Heat exchange module and electronic equipment

Abstract

The embodiment of the utility model discloses a heat exchange module and electronic equipment, the heat exchange module comprises a micropump and a heat exchange piece, the micropump comprises a shell, and an opening is formed in the shell; the heat exchange piece comprises a base plate layer and a cover plate layer, and the base plate layer is provided with a flow channel. Wherein the first side of the cover plate layer is in sealing connection with the shell at the opening, and the second side of the cover plate layer is in sealing connection with the substrate layer. Therefore, the design of a micro-pump back plate is omitted, and the back plate does not need to be arranged to independently seal the shell, so that the overall thickness of the heat exchange module can be reduced, the light and thin development of the heat exchange module is facilitated, the production cost can be reduced, and the production process can be simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer, and more specifically, to a heat exchange module and an electronic device. Background Art

[0002] With the increasing integration of electronic devices, the heat exchange problem has become one of the key factors restricting the performance improvement. As an efficient heat dissipation element, the liquid cooling plate is widely used in various high-power density electronic devices.

[0003] In actual heat dissipation design, it is usually necessary to connect the liquid cooling plate to a pump, and the pump is used to drive the flow of the working medium in the liquid cooling plate. At present, most of them are directly stacked and connected, resulting in a relatively large thickness dimension of the formed liquid cooling module, which is not conducive to its development towards thin and light. Summary of the Utility Model

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide a novel heat exchange module and an electronic device.

[0005] According to one aspect of the present utility model, a heat exchange module is provided.

[0006] The heat exchange module includes:

[0007] A micropump, the micropump includes a housing, and the housing has an opening;

[0008] A heat exchange member, the heat exchange member includes a substrate layer and a cover plate layer, and the substrate layer has a flow channel;

[0009] Wherein, the first side of the cover plate layer is hermetically connected to the housing at the opening, and the second side of the cover plate layer is hermetically connected to the substrate layer.

[0010] Optionally, an accommodation cavity is provided in the housing, the accommodation cavity is communicated with the opening, a working medium inlet and a working medium outlet are provided on the cover plate layer, one end of the working medium inlet and one end of the working medium outlet are respectively communicated with the accommodation cavity, and the other end of the working medium inlet and the other end of the working medium outlet are respectively communicated with the flow channel.

[0011] Optionally, the working medium inlet and the working medium outlet are respectively located on two adjacent sides of the cover plate layer, or the working medium inlet and the working medium outlet are respectively located on two opposite sides of the cover plate layer.

[0012] Optionally, the working medium inlet and the working medium outlet are arranged along the diagonal of the cover plate layer.

[0013] Optionally, in the cross-section of the cover plate layer, the working medium inlet and the working medium outlet are arranged side by side.

[0014] Optionally, the working fluid inlet and the working fluid outlet are symmetrically arranged along the axis of the cover plate layer.

[0015] Optionally, a flow channel groove is formed on one side of the substrate layer close to the cover plate layer. The substrate layer includes a liquid cooling layer and an adhesive layer provided on the liquid cooling layer. The liquid cooling layer and the adhesive layer jointly form the side wall of the flow channel groove. The second side of the cover plate layer is hermetically connected to the liquid cooling layer through the adhesive layer, so that the cover plate layer and the substrate layer enclose the flow channel at the flow channel groove.

[0016] Optionally, a flow channel groove is formed on the substrate layer, and the flow channel groove runs through the substrate layer along the thickness direction thereof. The substrate layer includes a liquid cooling layer and adhesive layers provided on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides jointly form the side wall of the flow channel groove;

[0017] The cover plate layer includes a first cover plate and a second cover plate. One of the first cover plate and the second cover plate is hermetically connected to the housing. The first cover plate and the second cover plate are respectively hermetically connected to the liquid cooling layer through the adhesive layer, so that the first cover plate, the second cover plate and the substrate layer enclose the flow channel at the flow channel groove.

[0018] Optionally, the thickness range of the cover plate layer is 0.03 mm to 0.15 mm.

[0019] Optionally, the cover plate layer includes at least one of a polymer material layer and a metal layer.

[0020] According to another aspect of the present invention, an electronic device is provided, including the above heat exchange module.

