Thermosyphon heat dissipation module for 5G base station
Through the condensation and evaporation mechanism circulation of the thermosiphon heat dissipation module, the 5G base station heat dissipation module has been solved, and the efficient and low-cost heat dissipation effect is achieved, which is suitable for the heat dissipation needs of 5G base stations.
Patent Information
- Application Number
- CN202422403540.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-09-30
AI Technical Summary
The heat dissipation modules of existing 5G base stations have problems such as large size, complex structure, high cost, high noise and poor heat dissipation effect. The traditional heat pipe heat dissipation method requires a large number of fins and fans to assist, and the metal shell conducts slowly.
Thermosiphon heat dissipation module is adopted, including a condensing mechanism and an evaporation mechanism, a condenser and harmonica tube, an evaporation box and an evaporation fin assembly, which dissipates heat through the gasification and liquefaction cycle of the coolant. The external condenser directly conducts heat without fan assistance.
It realizes miniaturization, low-cost, noise-free and efficient heat dissipation, can be installed vertically against gravity, improves installation flexibility and heat dissipation effect, accelerates cooling speed, reduces thermal resistance, and improves heat dissipation performance.
Smart Images
Figure CN223157482U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of base station heat dissipation, in particular to a thermosyphon heat dissipation module for a 5G base station. Background Art
[0002] With the development of technology, 5G technology has become increasingly mature, and 5G base stations have been widely covered. When a 5G base station is operating, it will generate heat. As the power increases, the temperature of the 5G base station also rises. When the temperature is too high, in order to prevent the 5G base station from burning out, it is often necessary to reduce the power operation, which leads to fluctuations in network stability. The traditional heat dissipation module of a 5G base station dissipates heat through heat pipes, and multiple fins are arranged on the heat pipes to reduce the chip temperature of the 5G base station. This heat dissipation method requires a large number of heat dissipation fins to improve the heat dissipation effect. Moreover, the heat dissipation module is installed inside the housing of the 5G base station, and it is difficult for the heat to be discharged from the housing. Often, a fan is needed for auxiliary heat dissipation, which is large in size, complex in structure, high in cost, and will generate relatively large noise. There is also a heat dissipation module that uses a metal casting to form a housing with multiple fins, and directly conducts and cools the chip temperature of the 5G base station through the housing. This heat dissipation method has a simple structure and a small volume, but only conducts heat through the thermal conductivity of the metal, with a slow conduction speed and a poor heat dissipation effect. Therefore, it is necessary to make improvements. Summary of the Utility Model
[0003] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a thermosyphon heat dissipation module for a 5G base station, which has a simple structure, a small volume, a light weight, a low cost, no noise, strong heat dissipation, and can be installed and used vertically against gravity to improve the installation flexibility.
[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is: a thermosyphon heat dissipation module for a 5G base station, including a heat dissipation box body, the heat dissipation box body is provided with a thermosyphon heat dissipation device, and the thermosyphon heat dissipation device includes a condensation mechanism and at least one evaporation mechanism.
[0005] The condensation mechanism includes a condenser and a plurality of corrugated tubes. The condenser is fixedly installed outside the heat dissipation box body. The first ends of the corrugated tubes are closed, and the second ends are fixedly installed on the condenser. A condensation chamber is arranged inside the condenser. A plurality of condensation channels are respectively arranged in each corrugated tube, and the condensation channels are respectively communicated with the condensation chamber.
[0006] The evaporation mechanism includes an evaporation box body with an upward opening. An air inlet is arranged at the lower part of the condenser. The evaporation box body is fixedly installed at the air inlet. An evaporation chamber is arranged inside the evaporation box body. The evaporation chamber is communicated with the condensation chamber. The heat dissipation box body is provided with a first installation port. The evaporation box body passes through the first installation port and is arranged inside the heat dissipation box body. The evaporation chamber, the condensation chamber and the condensation channels form a sealed heat dissipation cavity, and a coolant is arranged in the heat dissipation cavity.
