Heat dissipation structure and protective shell of handheld electronic product comprising heat dissipation structure

Abstract

The utility model discloses a heat dissipation structure and a protective shell of a handheld electronic product comprising the heat dissipation structure, and particularly relates to the technical field of heat dissipation of protective shells. The heat dissipation structure comprises a heat dissipation plate which is located on one side face of the heat dissipation plate and used for being in contact with the back face of the handheld electronic product; and the heat dissipation surface is positioned on the other side surface of the heat dissipation plate and is parallel to the connecting surface. Wherein a heat dissipation cavity is formed in the heat dissipation plate, the interior of the heat dissipation cavity is in a vacuum sealing state, and the heat dissipation cavity is filled with a flowable cooling medium; and the vaporization critical point of the cooling medium is lower than 30 DEG C. According to the utility model, the problems that the heat dissipation effect is poor and the heat dissipation is hindered in the actual use process of the protection shell of the existing handheld electronic product can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of a shell, in particular to a heat dissipation structure and a protective shell of a handheld electronic product including the same. Background Art

[0002] With the progress of technology and the development of the Internet, the rapid development of electronic products has been driven. In recent years, the performance of handheld electronic products has become more comprehensive and powerful, and has continuously penetrated into all fields of life. For example, mobile phones, handheld computers, or handheld readers are often used in people's daily lives.

[0003] In order to improve the protection of handheld electronic products, a protective shell is usually attached to the electronic product. On the one hand, the protective shell realizes the protection of the handheld electronic product, and on the other hand, it can also be used to improve the beautification effect of the handheld electronic product.

[0004] At present, the protective shells of existing handheld electronic products are usually made of silicone material, metal material, or PVC hard plastic material. However, when the handheld electronic product is in use or charging, it will generate a certain amount of heat to varying degrees. Due to the existence of the protective shell, the heat generated by the handheld electronic product cannot be dissipated in time, and then accumulates in the components. The too high temperature of the components will cause problems such as the device freezing, running not smoothly, crashing, and component damage. As a result, the protective shell of the current handheld electronic product cannot achieve the heat dissipation effect in actual use, and it will also hinder the heat dissipation of the mobile phone, which not only seriously affects the service life and performance of the handheld electronic product, but also affects the actual use experience. Summary of the Utility Model

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present utility model is to disclose a heat dissipation structure and a protective shell of a handheld electronic product including the same, so as to improve the problem that the existing protective shell of the handheld electronic product has poor heat dissipation effect and will also hinder heat dissipation in actual use.

[0006] To achieve the above purpose and other related purposes, the present utility model discloses a heat dissipation structure, which includes:

[0007] A heat dissipation plate, which includes:

[0008] A connection surface, which is located on one side of the heat dissipation plate and is used for contacting and setting with the back surface of the handheld electronic product;

[0009] A heat dissipation surface, which is located on the other side of the heat dissipation plate and is arranged parallel to the connection surface;

[0010] Wherein, a heat dissipation cavity is formed in the heat dissipation plate, and the heat dissipation cavity is in a vacuum-sealed state, and a flowable cooling medium is filled in the heat dissipation cavity;

[0011] The vaporization critical point of the cooling medium is lower than 30 degrees Celsius.

[0012] In one embodiment of the present utility model, the heat dissipation plate includes:

[0013] A first connection plate, with a first connection portion provided on its periphery; and

[0014] A second connection plate, with a second connection portion provided on its periphery;

[0015] Wherein, the first connection portion and the second connection portion are fixedly connected to form a heat dissipation cavity between the first connection plate and the second connection plate.

[0016] In one embodiment of the present utility model, a recessed portion is provided on the inner side surface of the first connection plate and / or the second connection plate.

[0017] In one embodiment of the present utility model, a plurality of notches are respectively formed at the outer edges of the first connection portion and the second connection portion.

[0018] In one embodiment of the present utility model, a plurality of flow paths are further provided in the heat dissipation cavity, and the cooling medium is allowed to flow in the flow paths.

[0019] In one embodiment of the present utility model, a plurality of metal bumps are further included, which are located in the heat dissipation cavity, and the ends of the metal bumps are fixedly connected in the recessed portions of the first connection plate and / or the second connection plate. The plurality of metal bumps are arranged in an array, and the flow paths are formed between the plurality of metal bumps.

[0020] In one embodiment of the present utility model, through holes are formed in the heat dissipation plate.

