vibrating rod 233, but also reducing the direct contact with the inner wall of the accommodating chamber, improving the stability and service life of the aerostatic ultrasonic vibration device 23.

[0109] In summary, as Figure 5 As shown in the figure, the aerostatic ultrasonic vibration device 23 includes a vibrating rod 233, an air-floating vibration plate 237, a first aerostatic bearing 234, a second aerostatic bearing 235, a third aerostatic bearing 236, a bearing mounting cover 231 and a bearing mounting base 232. The output end of the vibrating rod 233 is detachably connected to the processing workbench 21, and the bearing mounting cover 231 and the bearing mounting base 232 are fixed together by bolts or other connecting devices to form an accommodating chamber, and the vibrating rod 233 is arranged in this accommodating chamber. The first aerostatic bearing 234 is fixedly installed on the bearing mounting cover 231, while the second aerostatic bearing 235 and the third aerostatic bearing 236 are both fixedly installed on the bearing mounting base 232. The central axis of the vibrating rod 233 is perpendicular to the central axes of the first aerostatic bearing 234 and the second aerostatic bearing 235. The first air inlet passage 238, the second air inlet passage 239 and the third air inlet passage 2310 are all communicated with the air inlet hole 2314.

[0110] During operation, high-pressure air enters through the air inlet hole 2314, passes through the first air inlet channel 238, and enters the first annular air groove 2311 on the first aerostatic bearing 234 to form a first air film. At the same time, the high-pressure air enters the second annular air groove 2312 on the second aerostatic bearing 235 through the second air inlet channel 239 to form a second air film. Different pressures are generated on both sides of the air-floating vibration plate 237 by the first air film and the second air film, causing the air-floating vibration plate 237 to vibrate in the first direction, thereby driving the vibration rod 233 to drive the processing workbench 21 to vibrate in the first direction. In addition, the third aerostatic bearing 236 is connected to the air inlet hole 2314 through the third air inlet channel 2310. After the high-pressure air enters the third annular air groove 2313 on the third aerostatic bearing 236, it is filled into the accommodation chamber to form a third air film. The third air film generates a supporting force in the accommodation chamber to support the suspension of the vibration rod 233, reducing the contact between the vibration rod 233 and the inner wall of the accommodation chamber. Through the above settings, the problem of the complex structure caused by the need for functional components such as ultrasonic power supplies, transducers, and horn bars in the existing ultrasonic vibration device 22 is simplified, and the cost is reduced.

[0111] Furthermore, as Figure 5 shown, the aerostatic ultrasonic vibration device 23 further includes a muffler 2315; the bearing mounting base 232 is provided with an outlet communicating with the accommodation chamber, and the muffler 2315 is arranged at the outlet.

[0112] In some embodiments, the muffler 2315 can be fixed to the outlet communicating with the accommodation chamber on the bearing mounting base 232 by bolts, clamps, or flanges, etc., to reduce the noise generated during the operation of the aerostatic ultrasonic vibration device 23, thereby improving the comfort of the working environment and the operating quietness of the equipment. Among them, the muffler 2315 can be of various types, including but not limited to: porous muffler 2315, diffusion muffler 2315, and reflection muffler 2315.

[0113] In one embodiment, the processing types of the substrate 13 include drilling, routing, milling, or cutting.

[0114] In some embodiments, during the processing of the substrate 13, the vibration processing module 1 and the vibration workbench 2 can be controlled to vibrate at different amplitudes and frequencies according to the processing type and processing stage of the substrate 13 to improve the processing accuracy, efficiency, and surface quality of the substrate 13. For example, during drilling, the vibration processing module 1 and the vibration workbench 2 are controlled to vibrate at different amplitudes and frequencies. When the drill bit encounters an offset during the drilling process, the vibration action will cause the drill bit to withdraw briefly and reposition, thereby automatically eliminating the offset and ensuring that the drill bit can accurately re-enter the target position, thus improving the positioning accuracy of drilling and greatly improving the processing accuracy and processing efficiency.

[0115] In another embodiment, the substrate 13 includes a substrate with a high aspect ratio, a multi-layer stacked substrate, or a high density interconnect substrate.

[0116] In some embodiments, a substrate with a high aspect ratio refers to a substrate with a relatively large thickness. For example, a substrate with a thickness ranging from 1.0 mm to 10.0 mm. A multi-layer stacked substrate refers to a circuit board formed by stacking multiple substrates, where each layer has an independent circuit pattern and connection structure. For example, a substrate with a number of layers ranging from 4 to 20 and a thickness ranging from 1.5 mm to 10.0 mm. A high density interconnect (HDI) substrate refers to a printed circuit board with a high wiring density.