[0007] In a further technical solution, the condensation chamber is provided with folded staggered fins formed by stamping. The folded staggered fins are provided with a plurality of bent flow channels at intervals, and adjacent two bent flow channels are communicated through a plurality of diversion ports;
[0008] The evaporation chamber is provided with an evaporation fin assembly. The evaporation fin assembly is provided with a plurality of vertical evaporation channels in the vertical direction. Each vertical evaporation channel is arranged at intervals in the horizontal direction. The upper part of the evaporation fin assembly is provided with a plurality of upper horizontal channels. Each upper horizontal channel penetrates through each vertical evaporation channel in the horizontal direction and is respectively communicated with each vertical evaporation channel. The lower part of the evaporation fin assembly is provided with a plurality of lower horizontal channels. Each lower horizontal channel penetrates through each vertical evaporation channel in the horizontal direction and is respectively communicated with each vertical evaporation channel. Each upper horizontal channel is respectively communicated with the corresponding bent flow channel.
[0009] In a further technical solution, the condenser includes a base, an upper plate and a plurality of connecting screws. The base is provided with a condensation groove with an upward opening. The upper plate covers the condensation groove to form a condensation chamber. The air inlet is arranged on the base. A plurality of fixing holes are respectively arranged on the left and right sides of the base. The corresponding heat dissipation box body is provided with a plurality of threaded holes. The connecting screws pass through the fixing holes and are threadedly connected with the threaded holes. The upper part of the folded staggered fins abuts against the upper plate, and the lower part abuts against the bottom surface of the condensation groove.
[0010] In a further technical solution, the upper plate is provided with a plurality of fixing grooves. The bottom of each fixing groove is further provided with a flow channel connecting groove penetrating through the upper plate. The mouthpiece tube is inserted into the fixing groove. The condensation flow channel is communicated with the condensation chamber through the flow channel connecting groove.
[0011] In a further technical solution, the condenser is further provided with a liquid injection pipe. The lower part of the liquid injection pipe is arranged on the upper plate and is communicated with the condensation chamber. The upper part of the liquid injection pipe is provided with a one-way valve.
[0012] In a further technical solution, the evaporation fin assembly includes a plurality of upper substrates, a plurality of lower substrates and a plurality of fins. The upper parts of each fin respectively extend upwards to form a plurality of upper convex parts. The lower parts of each fin respectively extend downwards to form a plurality of lower convex parts. Each upper substrate is respectively arranged on each upper convex part. Each lower substrate is respectively arranged on each lower convex part. A plurality of upper flow holes are respectively formed between adjacent two upper convex parts of the same fin and between the upper convex part and the inner wall of the evaporation box body. The upper flow holes of each fin form an upper horizontal channel. A plurality of lower flow holes are respectively formed between adjacent two lower convex parts of the same fin and between the lower convex part and the inner wall of the evaporation box body. The lower flow holes of each fin form a lower horizontal channel. A vertical evaporation channel is formed between adjacent two fins.
[0013] In a further technical solution, the upper substrate passes through and abuts against the folded staggered fins in cooperation with the air inlet. Each upper horizontal channel is respectively located below the corresponding bent flow channel.
[0014] In a further technical solution, the inner wall of the condensation flow channel is provided with a corrugated surface structure.
[0015] In a further technical solution, a plurality of heat conducting plates are further arranged on the outer side surface of the evaporation box body. The outer side surfaces of the heat conducting plates respectively extend outwards with a plurality of heat conducting strips. A plurality of second installation grooves are formed in the heat dissipation box body, and the heat conducting plates are embedded in the second installation grooves.
[0016] In a further technical solution, the thermosyphon heat dissipation device is arranged on one side of the heat dissipation box body. A plurality of heat dissipation fins extend outwards on the other side of the heat dissipation box body. A plurality of heat dissipation convex columns are arranged on the inner wall of the heat dissipation box body;
[0017] A plurality of positioning columns and installation blocks are arranged on the top of the condenser and / or the top of the heat dissipation box body, and installation holes are respectively formed in each positioning column and installation block;
[0018] Installation handles are respectively arranged on the left and right sides of the heat dissipation box body;
[0019] The coolant is R134a high-pressure refrigerant.
