Power amplifier equipment

Abstract

The utility model discloses power amplifier equipment. The power amplifier equipment comprises an upper cover plate, a lower cover plate, a circuit board and a heat dissipation structure, the heat dissipation structure comprises a heat dissipation plate, a copper block and a copper pipe; a groove is formed in the heat dissipation plate, a U-shaped copper pipe is contained in the groove, and a copper block is fixedly arranged on the copper pipe; paired sinking tables are arranged on the surface of one side, facing the circuit board, of the heat dissipation plate, a mounting boss is arranged on each sinking table, and the sinking tables and the mounting bosses are arranged on the two sides of the groove respectively; according to the utility model, the heat of the heating element is conducted to the U-shaped copper pipe through the copper block, and the U-shaped copper pipe disperses the heat to a larger area, thereby playing a role of uniform heat dissipation, and the structure disclosed by the utility model is simple to process and efficient to assemble.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic devices, and particularly relates to a power amplifier device. Background Art

[0002] In a power amplifier device, heat dissipation is a particularly important issue. Since the internal space of the power amplifier device is narrow and the circuit board is covered with electronic components, these electronic components generate heat during operation. If the heat dissipation problem cannot be well solved, the performance of the power amplifier device will be affected.

[0003] In the prior art, a heat dissipation plate is usually arranged in the power amplifier device, and heat dissipation fins are arranged on the heat dissipation plate to play a role in heat dissipation. However, the efficiency of this heat dissipation is relatively low because the heat generated by different electronic components on the circuit board is different, and the heat generated by the main heat generating components cannot be evenly dissipated through the heat dissipation plate. Moreover, the processing and installation of the existing heat dissipation structure are relatively complex, bringing great inconvenience to the assembly. Content of the Utility Model

[0004] The utility model provides a power amplifier device. By arranging grooves on the heat dissipation plate, a U-shaped copper tube is accommodated in the grooves, and copper blocks are fixedly arranged on the copper tube; a sunken platform is also arranged on the heat dissipation plate, and an installation boss and a positioning structure are arranged on each sunken platform; the heat of the IC component is conducted to the U-shaped copper tube through the copper block, and the U-shaped copper tube disperses the heat to a larger area, thereby playing a role in uniform heat dissipation.

[0005] To achieve the above object, the utility model provides the following technical solution: A power amplifier device, including an upper cover plate, a lower cover plate, a circuit board and a heat dissipation structure;

[0006] The circuit board and the heat dissipation structure are accommodated in the space enclosed by the upper cover plate and the lower cover plate; the circuit board and the heat dissipation structure are arranged in parallel;

[0007] The heat dissipation structure includes a heat dissipation plate, a copper tube and a copper block; grooves are arranged on the surface of the heat dissipation plate facing the circuit board, and the copper tube is accommodated in the grooves;

[0008] The copper tube is U-shaped, and the shape of the groove is adapted to the shape of the copper tube;

[0009] The copper block is fixedly connected to the copper pipe; on the surface of the heat dissipation plate facing the circuit board, there are paired sunken platforms, and on each sunken platform, there is an installation boss. The sunken platforms and the installation bosses are respectively arranged on both sides of the groove; a positioning structure is arranged on each of the sunken platforms. The purpose of setting this positioning structure is to pre-position the copper block during assembly, facilitating the welding between the copper block and the copper pipe. Heat is first dissipated through the copper block, and then conducted from the copper block to the copper pipe for secondary dissipation. This structure has good heat dissipation effect, and is simple and convenient to install.

[0010] Preferably, the positioning structure is cylindrical. The positioning structure is arranged on the sunken platform, mainly to pre-position the copper block, facilitating welding with the copper pipe.

[0011] Preferably, the number of the positioning structures is at least two. The number of the positioning structures is at least two, and the two positioning structures are respectively arranged on both sides of the groove.

[0012] Preferably, the copper block and the copper pipe are welded. There are various ways to fixedly connect the copper block and the copper pipe, and welding is preferred. Welding can ensure that the copper pipe can take away the heat of the copper block to the greatest extent.

