Heat exchange plate, heat exchange module and electronic equipment

Abstract

The utility model provides a heat exchange plate, a heat exchange module and electronic equipment, the heat exchange plate comprises a plate body, the plate body is provided with an avoiding hole, and the avoiding hole is configured to be matched with a device of the electronic equipment to avoid the device; the plate body is provided with heat exchange flow channels, and the heat exchange flow channels are distributed on the peripheries of the receding holes. According to the heat exchange plate, the avoiding holes matched with the devices of the electronic equipment are formed, so that the heat exchange plate can be matched with the electronic equipment, the heat exchange effect of the heat exchange plate can be ensured, the heat exchange runners are arranged on the peripheries of the avoiding holes, the heat exchange plate can effectively conduct heat exchange on the areas around the devices, and the heat exchange efficiency is improved. The problem of local overheating of the electronic equipment is effectively prevented, and stable operation of the electronic equipment is guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation for electronic products, and more specifically, to a heat exchange plate, a heat exchange module, and an electronic device. Background Art

[0002] Electronic devices usually dissipate heat through a heat pipe with a wick. Existing heat pipes usually have a notch to avoid protruding devices. This notch-based avoidance method can only dissipate heat from a local area on the outer periphery of the device, rather than covering the entire outer periphery of the device, which easily leads to local overheating problems in the electronic device. Summary of the Utility Model

[0003] This application provides a new technical solution for a heat exchange plate, which can at least solve the problem that existing heat pipes easily cause local overheating in electronic devices.

[0004] This application also provides a new technical solution for a heat exchange module.

[0005] This application also provides a new technical solution for an electronic device.

[0006] According to the first aspect of this application, a heat exchange plate is provided, including: a plate body, the plate body is provided with avoidance holes, and the avoidance holes are configured to match with the devices of the electronic device to avoid the devices; the plate body is provided with heat exchange channels, and the heat exchange channels are arranged on the outer periphery of the avoidance holes.

[0007] Optionally, the heat exchange channel includes at least one transition channel segment, and the avoidance hole is located on one side in the width direction of the transition channel segment; the heat exchange channel further includes an upstream channel segment and a downstream channel segment, and the upstream channel segment and the downstream channel segment are respectively connected to both ends of the transition channel segment.

[0008] Optionally, at least one of the transition channel segments is narrower than the upstream channel segment or the downstream channel segment.

[0009] Optionally, the plate body is provided with a heat zone, and the heat zone is configured to cooperate with the heat generating area of the electronic device, and the narrowed transition channel segment is located in the heat zone.

[0010] Optionally, at least one of the transition channel segments extends at least one week along the circumferential direction of the avoidance hole.

[0011] Optionally, at least one of the transition channel segments is formed as an annular channel segment extending along the circumferential direction of the avoidance hole.

[0012] Optionally, the heat exchange flow path includes multiple upstream flow path segments, and the multiple upstream flow path segments communicate with one transition flow path segment; and / or, the heat exchange flow path includes multiple downstream flow path segments, and the multiple downstream flow path segments communicate with one transition flow path segment.

[0013] Optionally, the ratio of the width of the transition flow path segment to the width of the upstream flow path segment or the downstream flow path segment ranges from 0.25 to 0.75.

[0014] Optionally, the width range of the transition flow path segment is 0.5 mm to 1.5 mm.

[0015] Optionally, the heat exchange flow path includes multiple transition flow path segments arranged side by side; the heat exchange flow path includes multiple upstream flow path segments arranged side by side or multiple downstream flow path segments arranged side by side; the distance between adjacent transition flow path segments arranged side by side is less than the distance between adjacent upstream flow path segments arranged side by side, or less than the distance between adjacent downstream flow path segments arranged side by side.

[0016] Optionally, the distance between the edge of the avoidance hole and the heat exchange flow path is less than or equal to 2 mm.

[0017] Optionally, the plate body is provided with multiple avoidance holes, and the multiple avoidance holes are used to avoid different devices.

[0018] According to a second aspect of the present application, there is provided a heat exchange module, including the heat exchange plate according to any one of the above; a micro pump, the micro pump is arranged on the heat exchange plate, and the micro pump communicates with the heat exchange flow path to form a circulation path.