[0020] After adopting the above structure, the advantages of the present utility model compared with the prior art are as follows: By arranging the thermosyphon heat dissipation device on the heat dissipation box body, the space occupation is reduced, the volume is decreased, and the weight is lightened; By closely attaching the evaporation mechanism to the chip, the coolant gasifies under the action of high temperature. The gasified coolant enters the condensation chamber from the evaporation chamber. Part of the gasified coolant is liquefied when encountering cold and flows back to the evaporation chamber along the inner wall of the condensation chamber, while the unliquefied coolant continues to move to the condensation flow channels in each corrugated pipe, and thus is all liquefied and flows through the condensation chamber along the inner wall of the condensation flow channel into the evaporation chamber, thereby forming a cycle. The structure is simple, the cost is low, the heat dissipation effect is improved, and it can be installed vertically against gravity, improving the installation flexibility; The condensation mechanism is located outside the heat dissipation box body, and can directly conduct heat to the atmosphere without the need to assist heat dissipation by means of a fan, and natural heat dissipation is noise-free; By the folded staggered fins and the evaporation fin assembly respectively playing a supporting role in the interior of the condenser and the evaporation box body, the pressure-bearing capacity of the condenser and the evaporation box body is improved, the reliability and stability are improved, and the flow rate and cooling rate of the coolant are increased, further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present utility model will be further described below in conjunction with the drawings and embodiments.
[0022] Figure 1 is a structural schematic diagram of the present utility model;
[0023] Figure 2 is an exploded view of the present utility model;
[0024] Figure 3 is the enlarged view of part A of Figure 2 the present utility model;
[0025] Figure 4 is the enlarged view of part B of Figure 2 the present utility model;
[0026] Figure 5 is the enlarged view of part C of Figure 2 the present utility model;
[0027] Figure 6 is the cross-sectional view of the thermosyphon heat dissipation device of the present utility model;
[0028] Figure 7 is the enlarged view of part D of Figure 6 the present utility model;
[0029] Figure 8 is the structural schematic diagram of the harmonica tube of the present utility model.
[0030] In the figure:
[0031] 1 heat dissipation box body, 11 first installation port, 12 second installation groove, 13 threaded hole, 14 heat sink, 15 installation handle;
[0032] 2 condenser, 21 base, 211 condensation tank, 212 air inlet, 213 fixing hole, 22 upper plate, 221 fixing groove, 222 flow channel connection groove, 23 liquid injection pipe, 231 one-way valve;
[0033] 3 harmonica tube, 31 condensation flow channel, 32 corrugated surface structure;
[0034] 4 evaporation box body, 41 evaporation chamber;
[0035] 5 folding staggered fins, 51 bending flow channel, 52 diversion port;
[0036] 6 evaporation fin assembly, 61 vertical evaporation flow channel, 62 upper horizontal flow channel, 63 lower horizontal flow channel, 64 upper substrate, 65 lower substrate, 66 fins, 661 upper convex part, 662 lower convex part, 7 heat conducting plate, 71 heat conducting strip;
[0037] 81 positioning column, 82 mounting block, 83 mounting hole. Specific embodiments
[0038] The following are only the preferred embodiments of the present utility model, and do not limit the protection scope of the present utility model accordingly.
[0039] A thermosyphon heat dissipation module for a 5G base station, as Figures 1 to 8As shown in the figure, it includes a heat dissipation box body 1. The heat dissipation box body 1 is provided with a thermosyphon heat dissipation device. The thermosyphon heat dissipation device includes a condensation mechanism and at least one evaporation mechanism. The condensation mechanism includes a condenser 2 and a plurality of corrugated tubes 3. The condenser 2 is fixedly installed outside the heat dissipation box body 1. The first ends of the respective corrugated tubes 3 are closed, and the second ends are fixedly installed on the condenser 2. A condensation chamber is arranged inside the condenser 2. A plurality of condensation channels 31 are respectively arranged in each corrugated tube 3, and the respective condensation channels 31 communicate with the condensation chamber; the evaporation mechanism includes an evaporation box body 4 with an upward opening. An air inlet 212 is arranged at the lower part of the condenser 2. The evaporation box body 4 is fixedly installed on the air inlet 212. An evaporation chamber 41 is arranged inside the evaporation box body 4. The evaporation chamber 41 communicates with the condensation chamber. The heat dissipation box body 1 is provided with a first installation opening 11. The evaporation box body 4 passes through the first installation opening 11 and is arranged inside the heat dissipation box body 1. The evaporation chamber 41, the condensation chamber and the respective condensation channels 31 form a sealed heat dissipation cavity, and a coolant is arranged inside the heat dissipation cavity.