[0117] In one embodiment, the substrate processing equipment further includes a bed 6, a gantry system, and a moving platform 3 disposed below the vibration worktable 2.

[0118] In some embodiments, the gantry system includes a beam base 4 and a beam 5 disposed on the beam base 4. Specifically, the beam base 4 includes a first base 41 and a second base 42 spaced apart. One end of the first base 41 and the second base 42 are respectively connected to the beam 5 to form the gantry system. The beam 5 can also be made of a material with strong rigidity, such as marble, steel, or aluminum alloy, to ensure that it can withstand the weight and load brought by the movement of the vibration processing module 1 during processing and avoid deformation.

[0119] Furthermore, the vibration worktable 2 can be located below the vibration processing module 1, so that during processing, the vibration worktable 2 can drive the substrate 13 thereon to vibrate along the first direction with a second amplitude and a second frequency, providing greater flexibility and adaptability for the substrate processing equipment.

[0120] Furthermore, a channel is formed between the gantry system and the bed 6. As an example, one end of the first base 41 and the second base 42 can be respectively connected to the beam 5, and the other end can be respectively connected to the bed 6, thereby forming a movement channel for the processing worktable 21 between the first base 41 and the second base 42.

[0121] Furthermore, the gantry system and / or the moving platform 3 are movably disposed along the third direction on the bed 6, that is, the gantry system is movably disposed along the third direction on the bed 6, or the moving platform 3 is movably disposed along the third direction on the bed 6, or the gantry system and the moving platform 3 are movably disposed along the third direction on the bed 6; then when the gantry system and / or the moving platform 3 move, the moving platform 3 can drive the vibration worktable 2 to move into or out of the channel relative to the channel. If the gantry system moves, the moving platform 3 can drive the vibration worktable 2 to pass through or penetrate the channel to achieve moving into or out of the channel relative to the channel.

[0122] In some embodiments, the bed body 6 serves as a support base, on which a gantry system and / or a moving platform 3 are movably arranged along a third direction. As an example, a third motion component 9 for moving along the third direction can be arranged between the bed body 6 and the moving platform 3. One end of the third motion component 9 is connected to the bed body 6, and the other end is connected to the moving platform 3, so as to drive the moving platform 3 to move along the third direction through the third motion component 9, so that the moving platform 3 drives the vibrating workbench 2 to move into or out of the channel, so that when needed, the moving platform 3 can be moved to drive the vibrating workbench 2 to move into or out of, which improves the automation degree and efficiency of the substrate processing equipment.

[0123] In some embodiments, the third motion component 9 may include a third linear motor, a third rolling guide rail and a third slider. The third linear motor and the third rolling guide rail are installed on the bed body 6, the third slider is arranged on the third rolling guide rail, and is connected to the moving platform 3 and the third linear motor. During operation, by controlling the third linear motor, it drives the third slider to move along the third rolling guide rail in the third direction, so as to drive the moving platform 3 to move in the third direction, thereby driving the vibrating workbench 2 to move into or out of the channel formed between the gantry system and the bed body 6.

[0124] Furthermore, the vibration processing module 1 is movably arranged on the gantry system along a second direction, and the vibration processing module 1 can move along a first direction.

[0125] As an example, a first motion component 7 for moving along the first direction and a second motion component 8 for moving along the second direction can be arranged between the vibration processing module 1 and the gantry system. In this way, the vibration processing module 1 is driven to move along the first direction through the first motion component 7; the first motion component 7 is driven to move along the second direction through the second motion component 8, so that the first motion component 7 drives the vibration processing module 1 to move along the second direction, so as to realize moving along the second direction on the cross beam 5.

[0126] Specifically, one end of the vibration processing module 1 can be detachably connected to one end of the first motion component 7; the other end of the first motion component 7 is detachably connected to one end of the second motion component 8; the other end of the second motion component 8 is detachably connected to the cross beam 5. Among them, the first motion component 7 and the second motion component 8 can adopt a high-precision ball screw or linear guide rail design to ensure that when driving the vibration processing module 1 to move along the first direction, it can maintain a stable and precise movement. Here, it does not constitute a limitation to the present utility model.

[0127] In some embodiments, the first motion component 7 may include a first linear motor, a first rolling guide, a first slider, and a base plate. Among them, the first linear motor and the first rolling guide are fixed to the front of the base plate. The first slider is arranged on the first rolling guide and connected to the first linear motor, and the vibration processing module 1 may be fixed on the first slider or connected to the first slider through a fixing component. During operation, by controlling the first linear motor, the first linear motor drives the first slider to move along the first rolling guide in the first direction, thereby driving the vibration processing module 1 to move in the first direction. Preferably, the first rolling guide is made of materials with high precision and low friction, such as marble, steel, or aluminum alloy, to ensure the smoothness and accuracy of the first slider moving on the first rolling guide, effectively reducing vibrations or frictions that affect the processing accuracy.