[0019] According to a third aspect of the present application, there is provided an electronic device, including the above heat exchange module, the electronic device has a device, the heat exchange module is arranged in the electronic device, and the avoidance hole on the heat exchange plate is sleeved around the device.

[0020] Optionally, the device is a resistor, a capacitor or a camera module.

[0021] According to the heat exchange plate of the present application, by providing avoidance holes matching the devices of the electronic device, the heat exchange plate can cooperate with the electronic device, thereby ensuring the heat exchange effect of the heat exchange plate, and arranging the heat exchange flow path on the outer periphery of the avoidance hole, so that the heat exchange plate can effectively heat the area around the device, effectively preventing the problem of local overheating of the electronic device and ensuring the stable operation of the electronic device; at the same time, the structure of the heat exchange plate is simple and the production cost is low.

[0022] Other features and advantages of the present application will become clear through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings. Description of the Drawings

[0023] The drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description thereof, are used to explain the principles of the present application.

[0024] Figure 1 is a schematic structural diagram of a heat exchange plate according to an embodiment provided by the present application;

[0025] Figure 2 is a partial schematic structural diagram of a heat exchange plate according to an embodiment provided by the present application;

[0026] Figure 3 is a partial schematic structural diagram of a heat exchange plate according to another embodiment provided by the present application.

[0027] Reference numerals

[0028] 100, heat exchange plate;

[0029] 10, plate body; 11, avoidance hole; 12, hot zone;

[0030] 20, heat exchange flow channel; 21, transition flow channel section; 22, upstream flow channel section; 23, downstream flow channel section. Detailed embodiments

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present application or its application or use.

[0033] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0034] In all examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0036] The heat exchange plate 100 according to the embodiments of the present application will now be specifically described with reference to the drawings first.

[0037] AsFigures 1 to 3 As shown in Figures 1 to 3 , the heat exchange plate 100 according to an embodiment of the present application includes a plate body 10.

[0038] Specifically, the plate body 10 is provided with avoidance holes 11, and the avoidance holes 11 are configured to match the devices of the electronic device to avoid the devices; the plate body 10 is provided with heat exchange channels 20, and the heat exchange channels 20 are arranged on the outer periphery of the avoidance holes 11.

[0039] In other words, as Figures 1 to 3 shown in Figures 1 to 3 , the heat exchange plate 100 according to an embodiment of the present application is mainly applied to an electronic device. The heat exchange plate 100 is mainly composed of a plate body 10. The plate body 10 is provided with avoidance holes 11 penetrating along its thickness direction. These avoidance holes 11 match the devices in the electronic device, so that the avoidance holes 11 can provide necessary avoidance space for the devices, and at the same time, the rest of the plate body 10 can cooperate with the structure of the electronic device.

[0040] Specifically, the plate body 10 is provided with heat exchange channels 20 for circulating heat exchange liquid. When in use, the first end of the heat exchange channel 20 can be communicated with the liquid outlet of the micro pump, and the second end of the heat exchange channel 20 can be communicated with the liquid inlet of the micro pump to form a circulation path. The micro pump can drive the heat exchange liquid to circulate in the circulation path. In this embodiment, the heat exchange channels 20 are arranged around the avoidance holes 11, so that the heat exchange liquid can flow around the avoidance holes 11, thereby effectively exchanging heat for the area around the devices.

[0041] Therefore, for the heat exchange plate 100 provided according to this embodiment, by setting the avoidance holes 11 that match the devices of the electronic device, the heat exchange plate 100 can cooperate with the electronic device, thereby ensuring the heat exchange effect of the heat exchange plate 100. Moreover, arranging the heat exchange channels 20 on the outer periphery of the avoidance holes 11 enables the heat exchange plate 100 to effectively exchange heat for the area around the devices, effectively preventing the problem of local overheating of the electronic device and ensuring the stable operation of the electronic device; at the same time, the structure of the heat exchange plate is simple and the production cost is low.

[0042] According to an embodiment of the present application, the heat exchange channel 20 includes at least one transition channel section 21, and the avoidance hole 11 is located on one side in the width direction of the transition channel section 21; the heat exchange channel 20 further includes an upstream channel section 22 and a downstream channel section 23, and the upstream channel section 22 and the downstream channel section 23 are respectively connected to both ends of the transition channel section 21.