[0040] The heat dissipation module of the traditional 5G base station dissipates heat through heat pipes, with a complex structure and high cost. And to ensure the heat dissipation effect, its heat pipes must be made of copper heat pipes, which are costly and have complex production steps. However, the thermosyphon heat dissipation device of the present utility model is an aluminum thermosyphon heat dissipation device and is arranged on the heat dissipation box body 1, reducing space occupation, decreasing volume, lightening weight and lowering cost; by arranging the evaporation mechanism close to the chip, under the action of high temperature, the coolant gasifies. The gasified coolant enters the condensation chamber from the evaporation chamber 41. Part of the gasified coolant is liquefied when encountering cold and flows back to the evaporation chamber 41 along the inner wall of the condensation chamber, while the unliquefied coolant continues to move into the condensation channels 31 in the respective corrugated tubes 3, and thus is all liquefied and flows through the condensation chamber along the inner wall of the condensation channels 31 and enters the evaporation chamber 41, thereby forming a cycle. The structure is simple and the cost is low. When the ambient temperature is 27 °C, the heat dissipation module of the thermosyphon of the present utility model can achieve a maximum heat dissipation power of 165 W, and the thermal resistance is 0.267 °C / W. While the thermal resistance of the traditional heat pipe-based heat dissipation module in the same environment is 0.415 °C / W. The heat dissipation performance of the thermosyphon heat dissipation module of the present utility model is improved by 36%, improving the heat dissipation effect, and it can be installed vertically against gravity for use, improving the installation flexibility; the condensation mechanism is located outside the heat dissipation box body 1, and can directly conduct heat to the atmosphere without the need to rely on a fan for auxiliary heat dissipation, and natural heat dissipation is noise-free.
[0041] Specifically, a folded staggered fin 5 formed by stamping is arranged in the condensation chamber. A plurality of bent flow channels 51 are arranged at intervals on the folded staggered fin 5, and a plurality of diversion openings 52 are provided to communicate between two adjacent bent flow channels 51. An evaporation fin assembly is arranged in the evaporation chamber 41. A plurality of vertical evaporation flow channels 61 are arranged vertically on the evaporation fin assembly. The vertical evaporation flow channels 61 are arranged at intervals in the transverse direction. A plurality of upper transverse flow channels 62 are arranged at the upper part of the evaporation fin assembly. Each upper transverse flow channel 62 penetrates through each vertical evaporation flow channel 61 in the transverse direction and is respectively communicated with each vertical evaporation flow channel 61. A plurality of lower transverse flow channels 63 are arranged at the lower part of the evaporation fin assembly. Each lower transverse flow channel 63 penetrates through each vertical evaporation flow channel 61 in the transverse direction and is respectively communicated with each vertical evaporation flow channel 61. Each upper transverse flow channel 62 is respectively communicated with a corresponding bent flow channel 51. The folded staggered fin 5 and the evaporation fin assembly 6 respectively play a supporting role in the interiors of the condenser 2 and the evaporation box body 4, improving the pressure-bearing capacity of the condenser 2 and the evaporation box body 4, enhancing the reliability and stability, and increasing the flow rate and cooling rate of the coolant, further improving the heat dissipation effect. The heat dissipation box body 1 is formed by die-casting with material ADC12. The evaporation box body 4, the condenser 2, the folded staggered fin 5 and the mouthpiece tube 3 are all made of AL3003 material. The evaporation fin assembly is made of AL1100 material.
[0042] Specifically, the condenser 2 includes a base 21, an upper plate 22 and a plurality of connecting screws. The base 21 is provided with a condensation groove 211 with an upward opening. The upper plate 22 covers the condensation groove 211 to form a condensation chamber. The air inlet 212 is arranged on the base 21. A plurality of fixing holes 213 are respectively arranged on the left and right sides of the base 21. Corresponding threaded holes 13 are provided on the heat dissipation box body 1. The connecting screws pass through the fixing holes 213 and are threadedly connected with the threaded holes 13. The upper part of the folded staggered fin 5 abuts against the upper plate 22, and the lower part abuts against the bottom surface of the condensation groove 211. The thermosyphon heat dissipation device is directly threadedly connected to the heat dissipation box body 1 through the connecting screws, which is convenient for disassembly and assembly.
[0043] Specifically, the upper plate 22 is provided with a plurality of fixing grooves 221. A flow channel connecting groove 222 penetrating through the upper plate 22 is further provided at the bottom of each fixing groove 221. The mouthpiece tube 3 is inserted into the fixing groove 221. The condensation flow channel 31 is communicated with the condensation chamber through the flow channel connecting groove 222. The mouthpiece tube 3 is inserted into the fixing groove 221 and welded to the upper plate 22 by brazing, increasing the welding area, making the connection more firm and improving the pressure-bearing capacity.