[0128] The second motion component 8 may include a second linear motor, a second rolling guide, and a second slider. As an example, the second linear motor and the second rolling guide may be arranged on the crossbeam 5. The second slider may be arranged on the second rolling guide and connected to the back of the base plate and the second linear motor respectively. During operation, by controlling the second linear motor, the second linear motor drives the second slider to move along the second rolling guide in the second direction, thereby realizing the driving of the first motion component 7 by the second motion component 8, and further driving the vibration processing module 1 to move in the second direction. Through the above settings, the vibration processing module 1 can not only move in the first direction but also move in the second direction, achieving all-round and high-precision processing of the substrate 13.

[0129] In summary, through the first motion component 7 and the second motion component 8 respectively driving the spindle for precision machining in the first direction and the second direction, after the machining is completed, the third motion component 9 drives the moving platform 3 to move out in the third direction, so that the moving platform 3 drives the vibration workbench 2 to move out of the machining area, enabling the operator to conveniently unload and reload the plates. The whole process improves the working efficiency and operation convenience of the substrate processing equipment.

[0130] Among them, the first direction, the second direction, and the third direction are perpendicular to each other in pairs. Specifically, this perpendicular relationship ensures that when the first motion component 7, the second motion component 8, and the third motion component 9 work independently in their respective directions, they will not interfere with each other, thereby realizing precise and stable motion control. For example, when the first motion component 7 drives the vibration processing module 1 to move in the first direction, the second motion component 8 can simultaneously adjust the processing position in the second direction, while the third motion component 9 can flexibly adjust the movement of the vibration workbench 2 in the third direction. Through this design, the substrate processing equipment can accurately position and operate in three-dimensional space, thereby realizing complex processing tasks.

[0131] Further, the substrate processing equipment further includes a laser displacement sensor 11 for detecting the actual amplitude and actual frequency of the processing worktable 21; the laser displacement sensor 11 is disposed on the processing worktable 21.

[0132] In some embodiments, the laser displacement sensor 11 can be mounted on the moving platform 3 below the processing worktable 21 by screws or other means. Further, by emitting a laser beam and receiving the reflected optical signal, the actual displacement of the surface of the processing worktable 21 is measured, so as to determine the actual amplitude and actual frequency of the processing worktable 21, realize the real-time detection of the vibration state of the processing worktable 21 during the processing, ensure that the cooperation between the vibration processing module 1 and the vibration worktable 2 reaches the best, and thus realize high-precision and low-wear processing.

[0133] Further, the laser displacement sensor 11 includes a laser emitter and a laser receiver. As an example, the laser emitter is used to emit a laser beam onto the surface of the processing worktable 21, and the laser beam will be reflected after contacting the surface. The laser receiver is used to receive these reflected optical signals, and thus calculate the vibration condition of the processing worktable 21 according to the intensity and frequency change of the reflected light, so as to ensure that the amplitude and frequency during the processing meet the preset processing requirements.

[0134] On the other hand, a substrate processing method is provided, which is applicable to the substrate processing equipment in the first aspect of the above embodiments. The substrate processing equipment includes a vibration processing module 1, a vibration worktable 2 and a control system 12. The substrate processing method includes:

[0135] S10. Obtain the processing parameters of the substrate 13;

[0136] In this embodiment, the processing parameters of the substrate 13 include substrate parameters and processing type parameters. Specifically, the substrate parameters may include substrate type and substrate inherent parameters. Among them, the substrate type includes high aspect ratio substrates, multi-layer stacked substrates or high density interconnect (HDI) substrates. The substrate inherent parameters include high aspect ratio substrate parameters, multi-layer stacked substrate parameters or high density interconnect substrate parameters.

[0137] As an example, the high aspect ratio substrate parameters include:

[0138] Total thickness: for example, 1.0 mm to 10.0 mm;

[0139] First material: for example, fiberglass composite material;

[0140] Second material: for example, conductive metal foil material.

[0141] The multi-layer stacked substrate parameters include:

[0142] Number of layers: for example, 4 layers to 20 layers or more;

[0143] Total thickness: for example, 1.5 mm to 10.0 mm;

[0144] First material: for example, fiberglass composite material;

[0145] Second material: for example, conductive metal foil material.

[0146] The parameters of the high density interconnect substrate include:

[0147] Thickness: for example, 0.5 mm to 3.0 mm;

[0148] Line width and pitch: for example, 50 µm to 150 µm.

[0149] First material: for example, fiberglass composite material;

[0150] Second material: for example, conductive metal foil material.

