Vapor chamber with high-temperature-uniformity bending structure
By setting grooves and support columns on the inner and outer surfaces of the shell of the ultra-thin heat-smoothing plate, the problem of heat transfer obstacles under bending conditions is solved, efficient heat dissipation and structural stability are achieved, and it is suitable for highly integrated and miniaturized electronic devices.
Patent Information
- Application Number
- CN202323217207.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-27
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2033-11-27
AI Technical Summary
The existing ultra-thin heat-superior plates are hindered due to collapse and compression of the steam channel under bending conditions, and good temperature uniformity performance cannot be guaranteed.
A bend area is set on the inner and/or the outer surface of the shell, and several grooves are set up in the bend area. The cross-sectional shape of the grooves is rectangular or trapezoidal, supporting columns are set inside the shell, and a rough layer or a thermal conductive layer is provided on the surface of the grooves, the thickness of the shell is 0.05-1mm, and the distance between adjacent grooves is 0.02-0.1mm.
It enhances the heat exchange efficiency between the bending zone and the external environment, improves the structural strength distribution, extends the service life of the heat-efficient plate, reduces manufacturing costs, and is suitable for heat dissipation of highly integrated and miniaturized electronic devices.
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Figure CN223157439U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat pipes, in particular to a heat pipe with a bending structure having high temperature uniformity. Background Art
[0002] With the emergence and rapid development of the fifth-generation mobile communication technology (5G technology), electronic products, especially products such as smart phones and tablet computers, are increasingly developing towards high performance, high integration, and miniaturization. Taking mobile phones as an example, the full-load power consumption has increased from the initial 1W to more than 5W, and may even reach 15W in the future. Therefore, for portable electronic devices, developing a heat dissipation method that can handle high heat dissipation power in an extremely narrow space (<1mm) has become a common and urgent need.
[0003] The ultra-thin heat pipe has the characteristics of self-driving, high equivalent thermal conductivity, light weight, and compact structure, and is widely used in the heat dissipation of electronic components in narrow spaces. However, when facing some complex working environments, the conventional flat ultra-thin heat pipe will face the test of performance attenuation, such as folding screen mobile phones, folding screen laptops, etc. Therefore, optimizing the housing structure of the ultra-thin heat pipe has become a key factor in improving the working life of the ultra-thin flat heat pipe.
[0004] At present, the housing structure adopted by the ultra-thin heat pipe is a conventional planar type. However, under bending conditions, due to the collapse and compression of the steam channel, the heat transfer process is blocked, resulting in a higher temperature at the bending part of the heat pipe during operation, and it is impossible to ensure good temperature uniformity performance. Summary of the Utility Model
[0005] In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to provide a heat pipe with a bending structure having high temperature uniformity, which can solve the problem that under bending conditions, due to the collapse and compression of the steam channel and the blockage of the heat transfer process, the temperature of the bending area of the heat pipe during operation is relatively high, and it is impossible to ensure good temperature uniformity performance.
[0006] To achieve this purpose, the utility model adopts the following technical solutions:
[0007] A heat pipe with a bending structure having high temperature uniformity provided by the utility model includes a housing, and a bending area is provided on the inner surface and / or outer surface of the housing, and a plurality of grooves are provided on the bending area.
[0008] Preferably, the cross-sectional shape of the groove is trapezoidal.
[0009] Preferably, a plurality of support columns are provided inside the housing, and the support columns are located inside the bending area.
[0010] The preferred technical solution of the present utility model is that the surface of the groove is provided with a rough layer.
[0011] The preferred technical solution of the present utility model is that the surface of the groove is provided with a heat-conducting layer.
[0012] The preferred technical solution of the present utility model is that the thickness of the housing is 0.05 - 1 mm.
[0013] The preferred technical solution of the present utility model is that the distance between adjacent grooves is 0.02 - 0.1 mm.
[0014] The preferred technical solution of the present utility model is that the housing includes an outer housing and an inner housing, the groove is provided on the outer housing and / or the inner housing, and the depth of the groove is 10% - 50% of the minimum thickness of the outer housing and / or the inner housing.