[0021] In one embodiment of the present utility model, the heat dissipation plate is made of aluminum material.

[0022] The present utility model also discloses a protective housing for a palm-sized electronic product, which includes:

[0023] The heat dissipation structure as described in any one of the above; and

[0024] A side frame;

[0025] Wherein, the side frame is located at the periphery of the heat dissipation, and the side frame and the heat dissipation plate are detachably and fixedly connected.

[0026] In summary, the present utility model discloses a heat dissipation structure and a protective housing for a palm-sized electronic product including the same. By providing a heat dissipation structure on the protective housing, a cooling medium is provided in the heat dissipation cavity. The cooling medium vaporizes due to absorbing the heat generated by the mobile phone. The flow path located in the heat dissipation cavity guides the cooling medium, enabling the heat to be evenly diffused to the entire metal shell cover, so as to achieve the purpose of rapid heat dissipation. When the temperature of the mobile phone drops, the cooling medium liquefies and absorbs heat again, effectively reducing the temperature of the mobile phone. It can effectively improve the problem that the existing protective housing for palm-sized electronic products has poor heat dissipation effect and will also hinder heat dissipation during actual use. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0028] Figure 1 Structural schematic diagram of a protective housing for a palm-sized electronic product according to an embodiment of the present utility model;

[0029] Figure 2 Structural schematic diagram of a heat dissipation structure according to an embodiment of the present utility model;

[0030] Figure 3 For Figure 2 Enlarged structural schematic diagram of part A in

[0031] Figure 4 Top view structural schematic diagram of a heat dissipation structure according to an embodiment of the present utility model;

[0032] Figure 5 Side view structural schematic diagram of a heat dissipation structure according to an embodiment of the present utility model;

[0033] Figure 6 Structural schematic diagram of the first connecting plate of a heat dissipation structure according to an embodiment of the present utility model;

[0034] Figure 7 Structural schematic diagram of the second connecting plate of a heat dissipation structure according to an embodiment of the present utility model;

[0035] Figure 8 Partially sectional structural schematic diagram of the heat dissipation plate of a heat dissipation structure according to an embodiment of the present utility model.

[0036] Explanation of Component Reference Numerals

[0037] 100, heat dissipation plate; 101, connection surface; 102, heat dissipation surface; 103, heat dissipation cavity;

[0038] 110, first connection plate; 111, first connection part;

[0039] 120, second connection plate; 121, second connection part;

[0040] 130, recessed part;

[0041] 140, notch;

[0042] 200, circulation path; 210, metal bump;

[0043] 300, through hole;

[0044] 400, side frame. Specific embodiments

[0045] The following uses specific examples to illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0046] Please refer to Figures 1 to 8 . It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope covered by the technical content disclosed in the present invention without affecting the effects that the present invention can produce and the purposes that can be achieved.

[0047] Please refer to Figures 1 to 2 , the present invention discloses a protective housing for a handheld electronic product, which includes a heat dissipation structure. Through this heat dissipation mechanism, the problems of poor heat dissipation effect and obstruction of heat dissipation in the actual use process of the existing protective housing for handheld electronic products can be improved.

[0048] Specifically, the handheld electronic product disclosed by the present invention can be a mobile phone, a handheld computer, or a handheld reader, but is not limited thereto. Electronic products that can be used to install an external protective housing are within the scope of the present invention.

[0049] Furthermore, the protective housing of the handheld electronic product may also include a side frame 400, and the heat dissipation structure is connected to the side frame 400. Wherein, the side frame 400 is located on the periphery of the heat dissipation part, and the side frame 400 and the heat dissipation plate 100 are detachably and fixedly connected.

[0050] It can be understood that the side frame 400 can be used to cover the periphery of the handheld electronic product, and the heat dissipation structure is connected to the back of the handheld electronic product. Therefore, the protective housing can protect the handheld electronic product, and at the same time, the heat generated by the handheld electronic product can be dissipated through the heat dissipation mechanism to improve the use effect of the handheld electronic product.