[0043] That is to say, as Figure 1 and Figure 2As shown, the heat exchange flow channel 20 includes an upstream flow channel section 22 near the first end of the heat exchange flow channel 20, a downstream flow channel section 23 near the second end of the heat exchange flow channel 20, and a transition flow channel section 21 communicating between the two. In this embodiment, the avoidance hole 11 is located on one side in the width direction of the transition flow channel section 21, so that even when the avoidance hole 11 is close to the edge of the plate body 10, it can ensure that the heat exchange flow channel 20 is arranged in the peripheral area of the avoidance hole 11, thereby being able to effectively heat exchange the area around the device.

[0044] In some specific embodiments of the present application, at least one transition flow channel section 21 is narrowed relative to the upstream flow channel section 22 or the downstream flow channel section 23.

[0045] Specifically, as Figure 1 shown, one or more transition flow channel sections 21 of the heat exchange flow channel 20 are appropriately narrowed relative to the upstream flow channel section 22 or the downstream flow channel section 23, which is beneficial to setting a larger avoidance hole 11 on one side in the width direction of the transition flow channel section 21 to accommodate larger devices that need to be avoided, and avoids unnecessary reduction in the number of transition flow channel sections 21 due to the increase of the avoidance hole 11, and can ensure the heat exchange effect of the heat exchange plate 100.

[0046] According to an embodiment of the present application, the plate body 10 is provided with a heat area 12, and the heat area 12 is configured to cooperate with the heat generating area of the electronic device, and the narrowed transition flow channel section 21 is located in the heat area 12.

[0047] As Figure 1 shown, when the electronic device is running, there are often areas with relatively high heat generation inside it, and these areas are usually called heat generating areas. For example, the area where the processor of the electronic device is located is a typical heat generating area. In order to effectively cool the heat generating area of the electronic device, the plate body 10 is also divided into heat areas 12 (i.e., areas that absorb the heat of the heat generating areas) that match these heat generating areas, and the narrowed transition flow channel section 21 is arranged in the heat area 12 of the plate body 10, so that the hot liquid can quickly pass through when flowing through the heat area 12, effectively reducing and avoiding the phenomenon of heat saturation caused by the heat exchange liquid contacting high temperature for a long time, thereby ensuring the continuity and high efficiency of the heat exchange process.

[0048] In some specific embodiments of the present application, at least one transition flow channel section 21 extends at least one week along the circumferential direction of the avoidance hole 11.

[0049] That is to say, as Figure 2As shown, the heat exchange plate 100 at least includes a transition flow channel section 21 extending along the circumferential direction of the avoidance hole 11. The transition flow channel section 21 surrounds the avoidance hole 11 for at least one week, so as to ensure that the area around the avoidance hole 11 is fully covered by the heat exchange liquid, so that the heat exchange plate 100 can efficiently exchange heat for the area around the device and effectively prevent local overheating of the electronic device.

[0050] According to an embodiment of the present application, at least one transition flow channel section 21 is formed as an annular flow channel section extending along the circumferential direction of the avoidance hole 11.

[0051] Specifically, as Figure 2 shown, the heat exchange plate 100 at least includes a transition flow channel section 21 extending along the circumferential direction of the avoidance hole 11. The transition flow channel section 21 is formed as an annular flow channel section, and the annular flow channel section can ensure that the area around the avoidance hole 11 is fully covered by the heat exchange liquid, and has a simple structure and is convenient for production and manufacturing.

[0052] In some specific embodiments of the present application, the heat exchange flow channel 20 includes multiple upstream flow channel sections 22, and the multiple upstream flow channel sections 22 communicate with one transition flow channel section 21; and / or, the heat exchange flow channel 20 includes multiple downstream flow channel sections 23, and the multiple downstream flow channel sections 23 communicate with one transition flow channel section 21.