[0151] The processing type parameters may include drilling parameters, routing parameters, milling parameters or cutting parameters.

[0152] As an example, the drilling parameters include: drilling depth, spindle speed and feed rate;

[0153] The routing parameters include: cutting width, router diameter, cutting speed, router speed and feed rate;

[0154] The milling parameters include: milling depth, milling cutter diameter, spindle speed and feed rate;

[0155] The cutting parameters include: cutting depth, cutting speed and cutting accuracy.

[0156] It should be noted that the above high aspect ratio substrate, multi-layer stack substrate or high density interconnect (HDI) substrate can be formed by laminating the first material and the second material. For example, it is formed by laminating a fiberglass composite material and a conductive metal foil material. Among them, the thicknesses of the fiberglass composite material and the conductive metal foil material can be set according to actual needs and are not limited here.

[0157] S20. Determine the target vibration parameters corresponding to the processed substrate 13 according to the processing parameters.

[0158] In some embodiments, the target vibration parameters applicable to the substrate 13 are determined according to the processing parameters of the substrate 13, aiming to optimize the processing effect and ensure the processing quality. Specifically, the corresponding target vibration parameters can be preset according to the processing parameters of the substrate 13. Further, by inputting the processing parameters of the substrate 13, the corresponding target vibration parameters can be automatically queried, or can be determined by other means, which are not limited here.

[0159] As an example, the substrate 13 is a substrate with a high aspect ratio. The total thickness is 6.0 mm, the first material is a glass fiber composite material, the second material is a conductive metal foil material, and the via hole is 0.3 mm. Among them, the thickness of the glass fiber composite material is 0.5 mm, and the thickness of the conductive metal foil material is 0.1 mm. After inputting the above processing parameters, the control system 12 will automatically determine the required target vibration parameters according to the relationship table between the processing parameters of the substrate 13 and the target vibration parameters established in advance.

[0160] For example, when drilling the substrate 13, the target vibration parameters include the vibration parameters in the drilling-in stage, the vibration parameters in the middle of drilling, and the vibration parameters in the drilling-out stage. Among them, the vibration parameters in the drilling-in stage include a first parameter and a second parameter, the vibration parameters in the middle of drilling include a third parameter and a fourth parameter, and the vibration parameters in the drilling-out stage include a fifth parameter and a sixth parameter. Specifically, according to the processing parameters of the substrate 13 above, it can be determined that the first amplitude of the first parameter is 20 µm, the first frequency is 5 KHz, the second amplitude of the second parameter is 20 µm, the second frequency is 5 KHz, the third amplitude of the third parameter is 5 µm, the third frequency is 20 KHz, the fourth amplitude of the fourth parameter is 20 µm, the fourth frequency is 15 KHz, the fifth amplitude of the fifth parameter is 20 µm, the fifth frequency is 5 KHz, the sixth amplitude of the sixth parameter is 20 µm, and the sixth frequency is 15 KHz. It should be noted that the above is only an example and does not constitute a limitation specifically. In addition, the target vibration parameters in the present application can also be directly input by the user, and no limitation is made here.

[0161] S30. According to the target vibration parameters, control the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction, so as to form periodic contact and separation between the high-speed rotating processing tool 14 and the substrate 13.

[0162] In an embodiment, after obtaining the target vibration parameters, based on a preset processing program, the vibration processing module 1 and / or the vibration workbench 2 can be controlled to work in coordination, so as to form periodic contact and separation between the high-speed rotating processing tool 14 and the substrate 13. This coordinated vibration can enable the vibration processing module 1 to vibrate with a certain amplitude and frequency, and the vibration workbench 2 can be superimposed with vibration, expanding the vibration range and improving the flexibility and adaptability of the substrate processing equipment when processing substrates 13 with different shapes, sizes, and materials.

[0163] In an embodiment, the processing stage of the substrate 13 includes a first stage, a second stage, and a third stage, and the target vibration parameters include the vibration parameters in the first stage, the vibration parameters in the second stage, and the vibration parameters in the third stage. That is, in step S30, that is, in the step of controlling the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction according to the target vibration parameters, the following steps are included:

[0164] S31. When the processing stage is the first stage, control the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction according to the vibration parameters of the first stage.

[0165] In some embodiments, the first stage may be the drilling-in stage, and the vibration parameters of the first stage may be the vibration parameters of the drilling-in stage. As an example, when entering the first stage (e.g., the drilling-in stage), the control system 12 will control the vibration processing module 1 and / or the vibration workbench 2 to vibrate at a high frequency in the first direction according to the preset vibration parameters of the first stage (e.g., the vibration parameters of the drilling-in stage), so as to form periodic contact and separation between the high-speed rotating processing tool 14 and the substrate 13, thereby effectively reducing the resistance during initial drilling-in, improving the starting accuracy of drilling, and laying a good foundation for the subsequent drilling-middle stage.