[0044] Specifically, the condenser 2 is further provided with a liquid injection pipe 23. The lower part of the liquid injection pipe 23 is arranged on the upper plate 22 and communicated with the condensation chamber. A one-way valve 231 is arranged on the upper part of the liquid injection pipe 23. The cooling liquid is injected into the heat dissipation cavity through the liquid injection pipe 23. The one-way valve 231 adopts a valve core, which is convenient for subsequent replacement and supplement of the cooling liquid and convenient for maintenance. The liquid injection pipe 23 is made of AL3003 material.
[0045] Specifically, the evaporation fin assembly includes a plurality of upper substrates 64, a plurality of lower substrates 65 and a plurality of fins 66. A plurality of upper convex portions 661 respectively extend upward from the upper parts of the respective fins 66, and a plurality of lower convex portions 662 respectively extend downward from the lower parts of the respective fins 66. The respective upper substrates 64 are respectively arranged on the respective upper convex portions 661, and the respective lower substrates 65 are respectively arranged on the respective lower convex portions 662. A plurality of upstream holes are respectively formed between two adjacent upper convex portions 661 of the same fin 66 and between the upper convex portion 661 and the inner wall of the evaporation box body 4. The upstream holes of the respective fins 66 form an upper transverse flow channel 62. A plurality of downstream holes are respectively formed between two adjacent lower convex portions 662 of the same fin 66 and between the lower convex portion 662 and the inner wall of the evaporation box body 4. The downstream holes of the respective fins 66 form a lower transverse flow channel 63. A vertical evaporation flow channel 61 is formed between two adjacent fins 66. Fixing the respective fins 66 through the respective upper substrates 64 and the respective lower substrates 65 has a simple structure and low cost. Connecting the respective vertical evaporation flow channels 61 through the upper transverse flow channel 62 and the lower transverse flow channel 63 improves the isothermality of the evaporation mechanism, makes the steam in the evaporation chamber 41 in a saturated state, and improves the heat dissipation effect.
[0046] Specifically, the upper substrate 64 passes through and abuts against the folded staggered fins 5 in cooperation with the air inlet 212, and the respective upper transverse flow channels 62 are respectively located below the corresponding bent flow channels 51. The evaporation fin assembly abuts against the folded staggered fins 5 to prevent displacement. The upper transverse flow channel 62 is aligned with the bent flow channel 51 in the vertical direction, which increases the connection area and the flow rate of the cooling liquid. Connecting the respective bent flow channels 51 through the diversion ports 52 improves the isothermality of the cooling mechanism, makes the steam in the condensation chamber in a saturated state, and improves the heat dissipation effect.
[0047] Specifically, as Figure 8 shown, the inner wall of the condensation flow channel 31 is provided with a corrugated surface structure 32. The corrugated surface structure 32 can further improve the cooling speed and the heat dissipation effect.
[0048] Specifically, a plurality of heat conducting plates 7 are further arranged on the outer side surface of the evaporation box body 4. A plurality of heat conducting strips 71 respectively extend outward from the outer side surfaces of the heat conducting plates 7. A plurality of second installation grooves 12 are formed in the heat dissipation box body 1, and the heat conducting plates 7 are embedded in the second installation grooves 12. The temperature outside the evaporation mechanism is conducted to the entire heat dissipation box body 1 through the heat conducting plates 7, so as to further cool through the heat dissipation box body 1 and further improve the heat dissipation effect.
[0049] Specifically, the thermosyphon heat dissipation device is arranged on one side of the heat dissipation box body 1. On the other side of the heat dissipation box body 1, a plurality of heat dissipation fins 14 extend outward. A plurality of heat dissipation convex columns are arranged on the inner wall of the heat dissipation box body 1; a plurality of positioning columns 81 and mounting blocks 82 are arranged on the top of the condenser 2 and / or the top of the heat dissipation box body 1, and each positioning column 81 and mounting block 82 is respectively provided with a mounting hole 83; mounting handles 15 are respectively arranged on the left and right sides of the heat dissipation box body 1; the coolant is R134a high-pressure refrigerant. The heat dissipation box body 1 is dissipated by the heat dissipation fins 14 to further improve the heat dissipation effect. The heat dissipation convex columns are closely attached to the electronic components with a certain calorific value to further improve the heat conduction efficiency. The thermosyphon heat dissipation module is facilitated to be installed through the positioning columns 81 and the mounting blocks 82; the use of R134a high-pressure refrigerant as the coolant can reduce the boiling point, has a fast driving speed, a high heat flux density, and strong isothermal property when encountering saturated steam.