[0015] The beneficial effects of the present utility model:
[0016] The present utility model provides a heat pipe with a high isothermal bending structure. By setting a groove structure in the bending area of the heat pipe, the grooves in the bending area will increase the specific surface area due to being stretched, thereby enhancing the heat exchange efficiency between the bending area and the external environment. In addition, the setting of the groove structure can further improve the structural strength distribution of the heat pipe in the bending area and reduce the stress concentration of the material in the bending area. This helps to extend the service life of the heat pipe and reduce fatigue problems caused by long-term use and temperature changes. The structure of the present utility model is simple, has low assembly requirements, can be implemented based on industrial production of heat pipes, has low cost, and is easy to process and operate. The parts involved have low precision requirements and are easy to process, are convenient and practical, and have a wide range of application scenarios. Description of the Drawings
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0018] Figure 1 It is a three-dimensional view of the non-bent state of the heat pipe with a high isothermal bending structure in Embodiment 1;
[0019] Figure 2 It is a three-dimensional view of the bent state of the heat pipe with a high isothermal bending structure in Embodiment 1;
[0020] Figure 3 For Figure 2 The enlarged view of part A;
[0021] Figure 4 Schematic diagram of the inner processing structure of the outer casing in the first embodiment;
[0022] Figure 5 Schematic flow diagram of the processing method of the heat pipe with a high-temperature uniformity bending structure in the first embodiment;
[0023] Figure 6 Partial enlarged view of the groove structure in the fourth embodiment;
[0024] Figure 7 Schematic diagram of the inner processing structure of the outer casing in the fifth embodiment;
[0025] Figure 8 Partial enlarged view of the groove structure in the seventh embodiment;
[0026] Figure 9 Partial enlarged view of the groove structure in the eighth embodiment.
[0027] In the figure:
[0028] 1 - housing; 11 - outer casing; 111 - inner cavity; 112 - welding frame; 12 - inner casing; 2 - bending area; 3 - groove; 4 - support column; 5 - rough layer; 6 - heat conduction layer; 7 - non-bending area. Detailed implementation manners
[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.
[0030] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0031] Embodiment 1
[0032] As shown Figure 1-4 in the figure, a heat pipe with a high isothermal bending structure provided in this embodiment includes a housing 1. A bending area 2 and a non-bending area 7 are provided on the inner surface and the outer surface of the housing 1, and a plurality of grooves 3 are opened on the bending area 2. The working principle of this bending structure is that when the heat pipe undergoes bending deformation, no matter which side it bends to, the bending structure on the other side will increase the specific surface area due to being stretched, thereby enhancing the heat exchange efficiency between the bending area and the external environment. Compared with the traditional structure, this structure improves the heat dissipation ability of the heat pipe in the bending area, thus ensuring that the ultra-thin heat pipe still has good isothermal performance under bending conditions. In addition, the groove structure provided on the bending area can further improve the structural strength distribution of the heat pipe in the bending area and reduce the stress concentration of the material in the bending area. This helps to extend the service life of the heat pipe and reduce fatigue problems caused by long-term use and temperature changes.
[0033] Specifically, the cross-sectional shape of the groove is rectangular. The rectangular shape is relatively simple and easier to process and manufacture. Using a rectangular-shaped groove may reduce the manufacturing complexity, reduce the manufacturing cost, and improve the production efficiency. This is a very important consideration for large-scale production and wide application. In addition, compared with some complex shapes, the rectangular cross-section is easier to maintain the structural stability and strength. In the bending area of the heat pipe, choosing a rectangular shape may be more conducive to reducing stress concentration, ensuring sufficient structural strength during bending, and preventing deformation or damage.
[0034] Preferably, the thickness of the housing 1 is 0.05 - 1 mm. The thickness of the housing directly affects the heat conduction performance of the heat pipe. A thinner housing usually has better heat conductivity and helps to transfer heat more effectively. On the other hand, an appropriate housing thickness can also provide sufficient structural strength without significantly increasing the thermal resistance, thus contributing to heat dissipation. In this embodiment, the thickness of the housing 1 is 1 mm.
[0035] Preferably, the distance between adjacent grooves 3 is 0.02 - 0.1 mm. A smaller distance between adjacent grooves can ensure the maximization of the surface area between the grooves. By increasing the surface area, the heat pipe can absorb or dissipate heat more effectively, improving the overall heat transfer efficiency. However, too small a groove distance may cause problems with mechanical strength. During the manufacturing, assembly, and use processes, there may be risks of extrusion, deformation, or damage, affecting the long-term reliability of the heat pipe. In this embodiment, 0.05 mm is adopted.
[0036] For convenient processing and assembly, the housing 1 includes an outer housing 11 and an inner housing 12. The inner surface and the outer surface are the outward-facing surfaces of the outer housing 11 and the inner housing 12 respectively. The groove 3 is provided on the inner surface and the outer surface. Preferably, the depth and width of the groove 3 of the outer housing 11 and the inner housing 12 are 10%-50% of the minimum thickness of the outer housing 11 and the inner housing 12. In this embodiment, the minimum thickness of both the outer housing 11 and the inner housing 12 is 0.3 mm, and the depth and width of the groove are 20% of the minimum thickness, that is, the depth and width of the groove are 0.06 mm.