[0166] In an embodiment, the vibration parameters of the first stage include a first parameter and a second parameter. That is, in step S31, that is, when controlling the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction according to the vibration parameters of the first stage, the following steps are included:

[0167] S311. Control the vibration processing module 1 to vibrate in the first direction according to the first parameter;

[0168] S322. Control the vibration workbench 2 to vibrate synchronously with the vibration processing module 1 in the first direction according to the second parameter.

[0169] In this embodiment, the first parameter includes a first amplitude and a first frequency, and the second parameter includes a second amplitude and a second frequency. Among them, the first parameter characterizes the control parameter of the vibration processing module 1 in the first stage, and the second parameter characterizes the control parameter of the vibration workbench 2 in the first stage. And the above amplitude range can be 0 µm to 20 µm, and the frequency range can be 0 KHz to 40 KHz. Preferably, the amplitude can be configured as 5 µm, 10 µm, 15 µm or 18 µm, and the frequency can be configured as 5 KHz, 10 KHz, 20 KHz, 30 KHz or 35 KHz. The specific values are not limited.

[0170] As an example, assume that the first amplitude of the determined first parameter is 20 µm, the first frequency is 5 KHz, the second amplitude of the second parameter is 20 µm, the second frequency is 5 KHz, and the processing stage of the substrate 13 is the drilling stage. At this time, the control system 12 will control the vibration processing module 1 to vibrate upward in the first direction according to the determined first parameter, and at the same time, according to the second parameter, control the vibration workbench 2 to vibrate downward in the first direction synchronously with the vibration processing module 1. At this time, since the vibration directions are opposite and the phases are opposite, a vibration with a maximum amplitude of 40 µm is formed, so that during the drilling process, the offset of the drill bit is reduced, ensuring that the transverse edge of the drill bit can accurately contact the surface of the substrate 13 and gradually drill into the substrate 13, improving the precise positioning ability of the processing, maintaining stable processing conditions, and effectively improving the processing accuracy and efficiency of the substrate 13.

[0171] It should be noted that the present application can also control the vibration processing module 1 to vibrate in the first direction solely according to the first parameter, or control the vibration workbench 2 to vibrate in the first direction solely according to the second parameter. The above example description is only a preferred method and does not constitute a limitation to the present utility model.

[0172] S32. When the processing stage is the second stage, control the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction according to the vibration parameters of the second stage.

[0173] In this embodiment, the second stage can be the middle drilling stage, and the vibration parameters of the second stage can be the vibration parameters of the middle drilling stage. As an example, when entering the second stage (for example, the middle drilling stage), the control system 12 controls the vibration processing module 1 and the vibration workbench 2 to work together according to the vibration parameters of the middle drilling stage, aiming to maintain a stable cutting state, reduce the influence of cutting heat and friction on the processing quality, ensure the smoothness and dimensional accuracy of the hole wall, and achieve an efficient and high-precision middle drilling process.

[0174] In one embodiment, the vibration parameters of the second stage include a third parameter and a fourth parameter, the processing parameters of the substrate 13 include the inherent parameters of the substrate 13, and the inherent parameters of the substrate 13 include a first material and a second material. That is, in step S32, that is, when controlling the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction according to the vibration parameters of the second stage, the following steps are included:

[0175] S321. When processing the first material of the substrate 13, control the vibration processing module 1 to vibrate in the first direction according to the third parameter;

[0176] S322. When processing the second material of the substrate 13, control the vibration workbench 2 to vibrate in the first direction according to the fourth parameter.

[0177] In this embodiment, the first material may be a glass fiber composite material, the second material may be a conductive metal foil material, the third parameter includes a third amplitude and a third frequency, and the fourth parameter includes a fourth amplitude and a fourth frequency. Among them, the third parameter characterizes the control parameter of the vibration processing module 1 in the second stage, and the fourth parameter characterizes the control parameter of the vibration workbench 2 in the second stage. And the above amplitude range may be 0 µm to 20 µm, and the frequency range may be 0 KHz to 40 KHz. Preferably, the amplitude may be configured as 5 µm, 10 µm, 15 µm or 18 µm, and the frequency may be configured as 5 KHz, 10 KHz, 20 KHz, 30 KHz or 35 KHz. Specifically, it is not limited.