[0021] One technical effect of the embodiments of the present disclosure lies in that:

[0022] The heat exchange module includes a micropump and a heat exchange element. The micropump includes a housing having an opening thereon; the heat exchange element includes a substrate layer and a cover plate layer, and the substrate layer has a flow channel; wherein, the first side of the cover plate layer is hermetically connected to the housing at the opening, and the second side of the cover plate layer is hermetically connected to the substrate layer. In this way, the design of the micropump back plate is omitted, and there is no need to separately seal the housing with a back plate, thereby reducing the overall thickness of the heat exchange module, facilitating the development of the heat exchange module towards thin and light, and also reducing production costs and simplifying the production process.

[0023] Other features and advantages of the present invention will become clear through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. Description of the Drawings

[0024] The accompanying drawings forming a part of the specification illustrate embodiments of the present utility model and, together with the specification, are used to explain the principles of the present utility model.

[0025] Figure 1 is a schematic diagram of a heat exchange module according to an embodiment of the present disclosure;

[0026] Figure 2 is a schematic diagram of another heat exchange module according to an embodiment of the present disclosure;

[0027] Figure 3 is a schematic diagram of a cover plate layer according to an embodiment of the present disclosure;

[0028] Figure 4 is a schematic diagram of another cover plate layer according to an embodiment of the present disclosure;

[0029] Figure 5 is a schematic diagram of yet another cover plate layer according to an embodiment of the present disclosure;

[0030] Figure 6 is a schematic diagram of still another cover plate layer according to an embodiment of the present disclosure;

[0031] Figure 7 is a schematic diagram of still another cover plate layer according to an embodiment of the present disclosure.

[0032] Description of reference numerals:

[0033] 1, micro pump; 2, heat exchange element; 21, substrate layer; 211, flow channel; 22, cover plate layer; 221, working fluid inlet; 222, working fluid outlet. Detailed embodiments

[0034] Various exemplary embodiments of the present utility model will now be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present utility model.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present utility model or its application or use.

[0036] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be regarded as part of the specification.

[0037] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Accordingly, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that like reference numerals and letters refer to like items in the following figures. Therefore, once an item is defined in one figure, it will not be further discussed in subsequent figures.

[0039] An embodiment of the present utility model provides a heat exchange module, which can be applied to heat exchange of small electronic devices such as tablet computers, notebook computers, VR (Virtual Reality) products, AR (Augmented Reality) products, watches, etc.

[0040] As Figure 1 shown, the heat exchange module provided by the embodiment of the present utility model includes:

[0041] A micro pump 1, the micro pump 1 includes a housing, and the housing has an opening;

[0042] A heat exchange member 2, the heat exchange member 2 includes a substrate layer 21 and a cover layer 22, and a flow channel 211 is provided on the substrate layer 21;

[0043] Wherein, the first side of the cover layer 22 is hermetically connected to the housing at the opening, and the second side of the cover layer 22 is hermetically connected to the substrate layer 21.

[0044] In this embodiment, the housing of the micro pump 1 can be made of high-strength metal or engineering plastic materials, so that it can withstand the pressure during the operation of the internal structure and the external environment. An opening is provided on the housing, and the opening communicates with the accommodation cavity inside the housing. The micro pump 1 can form a hermetic connection with the cover layer 22 of the heat exchange member 2 at the opening, thereby ensuring that the working medium can flow smoothly between the micro pump 1 and the heat exchange member 2 and avoiding abnormalities such as liquid leakage. Among them, according to actual driving and application requirements, the micro pump 1 can include a mechanical micro pump or a non-mechanical micro pump, such as a piezoelectric pump and an electromagnetic pump, etc., all of which can realize the driving of the working medium.

[0045] For example, taking a piezoelectric pump as an example. The piezoelectric pump includes a housing and a piezoelectric member located inside the housing. When powered on, the piezoelectric member can deform, thereby generating vibration to change the pressure inside the housing, and then can drive the flow of the working medium under the drive of the pressure difference between the accommodation cavity and the outside. In this way, by using the movement of the piezoelectric member, the inflow and outflow of the working medium inside the housing can be driven, and then the working medium can be driven to circulate between the heat exchange member 2 and the micro pump 1, thereby ensuring the heat exchange effect of the heat exchange module. It should be noted that the specific structures and driving principles of various micro pumps 1 are all conventional technical means in the art and will not be elaborated here.