[0013] Preferably, the copper pipe includes a first section, a second section, and a third section, which are connected in sequence; the copper block is arranged at the position where the first section of the copper pipe is located. The purpose of this setting is determined by the structure of the copper pipe. The first section of the copper pipe is the evaporation section, which absorbs heat by evaporation and can quickly take away the heat of the copper block.

[0014] Preferably, the position where the copper block is located corresponds to the position of the IC component on the circuit board. On the circuit board, there are many heat-generating components, but the IC component generates the most heat and is the main object to be cooled. Therefore, the main purpose of the copper block is to take away the heat of the IC component.

[0015] Preferably, one or more of the first section, the second section, and the third section of the copper pipe correspond to the positions of other heat-generating components on the circuit board except the IC component. Except for the IC component, there are other heat-generating components on the circuit board. The shape of the copper pipe is adapted to the installation positions of the heat-generating components on the circuit board. Such a setting makes the heat dissipation efficiency of the heat dissipation structure the highest.

[0016] Preferably, the thickness of the copper block is less than the height of the installation boss. The thickness of the copper block is less than the thickness of the installation boss to reserve space for installing the IC component. When the circuit board is assembled with the heat dissipation component, the IC component can just closely fit with the upper surface of the copper block, which is also to increase the heat dissipation efficiency.

[0017] Preferably, heat dissipation fins are provided on the side of the heat dissipation plate facing away from the circuit board. The heat dissipation fins are used to increase the heat dissipation area of the heat dissipation plate.

[0018] Preferably, mounting holes are provided on the mounting bosses. The mounting holes on the mounting bosses are used to correspond to the mounting holes beside the IC components on the circuit board. By passing locking members through the holes on the circuit board and the mounting bosses respectively, while locking the circuit board and the heat dissipation plate, the IC components can be tightly attached to the copper blocks.

[0019] The beneficial effects of adopting the above technical solutions are as follows: Through the arrangement of the copper blocks and the U-shaped copper tubes, the heat of the heat-generating components on the circuit board can be evenly dissipated; and through the matching structure of the mounting bosses and the copper blocks, the processing and installation of the copper blocks can be simplified. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0021] Figure 1 It is a schematic structural diagram of the power amplifier device of the present invention;

[0022] Figure 2 It is a schematic structural diagram of the circuit board of the present invention;

[0023] Figure 3 It is a schematic diagram of the heat dissipation structure of the present invention;

[0024] Figure 4 It is a top view of the heat dissipation structure of the present invention.

[0025] Explanation of the Reference Numerals in the Drawings:

[0026] 100 - upper cover plate; 200 - lower cover plate; 300 - circuit board; 400 - heat dissipation structure; 310 - IC component; 320 - electronic component; 330 - first mounting hole; 410 - heat dissipation plate; 420 - copper tube; 430 - copper block; 440 - groove; 450 - heat dissipation fin; 460 - mounting boss; 461 - second mounting hole; 421 - first section; 422 - second section; 423 - third section;

[0027] The realization, functional features and advantages of the object of the present invention will be further described in conjunction with the embodiments and with reference to the drawings. Detailed Embodiments

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0030] like Figure 1 and Figure 2 As shown, the utility model provides a power amplifier device, including an upper cover plate 100, a lower cover plate 200, a circuit board 300, and a heat dissipation structure 400; the upper cover plate 100 and the lower cover plate 200 are locked together so that the upper cover plate 100 and the lower cover plate 200 enclose a closed space, and the circuit board 300 and the heat dissipation structure 400 are contained in the closed space; the circuit board 300 and the heat dissipation structure 400 are parallel and fixed; in terms of orientation, the circuit board 300 is closer to the upper cover plate 100, and the heat dissipation structure 400 is closer to the lower cover plate 200.

[0031] Several electronic components are arranged on the circuit board 300, wherein an IC assembly 310 is arranged on the side of the circuit board 300 facing the heat dissipation structure 400; and the remaining electronic components 320 are arranged on the side of the circuit board 300 away from the heat dissipation structure 400. A first mounting hole 330 is arranged on the circuit board 300.