[0178] As an example, assume that the third amplitude of the determined third parameter is 20 µm, the third frequency is 5 KHz, the fourth amplitude of the fourth parameter is 20 µm, and the fourth frequency is 5 KHz. The processing stage of the substrate 13 is the middle drilling stage. At this time, the control system 12 will control the vibration processing module 1 and the vibration workbench 2 to work according to the above determined preset processing program. For example, when processing the glass fiber composite material of the substrate 13, the vibration processing module 1 is controlled to vibrate along the first direction according to the third parameter. For example, the vibration processing module 1 is controlled to vibrate along the first direction with an amplitude of 5 µm and a frequency of 20 KHz. When processing the conductive metal foil of the substrate 13, the vibration processing module 1 is controlled to turn off, and the vibration workbench 2 is controlled to vibrate along the first direction with the fourth parameter. For example, the vibration workbench 2 is controlled to vibrate along the first direction with an amplitude of 20 µm and a frequency of 15 KHz. Thus, the substrate processing equipment can automatically adjust the opening and closing of the vibration processing module 1 and the vibration workbench 2 through a preset processing program, which not only reduces the need for manual intervention, but also improves the processing accuracy and efficiency.

[0179] It should be noted that the present application can also control the vibration processing module 1 to vibrate along the first direction separately according to the third parameter, or control the vibration workbench 2 to vibrate along the first direction separately according to the fourth parameter. The above example description is only a preferred method and does not constitute a limitation to the present invention.

[0180] In one embodiment, according to the vibration parameters in the second stage, controlling the vibration processing module 1 and / or the vibration workbench 2 to vibrate along the first direction further includes the following steps:

[0181] S323. Real-time obtain the processing state of the first material and / or the second material, where the processing state includes about to process and about to complete processing;

[0182] S324. Based on the processing state, control the vibration processing module 1 to vibrate along the first direction with the third parameter and the vibration workbench 2 to vibrate along the first direction synchronously with the vibration processing module 1 with the fourth parameter.

[0183] In some embodiments, during the processing of the substrate 13, since the substrate 13 is formed by laminating a first material and a second material, for example, formed by laminating a glass fiber composite material and a conductive metal foil material, therefore, when the processing of the first material (such as the glass fiber composite material) is about to be completed and the processing of the second material (such as the conductive metal foil material) is about to start, turning on the vibration workbench 2 in advance can enable the two vibration sources (the vibration processing module 1 and the vibration workbench 2) to form a composite vibration in terms of time and space, thereby achieving a smooth transition. This transition helps to reduce the processing instability and quality fluctuations caused by the sudden change of material properties.

[0184] Specifically, when the processing state of the first material obtained by the control system 12 in real time is about to complete processing, or, the processing state of the second material obtained is about to be processed, or, the processing state of the first material obtained is about to complete processing and the state of the second material is about to be processed, at this time, the vibration workbench 2 can be controlled to vibrate synchronously with the vibration processing module 1 in the first direction with a fourth parameter. It should be noted that the above is only one case and does not constitute a limitation.

[0185] It should be noted that the above processing state can be obtained by setting sensors inside the vibration processing module 1 and connecting them to the processing tool 14, and then by real-time detecting the position, speed, pressure of the processing tool 14 and the contact situation with the material, so as to obtain the processing state of the first material or the second material, or it can also be obtained by other means, and here it is not limited. It should be understood that the above processing state can also include being in the process of processing and other states, and here it is also not limited.

[0186] S33. When the processing stage is the third stage, control the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction according to the vibration parameters of the third stage.

[0187] In this embodiment, the third stage can be the drilling stage, and the vibration parameters of the third stage can be the vibration parameters of the drilling stage. As an example, when the processing stage advances to the third stage (for example, the drilling stage), the control system 12 controls the vibration processing module 1 and / or the vibration workbench 2 to vibrate at a high frequency in the first direction according to the preset vibration parameters of the third stage (for example, the vibration parameters of the drilling stage), aiming to reduce the cutting force and impact force during drilling, prevent cracks or breakages on the surface of the substrate 13, and at the same time ensure the flatness and dimensional accuracy of the hole opening.

[0188] In one embodiment, the vibration parameters of the third stage include a fifth parameter and a sixth parameter, that is, in step S33, that is, according to the vibration parameters of the third stage, controlling the vibration processing module 1 and / or the vibration workbench 2 to vibrate in the first direction includes the following steps:

[0189] S331. Control the vibration processing module 1 to vibrate in the first direction according to the fifth parameter, or control the vibration workbench 2 to vibrate in the first direction according to the sixth parameter.

[0190] In this embodiment, the fifth parameter includes a fifth amplitude and a fifth frequency, and the sixth parameter includes a sixth amplitude and a sixth frequency. Among them, the fifth parameter represents the control parameter of the vibration processing module 1 in the third stage, and the sixth parameter represents the control parameter of the vibration workbench 2 in the third stage. And the above amplitude range can be 0 µm to 20 µm, and the frequency range can be 0 KHz to 40 KHz. Preferably, the amplitude can be configured as 5 µm, 10 µm, 15 µm or 18 µm, and the frequency can be configured as 5 KHz, 10 KHz, 20 KHz, 30 KHz or 35 KHz, and the specific values are not limited.