[0046] The substrate layer 21 can be made of a metal material with a high thermal conductivity such as aluminum or copper. Flow channels 211 are formed on the substrate layer 21, and these flow channels 211 can be linear, serpentine, cross-shaped, S-shaped or other shapes to ensure that the working fluid can exchange heat with the substrate layer 21 when flowing through, thereby ensuring the heat exchange effect of the heat exchange module.

[0047] The cover layer 22 includes an opposite first side and second side. The first side of the cover layer 22 faces the micro pump 1 and can form a sealed connection with the housing at the opening to seal the accommodation cavity inside the micro pump 1. Among them, a sealing structure matching the opening of the housing can be designed on the first side of the cover layer 22, such as a flange, a sealing ring, etc., and these sealing structures can be used to strengthen the sealing effect of the cover layer 22 on the housing and avoid leakage of the working fluid.

[0048] The second side of the cover layer 22 can be hermetically connected to the substrate layer 21 by bonding, welding or other means to ensure the sealing performance of the flow channels 211 formed on the substrate layer 21, thereby ensuring the heat exchange effect. In this way, the sealed connection of the micro pump 1 and the heat exchange element 2 can be realized through the opposite two sides of the cover layer 22, and further the normal operation of the heat exchange module can be ensured.

[0049] Moreover, the double-sided sealing design of the cover layer 22, on the one hand, eliminates the backplane design of the micro pump 1, and there is no need to set a backplane to separately seal the housing, thereby reducing the overall thickness of the heat exchange module, facilitating the development of the heat exchange module towards thin and light, and also reducing the production cost and simplifying the production process. On the other hand, by sealing the micro pump 1 and the heat exchange element 2 with the cover layer 22, the working fluid only flows through the inlets and outlets on the cover layer 22, which can also avoid leakage of the working fluid, and further ensures the normal operation of the heat exchange module.

[0050] Optionally, the housing has an accommodation cavity, the accommodation cavity communicates with the opening, the cover layer 22 is provided with a working fluid inlet 221 and a working fluid outlet 222, one end of the working fluid inlet 221 and one end of the working fluid outlet 222 are respectively communicated with the accommodation cavity, and the other end of the working fluid inlet 221 and the other end of the working fluid outlet 222 are respectively communicated with the flow channels 211.

[0051] In this embodiment, the housing of the micro pump 1 has an accommodation cavity communicating with the opening, and the micro pump 1 can drive the working fluid to flow between the accommodation cavity and the flow channels 211 during operation to achieve a reliable heat exchange effect. In addition, the cover layer 22 is provided with a working fluid inlet 221 and a working fluid outlet 222, and the working fluid in the accommodation cavity can flow into the flow channels 211 in the heat exchange element 2 from the working fluid outlet 222, and then flow back into the accommodation cavity from the working fluid inlet 221 after heat exchange through the flow channels 211, so as to realize the cyclic movement of the working fluid and ensure the heat exchange effect of the heat exchange module.

[0052] Optionally, the working fluid inlet 221 and the working fluid outlet 222 are respectively located on two adjacent sides of the cover plate layer 22, as Figure 3 shown, or, the working fluid inlet 221 and the working fluid outlet 222 are respectively located on two opposite sides of the cover plate layer 22, as Figure 4 shown. In this way, it can adapt to different channel 211 designs on the substrate layer 21, facilitate meeting different heat exchange requirements, and can also adapt to the structures of different micro pumps 1.

[0053] Optionally, the working fluid inlet 221 and the working fluid outlet 222 are arranged along the diagonal of the cover plate layer 22, as Figure 5 shown. In this way, it can adapt to different channel 211 designs on the substrate layer 21, facilitate meeting different heat exchange requirements, and can also adapt to the structures of different micro pumps 1.

[0054] Optionally, on the cross-section of the cover plate layer 22, the working fluid inlet 221 and the working fluid outlet 222 are arranged side by side, as Figure 6 shown. In this way, it can adapt to different channel 211 designs on the substrate layer 21, facilitate meeting different heat exchange requirements, and also facilitate the connection of the working fluid inlet 221 and the working fluid outlet 222 to the internal structure of the housing respectively, simplifies the processing difficulty, and can also adapt to the structures of different micro pumps 1.