[0032] like Figure 3 and Figure 4As shown in the figure, the heat dissipation structure 400 includes a heat dissipation plate 410, a copper tube 420, a copper block 430, and a groove 440; the groove 440 is provided on the mounting surface of the heat dissipation plate 410, and the mounting surface of the heat dissipation plate 410 is the side facing the circuit board 300. On the side of the heat dissipation plate 410 facing away from the circuit board 300, there are heat dissipation fins 450, and the heat dissipation fins 450 are serrated, which are used to increase the heat dissipation area and enhance the heat dissipation effect. The copper tube 420 is U-shaped, and the copper tube 420 includes a first section 421, a second section 422, and a third section 423, which are connected in sequence to form a U-shaped. The reason why the copper tube 420 is set to be U-shaped is that the release of heat sources of various electronic components on the circuit board 300 is uneven, resulting in heat concentration in some areas of the circuit board 300 and less heat in other areas. The IC component 310 is the electronic component with the largest heat generation on the circuit board 300. Therefore, the first section 421 of the copper tube is set at the position corresponding to the IC component, the second section 422 is set at the position corresponding to other heating elements except the IC component, and the third section 423 is set at the position corresponding to almost no heating elements, that is, the position with the lowest temperature. Such a setting can sequentially disperse the heat generated by the heating components to the position with a lower temperature on the heat dissipation plate. Preferably, the IC component 310 is set at the position corresponding to the starting section on the first section 421 of the copper tube. Obviously, the shape of the copper tube 420 is related to the arrangement shape of the electronic components on the circuit board 300. Therefore, in fact, the shape of the copper tube is not limited to U-shaped, and U-shaped is only the optimal option for matching the existing circuit board of the power amplifier device.

[0033] The copper block 430 is set at the position where the first section 421 is located. The purpose of such a setting is because the IC component 310 is set at the position where the first section 421 is located. When the circuit board 300 and the heat dissipation structure 400 are assembled, the IC component 310 is exactly at the position where the copper block 430 is located. Copper has a high thermal conductivity. The purpose of setting the copper block 430 is to make up for the gap between the IC component and the copper tube 420. On the one hand, it is convenient for the IC component 310 to be better installed, and on the other hand, it is also convenient for the copper tube 420 to efficiently disperse the heat of the IC component 310.

[0034] The copper block 430 is fixedly connected to the copper tube 420, and there are many ways of fixed connection, all of which can be selected in this embodiment; but preferably, the copper block 430 is welded to the copper tube 420, and welding them together is convenient for the copper block 430 to take away the heat on the IC component 310 in time.

[0035] A counterbore is also provided on the heat dissipation structure 400. The counterbore is provided on the side of the heat dissipation structure facing the circuit board (mounting surface). The purpose of setting the counterbore is to facilitate the assembly of the copper block. The plane of the counterbore is lower than the mounting surface of the heat dissipation structure. The copper block 430 is placed on the counterbore. The copper block 430 can be in large-area contact with the copper tube 420 and then welded. In order to ensure that the copper block 430 does not displace during the welding of the copper block 430 and the copper tube 420, a positioning structure is also provided on the counterbore near the groove 440. Preferably, the positioning structure is a cylindrical protrusion, and the number is at least two. For example, it can be 4. The positioning structure abuts against the surface of the copper block 430 perpendicular to the mounting surface of the heat dissipation plate. The counterbores are provided in pairs, and each pair of counterbores are respectively arranged on both sides of the groove 440. An installation boss 460 is also provided on the counterbore. The installation bosses 460 are provided in pairs, and the installation bosses and the counterbores correspond one by one. In this embodiment, the number of the installation bosses 460 is 2, and the installation bosses 460 are also arranged at the position where the copper block 430 is located. Specifically, the two installation bosses 460 are respectively arranged on both sides of the groove 440, and the copper block 430 is arranged between the two installation bosses. The length of the copper block 430 is greater than the width of the groove 440, so the copper block 430 can be placed above the groove 440. The thickness of the copper block 430 is less than the height of the installation boss 460 because a position for placing the IC component 310 needs to be left. The installation boss 460 is fixedly connected to the heat dissipation plate.