[0191] As an example, assume that the fifth amplitude of the determined fifth parameter is 5 µm, the fifth frequency is 20 KHz, the sixth amplitude of the sixth parameter is 5 µm, and the sixth frequency is 20 KHz, and the processing stage of the substrate 13 is the drilling stage. At this time, the control system 12 can control the vibration processing module 1 to vibrate in the first direction with an amplitude of 5 µm and a frequency of 20 KHz according to the above determined preset processing program, or can control the vibration workbench 2 to vibrate in the first direction with an amplitude of 5 µm and a frequency of 20 KHz. In this way, by controlling either of them to work, when the processing tool 14 is about to drill out the substrate 13, the exit burrs can be effectively reduced and the surface quality of the hole can be improved. It should be noted that the present application can also control the vibration processing module 1 and the vibration workbench 2 to vibrate in the first direction at the same time with a relatively low frequency and amplitude. The above example only describes a preferred method and does not constitute a limitation to the present invention.

[0192] It can be understood that the processing stage in the present application can be determined by setting a sensor inside the vibration processing module 1 and connecting it to the processing tool 14 to detect whether the processing tool 14 contacts the substrate 13 and the material being processed, or can be determined by other means, which is not limited here. Among them, the material being processed can be judged according to the conductivity of the material, which is also not limited here.

[0193] In summary, in one of the solutions provided by the embodiments of the present utility model, the processing parameters of the substrate 13 are obtained; according to the processing parameters, the target vibration parameters corresponding to the processing of the substrate 13 are determined; according to the target vibration parameters, the vibration processing module 1 and / or the vibration workbench 2 are controlled to vibrate in the first direction, so as to form periodic contact and separation between the high-speed rotating processing tool 14 and the substrate 13. In this embodiment, through the target vibration parameters, the vibration processing module 1 and / or the vibration workbench 2 are synergistically controlled to work, avoiding the defects that are difficult to take into account simultaneously in the single vibration mode when processing laminated materials such as the substrate 13, reducing the cutting heat damage and delamination damage, and improving the processing quality of the substrate 13 and the service life of the processing tool 14.

[0194] The second aspect of the present utility model provides a substrate processing system, and the substrate processing system at least includes a substrate processing device described in the embodiments of the first aspect.

[0195] It should be noted that a substrate processing device provided in the embodiments of the first aspect of the present utility model can also be set as a substrate processing device with two vibration processing modules 1 or six vibration processing modules 1. Here, the present utility model does not make any limitations.

[0196] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model, and all should be included in the protection scope of the present utility model.

Claims

1. A substrate processing device, characterized in that, It includes a vibration processing module and a vibration workbench; The vibration processing module is used to drive a high-speed rotating processing tool to vibrate in a first direction at a set first amplitude and first frequency during the processing, so as to form periodic contact and separation between the processing tool and a substrate fixed on the vibration workbench; The vibration workbench is used to drive the substrate thereon to vibrate along the first direction at a set second amplitude and second frequency during the processing.

2. The substrate processing equipment according to claim 1, wherein The vibration processing module includes an ultrasonic vibration processing module, and the ultrasonic vibration processing module includes an ultrasonic vibration spindle.

3. The substrate processing equipment according to claim 2, characterized in that, The ultrasonic vibration spindle includes an ultrasonic vibration module and a first spindle body; One end of the ultrasonic vibration module is connected to one end of the first spindle body; The other end of the first spindle body is connected to one end of the processing tool.

4. The substrate processing equipment according to claim 3, characterized in that, The ultrasonic vibration spindle further includes an ultrasonic tool holder; The other end of the first spindle body is connected to one end of the ultrasonic tool holder; The other end of the ultrasonic tool holder is connected to one end of the processing tool.

5. The substrate processing equipment according to claim 3, wherein The ultrasonic vibration module includes a first transducer and a first horn; The output end of the first transducer is connected to one end of the first horn; The other end of the first horn is connected to one end of the first spindle body.

6. The substrate processing apparatus according to claim 2, wherein, The ultrasonic vibration spindle includes a hydrostatic ultrasonic electric spindle.