[0051] Please refer to Figures 1 to 8 , in an embodiment, the heat dissipation structure may include a heat dissipation plate 100, and a heat dissipation cavity 103 is arranged in the heat dissipation plate 100. At the same time, the heat dissipation plate 100 also includes a connection surface 101 and a heat dissipation surface 102, and the connection surface 101 is connected to the back of the handheld electronic product. The connection surface 101 is located on one side surface of the heat dissipation plate 100, and the heat dissipation surface 102 is located on the other side surface of the heat dissipation plate 100. Therefore, the heat generated by the handheld electronic product can be directly transferred to the heat dissipation surface 102. The heat dissipation surface 102 and the connection surface 101 are arranged in parallel, and the heat obtained on the connection surface 101 can be dissipated through the heat dissipation surface 102. Among them, the heat dissipation plate 100 is made of a metal material. By setting the heat dissipation plate 100 as a metal material, the heat exchange effect of the heat dissipation plate 100 can be improved. For example, the heat dissipation plate 100 may be made of aluminum material or aluminum alloy material, but it is not limited thereto, and it can be determined according to actual needs.

[0052] Furthermore, a heat dissipation cavity 103 is also formed in the heat dissipation plate 100, and the heat dissipation cavity 103 is in a vacuum-sealed state. At the same time, a flowable cooling medium is filled in the heat dissipation cavity 103, and the vaporization critical point of the cooling medium is lower than 30 degrees Celsius.

[0053] Specifically, since the cooling medium can flow in the heat dissipation cavity 103, the heat obtained on the connection surface 101 can be transferred to the cooling medium. Through the flow of the cooling medium, the heat on the connection surface 101 is evenly transferred to the entire heat dissipation plate 100. It can effectively avoid the concentration of heat in a certain area on the connection surface 101. At the same time, by evenly transferring the heat on the connection surface 101 to the entire heat dissipation plate 100, the heat dissipation effect of the heat dissipation plate 100 in actual use can be effectively improved.

[0054] It should be noted that since the vaporization critical point of the cooling medium is below 30 °C, the cooling medium is allowed to be chlorofluorocarbon, or 1-pentene, or isopentane. However, it is not limited thereto and can be determined according to actual needs. Among them, the heat carried by the cooling medium is evenly diffused in the heat dissipation cavity 103 to the entire heat dissipation plate 100, and the heat is conducted through the heat dissipation cavity 103 to the outside of the heat dissipation plate 100. When the temperature of the mobile phone decreases, the cooling medium is vaporized into a gas state by heat. After the temperature decreases, the cooling medium liquefies and is ready to absorb heat again, and this cycle continues.

[0055] Please refer to Figures 1 to 8 , in an embodiment, in order to improve the use effect of the device during actual use. The heat dissipation plate 100 is allowed to include a first connection plate 110 and a second connection plate 120. The connection surface 101 is located on the first connection plate 110, and the heat dissipation surface 102 is located on the second connection plate 120. At the same time, a first connection portion 111 is provided on the periphery of the first connection plate 110; and a second connection portion 121 is provided on the periphery of the second connection plate 120. Among them, the first connection portion 111 and the second connection portion 121 are fixedly connected, and the heat dissipation cavity 103 is located between the first connection plate 110 and the second connection plate 120.

[0056] Furthermore, a recess 130 is allowed to be provided on the first connection plate 110 and / or the second connection plate 120.

[0057] Specifically, recesses 130 are allowed to be provided on both the first connection plate 110 and the second connection plate 120. When the first connection plate 110 and the second connection plate 120 are fixedly connected, the recesses 130 on the first connection plate 110 and the second connection plate 120 can construct the spatial structure of the heat dissipation cavity 103. Or rather, when a recess 130 is provided on the first connection plate 110, a recess 130 is allowed not to be provided on the second connection plate 120. And when a recess 130 is provided on the second connection plate 120, a recess 130 is allowed not to be provided on the first connection plate 110.

[0058] Furthermore, in order to improve the connection effect between the heat dissipation plate 100 and the side frame 400, a plurality of notches 140 are allowed to be respectively provided at the outer edges of the first connection portion 111 and the second connection portion 121. The edge of the side frame 400 is embedded in the notches 140. Specifically, during the injection molding process, the molten plastic flows into and fills the notches 140; the function of the notches 140 is to improve the bonding force between the heat dissipation plate 100 and the side frame 400.

[0059] Please refer to Figures 1 to 8, in one embodiment, it is allowable to further provide a plurality of flow paths 200 in the heat dissipation cavity 103, and the cooling medium is allowed to flow within the flow paths 200. The flow paths 200 guide the cooling medium, which can reduce the sloshing of the cooling medium.