[0050] The production method of the thermosyphon heat dissipation device of the present utility model is as follows:
[0051] One end of the corrugated tube 3 is flattened and sealed by a stamping device, and then laser welding is used to seal it. The laser welding power is 5 kv, and each condensation flow channel 31 is tested to ensure no leakage. The test air pressure is 20 kg;
[0052] The oil stain on the corrugated tube 3, the upper plate 22, the bottom plate 21, the evaporation box body 4, the evaporation fin assembly and the folded staggered fin 5 is removed. Then, the welding surface between the corrugated tube 3 and the upper plate 22 is coated with brazing filler metal, the welding surface between the evaporation box body 4 and the bottom plate 21 is coated with brazing filler metal, and the welding surface between the upper plate 22 and the bottom plate 21 is coated with brazing filler metal;
[0053] The open end of the corrugated tube 3 is inserted into the fixed groove 221, the evaporation fin assembly is installed in the evaporation chamber 41, the folded staggered fin 5 is installed in the cooling chamber, and then the upper plate 22 and the evaporation box body 4 are respectively buckled on the bottom plate 21 and fixed by a clamp;
[0054] The thermosyphon heat dissipation device is sent into a tunnel furnace for brazing. The welding temperature is 620 °C and the welding time is 80 minutes. After welding, airtightness testing and helium detection testing are carried out;
[0055] The thermosyphon heat dissipation device after welding is pasted with the heat dissipation box body 1 through Dow Corning thermal conductive adhesive SE4485, and the Dow Corning thermal conductive adhesive SE4485 is cured at room temperature. The curing time is 1 to 7 days, and connecting screws are installed for fastening;
[0056] Finally, the heat dissipation chamber is evacuated and refrigerant is injected through the liquid injection pipe 23.
[0057] The above content is only a preferred embodiment of the present utility model. For those of ordinary skill in the art, based on the idea of the present utility model, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present utility model.
Claims
1. A thermosyphon heat dissipation module for a 5G base station, comprising a heat dissipation box body (1), characterized in that: The heat dissipation box body (1) is provided with a thermosyphon heat dissipation device, and the thermosyphon heat dissipation device includes a condensation mechanism and at least one evaporation mechanism. The condensation mechanism includes a condenser (2) and a plurality of corrugated tubes (3). The condenser (2) is fixedly installed outside the heat dissipation box body (1). The first ends of the corrugated tubes (3) are closed, and the second ends are fixedly installed on the condenser (2). A condensation chamber is arranged inside the condenser (2). A plurality of condensation channels (31) are respectively arranged in each corrugated tube (3), and the condensation channels (31) communicate with the condensation chamber respectively. The evaporation mechanism includes an evaporation box body (4) with an upward opening. An air inlet (212) is arranged at the lower part of the condenser (2). The evaporation box body (4) is fixedly installed on the air inlet (212). An evaporation chamber (41) is arranged inside the evaporation box body (4). The evaporation chamber (41) communicates with the condensation chamber. The heat dissipation box body (1) is provided with a first installation opening (11). The evaporation box body (4) passes through the first installation opening (11) and is arranged inside the heat dissipation box body (1). The evaporation chamber (41), the condensation chamber and the condensation channels (31) form a sealed heat dissipation cavity, and a coolant is arranged inside the heat dissipation cavity.
2. The thermosyphon heat dissipation module for a 5G base station according to claim 1, wherein: A stamping-formed folded staggered fin (5) is arranged inside the condensation chamber. A plurality of bent channels (51) are arranged at intervals on the folded staggered fin (5), and adjacent bent channels (51) are communicated through a plurality of diversion openings (52). An evaporation fin assembly is arranged inside the evaporation chamber (41). A plurality of vertical evaporation channels (61) are arranged vertically on the evaporation fin assembly. The vertical evaporation channels (61) are arranged at intervals in the transverse direction. A plurality of upper transverse channels (62) are arranged at the upper part of the evaporation fin assembly. The upper transverse channels (62) penetrate through the vertical evaporation channels (61) in the transverse direction and communicate with the vertical evaporation channels (61) respectively. A plurality of lower transverse channels (63) are arranged at the lower part of the evaporation fin assembly. The lower transverse channels (63) penetrate through the vertical evaporation channels (61) in the transverse direction and communicate with the vertical evaporation channels (61) respectively. The upper transverse channels (62) communicate with the corresponding bent channels (51) respectively.