[0053] That is to say, as Figure 3 shown, the heat exchange flow channel 20 includes multiple upstream flow channel sections 22 and multiple downstream flow channel sections 23. The multiple upstream flow channel sections 22 can communicate with the first end of one transition flow channel section 21, so that the heat exchange liquid will converge together when passing through the transition flow channel section 21, which can reduce the occupied position of the heat exchange flow channel 20 and is beneficial to setting a larger avoidance hole 11 on one side in the width direction of the transition flow channel section 21 to accommodate larger devices that need to be avoided;

[0054] Moreover, the first end of one transition flow channel section 21 is correspondingly connected to multiple downstream flow channel sections 23, so that the heat exchange liquid will be shunted after passing through the transition flow channel section 21, which is beneficial to the heat exchange liquid flowing to different areas.

[0055] According to an embodiment of the present application, the ratio of the width of the transition flow channel section 21 to the width of the upstream flow channel section 22 or the downstream flow channel section 23 ranges from 0.25 to 0.75. For example, the ratio of the width of the transition flow channel section 21 to the width of the upstream flow channel section 22 or the downstream flow channel section 23 can be 0.25, 0.35, 0.45, 0.55, 0.65, 0.75, etc. In this range, excessive pressure loss can be avoided, and enough design space can be left for the avoidance hole 11.

[0056] In some specific embodiments of the present application, the width range of the transition flow channel section 21 is 0.5 mm to 1.5 mm. For example, the width of the transition flow channel section 21 can be 0.5 mm, 0.8 mm, 1.2 mm, 1.5 mm, etc. Within this range, excessive pressure loss can be avoided, and sufficient design space can be reserved for the avoidance holes 11.

[0057] According to an embodiment of the present application, the heat exchange flow channel 20 includes multiple transition flow channel sections 21 arranged side by side; the heat exchange flow channel 20 includes multiple upstream flow channel sections 22 arranged side by side or multiple downstream flow channel sections 23 arranged side by side; the spacing between adjacent transition flow channel sections 21 arranged side by side is smaller than the spacing between adjacent upstream flow channel sections 22 arranged side by side, or smaller than the spacing between adjacent downstream flow channel sections 23 arranged side by side.

[0058] Specifically, as Figure 1 shown, the heat exchange flow channel 20 includes multiple upstream flow channel sections 22 arranged side by side, multiple transition flow channel sections 21 arranged side by side, and multiple downstream flow channel sections 23 arranged side by side. Among them, the transition flow channel sections 21 are arranged more densely relative to the upstream flow channel sections 22 or the downstream flow channel sections 23, that is, the spacing between adjacent transition flow channel sections 21 arranged side by side is smaller than the spacing between adjacent upstream flow channel sections 22 or downstream flow channel sections 23. In this way, the heat exchange effect of the plate body 10 in the heat area 12 can be improved, and thus overheating of the heat generation area of the electronic device can be avoided.

[0059] In some specific embodiments of the present application, the distance between the edge of the avoidance hole 11 and the heat exchange flow channel 20 is less than or equal to 2 mm. For example, the distance between the edge of the avoidance hole 11 and the heat exchange flow channel 20 can be 1 mm, 1.5 mm, 2 mm, etc. Within this range, the heat exchange effect of the heat exchange plate 100 on the surrounding area can be ensured.

[0060] According to an embodiment of the present application, the plate body 10 is provided with a plurality of avoidance holes 11, and the plurality of avoidance holes 11 are used to avoid different devices.

[0061] That is to say, the avoidance holes 11 provided on the plate body 10 can be matched with the number of different devices in the electronic device, so as to provide necessary avoidance space for each device, so that the heat exchange plate 100 can be applied to electronic devices with multiple devices.

[0062] In summary, for the heat exchange plate 100 provided according to this embodiment, by providing the avoidance holes 11 that match the components of the electronic device, the heat exchange plate 100 can cooperate with the electronic device, thereby ensuring the heat exchange effect of the heat exchange plate 100. Moreover, by arranging the heat exchange channels 20 on the outer periphery of the avoidance holes 11, the heat exchange plate 100 can effectively exchange heat in the area around the components, effectively preventing the problem of local overheating of the electronic device and ensuring the stable operation of the electronic device. At the same time, the structure of the heat exchange plate is simple and the production cost is relatively low.

[0063] This application also provides a heat exchange module, which includes the heat exchange plate 100 described in any of the above embodiments; a micro pump, which is arranged on the heat exchange plate 100 and is in communication with the heat exchange channels 20 to form a circulation path. Since the heat exchange plate 100 according to the embodiment of this application has the above technical effects, the heat exchange module according to the embodiment of this application also has corresponding technical effects, which will not be elaborated in this embodiment.