[0037] Preferably, the material of the housing is copper. Copper has excellent thermal conductivity and is an excellent heat dissipation material. By selecting copper as the material for the vertical part, the left wing part and the right wing part, the thermal conductivity of the heat pipe can be effectively improved, promoting more efficient heat transfer. Copper is a material with good plasticity, which is convenient for processing into complex shapes and helps to achieve a more flexible heat pipe design. This plasticity makes copper easier to process and form during manufacturing.
[0038] A heat dissipation working medium is provided inside the heat pipe with a high isothermal bending structure, and the heat dissipation working medium is deionized water. The heat dissipation working medium is deionized water with a resistivity of 18.2 MΩ·cm, and the vacuum degree inside after vacuum treatment is 7 Pa. After condensation, the heat dissipation working medium returns to the evaporation end through the capillary action of the wick for the second stage of heat transfer, realizing the internal heat cycle of the primary system.
[0039] As Figure 5 shown, the processing method of the heat pipe with a high isothermal bending structure in this embodiment is briefly described as follows:
[0040] The housing of the heat pipe is composed of welding the outer housing 11 and the inner housing 12. Specifically, taking the outer housing 11 as an example: Step 1, prepare the plate shell that needs to be grooved, ultrasonically clean the plate shell and dry it; Step 2, divide the bending area and coat photoresist on the bending area; Step 3, expose the surface coated with photoresist through a mold. In this embodiment, the mold used is a mold provided with multiple rectangular spaced light-transmitting openings, and the bending area is exposed through the mold; Step 4, develop, and the unexposed photoresist is dissolved; Step 5, through chemical etching, control the etching depth with an accuracy of 3 μm. The inner housing is processed in the same way.
[0041] Then, on the other side of the outer shell and the inner shell, a cavity 111 for setting the liquid absorption core is processed. The processing method of the cavity can be through conventional chemical etching or laser processing. The flexible liquid absorption core is welded into the cavity 111, and the outer shell and the inner shell are welded and assembled along the welding frame 112, and then conventional operations such as liquid injection and sealing are carried out to make them into one body. Among them, the flexible liquid absorption core can be a general wire mesh or a woven belt with strong bendability. In this embodiment, a metal woven belt treated by chemical corrosion is adopted. The subsequent process bends the welded heat pipe for the parts that need to be bent, and uses a conventional bending die to bend the bending area to obtain a heat pipe with a high isothermal bending structure.
[0042] It should be noted that after the surface groove structure of the present utility model is processed, additional surface treatment processes are carried out, including but not limited to spraying high thermal conductivity materials, oxidation treatment and other methods to increase the surface roughness of the micro-groove structure, thereby further increasing its specific surface area and improving the heat dissipation efficiency at the bending part. The above embodiments are only one example of the strengthening process, and the rest of the methods for increasing the surface roughness of the micro-groove structure belong to the protection scope.
[0043] The newly added process technical steps increase the processing cost of the heat pipe to a certain extent, but its structure improves the bending efficiency and performance, reduces the scrap rate in the bending manufacturing process, thereby reducing the manufacturing cost. By improving the overall performance of the heat pipe, it can be applied in a wider range of application fields. For example, in electronic devices, industrial devices or other heat transfer fields that require high isothermal bending application scenarios.
[0044] Embodiment 2
[0045] A heat pipe with a high isothermal bending structure provided in this embodiment is different from that in Embodiment 1 in that the grooves are only opened on the inner surface of the shell. Since the bending area is only provided on the inner surface of the shell, compared with the bending areas provided on both the inner and outer surfaces of the entire shell, materials can be saved and the manufacturing cost can be reduced. Moreover, due to the reduction of the grooves, the strength of the overall structure of the bending area is increased, which is suitable for the application occasions where the heat dissipation of the inner surface is enhanced.
[0046] Embodiment 3
[0047] A heat pipe with a high isothermal bending structure provided in this embodiment is different from that in Embodiment 1 in that the grooves are only opened on the outer surface of the shell. Since the bending area is only provided on the outer surface of the shell, compared with the bending areas provided on both the inner and outer surfaces of the entire shell, materials can be saved and the manufacturing cost can be reduced. Moreover, due to the reduction of the grooves, the strength of the overall structure of the bending area is increased, which is suitable for the application occasions where the heat dissipation of the outer surface is enhanced.
[0048] Embodiment 4
[0049] A heat pipe with a high isothermal bending structure provided in this embodiment is different from that in the first embodiment in that the cross-sectional shape of the groove 3 is trapezoidal, as Figure 6 shown. Compared with the shapes of some sharp edges, the trapezoidal cross-section is more likely to reduce stress concentration. This helps to improve the structural stability of the heat pipe during operation and reduce the risk of breakage caused by stress concentration. In addition, under the same groove volume, the trapezoidal cross-section has a larger specific surface area. After testing, under the same groove volume, the heat pipe with a trapezoidal cross-section in the second embodiment has a stronger heat dissipation capacity than the heat pipe with a rectangular cross-section in the first embodiment.