[0036] A second installation hole 461 is provided on each installation boss 460. The position of the second installation hole 461 corresponds to that of the first installation hole 330, and is used to fixedly install the circuit board 300 and the heat dissipation plate 400 while tightly fitting the IC component 310 on the copper block 430. Because in actual work, the heat on the IC component 310 is very high. Letting the copper block be arranged in contact with the IC component 310 can enable the copper block 430 to quickly take away the heat on the IC component 310 and increase the heat dissipation efficiency.

[0037] The copper tube 420 is composed of a tube shell, a wick, and an end cap. After evacuating the inside of the tube to a negative pressure, an appropriate amount of working liquid is filled, and the wick capillary porous material tightly attached to the inner wall of the tube is filled with liquid and then sealed. One end of the tube is the evaporation section, the other end is the condensation section, and the middle is the adiabatic section. In this embodiment, the first section 421, the second section 422, and the third section 433 respectively correspond to the evaporation section, the adiabatic section, and the condensation section. When one end of the copper tube 420 is heated, the liquid in the wick capillary porous material evaporates and vaporizes, and the vapor flows to the other end under a small pressure difference to release heat and condense into a liquid, and the liquid then flows back to the evaporation section by the action of capillary force, and so on in a cycle, and the heat is conducted from one end of the heat pipe to the other end.

[0038] The copper tube 420 includes the following six main processes that are interrelated in the process of realizing this heat transfer:

[0039] (1) Heat is transferred from the IC component 310 through the copper tube wall and the wick filled with the working liquid to the liquid-vapor interface:

[0040] (2) The liquid evaporates at the liquid-vapor interface in the evaporation section;

[0041] (3) The vapor in the vapor chamber flows from the evaporation section to the condensation section;

[0042] (4) The vapor condenses at the vapor-liquid interface in the condensation section;

[0043] (5) Heat is transferred from the vapor-liquid interface through the wick, the liquid, and the tube wall to the cold source;

[0044] (6) Due to capillary action, the condensed working liquid in the wick flows back to the evaporation section.

[0045] Therefore, the heat dissipation principle of the above copper tube 420 also determines that it is an optimal choice to set the copper tube 420 into a U shape; the first section 421 and the second section 422 of the copper tube are arranged at the positions corresponding to the heating elements, while the third section 423 of the copper tube is arranged at the position away from the corresponding heating elements, which can ensure higher heat dissipation efficiency. The above is only the preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made under the concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A power amplifier device, characterized in that, It includes an upper cover plate, a lower cover plate, a circuit board and a heat dissipation structure; The circuit board and the heat dissipation structure are accommodated in a space enclosed by the upper cover plate and the lower cover plate; the circuit board and the heat dissipation structure are arranged in parallel; The heat dissipation structure comprises a heat dissipation plate, a copper tube and a copper block; a groove is provided on the surface of the heat dissipation plate on the side facing the circuit board, and the copper tube is accommodated in the groove; The copper tube is U-shaped, and the shape of the groove matches the shape of the copper tube; The copper block is fixedly connected to the copper tube; a pair of sinks are arranged on the surface of the heat sink facing the circuit board, and a mounting boss is arranged on each sink, and the sinks and the mounting boss are arranged on both sides of the groove; a positioning structure is arranged on each sink.

2. The power amplifier device according to claim 1, characterized in that The positioning structure is cylindrical.

3. The power amplifier device according to claim 1, wherein The number of the positioning structures is at least two.

4. The power amplifier device according to claim 1, wherein The copper block and the copper tube are welded.

5. The power amplifier device according to claim 1, characterized in that, The copper tube comprises a first section, a second section and a third section, and the first section, the second section and the third section are connected in sequence; the copper block is arranged at the position of the first section of the copper tube.

6. The power amplifier device according to claim 5, wherein The position of the copper block corresponds to the position of the IC component on the circuit board.

7. The power amplifier device according to claim 6, characterized in that One or more of the first section, the second section and the third section of the copper tube corresponds to the position of other heating elements on the circuit board except the IC component.

8. The power amplifier device according to claim 1, wherein, The thickness of the copper block is smaller than the height of the mounting boss.

9. The power amplifier device according to claim 1, wherein A heat dissipation fin is arranged on a side of the heat dissipation plate away from the circuit board.

10. The power amplifier device according to claim 1, wherein, The mounting bosses are all provided with mounting holes.

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