3. The thermosyphon heat dissipation module for a 5G base station according to claim 2, wherein: The condenser (2) includes a base (21), an upper plate (22) and a plurality of connecting screws. The base (21) is provided with a condensation groove (211) with an upward opening. The upper plate (22) covers the condensation groove (211) to form the condensation chamber. The air inlet (212) is arranged on the base (21). A plurality of fixing holes (213) are respectively arranged on the left and right sides of the base (21). Corresponding threaded holes (13) are arranged on the heat dissipation box body (1). The connecting screws pass through the fixing holes (213) and are threadedly connected with the threaded holes (13). The upper part of the folded staggered fin (5) abuts against the upper plate (22), and the lower part abuts against the bottom surface of the condensation groove (211).
4. The thermosyphon heat dissipation module for a 5G base station according to claim 3, wherein: The upper plate (22) is provided with a plurality of fixing grooves (221), and a flow channel connecting groove (222) penetrating the upper plate (22) is further provided at the bottom of each fixing groove (221). The harmonica tube (3) is inserted into the fixing groove (221), and the condensation flow channel (31) is communicated with the condensation chamber through the flow channel connecting groove (222).
5. The thermosyphon heat dissipation module for a 5G base station according to claim 3, characterized in that: The condenser (2) is further provided with a liquid injection pipe (23). The lower part of the liquid injection pipe (23) is arranged on the upper plate (22) and communicated with the condensation chamber, and a one-way valve (231) is arranged on the upper part of the liquid injection pipe (23).
6. The thermosyphon heat dissipation module for a 5G base station according to claim 2, wherein: The evaporation fin assembly includes a plurality of upper substrates (64), a plurality of lower substrates (65) and a plurality of fins (66). A plurality of upper convex parts (661) respectively extend upward from the upper parts of the fins (66), and a plurality of lower convex parts (662) respectively extend downward from the lower parts of the fins (66). Each upper substrate (64) is respectively arranged on each upper convex part (661), and each lower substrate (65) is respectively arranged on each lower convex part (662). A plurality of upper flow holes are respectively formed between two adjacent upper convex parts (661) of the same fin (66) and between the upper convex part (661) and the inner wall of the evaporation box body (4). The upper flow holes of each fin (66) form the upper transverse flow channel (62). A plurality of lower flow holes are respectively formed between two adjacent lower convex parts (662) of the same fin (66) and between the lower convex part (662) and the inner wall of the evaporation box body (4). The lower flow holes of each fin (66) form the lower transverse flow channel (63). The vertical evaporation flow channel (61) is formed between two adjacent fins (66).
7. The thermosyphon heat dissipation module for a 5G base station according to claim 6, wherein: The upper substrate (64) passes through and abuts against the folded staggered fins (5) in cooperation with the air inlet (212), and each of the upper transverse flow channels (62) is respectively located below the corresponding bent flow channel (51).
8. The thermosyphon heat dissipation module for a 5G base station according to claim 1, wherein: The inner wall of the condensation flow channel (31) is provided with a corrugated surface structure (32).
9. The thermosyphon heat dissipation module for a 5G base station according to any one of claims 1 to 8, characterized in that: A plurality of heat conducting plates (7) are further arranged on the outer side surface of the evaporation box body (4). A plurality of heat conducting strips (71) respectively extend outward from the outer side surfaces of the heat conducting plates (7). A plurality of second installation grooves (12) are formed in the heat dissipation box body (1), and the heat conducting plates (7) are embedded in the second installation grooves (12).
10. The thermosyphon heat dissipation module for a 5G base station according to claim 9, characterized in that: The thermosyphon heat dissipation device is arranged on one side of the heat dissipation box body (1). A plurality of heat dissipation fins (14) extend outward from the other side of the heat dissipation box body (1), and a plurality of heat dissipation convex columns are arranged on the inner wall of the heat dissipation box body (1). A plurality of positioning columns (81) and installation blocks (82) are arranged on the top of the condenser (2) and / or the top of the heat dissipation box body (1), and installation holes (83) are respectively formed in each positioning column (81) and installation block (82). Installation handles (15) are respectively arranged on the left and right sides of the heat dissipation box body (1). The coolant is R134a high-pressure refrigerant.