[0064] In some optional examples of this application, the micro pump is a piezoelectric micro pump. The length and width of the micro pump can both be about 7 mm, and the thickness of the micro pump can be about 1 mm.

[0065] The embodiment of this application also provides an electronic device, such as, but not limited to, a mobile phone and a camera, etc. The electronic device has components, for example, the components can be resistors, capacitors or camera modules. The heat exchange module described in the above embodiment is arranged in the electronic device, and the avoidance holes 11 on the heat exchange plate 100 are sleeved around the components. Since the heat exchange plate 100 according to the embodiment of this application has the above technical effects, the electronic device according to the embodiment of this application also has corresponding technical effects, which will not be elaborated in this embodiment.

[0066] Although some specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration purposes and not for limiting the scope of this application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A heat exchange plate, characterized in that, Comprising: A plate body, the plate body is provided with an avoidance hole, and the avoidance hole is configured to match a device of an electronic device to avoid the device; The plate body is provided with a heat exchange flow channel, and the heat exchange flow channel is arranged on the outer periphery of the avoidance hole.

2. The heat exchange plate according to claim 1, characterized in that, The heat exchange flow channel includes at least one transition flow channel segment, and the avoidance hole is located on one side in the width direction of the transition flow channel segment; The heat exchange flow channel further includes an upstream flow channel segment and a downstream flow channel segment, and the upstream flow channel segment and the downstream flow channel segment are respectively connected to two ends of the transition flow channel segment.

3. The heat exchange plate according to claim 2, wherein At least one of the transition flow channel segments is narrowed relative to the upstream flow channel segment or the downstream flow channel segment.

4. The heat exchange plate according to claim 3, wherein, The plate body is provided with a heat zone, and the heat zone is configured to cooperate with a heat generating zone of the electronic device, and the narrowed transition flow channel segment is located in the heat zone.

5. The heat exchange plate according to claim 2, wherein At least one of the transition flow channel segments extends at least one week along the circumferential direction of the avoidance hole.

6. The heat exchange plate according to claim 5, characterized in that, At least one of the transition flow channel segments is formed as an annular flow channel segment extending along the circumferential direction of the avoidance hole.

7. The heat exchange plate according to claim 2, wherein The heat exchange flow channel includes multiple upstream flow channel segments, and the multiple upstream flow channel segments communicate with one transition flow channel segment; And / or, The heat exchange flow channel includes multiple downstream flow channel segments, and the multiple downstream flow channel segments communicate with one transition flow channel segment.

8. The heat exchange plate according to claim 3, wherein, The ratio of the width of the transition flow channel segment to the width of the upstream flow channel segment or the downstream flow channel segment ranges from 0.25 to 0.

75.

9. The heat exchange plate according to claim 2, wherein The width range of the transition flow channel segment is 0.5 mm to 1.5 mm.

10. The heat exchange plate according to claim 2, characterized in that, The heat exchange flow channel includes multiple transition flow channel segments arranged side by side; The heat exchange flow channel includes multiple upstream flow channel segments arranged side by side or multiple downstream flow channel segments arranged side by side; The distance between adjacent transition flow channel segments arranged side by side is less than the distance between adjacent upstream flow channel segments arranged side by side, or less than the distance between adjacent downstream flow channel segments arranged side by side.

11. The heat exchange plate according to claim 1, characterized in that, The distance between the edge of the avoidance hole and the heat exchange flow channel is less than or equal to 2 mm.

12. The heat exchange plate according to claim 1, wherein The plate body is provided with multiple avoidance holes, and the multiple avoidance holes are used to avoid different devices.

13. A heat exchange module, characterized in that, Comprising: The heat exchange plate according to any one of claims 1 to 12; A micropump, the micropump is arranged on the heat exchange plate, and the micropump communicates with the heat exchange flow channel to form a circulation path.

14. An electronic device, characterized in that, Including the heat exchange module according to claim 13, the electronic device has a device, the heat exchange module is arranged in the electronic device, and the avoidance hole on the heat exchange plate is sleeved around the device.

15. The electronic device according to claim 14, wherein The device is a resistor, a capacitor or a camera module.

Images