[0055] Optionally, the working fluid inlet 221 and the working fluid outlet 222 are symmetrically arranged along the axis of the cover plate layer 22, as Figure 7 shown. In this way, it can adapt to different channel 211 designs on the substrate layer 21, facilitate meeting different heat exchange requirements, can also improve the structural symmetry and aesthetics of the cover plate layer 22, and can also adapt to the structures of different micro pumps 1.

[0056] Optionally, a channel groove is formed on the side of the substrate layer 21 close to the cover plate layer 22. The substrate layer 21 includes a liquid cooling layer and an adhesive layer provided on the liquid cooling layer. The liquid cooling layer and the adhesive layer jointly form the side wall of the channel groove. The second side of the cover plate layer 22 is hermetically connected to the liquid cooling layer through the adhesive layer, so that the cover plate layer 22 and the substrate layer 21 enclose the channel 211 at the channel groove.

[0057] As Figure 1As shown, in this embodiment, a flow channel groove is provided on one side of the substrate layer 21 close to the cover plate layer 22, that is, the flow channel groove is a groove on the substrate layer 21, enabling the working fluid to flow smoothly in the flow channel 211 at the flow channel groove and fully contact the liquid cooling layer, thereby achieving efficient heat conduction. Moreover, since the flow channel groove is a groove on the substrate layer 21, the substrate layer 21 itself can also form a unilateral seal for the flow channel 211 at the flow channel groove, thus reducing the assembly difficulty of the heat exchange member 2 and improving the assembly efficiency.

[0058] In this embodiment, the substrate layer 21 may include a liquid cooling layer and an adhesive layer. During the processing of the flow channel groove, the adhesive layer and the liquid cooling layer can be stacked to form the substrate layer 21 first, and then the substrate layer 21 is cut to form the flow channel groove. In this way, the adhesive layer and the liquid cooling layer can jointly form the side wall of the flow channel groove, which can facilitate the formation of the flow channel groove while strengthening the sealing performance of the side wall of the flow channel groove, and further ensure the sealing performance of the flow channel 211 formed on the heat exchange member 2, thereby ensuring the heat exchange effect.

[0059] Among them, the liquid cooling layer can be made of a metal material, or the liquid cooling layer can be made of a polymer material, or the liquid cooling layer can also be made of a composite of a metal material and a polymer material, which can adapt to different application requirements.

[0060] The adhesive layer is located between the liquid cooling layer and the cover plate layer 22. The adhesive layer is used to seal and connect the liquid cooling layer and the cover plate layer 22. The adhesive layer can be made of an adhesive or a thin film material with good sealing performance and thermal conductivity. On the one hand, the adhesive layer can firmly connect the second side of the cover plate layer 22 with the liquid cooling layer, thus forming the overall structure of the heat exchange member 2; on the other hand, the adhesive layer can also ensure the sealing performance of the flow channel groove, preventing poor heat exchange caused by the leakage of the working fluid.

[0061] During the production and assembly process, the second side of the cover plate layer 22 is hermetically connected to the liquid cooling layer through the adhesive layer, and the cover plate layer 22 and the substrate layer 21 enclose a closed flow channel 211 at the flow channel groove. The working fluid flows in the flow channel 211, and thus the heat exchange function of the heat exchange member 2 can be realized. Among them, special treatment can be performed on the surface of the cover plate layer 22 in contact with the adhesive layer, such as surface roughening, etc., which can enhance the bonding strength between the cover plate layer 22 and the adhesive layer.

[0062] Optionally, a flow channel groove is provided on the substrate layer 21, the flow channel groove penetrates along the thickness direction of the substrate layer 21, the substrate layer 21 includes a liquid cooling layer and adhesive layers provided on both sides of the liquid cooling layer, and the liquid cooling layer and the adhesive layers on both sides jointly form the side wall of the flow channel groove;

[0063] As Figure 2As shown, in this embodiment, the cover layer 22 includes a first cover plate and a second cover plate. One of the first cover plate and the second cover plate is hermetically connected to the housing, and the first cover plate and the second cover plate are respectively hermetically connected to the liquid cooling layer through the adhesive layer, so that the first cover plate, the second cover plate and the substrate layer 21 enclose the flow channel 211 at the flow channel groove.