[0050] Embodiment Five
[0051] A heat pipe with a high isothermal bending structure provided in this embodiment is different from that in the first embodiment in that a number of support columns 4 are provided inside the housing. Specifically, an inner cavity 111 for setting the wick and the support columns 4 are processed on the other side of the outer housing and the inner housing. The support columns are located inside the bending area, as Figure 7 shown. Providing support columns inside helps to increase the structural strength of the heat pipe in the bending area. The support columns can effectively disperse external forces or stresses, reduce the structural stress concentration at the bending point, and improve the overall structural strength of the heat pipe. The presence of the support columns can slow down or resist the deformation and distortion of the bending area. When the heat pipe is working, it may be affected by external pressures or forces. The support columns help to prevent excessive deformation of the bending area and ensure that the heat pipe maintains its original shape.
[0052] Embodiment Six
[0053] A heat pipe with a high isothermal bending structure provided in this embodiment is different from that in the first embodiment in that the grooves are formed by laser micromachining technology. Laser micromachining technology has high precision and fineness and can form grooves at the micron scale. This can provide a more precise and delicate structure, which is suitable for applications that require high precision. Compared with chemical etching, laser micromachining does not involve the use of corrosive agents and chemicals, so it is more environmentally friendly and avoids the problem of chemical pollution. Compared with the chemical etching method, the processing depth of laser micromachining may be limited, which may not be ideal for applications that require deeper grooves.
[0054] Embodiment Seven
[0055] The difference between the heat spreader with a high temperature uniformity bending structure provided in this embodiment and the embodiment 1 is that after the grooves are formed by chemical etching, specifically, the bending area is immersed in a sufficient amount of a mixed solution of 2 mol / L NaOH and 0.1 mol / L K2S2O8 at room temperature (20-25°C) for 40 minutes, so that a micro-nano oxide layer structure with high bending strength is generated on its surface, and the oxide layer structure increases the surface roughness of the groove structure, and simultaneously forms a rough layer 5, such as Figure 8 As shown, the specific surface area is further increased, and the heat dissipation efficiency at the bend is further improved.
[0056] Embodiment 8
[0057] The difference between the heat spreader with a high temperature uniformity bending structure provided in this embodiment and the first embodiment is that after the grooves are formed by chemical etching, a high thermal conductivity material is sprayed on the grooves by a spraying process to form a thermal conductive layer 6, such as Figure 9 As shown. Graphene is used in this embodiment. Graphene has excellent thermal conductivity, and spraying it on the grooves can significantly improve the thermal conductivity of the heat spreader. This helps to transfer heat more efficiently and improve the thermal uniformity of the entire heat spreader. In addition, the graphene film can be applied to the grooves in a relatively thin form, adding almost no additional burden or weight. This is an advantage for applications that require lightweight design.
[0058] The present invention is described through preferred embodiments. Those skilled in the art will appreciate that, without departing from the spirit and scope of the present invention, various changes or equivalent substitutions can be made to these features (such as changing the processing depth, processing area, processing width and other parameters of the bending structure) and embodiments. The present invention is not limited to the specific embodiments disclosed herein, and other embodiments falling within the claims of this application are within the scope of protection of the present invention.
Claims
1. A heat pipe with a bending structure having high temperature uniformity, characterized in that: It includes a housing (1), a bending area (2) is provided on the inner surface and / or outer surface of the housing (1), and a plurality of grooves (3) are formed in the bending area (2); A rough layer (5) is provided on the surface of the groove (3).
2. The heat pipe with a bending structure having high temperature uniformity according to claim 1, characterized in that: The cross-sectional shape of the groove (3) is trapezoidal.
3. The heat pipe with a bending structure having high temperature uniformity according to claim 1, characterized in that: A plurality of support columns (4) are arranged inside the housing (1), and the support columns (4) are located inside the bending area (2).
4. The heat pipe with a bending structure having high temperature uniformity according to claim 1, characterized in that: A heat conduction layer (6) is provided on the surface of the groove (3).
5. The heat pipe with a bending structure having high temperature uniformity according to claim 1, characterized in that: The thickness of the housing (1) is 0.05 - 1 mm.
6. The heat pipe with a bending structure having high temperature uniformity according to claim 1, characterized in that: The distance between adjacent grooves (3) is 0.02 - 0.1 mm.
7. The heat pipe with a bending structure having high temperature uniformity according to claim 1, characterized in that: The housing (1) includes an outer housing (11) and an inner housing (12), the groove (3) is provided on the outer housing (11) and / or the inner housing (12), and the depth of the groove (3) is 10% - 50% of the minimum thickness of the outer housing (11) and / or the inner housing (12).
Citation Information
Cited By
Vapor chamber and electronic equipment
CN121335055A