7. The substrate processing equipment according to claim 6, characterized in that, The hydrostatic ultrasonic electric spindle includes an aerostatic hydrostatic ultrasonic electric spindle, and the aerostatic hydrostatic ultrasonic electric spindle includes a second spindle body, an air circuit structure, a thrust plate, and a rotating shaft core arranged inside the second spindle body; The thrust plate is arranged on the rotating shaft core; The air circuit structure is arranged inside the second spindle body and is used to guide high-pressure air to act on both sides of the thrust plate respectively, so as to drive the thrust plate to drive the rotating shaft core to vibrate along the first direction, and further drive the processing tool to vibrate synchronously along the first direction.

8. The substrate processing equipment according to claim 1, characterized in that, The vibration workbench includes an ultrasonic vibration workbench, and the ultrasonic vibration workbench includes a processing workbench and an ultrasonic vibration device; One end of the ultrasonic vibration device is connected to the processing workbench; The ultrasonic vibration device is used to drive the substrate on the processing workbench to vibrate along the first direction at a set second amplitude and second frequency during the processing.

9. The substrate processing equipment according to claim 8, characterized in that, It includes at least one of the ultrasonic vibration devices and is arranged on the processing workbench in a uniformly arranged manner; wherein, the ultrasonic vibration device includes a second transducer, a second horn, and a resonance body; The output end of the second transducer is connected to one end of the second horn; The other end of the second horn is connected to one end of the resonance body; The other end of the resonance body is connected to the processing workbench.

10. The substrate processing equipment according to claim 9, characterized in that, The ultrasonic vibration device includes an aerostatic ultrasonic vibration device, and the aerostatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, and a vibration rod; The output end of the vibration rod is detachably connected to the processing workbench; The bearing mounting cover is detachably connected to the bearing mounting base; The vibration rod is arranged in a accommodation chamber formed by the bearing mounting cover and the bearing mounting base and is used to drive the substrate on the processing workbench to vibrate in the first direction.

11. The substrate processing equipment according to claim 10, characterized in that, The aerostatic ultrasonic vibration device further includes a first aerostatic bearing, a second aerostatic bearing, and an air-floating vibration plate disposed on the vibration rod; The first aerostatic bearing is fixedly installed on the bearing mounting cover; The second aerostatic bearing is fixedly installed on the bearing mounting base; The central axis of the vibration rod is perpendicular to the central axes of the first aerostatic bearing and the second aerostatic bearing respectively, and the air-floating vibration plate is located between the first aerostatic bearing and the second aerostatic bearing; An air inlet hole is provided on the bearing mounting base, a first air inlet passage is provided between the first aerostatic bearing and the bearing mounting cover, and a second air inlet passage is provided between the second aerostatic bearing and the bearing mounting base; Both the first air inlet passage and the second air inlet passage are communicated with the air inlet hole, so that the high-pressure air introduced through the air inlet hole enters the first annular air groove on the first aerostatic bearing through the first air inlet passage, and then a first air film is formed between the first aerostatic bearing and the air-floating vibration plate. After entering the second annular air groove on the second aerostatic bearing through the second air inlet passage, a second air film is formed between the second aerostatic bearing and the air-floating vibration plate; The first air film and the second air film generate different pressures on both sides of the air-floating vibration plate, so that the air-floating vibration plate drives the vibration rod to vibrate along the first direction.

12. The substrate processing equipment according to claim 11, wherein The aerostatic ultrasonic vibration device further includes a third aerostatic bearing; The third aerostatic bearing is fixedly installed on the bearing mounting base; A third air inlet passage is provided between the third aerostatic bearing and the bearing mounting base; The third air inlet passage is communicated with the air inlet hole, so that the high-pressure air introduced through the air inlet hole enters the third annular air groove on the third aerostatic bearing through the third air inlet passage and then fills the accommodation chamber to form a third air film for supporting the suspension of the vibration rod.

13. The substrate processing apparatus according to claim 12, wherein The aerostatic ultrasonic vibration device further includes a muffler; The bearing mounting base is provided with an outlet communicated with the accommodation chamber, and the muffler is arranged at the outlet.

14. The substrate processing equipment according to any one of claims 8-13, characterized in that, The substrate processing equipment further includes a bed body, a gantry system, and a moving platform; A channel is formed between the gantry system and the bed body; The gantry system and / or the moving platform is / are movably arranged on the bed body along a third direction, and the moving platform can drive the vibration workbench to move into or out of the channel relative to the channel; The vibration processing module is movably arranged on the gantry system along a second direction, and the vibration processing module can move along the first direction; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

15. The substrate processing equipment according to claim 14, characterized in that, The substrate processing equipment further includes a laser displacement sensor for detecting the actual amplitude and actual frequency of the processing workbench; The laser displacement sensor is arranged on the processing workbench.

16. A substrate processing system, characterized in that, The processing types of the substrate include drilling, routing, milling or cutting, and / or, the substrate includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect substrate; the substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device as described in any one of claims 1-15.

Images