[0064] In another embodiment, the second side of the cover layer 22 can also be hermetically connected to the substrate layer 21 by welding. For example, a rough structure or a groove and other connection areas can be provided on one of the cover layer 22 and the substrate layer 21, and the other of the cover layer 22 and the substrate layer 21 can be embedded in the rough structure or the groove and other connection areas to form a hermetic connection.

[0065] The substrate layer 21 is sandwiched between the first cover plate and the second cover plate, so that the first cover plate and the second cover plate on both sides can support and protect the substrate layer 21. In the embodiment of the present invention, a flow channel groove is provided on the substrate layer 21, and the flow channel groove penetrates along the thickness direction of the substrate layer 21, so that the working medium can flow smoothly in the flow channel 211 at the flow channel groove and fully contact the liquid cooling layer, thereby realizing efficient heat conduction.

[0066] According to the arrangement positions of the micropump 1 and the heat exchanger 2, one of the first cover plate and the second cover plate can be hermetically connected to the housing. For example, when the micropump 1 is located above the heat exchanger 2, the first side of the upper first cover plate can be hermetically connected to the housing to connect the micropump 1 to the first cover plate of the heat exchanger 2; when the micropump 1 is located below the heat exchanger 2, the first side of the lower second cover plate can be hermetically connected to the housing to connect the micropump 1 to the second cover plate of the heat exchanger 2.

[0067] The substrate layer 21 may include a liquid cooling layer and adhesive layers on both sides. One side of the liquid cooling layer has a first adhesive layer, and the other side opposite to the liquid cooling layer has a second adhesive layer. The first adhesive layer, the liquid cooling layer and the second adhesive layer together form the substrate layer 21. During the processing of the flow channel groove, the first adhesive layer, the liquid cooling layer and the second adhesive layer can be stacked to form the substrate layer 21 first, and then the substrate layer 21 can be cut to form the flow channel groove. In this way, the first adhesive layer, the liquid cooling layer and the second adhesive layer can jointly form the side wall of the flow channel groove, which can not only facilitate the formation of the flow channel groove, but also strengthen the sealing performance of the side wall of the flow channel groove, and further ensure the sealing performance of the flow channel 211 formed on the heat exchanger 2, thereby ensuring the heat exchange effect.

[0068] Among them, the liquid cooling layer can be made of a metal material, the liquid cooling layer can also be made of a polymer material, and the liquid cooling layer can also be made of a composite of a metal material and a polymer material, which can adapt to different application requirements.

[0069] The first bonding layer and the second bonding layer are respectively located on both sides of the liquid cooling layer. The first bonding layer and the second bonding layer can be made of an adhesive or a thin film material with good sealing performance and heat conductivity. On the one hand, the bonding layer can firmly connect the cover plate and the liquid cooling layer, thereby forming the overall structure of the heat exchange component 2; on the other hand, the bonding layers on both sides can also ensure the sealing performance of the flow channel groove, preventing poor heat exchange caused by the leakage of the working medium.

[0070] During the production and assembly process, the first cover plate and the second cover plate are respectively hermetically connected to the liquid cooling layer through their respective bonding layers, and the first cover plate, the second cover plate and the substrate layer 21 enclose a closed flow channel 211 at the flow channel groove. A working medium flows in the flow channel 211, and thus the heat exchange function of the heat exchange component 2 can be realized. Among them, special treatment can be carried out on the surfaces of the first cover plate and the second cover plate that are respectively in contact with the bonding layer, such as surface roughening, etc., which can enhance the bonding strength between the first cover plate, the second cover plate and the bonding layer.

[0071] Optionally, the thickness range of the cover plate layer 22 is 0.03 mm to 0.15 mm.

[0072] In this embodiment, setting the thickness of the cover plate layer 22 between 0.03 mm and 0.15 mm can utilize the cover plate layer 22 to realize a reliable hermetic connection between the housing and the substrate layer 21. Thus, while realizing the hermetic connection between the micro pump 1 and the heat exchange component 2, the self-thickness of the cover plate layer 22 can be reduced, so as to reduce the overall thickness of the heat exchange module and facilitate meeting the thinning requirements of the electronic device applying the heat exchange module.

[0073] Optionally, the cover plate layer 22 includes at least one of a polymer material layer and a metal layer.