[0060] Furthermore, the heat dissipation cavity 103 is also allowed to include a plurality of metal bumps 210, and the ends of the metal bumps 210 are fixedly connected to the side wall of the heat dissipation cavity 103. Specifically, the plurality of metal bumps 210 are arranged, and the metal bumps 210 are formed between the plurality of metal bumps 210. The metal bumps 210 can also be used to support the heat dissipation cavity 103 to prevent the heat dissipation cavity 103 from deforming.

[0061] Please refer to Figures 1 to 8 , in one embodiment, in order to improve the usage effect of the device during actual use, it is allowable to provide through holes 300 in the heat dissipation plate 100, and the through holes 300 can be used to adapt to the charging module with wireless charging of the handheld electronic device.

[0062] It should be noted that it is allowable to provide a pipe orifice on the heat dissipation plate 100 that communicates with the heat dissipation cavity 103. The pipe orifice is sealed by a plug. The refrigerant filling machine can evacuate through the pipe orifice, and the filling machine can inject the cooling medium through the pipe orifice.

[0063] In summary, the present utility model discloses a heat dissipation structure and a protective housing of a handheld electronic product including the same. By providing a heat dissipation structure on the protective housing, a cooling medium is provided in the heat dissipation cavity 103, and the cooling medium vaporizes due to absorbing the heat generated by the mobile phone. The flow paths 200 located in the heat dissipation cavity 103 guide the cooling medium, so that the heat can be evenly diffused to the entire metal shell cover to achieve the purpose of rapid heat dissipation. When the temperature of the mobile phone drops, the cooling medium liquefies and absorbs heat again, effectively reducing the temperature of the mobile phone.

[0064] Therefore, it is possible to effectively improve the problem that the protective housing of the existing handheld electronic product has poor heat dissipation effect and hinders heat dissipation during actual use. Therefore, the present utility model effectively overcomes some practical problems in the prior art and thus has high utilization value and practical significance.

[0065] The above embodiments merely illustrate the principles and effects of the present utility model, rather than limiting the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. A heat dissipation structure, characterized in that, Comprising: A heat dissipation plate (100), which includes: A connection surface (101) located on one side of the heat dissipation plate (100) for contact setting with the back surface of a handheld electronic product; A heat dissipation surface (102) located on the other side of the heat dissipation plate (100) and arranged parallel to the connection surface (101); Wherein, a heat dissipation cavity (103) is formed inside the heat dissipation plate (100), and the heat dissipation cavity (103) is in a vacuum sealed state, and a flowable cooling medium is filled inside the heat dissipation cavity (103); The vaporization critical point of the cooling medium is lower than 30 degrees Celsius.

2. The heat dissipation structure according to claim 1, wherein The heat dissipation plate (100) includes: A first connection plate (110) with a first connection portion (111) arranged on its periphery; and A second connection plate (120) with a second connection portion (121) arranged on its periphery; Wherein, the first connection portion (111) and the second connection portion (121) are fixedly connected to each other, so that the heat dissipation cavity (103) is formed between the first connection plate (110) and the second connection plate (120).

3. The heat dissipation structure according to claim 2, wherein, A recessed portion (130) is provided on the inner side surface of the first connection plate (110) and / or the second connection plate (120).

4. The heat dissipation structure according to claim 3, wherein A plurality of notches (140) are respectively formed at the outer edges of the first connection portion (111) and the second connection portion (121).

5. The heat dissipation structure according to claim 4, characterized in that A plurality of flow paths (200) are further arranged inside the heat dissipation cavity (103), and the cooling medium is allowed to flow inside the flow paths (200).

6. The heat dissipation structure according to claim 5, wherein, It further includes a plurality of metal bumps (210) located inside the heat dissipation cavity (103), and the ends of the metal bumps (210) are fixedly connected inside the recessed portion (130) of the first connection plate (110) and / or the second connection plate (120). The plurality of metal bumps (210) are arranged in an array, and the flow paths (200) are formed between the plurality of metal bumps (210).

7. The heat dissipation structure according to claim 1, wherein A through hole (300) is formed on the heat dissipation plate (100).

8. The heat dissipation structure according to claim 1, wherein The heat dissipation plate (100) is made of aluminum material.

9. A protective housing for a handheld electronic product, characterized in that, Comprising: A heat dissipation structure as described in any one of claims 1 to 8 above; And A side frame (400); Wherein, the side frame (400) is located on the periphery of the heat dissipation plate (100), and the side frame (400) and the heat dissipation plate (100) are detachably and fixedly connected.

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