[0074] In this embodiment, according to the actual design requirements, the cover plate layer 22 can be set to include a polymer material layer and / or a metal layer. For example, the cover plate layer 22 can be set to include a metal layer, which can improve the overall strength and heat conduction performance of the heat exchange module, thereby ensuring the stability of the electronic device with the heat exchange module in a complex working environment and also reducing the working temperature of the electronic device; the cover plate layer 22 can also be set to include a polymer material layer, which can meet the lightweight design requirements of the heat exchange module, thereby facilitating the carrying and use of the electronic device with the heat exchange module; the cover plate layer 22 can also be set to include a polymer material layer and a metal layer, which can combine the characteristics of both to improve the comprehensive performance of the heat exchange module.

[0075] The embodiment of the present invention also provides an electronic device, including the foregoing heat exchange module. The electronic device can be a small electronic device, such as a tablet computer, a notebook computer, smart glasses, a smart watch, a smart headset, etc.

[0076] In the above embodiments, the differences between the various embodiments are mainly described. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the brevity of the text, they will not be elaborated here.

[0077] Although some specific embodiments of the present utility model have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of the present utility model. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present utility model. The scope of the present utility model is defined by the appended claims.

Claims

1. A heat exchange module, characterized in that, Comprising: A micropump (1), the micropump (1) comprising a housing having an opening thereon; A heat exchanger (2), the heat exchanger (2) comprising a substrate layer (21) and a cover layer (22), the substrate layer (21) having a flow channel (211); Wherein, a first side of the cover layer (22) is sealingly connected to the housing at the opening, and a second side of the cover layer (22) is sealingly connected to the substrate layer (21).

2. The heat exchange module according to claim 1, characterized in that, An accommodation cavity is provided in the housing, the accommodation cavity communicates with the opening, a working fluid inlet (221) and a working fluid outlet (222) are provided on the cover layer (22), one end of the working fluid inlet (221) and one end of the working fluid outlet (222) are respectively communicated with the accommodation cavity, and the other end of the working fluid inlet (221) and the other end of the working fluid outlet (222) are respectively communicated with the flow channel (211).

3. The heat exchange module according to claim 2, wherein The working fluid inlet (221) and the working fluid outlet (222) are respectively located on two adjacent sides of the cover layer (22), or the working fluid inlet (221) and the working fluid outlet (222) are respectively located on two opposite sides of the cover layer (22).

4. The heat exchange module according to claim 2, characterized in that, The working fluid inlet (221) and the working fluid outlet (222) are arranged along the diagonal of the cover layer (22).

5. The heat exchange module according to claim 2, wherein In the cross-section of the cover layer (22), the working fluid inlet (221) and the working fluid outlet (222) are arranged side by side.

6. The heat exchange module according to claim 2, characterized in that, The working fluid inlet (221) and the working fluid outlet (222) are arranged symmetrically along the axis of the cover layer (22).

7. The heat exchange module according to claim 1, characterized in that, A flow channel groove is provided on a side of the substrate layer (21) close to the cover layer (22), the substrate layer (21) comprises a liquid cooling layer and an adhesive layer provided on the liquid cooling layer, the liquid cooling layer and the adhesive layer together form the side wall of the flow channel groove, and the second side of the cover layer (22) is sealingly connected to the liquid cooling layer through the adhesive layer, so that the cover layer (22) and the substrate layer (21) enclose the flow channel (211) at the flow channel groove.

8. The heat exchange module according to claim 1, wherein, A flow channel groove is provided on the substrate layer (21), the flow channel groove runs through along the thickness direction of the substrate layer (21), the substrate layer (21) comprises a liquid cooling layer and adhesive layers provided on both sides of the liquid cooling layer, and the liquid cooling layer and the adhesive layers on both sides together form the side wall of the flow channel groove; The cover layer (22) comprises a first cover and a second cover, one of the first cover and the second cover is sealingly connected to the housing, and the first cover and the second cover are respectively sealingly connected to the liquid cooling layer through the adhesive layer, so that the first cover, the second cover and the substrate layer (21) enclose the flow channel (211) at the flow channel groove.

9. The heat exchange module according to claim 1, characterized in that, The thickness range of the cover layer (22) is from 0.03 mm to 0.15 mm.

10. The heat exchange module according to claim 1, characterized in that, The cover layer (22) comprises at least one of a polymer material layer and a metal layer.

11. An electronic device, characterized in that, Comprising the heat exchange module according to any one of claims 1 to 10.

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